CN203787458U - Full-color SMD diode support with cross green paint belt on back side - Google Patents
Full-color SMD diode support with cross green paint belt on back side Download PDFInfo
- Publication number
- CN203787458U CN203787458U CN201420126534.4U CN201420126534U CN203787458U CN 203787458 U CN203787458 U CN 203787458U CN 201420126534 U CN201420126534 U CN 201420126534U CN 203787458 U CN203787458 U CN 203787458U
- Authority
- CN
- China
- Prior art keywords
- back side
- resin plate
- cross
- full
- green
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003973 paint Substances 0.000 title abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 19
- 238000004020 luminiscence type Methods 0.000 claims abstract description 7
- 241000218202 Coptis Species 0.000 claims abstract description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 6
- 239000002966 varnish Substances 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000010422 painting Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Paints Or Removers (AREA)
Abstract
The utility model discloses a full-color SMD diode support with a cross green paint belt on a back side. The support comprises a BT resin plate, four copper foils distributed on the BT resin plate, a luminescence chip, a gold thread and four circular pads, wherein four angles of the BT resin plate are extended to the back side respectively; the luminescence chip is fixed to the copper foils through a solid crystal glue used for fixing a wafer; the gold thread passes through the copper foils; the four circular pads are connected to the four copper foils on a BT resin plate back side respectively; the four circular pads of the BT resin plate back side are separated by the cross green paint belt. The cross green paint belt can prevent a tin connection phenomenon which is caused by various factors that a spacing between the pads is small; tin coating is uneven; materials are dissociated and so on so that poor wetting phenomena in a reflow soldering assembling technology are reduced.
Description
Technical field
The utility model relates to LED lamp pearl technical field, relates in particular a kind of back side with the full-color SMD diode support of the green varnish-treated tape of cross.
Background technology
In recent years, along with LED display technology is applied to human lives's various aspects with the gesture of setting a prairie fire, but the SMD (surface attaching type providing due to prior art, Surface Mounted Devices) all-colour LED, differentiate rate variance, contrast is not high enough, the lack of resolution, humidity resistance is poor, can only be applied to definition and the not high low side LED display of other quality requirement.The moistureproof ability of simultaneously traditional support and the SMD all-colour LED of PPA encapsulated moulding exists obvious defect, thereby, the life-span of display screen is greatly limited, the small size full-color SMD of producing is at present because colloid is transparent color, so that " mirrored effect " of support can directly reflect ambient light and then affect the display effect of display screen, and high-quality LED display is to resolution, definition, contrast and moistureproof ability all have higher requirement, for solving this defect, for the demand in market, release a kind of surface-mount type SMD through black BT resin plate and the compression molding of glue cake especially, but because this type of little spacing small product size is small and light thin, the solder pad space length of structure only has 0.35mm, so can be easily because solder pad space length be too small when reflow, the many factors such as painting tin inequality and material are free cause even tin phenomenon, then reduce and in reflow packaging technology, eat tin bad phenomenon.
In sum, how a kind of full-color SMD diode support is provided, can when reflow, prevents because of solder pad space length too smallly, be coated with the many factors such as the uneven and material of tin is free and cause company's tin phenomenon, then reducing in reflow packaging technology and eat tin bad phenomenon, is the problem that those skilled in the art need solution badly.
Utility model content
In view of this, the utility model provides the full-color SMD diode support of a kind of back side with the green varnish-treated tape of cross, comprising: BT resin plate; Be distributed in four Copper Foils on described BT resin plate, and four angles of extending respectively described BT resin plate are to the back side; Crystal-bonding adhesive by fixed wafer is fixed on the luminescence chip on described Copper Foil; And and described Copper Foil between pass through gold thread; Four circular pad that are connected respectively with described four Copper Foils at the described BT resin plate back side, four circular pad at the described BT resin plate back side are separated by the green varnish-treated tape of cross.
Preferably, in the full-color SMD diode support at the above-mentioned back side with the green varnish-treated tape of cross, the green varnish-treated tape of described cross, in the center at described BT resin plate (01) back side, evenly separates four circular pad in structure.
Preferably, in the full-color SMD diode support at the above-mentioned back side with the green varnish-treated tape of cross, the green varnish-treated tape of described cross is formed by green painting brush system.
Preferably, in the full-color SMD diode support at the above-mentioned back side with the green varnish-treated tape of cross, described luminescence chip comprises blue chip, green glow chip and red light chips.
Known via above-mentioned technical scheme, compared with prior art, the utility model openly provides the full-color SMD diode support of a kind of back side with the green varnish-treated tape of cross, in Facad structure, black BT resin plate extends four metal pins by Copper Foil as die bond bonding wire carrier, and it is arranged at respectively this resin plate surface, and extends to outside four sides of this BT resin plate by this Copper Foil, while extending to the back side, be connected with four pads respectively.And the green paint of the cross providing in the utility model is divided into four isolated areas by structure, the circular pad in each region can be welded separately energising like this, the green varnish-treated tape of this cross is because of insulation characterisitic, just can when material reflow, prevent because of solder pad space length too small, be coated with the many factors such as the uneven and material of tin is free and cause company's tin phenomenon, then reduce and in reflow packaging technology, eat tin bad phenomenon.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 accompanying drawing is Facad structure schematic diagram of the present utility model;
Fig. 2 accompanying drawing is structure schematic diagram of the present utility model.
In Fig. 1 and Fig. 2:
01 is that BT resin plate, 02 is that Copper Foil, 03 is that blue chip, 04 is that green glow chip, 05 is that red light chips, 06 is that crystal-bonding adhesive, 07 is that gold thread, 08 is that circular pad, 09 is the green varnish-treated tape of cross.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model embodiment discloses a kind of back side with the full-color SMD diode support of the green varnish-treated tape of cross, comprising: BT resin plate 01; Be distributed in four Copper Foils 02 on BT resin plate 01, and four angles of extending respectively BT resin plate 01 are to the back side; Crystal-bonding adhesive by fixed wafer is fixed on the luminescence chip on Copper Foil 02; And and Copper Foil 02 between by gold thread 07; Four circular pad 08 that are connected respectively with four Copper Foils 02 at BT resin plate 01 back side, four circular pad 08 at BT resin plate 01 back side are separated by the green varnish-treated tape 09 of cross.
The green varnish-treated tape of this cross is because of insulation characterisitic, just can when material reflow, prevent because of solder pad space length too smallly, is coated with the many factors such as the uneven and material of tin is free and causes company's tin phenomenon, then reduces and in reflow packaging technology, eats tin bad phenomenon.
In order further to optimize technique scheme; the green varnish-treated tape of cross is in the center at BT resin plate 01 back side; four circular pad in structure are evenly separated; can guarantee that like this each circular pad has the useful space of oneself; can not vary; cause bad phenomenon, farthest the space of each circular pad has been arrived in protection.
In order further to optimize technique scheme, in the full-color SMD diode support at the above-mentioned back side with the green varnish-treated tape of cross, the green varnish-treated tape of cross by green painting brush to forming.Due to the insulating properties of paint itself, just can effectively tin be intercepted and be opened.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and each embodiment stresses is the difference with other embodiment, between each embodiment identical similar part mutually referring to.For the disclosed device of embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part partly illustrates referring to method.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the utility model.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. the back side, with a full-color SMD diode support for the green varnish-treated tape of cross, comprising: BT resin plate (01); Be distributed in four Copper Foils (02) on described BT resin plate (01), and four angles of extending respectively described BT resin plate (01) are to the back side; Crystal-bonding adhesive by fixed wafer is fixed on the luminescence chip on described Copper Foil (02); And and described Copper Foil (02) between by gold thread (07); Four circular pad (08) that are connected respectively with described four Copper Foils (02) at described BT resin plate (01) back side, it is characterized in that, four circular pad (08) at described BT resin plate (01) back side are separated by the green varnish-treated tape of cross (09).
2. the back side according to claim 1 is with the full-color SMD diode support of the green varnish-treated tape of cross, it is characterized in that, the green varnish-treated tape of described cross (09), in the center at described BT resin plate (01) back side, evenly separates four circular pad (08) in structure.
3. the back side according to claim 1, with the full-color SMD diode support of the green varnish-treated tape of cross, is characterized in that, the green varnish-treated tape of described cross (09) by green painting brush to forming.
4. the back side according to claim 1, with the full-color SMD diode support of the green varnish-treated tape of cross, is characterized in that, described luminescence chip comprises blue chip (03), green glow chip (04) and red light chips (05).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420126534.4U CN203787458U (en) | 2014-03-19 | 2014-03-19 | Full-color SMD diode support with cross green paint belt on back side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420126534.4U CN203787458U (en) | 2014-03-19 | 2014-03-19 | Full-color SMD diode support with cross green paint belt on back side |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203787458U true CN203787458U (en) | 2014-08-20 |
Family
ID=51323613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420126534.4U Expired - Lifetime CN203787458U (en) | 2014-03-19 | 2014-03-19 | Full-color SMD diode support with cross green paint belt on back side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203787458U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994457A (en) * | 2017-12-29 | 2019-07-09 | 惠州市聚飞光电有限公司 | A kind of LED illuminating part |
-
2014
- 2014-03-19 CN CN201420126534.4U patent/CN203787458U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994457A (en) * | 2017-12-29 | 2019-07-09 | 惠州市聚飞光电有限公司 | A kind of LED illuminating part |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140820 |