CN203779968U - Layered structure of uniform-temperature electromagnetic shielding material - Google Patents

Layered structure of uniform-temperature electromagnetic shielding material Download PDF

Info

Publication number
CN203779968U
CN203779968U CN201420118995.7U CN201420118995U CN203779968U CN 203779968 U CN203779968 U CN 203779968U CN 201420118995 U CN201420118995 U CN 201420118995U CN 203779968 U CN203779968 U CN 203779968U
Authority
CN
China
Prior art keywords
layer
samming
heat conduction
heat
metal level
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420118995.7U
Other languages
Chinese (zh)
Inventor
饶瑞祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amy Material Science And Technology Ltd
Original Assignee
Amy Material Science And Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amy Material Science And Technology Ltd filed Critical Amy Material Science And Technology Ltd
Priority to CN201420118995.7U priority Critical patent/CN203779968U/en
Application granted granted Critical
Publication of CN203779968U publication Critical patent/CN203779968U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

The utility model discloses a layered structure of a uniform-temperature electromagnetic shielding material. The layered structure of the uniform-temperature electromagnetic shielding material comprises a first layer, a second layer and a third layer, wherein the first layer is a heat conduction insulation layer; the second layer is a metal layer; the third layer is a heat conduction glue layer; the first layer and the second layer are combined by glue, hot press molding or ultrasonic waves; the second layer and the third layer are bonded through the glue; the heat conduction insulation layer can be made of a plastic material, PET (Polyethylene Glycol Terephthalate), PI (Polyimide), rubber, silica gel, heat conduction silica gel or graphite and used for conducting heat, insulating, equalizing temperature and resisting electromagnetic waves; the metal layer is used for equalizing temperature, conducting heat and isolating electromagnetic waves; the heat conduction glue layer can be made of glues which are prepared by mixing ceramic powder, aluminium oxide, ferric oxide and color powder with the colloid; the color powder can be black, white, transparent or available in various colors and used for shading, absorbing heat and laminating with heating elements, thereby isolating the harm of electromagnetic waves; meanwhile, the heating elements are capable of effectively conducting heat to the uniform-temperature electromagnetic shielding material and quickly radiating heat outwards.

Description

Samming ELECTROMAGNETIC OBSCURANT material layer structure
Technical field
The utility model relates to a kind of technical field of the adhesive tape that dispels the heat, and particularly relates to a kind of samming ELECTROMAGNETIC OBSCURANT material layer structure, and it can effectively block electromagnetic wave, and can efficiently transmit heat conduction and samming, and externally heat radiation rapidly.
Background technology
It is more and more faster that the feature of electronic product is now exactly arithmetic speed efficiency, and the used heat temperature of its generation is simultaneously also more and more higher, how can become an important problem by efficiently radiates heat.On the other hand, Electromagnetic Interference (Electro-Magnetic Interference, EMI) be a kind of new electronic pollution of finding in recent decades, be a kind ofly can not touch, cannot see, unheard invisible pollution, it is along with society is flourishing now, be on the rise, arrived the stage that can not ignore, it must be minimized on the injury of human body and on the problems such as impact of precision instrument.
Because the problem that above-mentioned existing electronic product exists, the inventor is based on being engaged in this type of product design manufacture abundant practical experience and professional knowledge for many years, and the utilization of cooperation scientific principle, positive research and innovation in addition, to founding a kind of samming ELECTROMAGNETIC OBSCURANT material layer structure of new structure, can solve the problem that existing electronic product exists, make it have more practicality.Through constantly research, design, and after repeatedly studying sample and improving, finally create the utility model having practical value.
Summary of the invention
The purpose of this utility model is that a kind of samming ELECTROMAGNETIC OBSCURANT material layer structure is being provided, it contacts with heater element establishes heat conduction glue-line, can fast heat be conducted outward, metal level is established in centre, it has samming heat conduction and isolated electromagnetic effect, heat is effectively insulated by outer field surface insulation layer again, and can externally dispel the heat rapidly.
The purpose of this utility model is to adopt following technical scheme to realize.The utility model samming ELECTROMAGNETIC OBSCURANT material layer structure, comprising: heat conductive insulating layer, and ground floor is this heat conductive insulating layer; Metal level, the second layer is this metal level, this metal level that the below of this heat conductive insulating layer of ground floor is the second layer; And heat conduction glue-line, the 3rd layer is this heat conduction glue-line, the below of this metal level of the second layer is this heat conduction glue-line of the 3rd layer, forms samming ELECTROMAGNETIC OBSCURANT material layer structure.
The purpose of this utility model can also be further achieved by the following technical measures.
Preferably, aforesaid samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein the combination of this heat conductive insulating layer of ground floor and this metal level of the second layer can be cementingly close, hot-forming combination or ultrasonic wave bonding.
Preferably, aforesaid samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conduction glue-line of this metal level of the second layer and the 3rd layer is with glue bond.
Preferably, aforesaid samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conductive insulating layer can be plastic cement, rubber, silica gel or graphite.
Preferably, aforesaid samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conductive insulating layer can be fire resistant coating, insulated paint or printing ink paint.
Preferably, aforesaid samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this metal level can be aluminium, copper or alloy material.
Preferably, aforesaid samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conduction glue-line can be ceramic powders, aluminium oxide, iron oxide.
The utility model compared with prior art has obvious advantage and beneficial effect.By technique scheme, the utility model samming ELECTROMAGNETIC OBSCURANT material layer structure at least has following advantages and beneficial effect: utilize the utility model can completely cut off electromagnetic harm, and make heater element be able to effective to samming ELECTROMAGNETIC OBSCURANT material, and externally disperse rapidly, moreover, samming ELECTROMAGNETIC OBSCURANT material layer structure of the present utility model, it does not limit and uses on electronic component, as long as can producing used heat, other need the equipment of heat radiation, maybe need to have the equipment of anti electromagnetic wave, all can use the utility model.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of description, and for above and other object of the present utility model, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the layer structure schematic diagram of an embodiment of the utility model.
Fig. 2 is that the utility model is carried out up to the layer structure schematic diagram on heater element.
[main element symbol description]
1: samming ELECTROMAGNETIC OBSCURANT material layer structure 10: heat conductive insulating layer
20: metal level 30: heat conduction glue-line
40: heater element
The specific embodiment
For further setting forth the utility model, be to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, a kind of its specific embodiment of samming ELECTROMAGNETIC OBSCURANT material layer structure, structure, feature and effect thereof to according to the utility model proposes, be described in detail as follows.
Refer to shown in Fig. 1 and Fig. 2, the utility model provides a kind of samming ELECTROMAGNETIC OBSCURANT material layer structure, includes:
Heat conductive insulating layer 10, ground floor is this heat conductive insulating layer 10;
Metal level 20, the second layer is this metal level 20, this metal level 20 that the below of this heat conductive insulating layer 10 of ground floor is the second layer; And
30, the three layers of heat conduction glue-lines are this heat conduction glue-line 30, and the below of this metal level 20 of the second layer is this heat conduction glue-line 30 of the 3rd layer, with it, forms samming ELECTROMAGNETIC OBSCURANT material layer structure 1 of the present utility model.
Described samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conductive insulating layer 10 of ground floor and the combination of this metal level 20 of the second layer can be cementingly close, hot-forming combination or ultrasonic wave bonding.
Described samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conduction glue-line 30 of this metal level 20 of the second layer and the 3rd layer is with glue bond.
Described samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conductive insulating layer 10 can be plastic material, PET, PI, rubber, silica gel, heat conductive silica gel or graphite.
Described samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conductive insulating layer 10 can be fire resistant coating or insulated paint or printing ink paint.
Described samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this metal level 20 can be aluminium, copper or alloy material.
Described samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this heat conduction glue-line 30 can be the mixed made glue class of ceramic powders, aluminium oxide, iron oxide or toner and colloid.
Described samming ELECTROMAGNETIC OBSCURANT material layer structure, wherein this toner can be and is able to white or transparent or other the versicolor toners of the black of shading heat absorption.
This heat conductive insulating layer 10 of aforementioned ground floor can be plastic material, PET, PI, rubber, silica gel, heat conductive silica gel or graphite, as the purposes of heat conduction, insulation, mean temperature and anti electromagnetic wave.
This metal level 20 of the aforementioned second layer can be the various alloy materials such as aluminium, copper, and this metal level 20 of the second layer, in order to samming heat conduction, completely cuts off electromagnetic wave.
This heat conduction glue-line 30 of aforementioned the 3rd layer can be the mixed made glue class of ceramic powders, aluminium oxide, iron oxide, toner and colloid, toner can be white or the transparent or shades of colour of black, be able to shading heat absorption and fit with heater element 40, so as to isolated electromagnetic harm, and it is upper to the 3rd layer of samming ELECTROMAGNETIC OBSCURANT material layer structure to make heater element 40 be able to effective, and by ground floor, externally dispelled the heat rapidly.
Aforementioned samming ELECTROMAGNETIC OBSCURANT material layer structure is closely connected in heater element 40 with this heat conduction glue-line 30 of the 3rd layer, be able to heat conduction to this metal level 20, mean temperature and the anti electromagnetic wave of the second layer, thereafter this metal level 20 of the second layer in order to samming heat conduction this heat conductive insulating layer 10 to ground floor, isolated electromagnetic wave, this heat conductive insulating layer 10 of ground floor can effective externally heat radiation rapidly thereafter.
The above, it is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, although the utility model discloses as above with preferred embodiment, yet not in order to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solutions of the utility model, any simple modification of above embodiment being done according to technical spirit of the present utility model, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.

Claims (7)

1. a samming ELECTROMAGNETIC OBSCURANT material layer structure, is characterized in that comprising:
Heat conductive insulating layer, ground floor is this heat conductive insulating layer;
Metal level, the second layer is this metal level, this metal level that the below of this heat conductive insulating layer of ground floor is the second layer; And
Heat conduction glue-line, the 3rd layer is this heat conduction glue-line, the below of this metal level of the second layer is this heat conduction glue-line of the 3rd layer, forms samming ELECTROMAGNETIC OBSCURANT material layer structure.
2. samming ELECTROMAGNETIC OBSCURANT material layer structure as claimed in claim 1, the combination that it is characterized in that this heat conductive insulating layer of ground floor and this metal level of the second layer can be and cementingly closes, hot-forming combination or ultrasonic wave bonding.
3. samming ELECTROMAGNETIC OBSCURANT material layer structure as claimed in claim 1, is characterized in that this heat conduction glue-line of this metal level of the second layer and the 3rd layer is with glue bond.
4. samming ELECTROMAGNETIC OBSCURANT material layer structure as claimed in claim 1, is characterized in that this heat conductive insulating layer can be plastic cement, rubber, silica gel or graphite.
5. samming ELECTROMAGNETIC OBSCURANT material layer structure as claimed in claim 1, is characterized in that this heat conductive insulating layer can be fire resistant coating, insulated paint or printing ink paint.
6. samming ELECTROMAGNETIC OBSCURANT material layer structure as claimed in claim 1, is characterized in that this metal level can be aluminium, copper or alloy material.
7. samming ELECTROMAGNETIC OBSCURANT material layer structure as claimed in claim 1, is characterized in that this heat conduction glue-line can be ceramic powders, aluminium oxide, iron oxide.
CN201420118995.7U 2014-03-17 2014-03-17 Layered structure of uniform-temperature electromagnetic shielding material Expired - Fee Related CN203779968U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420118995.7U CN203779968U (en) 2014-03-17 2014-03-17 Layered structure of uniform-temperature electromagnetic shielding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420118995.7U CN203779968U (en) 2014-03-17 2014-03-17 Layered structure of uniform-temperature electromagnetic shielding material

Publications (1)

Publication Number Publication Date
CN203779968U true CN203779968U (en) 2014-08-20

Family

ID=51316193

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420118995.7U Expired - Fee Related CN203779968U (en) 2014-03-17 2014-03-17 Layered structure of uniform-temperature electromagnetic shielding material

Country Status (1)

Country Link
CN (1) CN203779968U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106273883A (en) * 2016-08-12 2017-01-04 碳元科技股份有限公司 A kind of graphite linings laminated structure and preparation method thereof
CN106531902A (en) * 2016-11-16 2017-03-22 广州宏庆电子有限公司 Extremely-thin flexible heat-radiation film and method for manufacturing the same
CN111491485A (en) * 2019-01-29 2020-08-04 东莞市兆科电子材料科技有限公司 Heat dissipation label with high contrast color difference forms discernment and marks

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106273883A (en) * 2016-08-12 2017-01-04 碳元科技股份有限公司 A kind of graphite linings laminated structure and preparation method thereof
CN106273883B (en) * 2016-08-12 2018-10-02 碳元科技股份有限公司 A kind of graphite laminar structure and preparation method thereof
CN106531902A (en) * 2016-11-16 2017-03-22 广州宏庆电子有限公司 Extremely-thin flexible heat-radiation film and method for manufacturing the same
CN111491485A (en) * 2019-01-29 2020-08-04 东莞市兆科电子材料科技有限公司 Heat dissipation label with high contrast color difference forms discernment and marks

Similar Documents

Publication Publication Date Title
CN202374617U (en) Ultrathin heat radiation film having electromagnetic shielding function
CN203779968U (en) Layered structure of uniform-temperature electromagnetic shielding material
CN104144589B (en) A kind of onboard wireless equipment for surfing the net
CN205439397U (en) Ultra -thin heat dissipation, electromagnetic shield and inhale ripples combined material
CN104202446A (en) Colorful mobile phone shell with wave-adsorbing radiating function and processing method of mobile phone shell
CN204229862U (en) A kind of conducting foam composite material
CN203855543U (en) Thermally conductive graphite composite film
CN203095967U (en) Adhering film applied to electronic products
CN203884121U (en) Radiating fin
CN202750392U (en) Heat conduction radiating fin with wrapped edges
CN204309333U (en) A kind of aluminium foil foam composite material
CN204425894U (en) Lightweight electromagnetic shielding polymer composite plate
CN103260388A (en) Highly thermally conductive graphite film structure with function of shielding case
CN202841560U (en) Composite heating insulation sheet material
CN205364691U (en) Good copper -clad plate of heat dissipation function
CN104212311A (en) Latex paint with electromagnetic shielding performance
CN201481033U (en) Ceramic vessel for heating
CN203105049U (en) Film for attenuating electromagnetic waves
CN208422896U (en) A kind of chip encapsulated with glass fabric of epoxy resin
CN207475905U (en) A kind of Electric radiant Heating Film
CN207657295U (en) Unmanned plane circuit control panel with class graphene composite radiating film
CN202968460U (en) Conductive and heat-conducting composite powder particle
CN203233633U (en) Graphite radiation film applied to intelligent mobile phone and tablet computer
CN205354521U (en) Battery label film
CN205202355U (en) Copper base copper -clad plate of ceramic film structure

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140820

Termination date: 20190317