CN204046937U - A kind of wiring board splicing structure with Organic Conductive Films - Google Patents
A kind of wiring board splicing structure with Organic Conductive Films Download PDFInfo
- Publication number
- CN204046937U CN204046937U CN201420410396.2U CN201420410396U CN204046937U CN 204046937 U CN204046937 U CN 204046937U CN 201420410396 U CN201420410396 U CN 201420410396U CN 204046937 U CN204046937 U CN 204046937U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- splicing
- organic conductive
- assembled
- conductive films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003475 lamination Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a kind of wiring board splicing structure with Organic Conductive Films, include wiring board, it is characterized in that: on described wiring board, be provided with multiple assembled region, groove is provided with in described assembled region, described groove floor is distributed with snapping hole and via, the hole wall of described via is provided with organic conductive rete, be provided with in described assembled region and can connect two pieces of wiring boards and the splicing apparatus making two pieces of circuit board mutual conduction, described splicing apparatus includes splicing seat, position corresponding with snapping hole below described splicing seat is provided with snap fit, position corresponding with via below described splicing seat is provided with conductive pole, the turning circuit being communicated with two conductive poles on splicing seat is provided with in described splicing seat.The purpose of this utility model is to overcome weak point of the prior art, provides a kind of structure simple, assembled convenient and swift, the wiring board splicing structure of band Organic Conductive Films.
Description
Technical field
The utility model relates to a kind of wiring board splicing structure with Organic Conductive Films.
Background technology
Each electric parts set is arranged on a sheet material in the mode that height is integrated by wiring board, namely facilitates the welding of electric parts, also optimizes the layout of circuit, the space shared by reduction.At present, there is the identical module circuitry of many line arrangements repeatedly can be used in same electronic circuit, therefore need to arrange in the circuit board and organize module circuitry more, but change can be there is according to actual conditions in the module circuitry really come into operation, if the module circuitry on wiring board does not all come into operation, then can waste a large amount of space resourcess, if the module circuitry on wiring board is not enough to needed for reality, then can make troubles for the layout of electronic circuit.Existing wiring board can solve above-mentioned defect by assembled mode, but existing splicing structure is relatively complicated, assembled convenient not.
So existing wiring board splicing structure awaits perfect further.
Utility model content
The purpose of this utility model is to overcome weak point of the prior art, provides a kind of structure simple, assembled convenient and swift, the wiring board splicing structure of band Organic Conductive Films.
In order to achieve the above object, the utility model adopts following scheme:
A kind of wiring board splicing structure with Organic Conductive Films, include wiring board, it is characterized in that: on described wiring board, be provided with multiple assembled region, groove is provided with in described assembled region, described groove floor is distributed with snapping hole and via, the hole wall of described via is provided with organic conductive rete, be provided with in described assembled region and can connect two pieces of wiring boards and the splicing apparatus making two pieces of circuit board mutual conduction, described splicing apparatus includes splicing seat, position corresponding with snapping hole below described splicing seat is provided with snap fit, position corresponding with via below described splicing seat is provided with conductive pole, the turning circuit being communicated with two conductive poles on splicing seat is provided with in described splicing seat.
A kind of wiring board splicing structure with Organic Conductive Films as above, it is characterized in that on described wiring board, be provided with four assembled regions, described four assembled regions are separately positioned on the centre position on four limits.
A kind of wiring board splicing structure with Organic Conductive Films as above, is characterized in that being respectively equipped with screw hole on described wiring board four angles.
A kind of wiring board splicing structure with Organic Conductive Films as above, it is characterized in that described wiring board comprises the upper layer circuit plate of lamination successively, intermediate layer wiring board and lower sandwich circuit board, described upper layer circuit plate and lower sandwich circuit board are symmetrically arranged with assembled region respectively, and the position corresponding with assembled region at described intermediate layer wiring board is provided with the pilot hole that snap fit can be made to catch on upper layer circuit plate or lower sandwich circuit board.
A kind of wiring board splicing structure with Organic Conductive Films as above, it is characterized in that being provided with on described wiring board the via running through upper layer circuit plate, intermediate layer wiring board and lower sandwich circuit board, described via inwall is provided with organic conductive rete, in described machine conductive film layer, is filled with yellow solder mask.
In sum, the utility model relative to its beneficial effect of prior art is:
The utility model structure is simple, assembled convenient, fast, without extra soldered conducting, can is stitched together to meet the demands by any polylith wiring board as required, so can satisfy the demands, and also can optimize overall duty ratio, very firmly stable between wiring board.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the utility model wiring board;
Schematic diagram when Fig. 2 is the splicing of the utility model wiring board;
Fig. 3 is the generalized section of A-A in Fig. 2;
Fig. 4 is the enlarged drawing at B place in Fig. 3;
Fig. 5 is the generalized section of wiring board.
Embodiment
Illustrate below in conjunction with accompanying drawing and with embodiment, the utility model to be further described:
A kind of wiring board splicing structure with Organic Conductive Films as shown in Fig. 1 to 5, include wiring board 1, described wiring board 1 is provided with multiple assembled region 2, groove 3 is provided with in described assembled region 2, described groove 3 bottom surface is distributed with snapping hole 4 and via 5, the hole wall of described via 5 is provided with organic conductive rete 6, be provided with in described assembled region 2 and can connect two pieces of wiring boards and the splicing apparatus 7 making two pieces of circuit board mutual conduction, described splicing apparatus 7 includes splicing seat 71, position corresponding with snapping hole 4 below described splicing seat 71 is provided with snap fit 72, position corresponding with via 5 below described splicing seat 71 is provided with conductive pole 73, the turning circuit being communicated with two conductive poles 73 on splicing seat 71 is provided with in described splicing seat 71.The utility model splicing apparatus 7 is adopted to carry out jigsaw, convenient and swift, and also splicing rear plate body flat appearance is attractive in appearance, can not affect installation.
One of them embodiment of the utility model, described wiring board 1 is provided with four assembled regions 2, and described four assembled regions 2 are separately positioned on the centre position on four limits.
On described wiring board 1 four angles, screw hole 8 is respectively equipped with in the utility model.
Wiring board 1 described in the utility model comprises the upper layer circuit plate 11 of lamination successively, intermediate layer wiring board 12 and lower sandwich circuit board 13, described upper layer circuit plate 11 and lower sandwich circuit board 13 are symmetrically arranged with assembled region 2 respectively, are provided with the pilot hole 121 that snap fit 72 can be made to catch on upper layer circuit plate 11 or lower sandwich circuit board 13 in the position that described intermediate layer wiring board 12 is corresponding with assembled region 2.
On described wiring board 1, the via 5 running through upper layer circuit plate 11, intermediate layer wiring board 12 and lower sandwich circuit board 13 is provided with in the utility model, described via 5 inwall is provided with organic conductive rete 6, in described machine conductive film layer 6, is filled with yellow solder mask 9.
Any polylith wiring board can be stitched together to meet the demands by the utility model as required, so can satisfy the demands, and also can optimize overall duty ratio, very firmly stable between wiring board.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (5)
1. the wiring board splicing structure with Organic Conductive Films, include wiring board (1), it is characterized in that: on described wiring board (1), be provided with multiple assembled region (2), groove (3) is provided with in described assembled region (2), described groove (3) bottom surface is distributed with snapping hole (4) and via (5), the hole wall of described via (5) is provided with organic conductive rete (6), be provided with in described assembled region (2) and two pieces of wiring boards can be connected and the splicing apparatus (7) making two pieces of circuit board mutual conduction, described splicing apparatus (7) includes splicing seat (71), the position that described splicing seat (71) below is corresponding with snapping hole (4) is provided with snap fit (72), the position that described splicing seat (71) below is corresponding with via (5) is provided with conductive pole (73), the turning circuit being communicated with splicing seat (71) upper two conductive poles (73) is provided with in described splicing seat (71).
2. a kind of wiring board splicing structure with Organic Conductive Films according to claim 1, it is characterized in that on described wiring board (1), be provided with four assembled regions (2), described four assembled regions (2) are separately positioned on the centre position on four limits.
3. a kind of wiring board splicing structure with Organic Conductive Films according to claim 1, is characterized in that being respectively equipped with screw hole (8) on described wiring board (1) four angle.
4. a kind of wiring board splicing structure with Organic Conductive Films according to claim 1, it is characterized in that described wiring board (1) comprises the upper layer circuit plate (11) of lamination successively, intermediate layer wiring board (12) and lower sandwich circuit board (13), described upper layer circuit plate (11) and lower sandwich circuit board (13) are symmetrically arranged with assembled region (2) respectively, the pilot hole (121) that snap fit (72) can be made to catch on upper layer circuit plate (11) or lower sandwich circuit board (13) is provided with in the position that described intermediate layer wiring board (12) is corresponding with assembled region (2).
5. a kind of wiring board splicing structure with Organic Conductive Films according to claim 4, it is characterized in that on described wiring board (1), be provided with the via (5) running through upper layer circuit plate (11), intermediate layer wiring board (12) and lower sandwich circuit board (13), described via (5) inwall is provided with organic conductive rete (6), in described machine conductive film layer (6), is filled with yellow solder mask (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420410396.2U CN204046937U (en) | 2014-07-23 | 2014-07-23 | A kind of wiring board splicing structure with Organic Conductive Films |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420410396.2U CN204046937U (en) | 2014-07-23 | 2014-07-23 | A kind of wiring board splicing structure with Organic Conductive Films |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204046937U true CN204046937U (en) | 2014-12-24 |
Family
ID=52247554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420410396.2U Expired - Fee Related CN204046937U (en) | 2014-07-23 | 2014-07-23 | A kind of wiring board splicing structure with Organic Conductive Films |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204046937U (en) |
-
2014
- 2014-07-23 CN CN201420410396.2U patent/CN204046937U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 |