CN203839401U - An LED transverse fluid heat radiation COB light source - Google Patents
An LED transverse fluid heat radiation COB light source Download PDFInfo
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- CN203839401U CN203839401U CN201420119982.1U CN201420119982U CN203839401U CN 203839401 U CN203839401 U CN 203839401U CN 201420119982 U CN201420119982 U CN 201420119982U CN 203839401 U CN203839401 U CN 203839401U
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- heat pipe
- chip
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- light source
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Abstract
The utility model relates to an LED transverse fluid heat radiation COB light source comprising a micro-array heat pipe slab, a copper plated layer, a silver plated layer, a line layer, an insulating varnish layer, a chip and silica gel. The micro-array heat pipe slab, the copper plated layer, the silver plated layer, the line layer, the insulating varnish layer are sequentially composite. The external surface of the chip is sealed and fixed by the silica gel. The chip is closely attached to the silver plated layer and is welded and fixed. The micro-array heat pipe slab is sheet-shaped and is formed through cold drawing integrated molding with aluminum. A plurality of fine array channels which operate independently are distributed in a juxtaposition mode in the micro-array heat pipe slab. A working medium is filled in each fine array channel. The two ends of each array channel are sealed after the working medium is filled in. After the surface of the micro-array heat pipe slab absorbs heat, the working mediums in the fine array channels evaporate; the heat is rapidly transferred to a condensing section to realize heat release; and then the working mediums flow back to an evaporation section to carry out heat absorption so as to repeatedly carry out the series of continuous phase changing heat transfer and medium transfer process.
Description
Technical field
The utility model relates to LED lateral fluid heat radiation COB light source, belongs to LED illumination encapsulation technology field.
Background technology
LED lateral fluid heat radiation COB its efficient performance of light source and low cost fabrication thereof are subject to pursuing of many encapsulation enterprises, yet the integrity problems such as its light efficiency, life-span but cannot be protected, COB encapsulation can be one or two large chip, be divided into tens little chips, can do smallerly, therefore require radiating efficiency higher, vertical plane angle, COB is encapsulated under limited volume can reach reasonable efficiency, so it has all required reasonable performance in horizontal and rectilinear heat radiation.Integrated form COB packaged light source is used aluminium base as material mostly at present, aluminium base COB thermal resistance is large, reliability is not high, easily occurs that light decay, dead lamp phenomenon are serious, on the other hand, COB package cooling also need to promote, the cumulative hot concentration degree of COB light source is higher, if heat of light source can not be derived in time, will cause light source life to shorten, and without traditional gold thread, cost-saving.
Publication number is that the disclosed metal substrate of the Chinese patent of 201549488U adopts aluminum alloy material, pearl is fixed on metal substrate by techniques such as Reflow Solderings plurality of LEDs lamp, change encapsulating structure for the most traditional LED illumination, but not the encapsulating structure that LED lateral fluid heat radiation COB light source adopts.
Utility model content
Technical problem to be solved in the utility model is to overcome existing above-mentioned deficiency in prior art, and a kind of energy-efficient, heat dispersion is excellent, illumination is stable LED lateral fluid heat radiation COB light source is provided.
The utility model solves the problems of the technologies described above adopted technical scheme: LED lateral fluid heat radiation COB light source, comprise that microarray heat pipe is dull and stereotyped, copper plate, silver coating, line layer, insulation enamelled coating, chip, silica gel, described microarray heat pipe is dull and stereotyped, copper plate, silver coating, line layer, insulation enamelled coating is composited successively, described chip outer surface adopts silica gel sealing to fix, chip is close to silver coating and is welded and fixed, the dull and stereotyped profile of microarray heat pipe is lamellar, microarray heat pipe is dull and stereotyped adopts aluminium cold-drawn one-body molded, the dull and stereotyped inner fine array channel of distributive plural root independent operating side by side of microarray heat pipe, in fine array channel, be filled with working medium, sealed at both ends after filling working medium in fine array channel.
Chip described in the utility model and silver coating are provided with golden tin between also, and chip adopts golden tin to cover brilliant upside-down mounting with silver coating to be connected.
Two ends welded seal after filling working medium in fine array channel described in the utility model.
Microarray heat pipe slab-thickness 1.4mm～5mm described in the utility model, width is 5mm～70mm, every square meter microarray heat pipe flat board is distributed with the fine array channel of 300～600 independent operatings.
Golden tin described in the utility model be by the Asia gold in plating solution and stannous ion according to mass fraction 3:1 mixed preparing, and make by electrolysis.
The utility model is compared with prior art to be had advantages of:
1, the microarray heat pipe flat board that LED lateral fluid heat radiation COB light source adopts is lamellar, due to its relatively large specific area, full surface evaporation and condense, thereby better than traditional cylindrical properties of hot pipe, microarray heat pipe is dull and stereotyped by the direct contact heating element of silver coating, heater element direct contact heat transfer surface, it is efficient that heat passes transsexual energy.
2, after microarray heat pipe planar surface heat absorption, working medium evaporation in fine array channel, transfer heat to rapidly condensation segment heat release then working medium be back to evaporation section and continue heat absorption, thereby repeatedly carry out this series of continuous phase transistion heat and mass transfer processes.
3, microarray heat pipe slab-thickness 1.4mm～5mm described in the utility model, width is 5mm～70mm, every square meter microarray heat pipe flat board is distributed with the fine array channel of 300～600 independent operatings, the results showed, and the dull and stereotyped apparent heat conduction 2 of microarray heat pipe, 500,000W/mk, serviceability temperature scope-100 ℃～170 ℃, the caliber of fine array channel is thinner, therefore 100 of its inner bearing strengths are more than atmospheric pressure, outside bearing strength (evenly pressurization) 40kg/c ㎡.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1 described in the utility model.
Fig. 2 is the structural representation of embodiment 2 described in the utility model.
Embodiment
Below in conjunction with embodiment, the utility model is described in further detail, following examples are to explanation of the present utility model and the utility model is not limited to following examples.
Embodiment 1:
Referring to Fig. 1, LED lateral fluid heat radiation COB light source described in the utility model embodiment, comprise: microarray heat pipe flat board 1, silver coating 2, line layer 3, insulation enamelled coating 4, chip 6, silica gel 7 and copper plate 8, described microarray heat pipe flat board 1, copper plate 8, silver coating 2, line layer 3, insulation enamelled coating 4 is composited successively, described chip 6 outer surfaces adopt silica gel 7 sealings fixing, chip 6 is close to silver coating 2 and is welded and fixed, dull and stereotyped 1 profile of microarray heat pipe is lamellar, microarray heat pipe dull and stereotyped 1 adopts aluminium cold-drawn one-body molded, the inner fine array channel 11 of distributive plural root independent operating side by side of microarray heat pipe dull and stereotyped 1, in fine array channel 11, be filled with working medium, sealed at both ends after the interior filling working medium of fine array channel 11.
After the interior filling working medium of fine array channel 11 described in the utility model, two ends adopt welded seal.
The dull and stereotyped 1 thickness 5mm of microarray heat pipe described in the utility model embodiment, width is 70mm, length is 100mm, every square meter microarray heat pipe flat board 1 is distributed with the fine array channel 11 of 600 independent operatings, light emitting source that can maximum encapsulation 600W at this microarray heat pipe flat board 1, and the stable operation that can keep illumination
The encapsulation of LED lateral fluid heat radiation COB light source described in the utility model, comprises the following steps:
A. cutting microarray heat pipe flat board 1.The accurate cutting of microarray heat pipe dull and stereotyped 1, the accurate cutting in two ends must be bright and clean neat, there is no burr distortion, is convenient to vacuumize filling with working medium.
B. the fine array channel 11 in microarray heat pipe flat board 1 is vacuumized and filling work.First wherein adopt the special frock of hydraulic pressure to be pushed down and adopt ultrasonic bonding sealing in one end microarray heat pipe flat board 1, then after being pumped into the negative pressure of 1.3 * 10-1-1.3 * 10-4Pa in fine array channel 11, fill with appropriate working medium.
C. the 11 two ends welded seals of the fine array channel in microarray heat pipe flat board 1 after filling working medium, adopt the frock that hydraulic pressure is special to push down filling exit after filling working medium, and adopt ultrasonic bonding sealing.
D. dull and stereotyped 1 surface acid-washing of microarray heat pipe, copper facing, silver-plated, be coated with insulating layer coating, apply line layer, copper facing, silver-plated temperature remain between 70-90 degree, guarantee the smooth of coating surface.
E. flip-chip is covered crystalline substance, chip 6 is engaged on microarray heat pipe flat board 1, compare conventional package because not had gold thread weld pad to hinder, therefore can effectively improve brightness, adopt encapsulating structure of the present utility model to make the Distance Shortened of current flowing, resistance lowers, so the generation of heat also reduces relatively.Such joint also can go to heat the heat radiation microarray heat pipe flat board 1 of lower one deck effectively simultaneously, and thermal resistance reduces greatly.
F. chip surface is coated with and fills with silica gel, according to technological requirement, is coated with and fills with silica gel, and described silica gel is the fluorescent powder silica gel that proportioning is good.
Embodiment 2:
Referring to Fig. 2, LED lateral fluid heat radiation COB light source described in the utility model embodiment, comprise: microarray heat pipe flat board 1, silver coating 2, line layer 3, insulation enamelled coating 4, gold tin 5, chip 6, silica gel 7 and copper plate 8, described microarray heat pipe flat board 1, copper plate 8, silver coating 2, line layer 3, insulation enamelled coating 4 is composited successively, between described chip 6 and silver coating 2, be provided with golden tin 5, chip 6 covers brilliant upside-down mounting with the golden tin 5 of silver coating 2 employing and is connected, described chip 6 outer surfaces adopt silica gel 7 sealings fixing, dull and stereotyped 1 profile of microarray heat pipe is lamellar, microarray heat pipe dull and stereotyped 1 adopts aluminium cold-drawn one-body molded, the inner fine array channel 11 of distributive plural root independent operating side by side of microarray heat pipe dull and stereotyped 1, in fine array channel 11, be filled with working medium, sealed at both ends after the interior filling working medium of fine array channel 11.
Two ends welded seal after the interior filling working medium of fine array channel 11 described in the utility model.
Golden tin described in the utility model be by the Asia gold in plating solution and stannous ion according to mass fraction 3:1 mixed preparing, and make by electrolysis, electrolysis is prepared as prior art.
The dull and stereotyped 1 thickness 1.4mm of microarray heat pipe described in the present embodiment, width is 5mm, length is 10mm, the light emitting source of the encapsulated 30W power of this microarray heat pipe flat board 1, every square meter microarray heat pipe flat board 1 is distributed with the fine array channel 11 of 300 independent operatings; The another kind of described microarray heat pipe flat board 1 is selected thickness 3mm, width is 20mm, length is 30mm, the light emitting source of the encapsulated 100W power of this microarray heat pipe flat board 1, and every square meter microarray heat pipe flat board 1 is distributed with the fine array channel 11 of 380 independent operatings.
The encapsulation of LED lateral fluid heat radiation COB light source described in the utility model, comprises the following steps:
A. cutting microarray heat pipe flat board 1.The accurate cutting of microarray heat pipe dull and stereotyped 1, the accurate cutting in two ends must be bright and clean neat, there is no burr distortion, is convenient to vacuumize filling with working medium.
B. the fine array channel 11 in microarray heat pipe flat board 1 is vacuumized and filling work.First wherein adopt the special frock of hydraulic pressure to be pushed down and adopt ultrasonic bonding sealing in one end microarray heat pipe flat board 1, then after being pumped into the negative pressure of 1.3 * 10-1-1.3 * 10-4Pa in fine array channel 11, fill with appropriate working medium.
C. the 11 two ends welded seals of the fine array channel in microarray heat pipe flat board 1 after filling working medium, adopt the frock that hydraulic pressure is special to push down filling exit after filling working medium, and adopt ultrasonic bonding sealing.
D. dull and stereotyped 1 surface acid-washing of microarray heat pipe, copper facing, silver-plated, be coated with insulating layer coating, apply line layer, copper facing, silver-plated temperature remain between 70-90 degree, guarantee the smooth of coating surface.
E. flip-chip is covered crystalline substance, chip 6 is engaged on microarray heat pipe flat board 1, chip 6 covers brilliant upside-down mounting with the golden tin 5 of silver coating 2 employing and is connected, compare conventional package because not had gold thread weld pad to hinder, therefore can effectively improve brightness, adopt encapsulating structure of the present utility model to make the Distance Shortened of current flowing, resistance lowers, so the generation of heat also reduces relatively.Such joint also can go to heat the heat radiation microarray heat pipe flat board 1 of lower one deck effectively simultaneously, and thermal resistance reduces greatly.
F. chip surface is coated with and fills with silica gel, according to technological requirement, is coated with and fills with silica gel, and described silica gel is the fluorescent powder silica gel that proportioning is good.
More than be the concrete enforcement under technical solutions of the utility model framework, simple deformation or the combination of every the utility model embodiment technical scheme and technical characterictic, all should think and fall into protection range of the present utility model.
Claims (2)
1.LED lateral fluid heat radiation COB light source, it is characterized in that: comprise that microarray heat pipe is dull and stereotyped, copper plate, silver coating, line layer, insulation enamelled coating, chip, silica gel, described microarray heat pipe is dull and stereotyped, copper plate, silver coating, line layer, insulation enamelled coating is composited successively, described chip outer surface adopts silica gel sealing to fix, chip is close to silver coating and is welded and fixed, the dull and stereotyped profile of microarray heat pipe is lamellar, microarray heat pipe is dull and stereotyped adopts aluminium cold-drawn one-body molded, the dull and stereotyped inner fine array channel of distributive plural root independent operating side by side of microarray heat pipe, in fine array channel, be filled with working medium, sealed at both ends after filling working medium in fine array channel.
2. LED lateral fluid according to claim 1 heat radiation COB light source, is characterized in that: described chip and silver coating are provided with golden tin between also, and chip adopts golden tin to cover brilliant upside-down mounting with silver coating to be connected.
3. LED lateral fluid heat radiation COB light source according to claim 1, is characterized in that: two ends welded seal after filling working medium in described fine array channel.
4. LED lateral fluid according to claim 1 heat radiation COB light source, it is characterized in that: described microarray heat pipe slab-thickness 1.4mm～5mm, width is 5mm～70mm, and every square meter microarray heat pipe flat board is distributed with the fine array channel of 300 ~ 600 independent operatings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420119982.1U CN203839401U (en) | 2014-03-18 | 2014-03-18 | An LED transverse fluid heat radiation COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420119982.1U CN203839401U (en) | 2014-03-18 | 2014-03-18 | An LED transverse fluid heat radiation COB light source |
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| Publication Number | Publication Date |
|---|---|
| CN203839401U true CN203839401U (en) | 2014-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420119982.1U Expired - Fee Related CN203839401U (en) | 2014-03-18 | 2014-03-18 | An LED transverse fluid heat radiation COB light source |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977362A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | High-efficiency heat-dissipation integrated LED packaging structure and method |
| CN105977366A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | Heat-dissipation type LED packaging structure and method |
| CN109341392A (en) * | 2018-10-22 | 2019-02-15 | 华南理工大学 | A kind of shell core separate type porous wick structure concurrent flow aluminothermy pipe and its manufacturing method |
-
2014
- 2014-03-18 CN CN201420119982.1U patent/CN203839401U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977362A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | High-efficiency heat-dissipation integrated LED packaging structure and method |
| CN105977366A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | Heat-dissipation type LED packaging structure and method |
| CN109341392A (en) * | 2018-10-22 | 2019-02-15 | 华南理工大学 | A kind of shell core separate type porous wick structure concurrent flow aluminothermy pipe and its manufacturing method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140917 Termination date: 20160318 |
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| CF01 | Termination of patent right due to non-payment of annual fee |