CN204036679U - 丝线导向器监视装置和丝锯 - Google Patents
丝线导向器监视装置和丝锯 Download PDFInfo
- Publication number
- CN204036679U CN204036679U CN201420366308.3U CN201420366308U CN204036679U CN 204036679 U CN204036679 U CN 204036679U CN 201420366308 U CN201420366308 U CN 201420366308U CN 204036679 U CN204036679 U CN 204036679U
- Authority
- CN
- China
- Prior art keywords
- silk thread
- silk
- thread guider
- saw
- monitoring arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012544 monitoring process Methods 0.000 title claims abstract description 128
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- 238000005266 casting Methods 0.000 claims abstract description 36
- 230000005855 radiation Effects 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 description 64
- 238000000034 method Methods 0.000 description 26
- 238000010586 diagram Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 16
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- 239000010432 diamond Substances 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 7
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- 238000006243 chemical reaction Methods 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 238000007619 statistical method Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
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- 239000010959 steel Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
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- 238000000608 laser ablation Methods 0.000 description 1
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- 239000010453 quartz Substances 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14165254.5 | 2014-04-17 | ||
| EP14165254.5A EP2933049A1 (fr) | 2014-04-17 | 2014-04-17 | Dispositif de surveillance de guide de fil et procédé de surveillance d'un guide de fil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204036679U true CN204036679U (zh) | 2014-12-24 |
Family
ID=50513093
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410315096.0A Pending CN105014804A (zh) | 2014-04-17 | 2014-07-03 | 丝线导向器监视装置、丝锯和用于监视丝线导向器的方法 |
| CN201420366308.3U Expired - Fee Related CN204036679U (zh) | 2014-04-17 | 2014-07-03 | 丝线导向器监视装置和丝锯 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410315096.0A Pending CN105014804A (zh) | 2014-04-17 | 2014-07-03 | 丝线导向器监视装置、丝锯和用于监视丝线导向器的方法 |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2933049A1 (fr) |
| CN (2) | CN105014804A (fr) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH690907A5 (fr) * | 1996-05-23 | 2001-02-28 | Hct Shaping Systems Sa | Dispositif de sciage par fil |
| JPH1015805A (ja) * | 1996-07-02 | 1998-01-20 | Tokyo Seimitsu Co Ltd | ワイヤソー |
| DE10220640A1 (de) * | 2002-05-08 | 2002-12-19 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Abtrennen von Scheiben von einem Werkstück |
| WO2011070386A1 (fr) * | 2009-12-11 | 2011-06-16 | Applied Materials, Inc. | Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation |
-
2014
- 2014-04-17 EP EP14165254.5A patent/EP2933049A1/fr not_active Withdrawn
- 2014-07-03 CN CN201410315096.0A patent/CN105014804A/zh active Pending
- 2014-07-03 CN CN201420366308.3U patent/CN204036679U/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2933049A1 (fr) | 2015-10-21 |
| CN105014804A (zh) | 2015-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160427 Address after: American California Patentee after: Applied Materials Inc. Address before: Lausanne Patentee before: Applied Materials Switzerland Sarl |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161028 Address after: Hiroshima County Patentee after: Toyo Advanced Machine Tool Co., Ltd. Address before: American California Patentee before: Applied Materials Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20170703 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |