CN203999810U - Baseplate support device, high temperature film-forming process chamber and base plate supports bar - Google Patents
Baseplate support device, high temperature film-forming process chamber and base plate supports bar Download PDFInfo
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- CN203999810U CN203999810U CN201420176154.1U CN201420176154U CN203999810U CN 203999810 U CN203999810 U CN 203999810U CN 201420176154 U CN201420176154 U CN 201420176154U CN 203999810 U CN203999810 U CN 203999810U
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- base plate
- plate supports
- substrate
- bearing surface
- fomale
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 abstract description 17
- 238000009825 accumulation Methods 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- -1 described in each Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
The utility model relates to base plate supports technical field, discloses a kind of baseplate support device, high temperature film-forming process chamber and base plate supports bar.Described baseplate support device, comprises multiple base plate supports bars, and described in each, base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, and described male and fomale(M&F) has the bearing surface of multiple protrusions.In technical solutions of the utility model, because base plate supports bar surface is not existing planar shaped, but there are multiple upholders, reduce the contact area with substrate, reduce the accumulation of heat, thereby reduced Intermolecular Forces, thereby reduced most advanced and sophisticated particle, and, between multiple bearing surfaces, there is sunk part, thereby reduced cusp field and the temperature contrast of substrate zone around, and then reduced most advanced and sophisticated spot, therefore, improved the yield of product.
Description
Technical field
The utility model relates to base plate supports technical field, particularly relates to a kind of baseplate support device, high temperature film-forming process chamber and base plate supports bar.
Background technology
In the array substrate manufacturing processed of liquid crystal panel, plasma enhanced chemical vapor deposition (PlasmaEnhanced Chemical Vapor Deposition, being called for short PECVD) technique is most important manufacturing process, to determine TFT(Thin Film Transistor on array substrate, thin film transistor) core process of electrology characteristic.But because of the feature of pecvd process self high vacuum, high temperature and manufacturing process chamber structure, in processing procedure process, can produce most advanced and sophisticated particle (Pin Particle) and most advanced and sophisticated spot (Pin Muar) problem at substrate surface.
As shown in Figure 1, Fig. 1 is the vertical view of the baseplate support device of prior art, this baseplate support device comprises multiple support bars 2, wherein, support bar 2 is called again tip (Pin), tip is generally made up of the bar of tip cap (Pin cap) and tip cap below, by tip cap as bearing surface, when substrate 1 is sent to pecvd process chamber and is loaded (Load) by mechanical manipulator, substrate 1 is placed on multiple support bars 2, in vapor deposition film-formation process due to cusp field (being support bar and the contact area of substrate) with around substrate zone exist temperature head to cause cusp field film membranous different with neighboring area, and then may on substrate 1, produce most advanced and sophisticated spot, in addition, substrate 1 weight is larger, when completing thin film deposition metacoxa 1 in the time unloading (Unload), for example, under hot environment (360 DEG C), Intermolecular Forces between support bar 2 and substrate 1 is larger, material on the support bar 2 contacting with substrate 1 can stick at the substrate 1 surface particle that tapers off to a point, particularly for the support bar 2 at supporting substrate 1 middle part, be central tip (Center Pin), as six tips in the middle of Fig. 1, the weight major part of whole substrate 1 all can be born by these six central tip, the pressure that central tip and substrate 1 contact area are subject to is larger, and heat is easily in this contact area accumulation, cause the temperature of this contact area higher, therefore cause Intermolecular Forces larger, make it more easily stick at the substrate 1 surface particle that tapers off to a point.
The defect of prior art is, in the technological process of high temperature film forming, easily produces most advanced and sophisticated spot and most advanced and sophisticated particle at the substrate surface of support bar contact, causes product bad, finally causes product yield lower.
Utility model content
The purpose of this utility model is to provide a kind of baseplate support device, high temperature film-forming process chamber and base plate supports bar, in order to reduce most advanced and sophisticated spot and the most advanced and sophisticated particle of substrate surface, and then the yield of raising product.
First the utility model embodiment provides a kind of baseplate support device, described baseplate support device comprises the base plate supports bar of multiple supporting substrates, described in each, base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, and described male and fomale(M&F) has the bearing surface of multiple protrusions.
In baseplate support device of the present utility model, because base plate supports bar surface is not existing planar shaped, but there is the male and fomale(M&F) of multiple bearing surfaces, multiple some contacts have been become from face contact, thereby reduce and the contact area of substrate, heat in support bar and substrate contacts region is difficult for accumulation, temperature is difficult for raising, and then reduce Intermolecular Forces, thereby reduce most advanced and sophisticated particle, and, between multiple bearing surfaces, there is sunk part, thereby cusp field and the temperature contrast of substrate zone are around reduced, and then reduce most advanced and sophisticated spot, therefore, improve the yield of product.
The shape of bearing surface is not limit, and preferred, described bearing surface is circular support face or Polygons bearing surface.For example, triangular support face, tetragon bearing surface, pentagon bearing surface or hexagon bearing surface.
The arrangement mode of bearing surface also can have multiple, and one is uniformly distributed for multiple bearing surfaces, for example, be multiple lines and multiple rows array arrangement.
Equally distributed multiple bearing surface, preferred, every square centimeter has 16～100 described bearing surfaces.
Another kind of is that multiple bearing surfaces are the bar shaped bearing surface of row's parallel arrangement.
Preferably, the spacing of every adjacent two described bar shaped bearing surfaces is 0.1～3 millimeter.
The contact area of bar shaped bearing surface and substrate has also had necessarily and has reduced, be unfavorable for thermal accumlation, therefore be beneficial to and reduce Intermolecular Forces, in addition, when bar shaped bearing surface be spaced apart 0.1～3 millimeter time, be beneficial to and reduce cusp field and the temperature contrast of substrate zone around, and then more effectively reduce most advanced and sophisticated spot, be beneficial to the yield that improves product.
For above-mentioned any baseplate support device, preferred, the bearing surface of described male and fomale(M&F) is 0.05～2 millimeter with the distance of depression bottom surface.
When bearing surface is with the distance of depression bottom surface when larger, the excellent support capability of substrate is reduced, when the distance of bearing surface and depression bottom surface hour, be unfavorable for again reducing cusp field and the temperature contrast of substrate zone around, therefore, preferably the bearing surface of male and fomale(M&F) is 0.05～2 millimeter with the distance of depression bottom surface.
In the time that the material of upholder and base plate supports bar is identical, can once shaped, thus effectively simplify the technological process that forms upholder, reduce the production cost of product.
The utility model embodiment also provides a kind of high temperature film-forming process chamber, be provided with multiple base plate supports bars in described high temperature film-forming process chamber interior, described in each, base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, and described male and fomale(M&F) has the bearing surface of multiple protrusions.
For the processing chamber of high temperature film forming, easily produce most advanced and sophisticated spot and most advanced and sophisticated particle, when the base plate supports bar in high temperature film-forming process chamber adopts the male and fomale(M&F) of multiple bearing surfaces, multiple some contacts have been become from face contact, reduce the contact area with substrate, heat in support bar and substrate contacts region is difficult for accumulation, temperature is difficult for raising, and then reduce Intermolecular Forces, thereby reduce most advanced and sophisticated particle, and, between multiple bearing surfaces, there is sunk part, thereby cusp field and the temperature contrast of substrate zone are around reduced, and then reduce most advanced and sophisticated spot, therefore, improve the yield of product.
Preferably, described multiple base plate supports bar supporting substrates central zone, region Shi Yi substrate center of described substrate center is round dot, taking 1/3rd border circular areas as radius formation of substrate length.
This high temperature film-forming process chamber is generally pecvd process chamber or magnetron sputtering technique chamber.
The utility model embodiment also provides a kind of base plate supports bar, and described base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, and described male and fomale(M&F) has the bearing surface of multiple protrusions.This base plate supports bar is applied in the baseplate support device that aforementioned techniques scheme provides, and also has aforementioned corresponding technique effect.
Brief description of the drawings
Fig. 1 is the vertical view of the baseplate support device of prior art;
Fig. 2 is the structural representation of the utility model one embodiment baseplate support device;
Fig. 3 is the structural representation of the utility model one embodiment baseplate support device supporting substrate;
Fig. 4 is the structural representation of the base plate supports bar of the utility model the first embodiment baseplate support device;
Fig. 5 is the structural representation of the base plate supports bar of the utility model the second embodiment baseplate support device;
Fig. 6 a is the structural front view of the base plate supports bar of the utility model the 3rd embodiment baseplate support device;
Fig. 6 b is the structure vertical view of the base plate supports bar of the utility model the 3rd embodiment baseplate support device;
Fig. 7 a is the structural front view of the base plate supports bar of the utility model the 4th embodiment baseplate support device;
Fig. 7 b is the structure vertical view of the base plate supports bar of the utility model the 4th embodiment baseplate support device.
Reference numeral:
1-substrate 2-support bar 3-base plate supports bar 4-bearing surface
The square bearing surface 42-of 41-bar shaped bearing surface 43-circular support face 44-triangular support face
Embodiment
In order to reduce most advanced and sophisticated spot and the most advanced and sophisticated particle of substrate surface, the utility model provides a kind of baseplate support device, high temperature film-forming process chamber and base plate supports bar.In this technical scheme, because base plate supports bar surface is not existing planar shaped, but there is the male and fomale(M&F) of multiple bearing surfaces, multiple some contacts have been become from face contact, reduce the contact area with substrate, and be easy to reduce the accumulation of contact area and peripheral region heat, temperature is difficult for raising, and then has reduced Intermolecular Forces, thereby has reduced most advanced and sophisticated particle, and, between multiple bearing surfaces, there is sunk part, thereby reduced cusp field and the temperature contrast of substrate zone around, and then reduced most advanced and sophisticated spot, therefore, improved the yield of product.For making the purpose of this utility model, technical scheme and advantage clearer, below lift specific embodiment the utility model is described in further detail.
As shown in Figure 2, the structural representation of the utility model one embodiment baseplate support device, described baseplate support device comprises multiple base plate supports bars 3, and each base plate supports bar 3 is male and fomale(M&F) towards the end face of one end of substrate, and male and fomale(M&F) has the bearing surface 4 of multiple protrusions.
In baseplate support device of the present utility model, baseplate support device of the present utility model is for supporting substrate, as shown in Figure 3, the structural representation of the utility model one embodiment baseplate support device supporting substrate, Fig. 3 is the front view of Fig. 2, substrate 1 is positioned on the bearing surface 4 of base plate supports bar 3, because base plate supports bar 3 surfaces are not existing planar shaped, but there is the male and fomale(M&F) of multiple bearing surfaces, multiple some contacts have been become from face contact, reduce the contact area with substrate 1, heat at contact area is difficult for accumulation, temperature is difficult for raising, and then reduce Intermolecular Forces, thereby reduce most advanced and sophisticated particle, and, between multiple bearing surfaces 4, there is space, thereby cusp field and the temperature contrast of substrate zone are around reduced, and then reduce most advanced and sophisticated spot, therefore, improve the yield of product.
In technical solutions of the utility model, the support bar of the supporting substrate peripheral portion in baseplate support device can adopt support bar of the prior art, remove the support bar of supporting substrate peripheral portion, should adopt the base plate supports bar with multiple upholders of the present utility model.Certainly, all to adopt the base plate supports bar with multiple upholders of the present utility model be preferred embodiment to all support bars in baseplate support device.
The shape of bearing surface is not limit, and preferred, described bearing surface is circular support face or Polygons bearing surface.For example, triangular support face, tetragon bearing surface, pentagon bearing surface or hexagon bearing surface.
Dissimilar bearing surface, its arrangement mode is also different, and bearing surface can be square bearing surface, circular support face and triangular support face etc., and these bearing surfaces can be uniformly distributed; Bearing surface also can be for bar shaped bearing surface, and multiple bar shaped bearing surfaces are arranged in row's multiple row mode, below enumerates respectively embodiment and introduces one by one.
As shown in Figure 4, Fig. 4 is the structural representation of the base plate supports bar of the utility model the first embodiment baseplate support device, and Fig. 4 is vertical view, and the bearing surface of base plate supports bar 3 is square bearing surface 41, in the time making, multiple box-shaped upholders of can arranging on base plate supports bar 3.Multiple square bearing surfaces 41 are arranged in array, and every square centimeter has 16～100 square bearing surfaces 41.
As shown in Figure 5, Fig. 5 is the structural representation of the base plate supports bar of the utility model the second embodiment baseplate support device, this figure is vertical view, the bearing surface of base plate supports bar 3 is the bar shaped bearing surface 42 of row's parallel arrangement, bar shaped bearing surface 42 1 row's multiple rows distribute, when making, can on base plate supports bar 3, make multiple bar shaped upholders that are arranged in parallel.
For bar shaped bearing surface 42, preferred, every adjacent two bar shaped bearing surfaces 42 be spaced apart 0.1～3 millimeter.
Bar shaped bearing surface 42 has good support performance, and also have necessarily and reduced with the contact area of substrate, reduce the accumulation of heat, be beneficial to and reduce Intermolecular Forces, in addition, when bar shaped bearing surface 42 be spaced apart 0.1～3 millimeter time, be beneficial to and reduce cusp field and the temperature contrast of substrate zone around, and then more effectively reduce most advanced and sophisticated spot, be beneficial to the yield that improves product.
As shown in Fig. 6 a and Fig. 6 b, Fig. 6 a is the structural front view of the base plate supports bar of the utility model the 3rd embodiment baseplate support device, Fig. 6 b is the structure vertical view of the base plate supports bar of the utility model the 3rd embodiment baseplate support device, the bearing surface of base plate supports bar 3 is circular support face 43, in the time making, can on base plate supports bar 3, make multiple columnar supports.Preferably, multiple circular support faces 43 are evenly distributed, for example, be arranged in array, and every square centimeter has 16～100 circular support faces 43.
As shown in Fig. 7 a and Fig. 7 b, Fig. 7 a is the structural front view of the base plate supports bar of the utility model the 4th embodiment baseplate support device, Fig. 7 b is the structure vertical view of the base plate supports bar of the utility model the 4th embodiment baseplate support device, the bearing surface of base plate supports bar 3 is triangular support face 44, in the time making, can on base plate supports bar 3, make multiple three terrace with edge shape upholders.Preferably, multiple triangular support faces 44 are uniformly distributed, for example, be arranged in array, and every square centimeter has 16～100 triangular support faces 44.Certainly, upholder can be taper type upholder, for example, be round platform, five terrace with edges or six terrace with edges etc., and the bearing surface of formation is respectively circle, pentagon or hexagon etc.
Shown in Fig. 3, for above-mentioned any baseplate support device, the bearing surface of male and fomale(M&F) is 0.05～2 millimeter with the distance of depression bottom surface.
When bearing surface is with the distance of depression bottom surface when larger, the excellent support capability of substrate 1 is reduced, when the distance of bearing surface and depression bottom surface hour, be unfavorable for again reducing cusp field and the temperature contrast of substrate zone around, therefore, preferably the bearing surface of male and fomale(M&F) is 0.05～2 millimeter with the distance of depression bottom surface.
On base plate supports bar, make upholder for above-mentioned, preferred, upholder is identical with the material of base plate supports bar, and upholder and base plate supports bar are structure as a whole, can once shaped, thus the technological process that forms upholder effectively simplified, reduce the production cost of product.
The utility model embodiment also provides a kind of high temperature film-forming process chamber, be provided with multiple base plate supports bars in high temperature film-forming process chamber interior, described in each, base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, and described male and fomale(M&F) has the bearing surface of multiple protrusions.For the processing chamber of high temperature film forming, easily produce most advanced and sophisticated spot and most advanced and sophisticated particle, when the base plate supports bar in high temperature film-forming process chamber adopts the male and fomale(M&F) of multiple bearing surfaces, multiple some contacts have been become from face contact, reduce the contact area with substrate, heat in support bar and substrate contacts region is difficult for accumulation, temperature is difficult for raising, and then reduce Intermolecular Forces, thereby reduce most advanced and sophisticated particle, and, between multiple bearing surfaces, there is sunk part, thereby cusp field and the temperature contrast of substrate zone are around reduced, and then reduce most advanced and sophisticated spot, therefore, improve the yield of product.The processing chamber of this high temperature film forming is for example pecvd process chamber or magnetron sputtering technique chamber.
In above-mentioned high temperature film-forming process chamber, multiple base plate supports bar supporting substrates central zone, this region Shi Yi substrate center of substrate center is round dot, taking 1/3rd border circular areas as radius formation of substrate length.
Because the base plate supports bar in substrate center region is stressed larger, more easily produce the problem of most advanced and sophisticated particle and most advanced and sophisticated spot, therefore, the base plate supports bar that is positioned at substrate center region in this high temperature film-forming process chamber adopts the base plate supports bar with above-mentioned male and fomale(M&F), the support bar of other supporting substrates adopts existing support bar, the problem that both can solve most advanced and sophisticated particle and most advanced and sophisticated spot, is also beneficial to cost-saving.
The utility model embodiment also provides a kind of base plate supports bar, and described base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, and described male and fomale(M&F) has the bearing surface of multiple protrusions.This base plate supports bar is applied in the baseplate support device that aforementioned techniques scheme provides, and also has aforementioned corresponding technique effect.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if these amendments of the present utility model and within modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (9)
1. a baseplate support device, it is characterized in that, comprise multiple base plate supports bars, described in each, base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, described male and fomale(M&F) has the bearing surface of multiple protrusions, and the bearing surface of described male and fomale(M&F) is 0.05～2 millimeter with the distance of depression bottom surface.
2. baseplate support device as claimed in claim 1, is characterized in that, described bearing surface is circular support face or Polygons bearing surface.
3. baseplate support device as claimed in claim 1, is characterized in that, multiple bearing surfaces are uniformly distributed.
4. baseplate support device as claimed in claim 3, is characterized in that, every square centimeter has 16～100 described bearing surfaces.
5. baseplate support device as claimed in claim 1, is characterized in that, multiple bearing surfaces are the bar shaped bearing surface of row's parallel arrangement.
6. baseplate support device as claimed in claim 5, is characterized in that, the spacing of every adjacent two described bar shaped bearing surfaces is 0.1～3 millimeter.
7. a high temperature film-forming process chamber, it is characterized in that, be provided with multiple base plate supports bars in described high temperature film-forming process chamber interior, described in each, base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, described male and fomale(M&F) has the bearing surface of multiple protrusions, and the bearing surface of described male and fomale(M&F) is 0.05～2 millimeter with the distance of depression bottom surface.
8. high temperature film-forming process chamber as claimed in claim 7, is characterized in that, described multiple base plate supports bar supporting substrates central zone, and region Shi Yi substrate center of described substrate center is round dot, taking 1/3rd border circular areas as radius formation of substrate length.
9. a base plate supports bar, is characterized in that, described base plate supports bar is male and fomale(M&F) towards the end face of one end of substrate, and described male and fomale(M&F) has the bearing surface of multiple protrusions, and the bearing surface of described male and fomale(M&F) is 0.05～2 millimeter with the distance of depression bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420176154.1U CN203999810U (en) | 2014-04-11 | 2014-04-11 | Baseplate support device, high temperature film-forming process chamber and base plate supports bar |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420176154.1U CN203999810U (en) | 2014-04-11 | 2014-04-11 | Baseplate support device, high temperature film-forming process chamber and base plate supports bar |
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| CN203999810U true CN203999810U (en) | 2014-12-10 |
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| CN201420176154.1U Expired - Fee Related CN203999810U (en) | 2014-04-11 | 2014-04-11 | Baseplate support device, high temperature film-forming process chamber and base plate supports bar |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653674A (en) * | 2015-11-04 | 2017-05-10 | 应用材料公司 | Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films |
| CN117604478A (en) * | 2023-11-13 | 2024-02-27 | 中国科学院上海光学精密机械研究所 | Large-caliber optical film element coating clamp |
-
2014
- 2014-04-11 CN CN201420176154.1U patent/CN203999810U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653674A (en) * | 2015-11-04 | 2017-05-10 | 应用材料公司 | Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films |
| US11508611B2 (en) | 2015-11-04 | 2022-11-22 | Applied Materials, Inc. | Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films |
| CN106653674B (en) * | 2015-11-04 | 2024-04-16 | 应用材料公司 | For eliminating tetraethoxysilane oxide film enhanced lifter design for localized thickness non-uniformity |
| CN117604478A (en) * | 2023-11-13 | 2024-02-27 | 中国科学院上海光学精密机械研究所 | Large-caliber optical film element coating clamp |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 |
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| CF01 | Termination of patent right due to non-payment of annual fee |