CN204029850U - A kind of COB encapsulating structure of substrate surface pattern - Google Patents
A kind of COB encapsulating structure of substrate surface pattern Download PDFInfo
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- CN204029850U CN204029850U CN201420343496.8U CN201420343496U CN204029850U CN 204029850 U CN204029850 U CN 204029850U CN 201420343496 U CN201420343496 U CN 201420343496U CN 204029850 U CN204029850 U CN 204029850U
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Abstract
The utility model discloses a kind of COB encapsulating structure of substrate surface pattern, comprise substrate, be fixed on the luminescence chip on described substrate by crystal-bonding adhesive, connect the bonding line of described substrate and described luminescence chip, protect the packing colloid of described luminescence chip and described bonding line, it is characterized in that, described upper surface of base plate is provided with graphical treatment layer and graduation processing layer, described luminescence chip sticks on described graduation processing layer, the utility model changes packing colloid inner total reflection light transmition direction, while making light again arrive packing colloid and air interface, incidence angle is less than critical angle, light refraction goes out packaging body, and the light emission rate of raising planar package light source, also strengthened light efficiency, the utility model technique is simple, workable, can be widely used in LED Packaging Industry.
Description
Technical field
The utility model relates to LED light source encapsulation technology field, relates in particular a kind of COB encapsulating structure of substrate surface pattern.
Background technology
At present, LED light source is applied in every field more and more widely, but the light extraction efficiency of LED remains the outstanding problem of its popularization of restriction.Cause the main cause of this problem can be summed up as the total reflection at luminescence chip issued light material interface place in packaging body, the refractive index of packing colloid is about 1.4-1.6, the refractive index of air is 1, the critical angle of packing colloid and air interface is 38 °～45 °, according to the refraction principle of light, when light is propagated to optically thinner medium by optically denser medium, if incidence angle is greater than critical angle, without refraction, all equal backspace optically denser media of light, therefore when too small critical angle makes a part of light propagate from optically denser medium to optically thinner medium, there is total reflection, the light that luminescence chip sends can not be made full use of, cause light emission rate low, affect the light efficiency of LED, the performances such as brightness.
Those skilled in the art adopt the method for wafer scale to solve compared with the problem of the LED luminescence chip of small size and the total reflection of packing colloid interface, the method of wafer scale has become industry habitual practice, and business-like planar light source light-emitting area is larger, technical staff adopts Planar integration encapsulating structure to improve total reflection problem, the method because of light source volume excessive, cause consuming a large amount of silica gel, increase and encapsulated bad probability, and adopt ladder refractive index colloform texture easily to produce bubble at colloidal interface place, also can cause colloid layering if different refractivity colloid adhesion is poor.
In sum, existing Planar integration encapsulating structure technology can not effectively solve because light causes in packaging body inner total reflection the problem that light efficiency is low, and the COB encapsulating structure how a kind of high light-emitting rate is provided is the problem that those skilled in the art need solution badly.
Utility model content
In view of this, the utility model provides a kind of COB encapsulating structure of substrate surface pattern, can effectively solve the problem of light in packaging body inner total reflection.
In order to realize above-mentioned functions, the utility model provides following technical scheme:
A kind of COB encapsulating structure of substrate surface pattern; comprise substrate; be fixed on the luminescence chip on described substrate by crystal-bonding adhesive; connect the bonding line of described substrate and described luminescence chip; protect the packing colloid of described luminescence chip and described bonding line; it is characterized in that, described upper surface of base plate is provided with graphical treatment layer and graduation processing layer, and described luminescence chip sticks on described graduation processing layer.
Preferably, in the COB of above-mentioned a kind of substrate surface pattern encapsulating structure, described graphical treatment layer is zigzag reflecting surface.
Preferably, in the COB of above-mentioned a kind of substrate surface pattern encapsulating structure, described graduation processing layer is that high heat conductive transparent silica gel is filled into described graphical treatment layer upper surface, then carries out that graduation processing completes.
Known via above-mentioned technical scheme, compared with prior art, the utility model openly provides a kind of COB encapsulating structure of substrate surface pattern, its emphasis is in order to solve the low problem of light emission rate in planar light source encapsulating structure, a kind of novel base plate for packaging numerical simulation technology proposing, in this structure, LED chip is arranged on by crystal-bonding adhesive on the substrate reflecting through the height of surface graphics processing, and encapsulate with packing colloid, this structure is mainly to utilize on base plate for packaging, to produce regular sawtooth triangle, change colloid inner total reflection light transmition direction, while making light again arrive packing colloid and air interface, incidence angle is less than critical angle, reflect, and the light emission rate of raising planar package light source, also strengthened light efficiency, the utility model technique is simple, workable, can be widely used in LED Packaging Industry.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail simultaneously.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 accompanying drawing is structural representation of the present utility model.
In figure: 1-substrate; 2-luminescence chip; 3-packing colloid; 4-graphical treatment layer; 5-planarization process layer; 6-crystal-bonding adhesive
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model embodiment discloses and a kind ofly can effectively solve the COB encapsulating structure of light in the substrate surface pattern of packaging body inner total reflection problem, has greatly increased the light emission rate of LED light source, has strengthened the light efficiency of LED light source.
To achieve these goals, provide following technical scheme:
As shown in Figure 1; a kind of COB encapsulating structure of substrate surface pattern; comprise substrate 1; be fixed on the luminescence chip 2 on substrate 1 by crystal-bonding adhesive 6; the bonding line of connection substrate 1 and luminescence chip 2; the packing colloid 3 of protection luminescence chip 2 and bonding line, also comprises that substrate 1 upper surface is provided with graphical treatment layer 4 and graduation processing layer 5, and luminescence chip 2 sticks on graduation processing layer 5.In this structure, LED luminescence chip 2 is arranged on by crystal-bonding adhesive 6 on the substrate 1 reflecting through the height of surface graphics processing, and encapsulate with packing colloid 3, this structure is mainly to utilize on base plate for packaging, to produce regular sawtooth triangle, change packing colloid 3 inner total reflection light transmition directions, while making light again arrive packing colloid 3 with air interface, incidence angle is less than critical angle, reflect, and the light emission rate of raising planar package light source.
In order further to optimize technique scheme, the COB encapsulating structure of a kind of substrate surface pattern in above-described embodiment also comprises that graphical treatment layer 4 is for zigzag reflecting surface, its Main Function is, increase the reflecting surface of light, can multi-direction reflection ray, while making light reach packing colloid 3 with air, incidence angle is less than critical angle, light can reflect packaging body, increases light emission rate.
In order further to optimize technique scheme, the COB encapsulating structure of a kind of substrate surface pattern in above-described embodiment also comprises that graduation processing layer 5 is that high heat conductive transparent silica gel is filled into described graphical treatment layer 4 upper surface, carry out again that graduation processing completes, its role is to, facilitate fixed placement luminescence chip 2.
Known via above-mentioned technical scheme, compared with prior art, the utility model openly provides a kind of COB encapsulating structure of substrate surface pattern, it has solved the low problem of light emission rate in planar light source encapsulating structure, this structure is mainly to utilize on base plate for packaging 1, to produce regular sawtooth triangle, change packing colloid 3 inner total reflection light transmition directions, while making light again arrive packing colloid 3 with air interface, incidence angle is less than critical angle, reflect, and the light emission rate of raising planar package light source, also strengthened light efficiency, the utility model technique is simple, workable, can be widely used in LED Packaging Industry.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.For the disclosed device of embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part illustrates referring to method part.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (3)
1. the COB encapsulating structure of a substrate surface pattern; comprise substrate; be fixed on the luminescence chip on described substrate by crystal-bonding adhesive; connect the bonding line of described substrate and described luminescence chip; protect the packing colloid of described luminescence chip and described bonding line; it is characterized in that, described upper surface of base plate is provided with graphical treatment layer and graduation processing layer, and described luminescence chip sticks on described graduation processing layer.
2. the COB encapsulating structure of a kind of substrate surface pattern according to claim 1, is characterized in that, described graphical treatment layer is zigzag reflecting surface.
3. the COB encapsulating structure of a kind of substrate surface pattern according to claim 1, is characterized in that, described graduation processing layer is that high heat conductive transparent silica gel is filled into described graphical treatment layer upper surface, then carries out that graduation processing completes.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420343496.8U CN204029850U (en) | 2014-06-26 | 2014-06-26 | A kind of COB encapsulating structure of substrate surface pattern |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420343496.8U CN204029850U (en) | 2014-06-26 | 2014-06-26 | A kind of COB encapsulating structure of substrate surface pattern |
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| CN204029850U true CN204029850U (en) | 2014-12-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133693A (en) * | 2020-10-13 | 2020-12-25 | 业成科技（成都）有限公司 | Packaging structure and manufacturing method thereof, backlight source assembly, electronic equipment and packaging equipment |
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2014
- 2014-06-26 CN CN201420343496.8U patent/CN204029850U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133693A (en) * | 2020-10-13 | 2020-12-25 | 业成科技（成都）有限公司 | Packaging structure and manufacturing method thereof, backlight source assembly, electronic equipment and packaging equipment |
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