CN202968460U - Conductive and heat-conducting composite powder particle - Google Patents
Conductive and heat-conducting composite powder particle Download PDFInfo
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- CN202968460U CN202968460U CN 201220680263 CN201220680263U CN202968460U CN 202968460 U CN202968460 U CN 202968460U CN 201220680263 CN201220680263 CN 201220680263 CN 201220680263 U CN201220680263 U CN 201220680263U CN 202968460 U CN202968460 U CN 202968460U
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Abstract
The utility model provides a conductive and heat-conducting composite powder particle, is used for solving the problem that the composite conductive powder filler prepared in the prior art is low in heat-conducting coefficient and relates to the field of novel materials. The composite powder particle comprises an aluminum oxide base core, wherein a metal outer layer is coated on the surface of the aluminum oxide base core. The conductive and heat-conducting composite powder particle provided by the utility model not only has conductive performances, but also can be used as conductive filler. Moreover, the composite powder material is high in heat-conducting coefficient, good in heat-conducting performances, capable of replacing the metal powder filler for use and wider in application field.
Description
Technical field:
The utility model relates to field of new, relates in particular to the composite granule particle of a kind of conduction, heat conduction.
Background technology:
The metal species conductive filler materials such as silver, copper, nickel are the conductive filler materials of a class widespread use at present.Copper and mickel class conducting particles price is lower, but has the shortcoming that is easy to oxidation and reduces conductivity.The plurality of advantages such as argent has that contact resistance is little, good conductivity, thermal conductivity and excellent corrosion resistance, so in electronics industry in recent years, a large amount of finess that use Ag are as the conductive filler material of conductive resin etc., but that argent exists is expensive, be easy to the problem such as silver migration, so its application is restricted.For improving performance, reduce costs, comparatively extensive to the research of compounded mix, mainly realize by metal covering metal particle or inorganic organic non-conductive particles surface.
With the progress of first science and technology, the kind of solid conductive material is more and more.Nonmetal conducting function material becomes one of focus of novel material research gradually, and Application Areas is also in continuous expansion.
In prior art, cover non-conductive particle by metal and prepare conductive filler material, make nonconducting powder stuffing have the performance of conduction, Application Areas is more wide in range.Use at present maximum composite conductive powder fillers be with silicate or glass microsphere etc. with silicon-dioxide as the material of main component as base-material, silver-plated at the particle surface of base-material.The composite conductive powder filler that this method makes has good electroconductibility, can be used as conductive filler material and uses.But the thermal conductivity of this kind composite conductive powder filler is low, does not have good thermal conductivity.
The utility model content:
The purpose of this utility model is to provide the composite granule particle of a kind of conduction, heat conduction, the low problem of composite conductive powder filler thermal conductivity that makes to solve prior art.
Technical problem to be solved in the utility model realizes by the following technical solutions:
The composite granule particle of a kind of conduction, heat conduction, this composite granule particle comprises alumina base core, alumina base core surface is coated with metal outer.
Described alumina base core is α-Al
2O
3Powder granule, α-Al
2O
3Has good heat conductivility.
Described metal outer is silver, or the compound skin of two or more metal.
The composite granule particle of the conduction that the utility model provides, heat conduction not only has conductivity, can use as conductive filler material, and this composite powder material thermal conductivity is high, have good heat conductivility, alternative metal-powder filler uses, and Application Areas is more wide in range.
Description of drawings:
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the structural representation of the another kind of embodiment of the utility model.
Embodiment:
For technique means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with specific embodiments and the drawings, further set forth the utility model.
Embodiment one
The composite granule particle of a kind of conduction, heat conduction:
As shown in Figure 1, this composite granule particle comprises alumina base core 2, alumina base core 2 surperficial silver coated 1.
Embodiment two
The composite granule particle of a kind of conduction, heat conduction:
As shown in Figure 2, this composite granule particle comprises alumina base core 2, and alumina base core 2 surfaces are coated with metal outer, and metal outer is the composite bed of copper and silver, and copper layer 3 is interior, and silver layer 1 outside.
Above demonstration and described ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification sheets is only preference of the present utility model; be not used for limiting the utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (3)
1. the composite granule particle of a conduction, heat conduction, it is characterized in that: this composite granule particle comprises alumina base core, alumina base core surface is coated with metal outer.
2. the composite granule particle of conduction according to claim 1, heat conduction, it is characterized in that: described alumina base core is α-Al
2O
3Powder granule.
3. the composite granule particle of conduction according to claim 1 and 2, heat conduction is characterized in that: described metal outer is silver, or the compound skin of two or more metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220680263 CN202968460U (en) | 2012-12-11 | 2012-12-11 | Conductive and heat-conducting composite powder particle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220680263 CN202968460U (en) | 2012-12-11 | 2012-12-11 | Conductive and heat-conducting composite powder particle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202968460U true CN202968460U (en) | 2013-06-05 |
Family
ID=48509561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220680263 Expired - Lifetime CN202968460U (en) | 2012-12-11 | 2012-12-11 | Conductive and heat-conducting composite powder particle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202968460U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103045178A (en) * | 2012-12-11 | 2013-04-17 | 蚌埠鑫源石英材料有限公司 | Electricity-conductive and heat-conductive compound powdery material |
| CN114456776A (en) * | 2022-01-27 | 2022-05-10 | 湖南创瑾技术研究院有限公司 | Heat-conducting filler and preparation method and application thereof |
-
2012
- 2012-12-11 CN CN 201220680263 patent/CN202968460U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103045178A (en) * | 2012-12-11 | 2013-04-17 | 蚌埠鑫源石英材料有限公司 | Electricity-conductive and heat-conductive compound powdery material |
| CN114456776A (en) * | 2022-01-27 | 2022-05-10 | 湖南创瑾技术研究院有限公司 | Heat-conducting filler and preparation method and application thereof |
| CN114456776B (en) * | 2022-01-27 | 2024-03-15 | 湖南创瑾技术研究院有限公司 | Heat conduction filler and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: BENGBU XINYUAN MATERIALS TECHNOLOGY CO., LTD. Free format text: FORMER NAME: BENGBU XINYUAN QUARTZ MATERIAL CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Ying Huai Lu 233400 Anhui city of Bengbu province Huaiyuan Huaiyuan County Economic Development Zone Patentee after: BENGBU XINYUAN MATERIAL TECHNOLOGY CO.,LTD. Address before: Ying Huai Lu 233400 Anhui city of Bengbu province Huaiyuan Huaiyuan County Economic Development Zone Patentee before: BENGBU XINYUAN QUARTZ MATERIAL Co.,Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Ying Huai Lu 233400 Anhui city of Bengbu province Huaiyuan Huaiyuan County Economic Development Zone Patentee after: ANHUI ESTONE MATERIAL TECHNOLOGY Co.,Ltd. Address before: Ying Huai Lu 233400 Anhui city of Bengbu province Huaiyuan Huaiyuan County Economic Development Zone Patentee before: BENGBU XINYUAN MATERIAL TECHNOLOGY CO.,LTD. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130605 |
|
| CX01 | Expiry of patent term |