CN204062898U - Can bending COB packaged LED filamentray structure - Google Patents
Can bending COB packaged LED filamentray structure Download PDFInfo
- Publication number
- CN204062898U CN204062898U CN201420191910.8U CN201420191910U CN204062898U CN 204062898 U CN204062898 U CN 204062898U CN 201420191910 U CN201420191910 U CN 201420191910U CN 204062898 U CN204062898 U CN 204062898U
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- CN
- China
- Prior art keywords
- substrate
- bending
- electrode
- light source
- cob
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005452 bending Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 241000218202 Coptis Species 0.000 claims abstract description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 4
- 230000001154 acute effect Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract 1
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009992 mercerising Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses one can bending COB packaged LED filamentray structure, comprises COB light source, substrate and heat sink; COB light source is encapsulated on substrate; Heat sinkly be provided with electrode one, the wire conducting of substrate lower end, substrate lower end is provided with electrode two, and described substrate adopts flexible material to form through one or many bending.Gold thread in COB light source is connecting electrode one and electrode two respectively, reduces the trace width of COB light source; Overall heat sink with larger area, compares with common LED filament that to have excellent heat dispersion simultaneously heat sink upper with installing hole, and convenient installation, simplifies technique.
Description
Technical field
The utility model relates to one can bending COB packaged LED filamentray structure.
Background technology
cOBencapsulation and chip on board are exactly will
bare chipstick on interconnect substrates by conduction or non-conductive adhesive, then carry out wire bonding and realize its electrical connection.If
bare chipbe directly exposed in air, vulnerable to pollution or artificial damage, impact or destruction chip functions, so be just encapsulated chip and bonding wire with glue.Also this packing forms is claimed to be Soft Roll envelope.
Current LED silk is straight filament, and owing to adopting COB encapsulation technology, light source heating is comparatively concentrated, and the heat radiation difficulty of straight filament, can not bending make light emission direction more fixing, mounting process be complicated simultaneously, produces difficulty.
Utility model content
The purpose of this utility model overcomes the deficiencies in the prior art, provides one can bending COB packaged LED filamentray structure, can quick conductive, and can bend, technique is simply easy to produce.
Technical solution of the present utility model is:
One can bending COB packaged LED filamentray structure, comprises COB light source, substrate and heat sink; COB light source is encapsulated on substrate; Heat sinkly be provided with electrode one, the wire conducting of substrate lower end, substrate lower end is provided with electrode two, and described substrate adopts flexible material to form through one or many bending.
Preferably, be provided with gold thread in described COB light source, gold thread connects the electrode two of the electrode one and substrate lower end that heat sink surface insulating materials prints respectively.
Preferably, described substrate adopts aluminium, copper to become.
Preferably, described substrate is strip, and substrate forms with acute angle or right-angle bending.
Preferably, described substrate and be heat sinkly formed with acute angle or right angle inclination.
The beneficial effects of the utility model are: substrate is strip or other shape, and bending at a certain angle forms, and enable a chip part for COB light source tilt upward luminescence, a part is tilted to lower luminescence, and Integral luminous angle is large.The heat sink heat that COB light source produces can being read soon arranged transmits derivation.Have installing hole on heat sink, can be used for fixing, simplify technique, be convenient to produce.Electrode one, electrode two lay respectively at heat sink surface and substrate lower end, decrease the trace width of COB light source.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of wall scroll substrate in the utility model;
In figure: 1-is heat sink, 2-substrate, 3-COB light source, 4-electrode two, 5-electrode one, 6-gold thread, 7-installing hole.
Detailed description of the invention
Preferred embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
Embodiment
As shown in Figure 1, COB light source 3, substrate 2 and heat sink 1 can be comprised by bending COB packaged LED filamentray structure; COB light source 3 encapsulates on a substrate 2; Heat sink 1 is provided with electrode 1, and the wire conducting of substrate 2 lower end, is provided with electrode 24.Substrate 2 is bent into acute angle and also acutangulates inclination with heat sink 1, and LED chip is encapsulated in substrate 2 surface, forms COB light source 3.LED chip angularly makes Integral luminous angle increase further.Heat sink 1 heat that can COB light source 3 be produced fast shared is derived, while heat sink 1 on have installing hole 7, mounting process is very simple.
In fig. 2, substrate 2 have passed through 2 bendings, there is electrode 24 upper end of substrate 2, by wire conducting between substrate 2, LED chip is encapsulated in substrate 2 surface and forms COB light source 3, connected by gold thread 6 between LED chip, the electrode 1 on outermost gold thread 6 connecting electrode 24 and heat sink 1, decreases the trace width of COB light source 3.
Embodiment can bending COB packaged LED filamentray structure, the gold thread 6 in COB light source 3 is connecting electrode 1 and electrode 24 respectively, reduces the trace width of COB light source 3; Overall with heat sink 1 of larger area, compare with common LED filament have excellent heat dispersion simultaneously on heat sink 1 with installing hole 7, conveniently to install, simplify technique.The substrate 2 of embodiment can be strip or other shape, bending at a certain angle, many LED silks can also share one heat sink 1, and form one group of LED mercerising source, bending light source possesses larger heat-conducting area, simplifies mounting process while obtaining better light distribution effect.
Above specific embodiment and the relevant particular procedure described in relevant drawings, mechanism, manufacture, material, means, method and step, be interpreted as illustrating of the present utility model, and should not be construed restriction of the present utility model.
Claims (5)
1. can a bending COB packaged LED filamentray structure, it is characterized in that: comprise COB light source (3), substrate (2) and heat sink (1); COB light source (3) is encapsulated on substrate (2); Heat sink (1) is provided with electrode one (5), the wire conducting of substrate (2) lower end, and substrate (2) lower end is provided with electrode two (4), and described substrate (2) adopts flexible material to form through one or many bending.
2. as claimed in claim 1 can bending COB packaged LED filamentray structure, it is characterized in that: be provided with gold thread (6) in described COB light source (3), gold thread (6) connects the electrode two (4) of electrode one (5) and substrate (2) lower end that heat sink (1) surface insulation material prints respectively.
3. as claimed in claim 1 or 2 can bending COB packaged LED filamentray structure, it is characterized in that: described substrate (2) adopts aluminium, copper to become.
4. as claimed in claim 1 or 2 can bending COB packaged LED filamentray structure, it is characterized in that: described substrate (2) is in strip, and substrate (2) forms with acute angle or right-angle bending.
5. as claimed in claim 4 can bending COB packaged LED filamentray structure, it is characterized in that: described substrate (2) and heat sink (1) are formed with acute angle or right angle inclination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420191910.8U CN204062898U (en) | 2014-04-21 | 2014-04-21 | Can bending COB packaged LED filamentray structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420191910.8U CN204062898U (en) | 2014-04-21 | 2014-04-21 | Can bending COB packaged LED filamentray structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204062898U true CN204062898U (en) | 2014-12-31 |
Family
ID=52204405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420191910.8U Expired - Fee Related CN204062898U (en) | 2014-04-21 | 2014-04-21 | Can bending COB packaged LED filamentray structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204062898U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514097A (en) * | 2015-04-10 | 2016-04-20 | 郭垣成 | Bendable-ceramic COB LED light source sheet |
-
2014
- 2014-04-21 CN CN201420191910.8U patent/CN204062898U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514097A (en) * | 2015-04-10 | 2016-04-20 | 郭垣成 | Bendable-ceramic COB LED light source sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170802 Address after: 210008 Yizheng Economic Development Zone, Jiangsu, Ford Road, history, No. 6 Patentee after: Jiangsu Yide Electronic Technology Co. Ltd. Address before: 210008 Yizheng Economic Development Zone, Jiangsu, Ford Road, history, No. 6 Patentee before: Shi Jie |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20190421 |