CN203895495U - Array-type thermosetting LED line holder structure - Google Patents
Array-type thermosetting LED line holder structure Download PDFInfo
- Publication number
- CN203895495U CN203895495U CN201420221806.9U CN201420221806U CN203895495U CN 203895495 U CN203895495 U CN 203895495U CN 201420221806 U CN201420221806 U CN 201420221806U CN 203895495 U CN203895495 U CN 203895495U
- Authority
- CN
- China
- Prior art keywords
- bowl
- shape pedestal
- support plate
- array
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an array-type thermosetting LED line holder structure. The structure is composed of a carrying board and a bowl-shaped base formed on the carrying board through an epoxy molding compound (EMC), wherein a recessed bowl-shaped space is disposed in the middle of the top face of the bowl-shaped base, the carrying board comprises a chip carrying part whose top face is exposed to the bowl-shaped space so as to allow a plurality of chips to be implanted, and because the bowl-shaped base is molded on the carrying board, packaged LED products can be separated without cutting the bowl-shaped base after the bowl-shaped base is supplied to a packaging plant for packaging work, thereby avoiding dusts generated during bowl-shaped base cutting, saving costs on equipment such as a cutting device, a dust collecting device and other filtering devices required to be additionally purchased by the package plant otherwise, and maintaining a dust-free environment of the packaging plant and the yield of chips on board (COBs).
Description
Technical field
The utility model relates to a kind of array-type LED wire frame structure, espespecially a kind of array-type LED wire frame structure that molds bowl-shape pedestal with thermoset plastics (EMC).
Background technology
Light-emitting diode (LED, Light Emitting Diode) is general being applied in each electronic product to save the energy, compact characteristic and extensively; LED develops after high brightness (HI-POWER LED) technology in recent years, replaces more gradually traditional various illumination light-emitting device, such as industrial, home lighting, traffic route etc., all can see the trace that LED is used.But in high-brightness LED when running, can produce the used heat of higher temperature, affect the useful life of high-brightness LED, therefore industry by COB (chip on board) package application in the processing procedure of high-brightness LED, to meet the demand to dispelling the heat.
Be different from the LED of general single wafer, it is by routing that COB (chip on board) encapsulates, penetrate bowl-shape pedestal, packaging operation is transferred on the support plate with heat sinking function, and described support plate can be aluminium base or ceramic substrate.During manufacture, after first a sheet material being made to the support plate of plural proper alignment, carry out surface treatment (sputter, electricity/chemical deposition, and gold-tinted micro-photographing process) to form, plant brilliant space, afterwards via the encapsulation factory plural wafer of adhering in planting brilliant space, plural wafer is after matrix arrangement, the step such as encapsulate again, complete array-type LED finished product; Support plate surface processing equipment cost is wherein quite expensive.
In order to reduce costs, part dealer adopts traditional LED processing procedure, on support plate, penetrates after bowl-shape pedestal, implants array-type LED wafer (die bond), then carries out routing, encapsulation etc.Yet, the material of general bowl-shape pedestal is PET (PETG) or PPA (polyphthalamide), the two is all resistant to elevated temperatures thermoplastics, although support plate has possessed heat sinking function, but the high temperature waste hot that the running of plural wafer produces still can accelerate the bowl-shape pedestal of PET and PPA material to be produced deterioratedly, allows the reflectivity variation of LED finished product.
For solving easily deteriorated problem of PET and PPA, in recent years start with thermoset plastics (EMC, Epoxy Molding Compound) replace PET and PPA, at present to take epoxy resin (EPOXY) be application mainstream to EMC, there is the advantages such as high density, high heat-resisting, anti-yellowing change, high-air-tightness, compared to PET and PPA, EMC is not more subject to the impact that LED running produces used heat, can maintain product quality.
But during EMC moulding, be limited to material behavior, it is the manufacture moulding with similar die casting, as shown in Figure 1, its plural bowl-shape pedestal 1 is arranged with the matrix form that is connected between two on coil holder material strip 2, if encapsulation factory wish cuts bowl-shape pedestal 1 by EMC LED finished product, must purchase in addition cutting apparatus, increase equipment cost.Moreover, while cutting bowl-shape pedestal, can produce dust, allow encapsulation factory that dust collect plant need to be set in addition, and other filtering devices, in order to avoid the dustfree environment of impact encapsulation factory reduces the qualification rate that COB encapsulates.
In addition, the edge that cuts rear bowl-shape pedestal can produce irregular burr, and EMCLED finished product after encapsulating, cutting must in addition just can carry out packet assembler after Quality Detection through utilizing vibrations to arrange automatically feed measuring tool, cause EMC LED finished product when charging, to be given a shock collision and easily from burr, produce the flaw of slight crack.
In view of this, the utility model designer accumulates research and the practical experience of association area for many years, special utility model goes out a kind of array heat curing-type LED wire frame structure, must purchase in addition cutting apparatus when solving existing encapsulation factory processes EMCLED finished product cuts bowl-shape pedestal, and after cutting, can produce dust, the disappearance of impact encapsulation factory dustfree environment.
Utility model content
The purpose of this utility model is to provide a kind of array heat curing-type LED wire frame structure, the bowl-shape pedestal of this coil holder is with thermoset plastics (EMC) moulding, and plural bowl-shape pedestal is spaced with preset distance on coil holder material strip, follow-up EMC LED finished product can directly from material strip, be fractureed and carry out qualification rate detection.
For achieving the above object, the technical solution adopted in the utility model is:
An array heat curing-type LED wire frame structure, is characterized in that: by a support plate, and one with thermoset plastic forming, the bowl-shape pedestal on support plate is formed, wherein:
The outline periphery of this bowl-shape pedestal is provided with fillet, and the central authorities of this bowl-shape pedestal have a bowl shaped space, and described bowl shaped space is recess with respect to bowl-shape base top surface;
This support plate comprises an end face and is exposed in bowl shaped space and with array way, plants brilliant crystal chip bearing portion for plural LED wafer, and two junctions that are emerging in respectively bowl-shape pedestal two outer side edges confession external circuits connections, between described crystal chip bearing portion and two junctions, be respectively equipped with for the fixing space, location of bowl-shape pedestal, and bowl-shape pedestal has two isolation location divisions that embed in corresponding space, location.
Wherein, described crystal chip bearing portion wherein a side extend to bowl-shape pedestal outside and form junction.
Wherein, the outline of bowl-shape pedestal is cuboid or square.
Wherein, the bowl shaped space of bowl-shape pedestal depression is truncated cone-shaped wide at the top and narrow at the bottom.
Wherein, described support plate is made by a sheet material, proper alignment plural number support plate on this sheet material, and plural bowl-shape pedestal is array on plural support plate to be arranged, and interval preset distance between two adjacent bowl-shape pedestals.
Rely on above-mentioned structure, described coil holder is supplied with encapsulation factory and is carried out after packaging operation, need not cut bowl-shape pedestal, just can the LED finished product after encapsulation is separated from material strip, maintain the integrality of bowl-shape pedestal fillet outline.Simultaneously, in the time of can avoiding cutting bowl-shape pedestal, produce dust, to save encapsulation factory, must purchase in addition cutting means, dust collect plant, and the equipment cost of other filtering devices, the dustfree environment of encapsulation factory and the qualification rate of COB (chip on board) encapsulation maintained.
Compared to prior art, the utlity model has following advantage:
1. the utility model makes EMC LED finished product directly from material strip, directly fracture and to carry out qualification rate detection, exempts in prior art and needs to purchase in addition the shortcoming that cutting apparatus cuts bowl-shape pedestal.
2. because the utility model is for cutting operation to bowl-shape pedestal, therefore produce dust in the time of can avoiding cutting, save encapsulation factory and must purchase in addition cutting means, dust collect plant, and the equipment cost of other filtering devices, maintain the dustfree environment of encapsulation factory and the qualification rate of COB (chip on board) encapsulation.
Following foundation technological means of the present utility model, lists and is suitable for embodiment of the present utility model, and coordinate graphic explanation as after.
Accompanying drawing explanation
Fig. 1 is that existing EMC LED coil holder is arranged schematic diagram.
Fig. 2 is that bowl-shape pedestal of the present utility model is arranged schematic diagram on coil holder material strip.
Fig. 3 is coil holder stereo appearance figure of the present utility model
Fig. 4 is wire frame structure schematic diagram of the present utility model.
Fig. 5 is another visual angle stereo appearance figure of coil holder of the present utility model.
Description of reference numerals: 100-material strip; 10-support plate; 11-crystal chip bearing portion; 12-junction; 13-locates space; The bowl-shape pedestal of 20-; 21-fillet; 22-bowl shaped space; 23-location division.
Embodiment
As shown in Figure 2 and Figure 3, array heat curing-type LED wire frame structure is by a support plate 10, and a bowl-shape pedestal 20 taking shape on support plate 10 with thermoset plastics (EMC) is formed.Described support plate 10 is made by a sheet material, proper alignment plural number support plate 10 on this sheet material, the bowl-shape pedestal 20 of plural number is array on plural support plate 10 to be arranged, and interval preset distance between two adjacent bowl-shape pedestals 20, and formation can be for the coil holder material strip 100 of encapsulation factory work.
Described coil holder material strip 100 is supplied with encapsulation factories and is carried out after packaging operation, need not cut bowl-shape pedestal 20, just can, by the LED finished product after encapsulation from material strip 100 separation that fractures, maintain the integrality of bowl-shape pedestal 20 fillet 21 outlines.Simultaneously, in the time of can avoiding cutting bowl-shape pedestal 20, produce dust, to save encapsulation factory, must purchase in addition cutting means, dust collect plant, and the equipment cost of other filtering devices, the dustfree environment of encapsulation factory and the qualification rate of COB (chip on board) encapsulation maintained.
As shown in Figures 3 to 5, the outline periphery of described bowl-shape pedestal 20 is provided with fillet 21, and the central authorities of this bowl-shape pedestal 20 have a bowl shaped space 22, and this bowl shaped space 22 is recess with respect to bowl-shape pedestal 20 end faces.
Described support plate 10 comprises an end face and is exposed to the plural LED wafer of the interior confession of bowl shaped space 22 and plants brilliant crystal chip bearing portion 11 with array way, and two are emerging in respectively the junction 12 that 20 liang of outer side edges of bowl-shape pedestal connect for external circuits; Between described crystal chip bearing portion 11 and two junctions 12, be respectively equipped with for the fixing space, location 13 of bowl-shape pedestal 20, and bowl-shape pedestal 20 has two isolation location divisions 23 and embeds in corresponding space, location 13, to increase the set area for bowl-shape pedestal 20.During enforcement, a crystal chip bearing portion 11 wherein side extends to bowl-shape pedestal 20 outsides formation junctions 12
As shown in Figure 3, the outline of bowl-shape pedestal 20 can be cuboid or square, and bowl shaped space 22 can be truncated cone-shaped wide at the top and narrow at the bottom.
Compared to prior art, the utlity model has following advantage:
1. the utility model makes EMC LED finished product directly from material strip, directly fracture and to carry out qualification rate detection, exempts in prior art and needs to purchase in addition the shortcoming that cutting apparatus cuts bowl-shape pedestal.
2. because the utility model is for cutting operation to bowl-shape pedestal, therefore produce dust in the time of can avoiding cutting, save encapsulation factory and must purchase in addition cutting means, dust collect plant, and the equipment cost of other filtering devices, maintain the dustfree environment of encapsulation factory and the qualification rate of COB (chip on board) encapsulation.
More than illustrate the utility model just illustrative; and nonrestrictive, those of ordinary skills understand, in the situation that do not depart from the spirit and scope that claim limits; can make many modifications, variation or equivalence, but within all falling into protection range of the present utility model.
Claims (5)
1. an array heat curing-type LED wire frame structure, is characterized in that: by a support plate, and one with thermoset plastic forming, the bowl-shape pedestal on support plate is formed, wherein:
The outline periphery of this bowl-shape pedestal is provided with fillet, and the central authorities of this bowl-shape pedestal have a bowl shaped space, and described bowl shaped space is recess with respect to bowl-shape base top surface;
This support plate comprises an end face and is exposed in bowl shaped space and with array way, plants brilliant crystal chip bearing portion for plural LED wafer, and two junctions that are emerging in respectively bowl-shape pedestal two outer side edges confession external circuits connections, between described crystal chip bearing portion and two junctions, be respectively equipped with for the fixing space, location of bowl-shape pedestal, and bowl-shape pedestal has two isolation location divisions that embed in corresponding space, location.
2. array heat curing-type LED wire frame structure according to claim 1, is characterized in that, a described crystal chip bearing portion wherein side extends to bowl-shape pedestal outside and forms junction.
3. array heat curing-type LED wire frame structure according to claim 1, is characterized in that, the outline of bowl-shape pedestal is cuboid or square.
4. array heat curing-type LED wire frame structure according to claim 1, is characterized in that, the bowl shaped space of bowl-shape pedestal depression is truncated cone-shaped wide at the top and narrow at the bottom.
5. according to the array heat curing-type LED wire frame structure described in any one in claim 1 to 4, it is characterized in that, described support plate is made by a sheet material, proper alignment plural number support plate on this sheet material, the bowl-shape pedestal of plural number is array on plural support plate to be arranged, and interval preset distance between two adjacent bowl-shape pedestals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420221806.9U CN203895495U (en) | 2014-04-30 | 2014-04-30 | Array-type thermosetting LED line holder structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420221806.9U CN203895495U (en) | 2014-04-30 | 2014-04-30 | Array-type thermosetting LED line holder structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203895495U true CN203895495U (en) | 2014-10-22 |
Family
ID=51721856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420221806.9U Expired - Fee Related CN203895495U (en) | 2014-04-30 | 2014-04-30 | Array-type thermosetting LED line holder structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203895495U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10403493B2 (en) | 2017-06-19 | 2019-09-03 | Au Optronics Corporation | Display panel and method for forming micro component support |
-
2014
- 2014-04-30 CN CN201420221806.9U patent/CN203895495U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10403493B2 (en) | 2017-06-19 | 2019-09-03 | Au Optronics Corporation | Display panel and method for forming micro component support |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014110333A5 (en) | Manufacturing method of LED device | |
| TW201712820A (en) | Semiconductor packaging method, semiconductor package and stacked semiconductor package | |
| TW200636954A (en) | Thermally enhanced semiconductor package and fabrication method thereof | |
| CN203588605U (en) | LED (light-emitting diode) lattice module adopting secondary stamping and secondary cutting encapsulation | |
| MY154178A (en) | Optoelectronic part producing method,optoelectronic part producing system,and optoelectronic part | |
| CN203895495U (en) | Array-type thermosetting LED line holder structure | |
| CN106328639A (en) | LED encapsulating structure and preparing method thereof | |
| CN204375748U (en) | A kind of COB encapsulation module of many glasss of polychromes | |
| TWI649577B (en) | Optical module and method of manufacturing same | |
| US20140291822A1 (en) | Integrated circuit package | |
| KR101598688B1 (en) | Manufacturing method of semiconductor device and semiconductor device thereof | |
| CN103441085B (en) | A kind of flip-chip BGA package method | |
| CN203826427U (en) | A thermosetting type LED coil holder structure | |
| CN102437271A (en) | Cache-on-board (COB) technology-based integrated light emitting diode (LED) packing method | |
| CN103378260A (en) | Method for manufacturing packaging structure of light emitting diode | |
| CN204315555U (en) | A kind of chip high efficiency encapsulating structure | |
| MY156107A (en) | Large panel leadframe | |
| TWM486149U (en) | Array type thermosetting LED rack structure | |
| KR101294714B1 (en) | Lead frame base plate for light emitting device and manufacturing method of light emitting device using the same | |
| CN102544262A (en) | LED (light-emitting diode) chip packaging process | |
| CN106158778A (en) | There is contacts side surfaces pad and the integrated antenna package of bottom engagement pad | |
| CN204834668U (en) | LED support | |
| CN103441080A (en) | Chip front-mounting BGA encapsulating method | |
| KR101685545B1 (en) | Multi die stacking method using Printed Circuit Board and semiconductor package employing it | |
| CN205248311U (en) | COB base plate group and COB light source group |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20170430 |