CN203909067U - All-metal capacitive pole plate micro accelerometer - Google Patents
All-metal capacitive pole plate micro accelerometer Download PDFInfo
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- CN203909067U CN203909067U CN201420315796.5U CN201420315796U CN203909067U CN 203909067 U CN203909067 U CN 203909067U CN 201420315796 U CN201420315796 U CN 201420315796U CN 203909067 U CN203909067 U CN 203909067U
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Abstract
The utility model provides an all-metal capacitive pole plate micro accelerometer which has a three-layer all-metal structure including a moving pole plate, and upper and lower fixed pole plates, wherein the moving pole plate comprises an anchor point, a mass block, a cantilever beam and a framework. The anchor point is fixedly connected with the cantilever beam which is connected with the mass block to form a movable portion of a sensitive chip, and the anchor point is fixedly connected with the framework. Gaps exist between the mass block and the upper and lower fixed pole plates, and the upper and lower surfaces of the gaps are of all-metal structure. The upper fixed pole plate and the upper surface of the anchor point of the moving pole plate are in bonding connection, and the lower fixed pole plate and the lower surface of the anchor point are in bonding connection. The bonding is completed through hot pressing, and the gaps between the mass block and the upper and lower pole plates are flexibly and accurately controlled.
Description
Technical field
The utility model belongs to microelectromechanical systems field, be specifically related to a kind of all-metal capacitor plate micro-acceleration sensor, have good compatibility with CMOS, this device is by oxide layer control capacitance gap, can adjust flexibly sensitivity, encapsulation adopts more reliable thermocompression bonding.
Background technology
For condenser type micro-acceleration sensor, the consistance that guarantees capacitance gap between pole plate is very important, the general method of wet etching that adopts is made polar plate interval, but corrosive liquid and etching condition is inconsistent, as the variation of the conditions such as corrosive liquid concentration, corrosion temperature can cause Corrosion results, great changes have taken place, directly causes smaller capacitive gap to be difficult to accurate control.
For protection electric capacity makes micro-acceleration sensor avoid the pollution of extraneous external environment, make sensor construction keep stable, need carry out encapsulation process to it.Encapsulation will guarantee not affect the performance of sensor, and lead-in wire and installation are reliable, and is simple and easy to realize, and is convenient to batch production, and current encapsulation mainly adopts bonding to complete.If bonding material is different, thermal expansivity is different, during bonding, will inevitably introduce unrelieved stress, must consider the impact of temperature on sensor performance in this case.If need to add high voltage during bonding, can there is strong electrostatic attraction, because Capacitive microsensor comprises moving part, may there is middle plate and upper or bottom crown adhesion, destroy sensor construction.In addition, consider the compatibility of MEMS and CMOS, optimum condenser type micro-acceleration sensor must be all-metal construction.
Summary of the invention
The purpose of this utility model is to provide a kind of all-metal capacitor plate micro-acceleration sensor, sensor is three-decker, capacitor plate spacing is determined by silicon oxide thickness, can accurately control the sensitivity of micro-acceleration sensor, and technique is simple to operation, repeatability is strong, is easy to realize mass.Capacitor plate is all-metal construction, encapsulation adopts Jin-Jin thermocompression bonding, without making alive, can avoid damaging because of the microstructure that voltage causes two pole plate bondings, and the material for bonding is identical, can avoid because of the different unrelieved stresss of introducing of thermal expansivity.
The utility model is achieved through the following technical solutions.
All-metal capacitor plate micro-acceleration sensor of the present utility model, is characterized in, described sensor comprises fixed polar plate, lower fixed polar plate, movable plate electrode; Wherein, movable plate electrode contains on anchor point, semi-girder, mass, upper surface moving electrode, lower surface moving electrode, anchor point bonding face, upper transmission electrode, lower transmission electrode, framework, lead wire tray under bonding face, anchor point.Upper fixed polar plate contains upper limit boss, upper bonding face, upper lead wire tray, upper substrate.Lower fixed polar plate contains lower limit boss, lower bonding face, lower lead wire tray, infrabasal plate.Its annexation is that described anchor point is fixedly connected with respectively with bonding face under bonding face, anchor point on anchor point; Described anchor point is fixedly connected with semi-girder; Described anchor point is fixedly connected with respectively with framework, lead wire tray.Described semi-girder is fixedly connected with respectively with upper transmission electrode, lower transmission electrode; Described semi-girder is fixedly connected with mass.Described mass is fixedly connected with respectively with upper surface moving electrode, lower surface moving electrode.Described upper fixed polar plate is fixedly connected with upper limit boss.Described upper limit boss is fixedly connected with upper bonding face.Described upper lead wire tray is fixedly connected with upper substrate.Described lower fixed polar plate is fixedly connected with lower limit boss.Described lower limit boss is fixedly connected with lower bonding face.Described lower lead wire tray is fixedly connected with infrabasal plate.Described movable plate electrode is connected by bonding respectively with upper fixed polar plate, lower fixed polar plate.
Upper gap between described movable plate electrode and upper fixed polar plate, lower fixed polar plate, lower gap arrange by upper limit boss, lower limit boss respectively.
Described movable plate electrode is fixedly connected with by bonding face, upper bonding face on anchor point with upper fixed polar plate.
Described movable plate electrode is fixedly connected with by bonding face, lower bonding face under anchor point with lower fixed polar plate.
Bonding face under bonding face, anchor point on described upper surface moving electrode, lower surface moving electrode, anchor point, upper transmission electrode, lower transmission electrode, upper bonding face, lower bonding face, upper fixed electorde are all identical with lower fixed electorde thickness.
All-metal capacitor plate micro-acceleration sensor of the present utility model, when the acceleration along device normal direction acts on device, inertial force is offset mass, cause upper and lower two electric capacity to change, produce capacitance difference, controlled voltage, then feed back to application of force electrode, the electrostatic forcing producing is on mass, and mass is got back to original position.Feedback voltage with by measuring acceleration, be there is certain relation, thereby measure acceleration.
Its advantage of all-metal capacitor plate micro-acceleration sensor of the present utility model is:
1. upper and lower two pole plates of electric capacity are all-metal planar structure, compare closer to ideal capacitance with silicon-metal face electric capacity with silicon-silicon face electric capacity.
2. the condenser type micro-acceleration sensor of design is all-metal construction, can be compatible with CMOS.
3. adopt Jin-Jin thermocompression bonding.Thermocompression bonding, without making alive, is avoided damaging because of the microstructure that voltage causes two pole plate bondings.
4. bonding need at high temperature carry out, and same metal material bonding can be avoided, because of the different unrelieved stresss of introducing of different materials thermal expansivity, need not examining the impact of temperature on sensitivity.
5. adopt oxide layer control capacitance polar plate spacing.By silicon face growth oxide layer, replace corrosion silicon to make the interval between mass moving electrode and upper and lower fixed electorde, can be by controlling the accurate control capacitance of growth of silicon oxide thickness gap, realized the making of small capacitance spacing, can control flexibly sensitivity, and technique realizes simple, is beneficial to batch production.
6. upper and lower fixed electorde is produced on low-resistance silicon face, and movable plate electrode and upper and lower fixed polar plate be all-metal construction, goes between simple to operate.
7. movable plate electrode metal level covers whole surface, and moving electrode signal spreads out of along mass, semi-girder and anchor point surface metal-layer, the pollution of avoiding some processing steps such as the necessary photoetching of graphical metal level, corrosion to cause.
Accompanying drawing explanation
Fig. 1 is all-metal capacitor plate micro-acceleration sensor overall diagram of the present utility model;
Fig. 2 is all-metal capacitor plate micro-acceleration sensor exploded view of the present utility model;
Fig. 3 is the sensitive chip schematic diagram in all-metal capacitor plate micro-acceleration sensor of the present utility model;
Fig. 4 is the sensitive chip vertical view in all-metal capacitor plate micro-acceleration sensor of the present utility model;
Fig. 5 is the sectional view along Fig. 1 A-A hatching line;
In figure, 1. 17. times fixed polar plates of fixed polar plate in 15. times lead wire tray 16. of lead wire tray 14. lead wire tray on 11. movable plate electrode 12. frameworks 13. of gap, 102. times, gap on 92. times fixed electordes 101. of fixed electorde on 72. times bonding faces of bonding face, 81. upper limit boss 82. lower limit boss 91. on 64. times transmission electrodes 71. of transmission electrode on bonding face 63. under bonding face 62. anchor points on anchor point 2. upper substrate 3. infrabasal plate 4. semi-girder 5. mass 61. anchor points.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
Embodiment 1
Fig. 1 is all-metal capacitor plate micro-acceleration sensor overall diagram of the present utility model, Fig. 2 is all-metal capacitor plate micro-acceleration sensor exploded view of the present utility model, Fig. 3 is the sensitive chip schematic diagram in all-metal capacitor plate micro-acceleration sensor of the present utility model, Fig. 4 is the sensitive chip vertical view in all-metal capacitor plate micro-acceleration sensor of the present utility model, and Fig. 5 is the sectional view along Fig. 1 A-A hatching line.In Fig. 1 ~ 5, all-metal capacitor plate micro-acceleration sensor of the present utility model, comprises fixed polar plate 16, lower fixed polar plate 17, movable plate electrode 11; Wherein, movable plate electrode 11 contains on anchor point 1, semi-girder 4, mass 5, upper surface moving electrode 65, lower surface moving electrode 66, anchor point bonding face 62, upper transmission electrode 63, lower transmission electrode 64, framework 12, lead wire tray 14 under bonding face 61, anchor point; Upper fixed polar plate 16 contains upper limit boss 81, upper bonding face 71, upper lead wire tray 13, upper substrate 2; Lower fixed polar plate 17 contains lower limit boss 82, lower bonding face 72, lower lead wire tray 15, infrabasal plate 3; Its annexation is that described anchor point 1 is fixedly connected with respectively with bonding face 62 under bonding face on anchor point 61, anchor point; Described anchor point 1 is fixedly connected with semi-girder 4; Described anchor point 1 is fixedly connected with respectively with framework 12, lead wire tray 14; Described semi-girder 4 is fixedly connected with respectively with upper transmission electrode 63, lower transmission electrode 64; Described semi-girder 4 is fixedly connected with mass 5; Described mass 5 is fixedly connected with respectively with upper surface moving electrode 65, lower surface moving electrode 66; Described upper fixed polar plate 16 is fixedly connected with upper limit boss 81; Described upper limit boss 81 is fixedly connected with upper bonding face 71; Described upper lead wire tray 13 is fixedly connected with upper substrate 2; Described lower fixed polar plate 17 is fixedly connected with lower limit boss 82; Described lower limit boss 82 is fixedly connected with lower bonding face 72; Described lower lead wire tray 15 is fixedly connected with infrabasal plate 3; Described movable plate electrode 11 is connected by bonding respectively with upper fixed polar plate 16, lower fixed polar plate 17.
Upper gap 101 between described movable plate electrode 11 and upper fixed polar plate 16, lower fixed polar plate 17, lower gap 102 arrange by upper limit boss 81, lower limit boss 82 respectively.
Described movable plate electrode 11 is fixedly connected with by bonding face on anchor point 61, upper bonding face 71 with upper fixed polar plate 16.
Described movable plate electrode 11 is fixedly connected with by bonding face under anchor point 62, lower bonding face 72 with lower fixed polar plate 17.
Described movable plate electrode 11 and the upper gap between upper fixed polar plate 16 101 are 2 μ m; And the lower gap between lower fixed polar plate 17 102 is 2 μ m, make sensitive chip have certain movement clearance on the one hand, can adjust sensitivity on the other hand.
Described upper surface moving electrode 65, lower surface moving electrode 66, upper fixed electorde 91, lower fixed electorde 92 are respectively the metal material of thickness 0.5 μ m.
Described upper transmission electrode 63, lower transmission electrode 64 are respectively the metal of thickness 0.5 μ m.
On described anchor point, under bonding face 61, anchor point, bonding face 62, upper bonding face 71, lower bonding face 72 are respectively the metal of thickness 0.5 μ m.
The low-resistance silicon that described upper fixed polar plate 16 and lower fixed polar plate 17 are thickness 400 μ m.
Described movable plate electrode 11 is the High Resistivity Si of thickness 400 μ m.
In the present embodiment, sensitive chip length is 6000 μ m, and width is 6000 μ m, and thickness is 400 μ m; Mass length is 2000 μ m, and width is 2000 μ m, and thickness is 400 μ m; Semi-girder length is 150 μ m, and width is 1000 μ m, and thickness is 50 μ m; Lead wire tray length is 1000 μ m, and width is 800 μ m, and thickness is 400 μ m.
The utility model is absolutely not only confined to embodiment.
Claims (5)
1. an all-metal capacitor plate micro-acceleration sensor, is characterized in that: described sensor comprises fixed polar plate (16), lower fixed polar plate (17), movable plate electrode (11); Wherein, movable plate electrode (11) contains on anchor point (1), semi-girder (4), mass (5), upper surface moving electrode (65), lower surface moving electrode (66), anchor point bonding face (62), upper transmission electrode (63), lower transmission electrode (64), framework (12), lead wire tray (14) under bonding face (61), anchor point; Upper fixed polar plate (16) contains upper limit boss (81), upper bonding face (71), upper lead wire tray (13), upper substrate (2); Lower fixed polar plate (17) contains lower limit boss (82), lower bonding face (72), lower lead wire tray (15), infrabasal plate (3); Its annexation is that described anchor point (1) is fixedly connected with respectively with bonding face (62) under bonding face on anchor point (61), anchor point; Described anchor point (1) is fixedly connected with semi-girder (4); Described anchor point (1) is fixedly connected with respectively with framework (12), lead wire tray (14); Described semi-girder (4) is fixedly connected with respectively with upper transmission electrode (63), lower transmission electrode (64); Described semi-girder (4) is fixedly connected with mass (5); Described mass (5) is fixedly connected with respectively with upper surface moving electrode (65), lower surface moving electrode (66); Described upper fixed polar plate (16) is fixedly connected with upper limit boss (81); Described upper limit boss (81) is fixedly connected with upper bonding face (71); Described upper lead wire tray (13) is fixedly connected with upper substrate (2); Described lower fixed polar plate (17) is fixedly connected with lower limit boss (82); Described lower limit boss (82) is fixedly connected with lower bonding face (72); Described lower lead wire tray (15) is fixedly connected with infrabasal plate (3); Described movable plate electrode (11) is connected by bonding respectively with upper fixed polar plate (16), lower fixed polar plate (17).
2. all-metal capacitor plate micro-acceleration sensor according to claim 1, is characterized in that: the upper gap (101) between described movable plate electrode (11) and upper fixed polar plate (16), lower fixed polar plate (17), lower gap (102) arrange by upper limit boss (81), lower limit boss (82) respectively.
3. all-metal capacitor plate micro-acceleration sensor according to claim 1, is characterized in that: described movable plate electrode (11) is fixedly connected with by bonding face on anchor point (61), upper bonding face (71) with upper fixed polar plate (16).
4. all-metal capacitor plate micro-acceleration sensor according to claim 1, is characterized in that: described movable plate electrode (11) is fixedly connected with by bonding face under anchor point (62), lower bonding face (72) with lower fixed polar plate (17).
5. all-metal capacitor plate micro-acceleration sensor according to claim 1, is characterized in that: bonding face (62) under bonding face (61), anchor point on described upper surface moving electrode (65), lower surface moving electrode (66), anchor point, upper transmission electrode (63), lower transmission electrode (64), upper bonding face (71), lower bonding face (72), upper fixed electorde (91) are all identical with lower fixed electorde (92) thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420315796.5U CN203909067U (en) | 2014-06-16 | 2014-06-16 | All-metal capacitive pole plate micro accelerometer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420315796.5U CN203909067U (en) | 2014-06-16 | 2014-06-16 | All-metal capacitive pole plate micro accelerometer |
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| Publication Number | Publication Date |
|---|---|
| CN203909067U true CN203909067U (en) | 2014-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420315796.5U Withdrawn - After Issue CN203909067U (en) | 2014-06-16 | 2014-06-16 | All-metal capacitive pole plate micro accelerometer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020313A (en) * | 2014-06-16 | 2014-09-03 | 中国工程物理研究院电子工程研究所 | All-metal capacitor plate micro-acceleration sensor |
-
2014
- 2014-06-16 CN CN201420315796.5U patent/CN203909067U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020313A (en) * | 2014-06-16 | 2014-09-03 | 中国工程物理研究院电子工程研究所 | All-metal capacitor plate micro-acceleration sensor |
| CN104020313B (en) * | 2014-06-16 | 2016-05-25 | 中国工程物理研究院电子工程研究所 | A kind of all-metal capacitor plate micro-acceleration sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141029 Effective date of abandoning: 20160525 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |