CN101486575A - Light high heat conducting nano composite material and preparation thereof - Google Patents
Light high heat conducting nano composite material and preparation thereof Download PDFInfo
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- CN101486575A CN101486575A CNA2009101055231A CN200910105523A CN101486575A CN 101486575 A CN101486575 A CN 101486575A CN A2009101055231 A CNA2009101055231 A CN A2009101055231A CN 200910105523 A CN200910105523 A CN 200910105523A CN 101486575 A CN101486575 A CN 101486575A
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- 239000000463 material Substances 0.000 title claims abstract description 46
- 239000002114 nanocomposite Substances 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 22
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 10
- 239000012298 atmosphere Substances 0.000 claims abstract description 7
- 239000002086 nanomaterial Substances 0.000 claims abstract description 7
- 239000002131 composite material Substances 0.000 claims abstract description 6
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 6
- 239000002243 precursor Substances 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 32
- 229910002804 graphite Inorganic materials 0.000 claims description 13
- 239000010439 graphite Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229920005596 polymer binder Polymers 0.000 claims description 8
- 239000002491 polymer binding agent Substances 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 238000013019 agitation Methods 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 235000013312 flour Nutrition 0.000 claims description 4
- 229920000609 methyl cellulose Polymers 0.000 claims description 4
- 239000001923 methylcellulose Substances 0.000 claims description 4
- 229920002401 polyacrylamide Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000010105 thermoset forming Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 2
- 239000001913 cellulose Substances 0.000 claims description 2
- 229920002678 cellulose Polymers 0.000 claims description 2
- 238000010892 electric spark Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 238000005098 hot rolling Methods 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 238000009768 microwave sintering Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 229910021487 silica fume Inorganic materials 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 4
- 238000003756 stirring Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000011863 silicon-based powder Substances 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 description 9
- 238000007731 hot pressing Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 235000010981 methylcellulose Nutrition 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 235000010210 aluminium Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000446313 Lamella Species 0.000 description 2
- 241001062472 Stokellia anisodon Species 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000024287 Areas Species 0.000 description 1
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- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 231100000518 lethal Toxicity 0.000 description 1
- 230000001665 lethal effect Effects 0.000 description 1
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- 238000004377 microelectronic Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
The invention discloses a light high-heat conducive nano composite material and a preparation method thereof; wherein, the composite material is formed by mixing 50 to 99 wt (weight percent) percent of black lead powder basic body material and 1 to 50 wt percent of nano materials with high-heat conducive performance. The preparation method comprises: a. selecting the black lead powder with a granularity between 0.1 and 100 microns and the nano carborundum powder and nano silicon powder with a granularity between 10 and 500 nanometers; b. mixing the black lead powder, the carborundum powder and the silicon powder materials under a stirring condition; simultaneously adding a macromolecular caking agent and obtaining the precursor powder of the composite material by carrying out drying and dispersing to the mixed materials; and c. thermosetting and shaping the precursor powder under an oxygen-free atmosphere. The composite material of the invention has the characteristics of easily-obtained and cheap materials, low production cost, light weight, and good heat radiation effect, and can partially or completely replace a metal heat radiating material.
Description
[technical field]
The present invention relates to thermally conductive material, it is low particularly to relate to a kind of production cost, in light weight, light high heat conducting nano composite material of good heat dissipation effect and preparation method thereof.
[background technology]
Along with the complexity and the function of microelectronics increases with surprising rapidity, its power is also continuing to increase, and volume constantly reduces.Because electronic component itself also is a thermal source, is in the vertex of whole electric equipment temperature, its too high temperature rise causes the lethal factor of electronic system fault and inefficacy often.For electronic system (particularly sensitive circuit and components and parts) can be worked sustainedly and stably, it is obviously very important that it is reliably dispelled the heat effectively.Therefore, it is very urgent to research and develop high efficiency electronic radiation material and correlation technique.
As everyone knows, metal is the thermally conductive material of using always.In the metal heat-conducting material, the gold and silver that heat-conduction coefficient is very high are soft because of quality, density is big, price is high can't extensively adopt; Iron rule is low owing to thermal conductivity, density is big, and can't satisfy high heat density occasion needs, and is not suitable for making computer air cooling radiator element etc.; Though the heat-conduction coefficient of copper is very high, because density is big, cost is higher, difficulty of processing is big etc. unfavorable factor is used less in the radiator element of computer equipment; Aluminium is as the highest metallic element of content in the earth's crust; higher because of its heat-conduction coefficient, density is little, price is low is favored; but because fine aluminium hardness is less; in various Application Areass, can make aluminium alloy by other metallic substance of admixture usually; obtain the not available characteristic of many fine aluminiums whereby, thereby become the first-selection of radiator element work material.In addition, because metallic substance density height, cost is big, perishable, smelt and the course of processing in energy consumption and environmental pollution big, therefore it is superior than metal to seek a kind of performance, and course of processing energy consumption is low, to the little light composite material of environmental influence as new heat sink material, with part or all of substituted metal, just become a kind of objective demand.
On the other hand, people know that graphite is a kind of non-metallic element, and it is the xln of carbon, has than copper and the big thermal conductivity of Yin Geng.Graphite is relevant with its special laminate structure with low heat conduction [theoretical value is (6W/ (mK))] characteristic perpendicular to its lamella direction along the high heat conduction on its lamella direction [theoretical value is number kW/ (mK)] characteristic.Compare with above-mentioned metal matrix thermally conductive material, the thermal conductivity of carbon material is obviously higher, and self light weight, corrosion-resistant, raw material is cheap and easy to get, and China's graphite rich in mineral resources, distribution area is wide, the ground ore reserves is big, makes carbon material have more superior future and market aspect the heat sink material exploitation.
[summary of the invention]
The present invention is intended to solve the problem that the traditional heat-dissipating material exists, and provides a kind of raw material to be easy to get and cheapness, and production cost is low, and is in light weight, good heat dissipation effect, the partly or entirely light high heat conducting nano composite material of substituted metal heat sink material.
The present invention also aims to provide the preparation method of this matrix material.
For achieving the above object, the invention provides a kind of light high heat conducting nano composite material, this matrix material is to be that 50%~99% Graphite Powder 99 body material and weight percent content are that 1~50% the nano material with high thermal conductivity mixes by weight percent content.
Preferably, this matrix material is to be that 85% Graphite Powder 99 body material and weight percent content are that 15% the nano material with high thermal conductivity mixes by weight percent content.
Graphite Powder 99 is selected from natural flake graphite, synthetic graphite, as one or more powders that grind to form in pyrolytic graphite, acidifying graphite, expanded graphite, soft graphite, the porous graphite.
Nano material is that granularity is nanometer silicon carbide (SiC) powder of 10~500 nanometers, a kind of or its combination in nano-silicon (Si) powder.
The present invention also provides the preparation method of light high heat conducting nano composite material, and this method may further comprise the steps:
A, to choose granularity be nano carborundum powder and the nano silica fume that 0.1~100 micron Graphite Powder 99 and granularity are 10~500 nanometers;
B, be that Graphite Powder 99, carborundum powder, the silica flour material of 50~99:0~50:0~50 places encloses container with weight ratio, under agitation condition, mixed 0.5~24 hour, blended adds the high polymer binder that weight is weight of material 1~10% simultaneously, mixed material drying, disperse, obtain the composite material precursor powder;
C, with precursor powder under oxygen-free atmosphere, temperature is more than 200 ℃, pressure is greater than thermoset forming under the 8MPa condition.
Among the step b, described high polymer binder is one or more the mixture in the basic Mierocrystalline cellulose of methylcellulose gum, hydroxyl, carboxymethyl cellulose, polyacrylamide, polyvinyl alcohol, the polymine.The weight ratio of Graphite Powder 99, carborundum powder, silica flour material is 60~80:20~40:20~40.
Among the step c, described oxygen-free atmosphere is vacuum state or argon gas, hydrogen, nitrogen, protection of ammonia atmosphere.Described thermoset forming is selected from 1~3 kind in pressure sintering, hot rolling system, hot-extrudable, discharge plasma sintering, ultra-high pressure sintering, electric spark sintering, the microwave sintering.
Contribution of the present invention is that it has effectively overcome heat dissipation metal density of material height, and cost is big, perishable, smelt and the course of processing in defectives such as energy consumption and environmental pollution are big.Compare with traditional heat dissipation metal material, light high heat conducting nano composite material of the present invention has following characteristics:
One, raw material sources are extensive, production cost and cheap, product corrosion resistance and good.
Two, preparation technology is simple, and is with short production cycle.
But three, this matrix material once shaped, finished product density is little, material internal is non-microcracked.
Four, thermal conductivity height, good heat dissipation effect.Part or all of alternative metals thermally conductive material.
[embodiment]
The following example is to further explanation of the present invention and explanation, and the present invention is not constituted any limitation.
Embodiment 1
Get natural flake graphite powder, nanometer silicon carbide and nano-silicon powder and place encloses container by the weight ratio of 70:15:15, mix under agitation condition, agitator speed is 10000 rev/mins.Blended adds the high polymer binder methylcellulose gum of mixture gross weight 5% simultaneously, methylated cellulose aqueous solution concentration is 10%, after mixing 1 hour, with of the temperature oven dry of mixed material at 120 ℃, disperse, with powder pressure sintering moulding under the pressure of vacuum 300 degree, 30MPa, obtain light high heat conducting nano composite material then.
Through measuring, this matrix material is 6.1W/mK along the thermal conductivity of hot pressing direction, is 190W/mK perpendicular to the thermal conductivity of hot pressing direction.
Embodiment 2
Pyrolytic graphite powder, nanometer silicon carbide powder are placed encloses container by the weight ratio of 85:15, mix under agitation condition, agitator speed is 11000 rev/mins.Blended adds the high polymer binder methylcellulose gum of mixture gross weight 5% simultaneously, methylated cellulose aqueous solution concentration is 5%, after mixing 1 hour, with of the temperature oven dry of mixed material at 100 ℃, disperse, with powder hot-extrudable moulding under 300 degree, the 30MPa pressure in argon atmospher, obtain light high heat conducting nano composite material then.
Through measuring, this matrix material is 6.0W/mK along the thermal conductivity of vertically extruding direction, is 188W/mK along the thermal conductivity of extruding direction.
Embodiment 3
Expanded graphite powder, nano-silicon powder are placed encloses container by the weight ratio of 90:10, mix under agitation condition, agitator speed is 10000 rev/mins.Blended adds the high polymer binder polyacrylamide of mixture gross weight 2% simultaneously, polyacrylamide solution concentration is 5%, mix and stir after 2 hours, with of the temperature oven dry of mixed material at 130 ℃, disperse, with powder ultra-high pressure sintering moulding under vacuum 600 degree, 50MPa pressure, obtain light high heat conducting nano composite material then.
Through measuring, this matrix material is 6.5W/mK along the thermal conductivity of hot pressing direction, is 228W/mK perpendicular to the thermal conductivity of hot pressing direction.
Embodiment 4
Porous graphite powder, nanometer silicon carbide and nano-silicon powder place encloses container by the weight ratio of 85:10:5, mix under agitation condition, and agitator speed is 11000 rev/mins.Blended adds the high polymer binder polyvinyl alcohol of mixture gross weight 2% simultaneously, polyvinyl alcohol water solution concentration is 5%, mix and stir after 1 hour, with of the temperature oven dry of mixed material at 130 ℃, disperse, with powder 800 degree, discharge plasma sinter molding under the 50MPa pressure in nitrogen atmosphere, obtain light high heat conducting nano composite material then.
Through measuring, this matrix material is 5.8W/mK along the thermal conductivity of hot pressing direction, is 240W/mK perpendicular to the thermal conductivity of hot pressing direction.
Claims (9)
1, a kind of light high heat conducting nano composite material is characterized in that, it is to be that 50%~99% Graphite Powder 99 body material and weight percent content are that 1~50% the nano material with high thermal conductivity mixes by weight percent content.
2, light high heat conducting nano composite material as claimed in claim 1 is characterized in that, it is to be that 85% Graphite Powder 99 body material and weight percent content are that 15% the nano material with high thermal conductivity mixes by weight percent content.
3, light high heat conducting nano composite material as claimed in claim 1, it is characterized in that, described Graphite Powder 99 is selected from natural flake graphite, synthetic graphite, as one or more powders that grind to form in pyrolytic graphite, acidifying graphite, expanded graphite, soft graphite, the porous graphite.
4, light high heat conducting nano composite material as claimed in claim 1 is characterized in that, described nano material is that granularity is the nanometer silicon carbide powder of 10~500 nanometers, a kind of or its combination in the nano-silicon powder.
5, the preparation method of light high heat conducting nano composite material according to claim 1 is characterized in that it may further comprise the steps:
A, to choose granularity be nano carborundum powder and the nano silica fume that 0.1~100 micron Graphite Powder 99 and granularity are 10~500 nanometers;
B, be 50~99: 0~50 with weight ratio: 0~50 Graphite Powder 99, carborundum powder, silica flour material place encloses container, under agitation condition, mixed 0.5~24 hour, blended adds the high polymer binder that weight is weight of material 1~10% simultaneously, mixed material drying, disperse, obtain the composite material precursor powder;
C, with precursor powder under oxygen-free atmosphere, temperature is more than 200 ℃, pressure is greater than thermoset forming under the 8MPa condition.
6, preparation method as claimed in claim 5, it is characterized in that, in the step (b), described high polymer binder is one or more the mixture in the basic Mierocrystalline cellulose of methylcellulose gum, hydroxyl, carboxymethyl cellulose, polyacrylamide, polyvinyl alcohol, the polymine.
7, preparation method as claimed in claim 5 is characterized in that, in the step (b), the weight ratio of Graphite Powder 99, carborundum powder, silica flour material is 60~80: 20~40: 20~40.
8, preparation method as claimed in claim 5 is characterized in that, in the step (c), described oxygen-free atmosphere is vacuum state or argon gas, hydrogen, nitrogen, protection of ammonia atmosphere.
9, preparation method as claimed in claim 5 is characterized in that, in the step (c), described thermoset forming is selected from 1~3 kind in pressure sintering, hot rolling system, hot-extrudable, discharge plasma sintering, ultra-high pressure sintering, electric spark sintering, the microwave sintering.
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CN101864271A (en) * | 2010-04-02 | 2010-10-20 | 邱凤阳 | Heat generating material capable of absorbing microwave and ceramic bonding heat generating material prepared by using same |
CN102172501A (en) * | 2011-03-14 | 2011-09-07 | 广东工业大学 | Preparation method of carbon-coated silicon carbide nano powder with nuclear shell structure |
CN102627882A (en) * | 2012-03-20 | 2012-08-08 | 庞伟 | Preparation method of nanometer silica glass microwave paint |
CN103043957A (en) * | 2012-12-27 | 2013-04-17 | 李建平 | Nanometer stone material and production method thereof |
CN103171207A (en) * | 2013-03-06 | 2013-06-26 | 厦门理工学院 | Heat sink material and preparation method thereof |
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CN103304237A (en) * | 2013-05-07 | 2013-09-18 | 山东科技大学 | Synthesis method of Al4SiC4 material |
CN103819903A (en) * | 2014-03-18 | 2014-05-28 | 上海利物盛企业集团有限公司 | Nanometer silicon composite heat conduction material and preparation method thereof |
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CN104386948A (en) * | 2013-10-30 | 2015-03-04 | 长沙理工大学 | Fast preparation method of graphite composite material with high thermal conductivity |
CN104672496A (en) * | 2015-02-03 | 2015-06-03 | 浙江荣泰科技企业有限公司 | Insulating heat-conducting graphite micro powder with core-shell structure as well as preparation method and application thereof |
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- 2009-02-23 CN CN2009101055231A patent/CN101486575B/en not_active Expired - Fee Related
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CN101864271A (en) * | 2010-04-02 | 2010-10-20 | 邱凤阳 | Heat generating material capable of absorbing microwave and ceramic bonding heat generating material prepared by using same |
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CN110041898A (en) * | 2019-05-23 | 2019-07-23 | 江苏碳元绿色建筑科技有限公司 | A kind of nano material in-situ enhancing porous graphite material and its preparation method and application |
CN110372409A (en) * | 2019-08-08 | 2019-10-25 | 苏州山人纳米科技有限公司 | Nano-cellulose enhances graphite material fast preparation method |
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