CN203761673U - PCB (printed circuit board) having secondary solder resistant protective layer - Google Patents

PCB (printed circuit board) having secondary solder resistant protective layer Download PDF

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Publication number
CN203761673U
CN203761673U CN201420001729.6U CN201420001729U CN203761673U CN 203761673 U CN203761673 U CN 203761673U CN 201420001729 U CN201420001729 U CN 201420001729U CN 203761673 U CN203761673 U CN 203761673U
Authority
CN
China
Prior art keywords
protective layer
pcb
resistant protective
circuit board
solder resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420001729.6U
Other languages
Chinese (zh)
Inventor
宦洪波
王国庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU HAIHONG ELECTRONICS CO LTD
Original Assignee
CHANGZHOU HAIHONG ELECTRONICS CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU HAIHONG ELECTRONICS CO LTD filed Critical CHANGZHOU HAIHONG ELECTRONICS CO LTD
Priority to CN201420001729.6U priority Critical patent/CN203761673U/en
Application granted granted Critical
Publication of CN203761673U publication Critical patent/CN203761673U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a PCB (printed circuit board), and especially relates to a cover oil layer structure of the PCB. The purpose of the present utility model is to provide a PCB that is convenient to process and reliable in performance and has a secondary solder resistant protective layer. The PCB having the secondary solder resistant protective layer has a green oil cover layer for covering the surface of a circuit. The secondary resistant protective layer is positioned at the edge of the PCB and the periphery of a threaded hole. The advantage of the PCB having the secondary solder resistant protective layer is that after the added printed secondary solder resistant protective layer, an ink layer of a dense fine circuit is thickened, and the wear resistance of the circuit board is enhanced without affecting the performance of the PCB.

Description

There is the pcb board of secondary welding resistance protective layer
Technical field
The utility model relates to pcb board, relates to especially its oil overlay structure.
Background technology
Pcb board is exactly printed circuit board (PCB), almost there will be in the middle of each electronic equipment.And electronic component is just set on the pcb board of different sizes.Along with electronic equipment becomes increasingly complex, the part needing is more and more, and circuit and part on pcb board are also more and more intensive.This plate is heat insulation by insulating, also unbending material forms substrate, the tiny line material that can see on surface is Copper Foil, originally Copper Foil is to cover on whole plank, and in manufacture process, part is etched disposes, and the part staying has just become webbed tiny circuit.These circuits are known as wire or claim wiring, and are used to provide the circuit connection of part on pcb board.
Existing pcb board circuit surface only has green oil to cover, and dense wire and thin diameter line road surfaces only have green oil to cover, and in the time of normal process, this position is rubbed, and easily causes leaking copper phenomenon.
Utility model content
The purpose of this utility model is to provide a kind of pcb board with secondary welding resistance protective layer of easy to process, dependable performance.Complete after solidifying and increase secondary solder mask in welding resistance ink silk screen printing, thereby prevent that plate face from wiping flower wearing and tearing, prevent from scrapping, increase product useful life.
The technical scheme that realizes the utility model object is as follows: a kind of pcb board with secondary welding resistance protective layer, there is the green oil cap rock for covering circuit surface, and on the green oil cap rock of above-mentioned wiring board, be also provided with secondary welding resistance protective layer.Above-mentioned secondary welding resistance protective layer is positioned at edge and the screw hole periphery of pcb board.This novel benefit is again to have printed additional after one deck secondary welding resistance protective layer, and the ink layer on intensive fine rule road is thickeied, and is not affecting under the prerequisite of the performance of product own, has strengthened circuit board resistance to wear.
Brief description of the drawings
Fig. 1 is the utility model schematic diagram.
Embodiment
See Fig. 1, this novel pcb board 1 with secondary welding resistance protective layer, has the green oil cap rock for covering circuit surface, and the edge of above-mentioned pcb board 1 goes out with screw hole 2 to be also provided with secondary welding resistance protective layer 3 around.
When production, pass through to increase printed board text addition silk-screen layer; flower is easily being wiped in printed board; leaking copper and insert row solder joint position increases secondary welding resistance protective layer ink, in product processing, without increasing operation, can in engineering data, extention directly be designed and be superposeed.Do not affecting under the prerequisite of the performance of product own, on welding resistance green oil layer surface, at panel edges and screw hole edge etc., place easy to wear increases character layer protective layer; accentuator plate resistance to wear; thereby prevent that plate face from wiping flower wearing and tearing, prevent from scrapping, increase product useful life.
Obviously, above-mentioned embodiment of the present utility model is only for the utility model example is clearly described, and is not the restriction to the utility model execution mode.For those of ordinary skill in the field, can also be easy on the basis of the above description make other pro forma variation or substitute, and these changes or alternative also by within being included in the definite protection range of the utility model.

Claims (2)

1. there is a pcb board for secondary welding resistance protective layer, there is the green oil cap rock for covering circuit surface, it is characterized in that: on the green oil cap rock of above-mentioned wiring board, be also provided with secondary welding resistance protective layer (3).
2. the pcb board with secondary welding resistance protective layer according to claim 1, is characterized in that: above-mentioned secondary welding resistance protective layer (3) is positioned at edge and screw hole (2) periphery of pcb board (1).
CN201420001729.6U 2014-01-02 2014-01-02 PCB (printed circuit board) having secondary solder resistant protective layer Expired - Fee Related CN203761673U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420001729.6U CN203761673U (en) 2014-01-02 2014-01-02 PCB (printed circuit board) having secondary solder resistant protective layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420001729.6U CN203761673U (en) 2014-01-02 2014-01-02 PCB (printed circuit board) having secondary solder resistant protective layer

Publications (1)

Publication Number Publication Date
CN203761673U true CN203761673U (en) 2014-08-06

Family

ID=51256900

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420001729.6U Expired - Fee Related CN203761673U (en) 2014-01-02 2014-01-02 PCB (printed circuit board) having secondary solder resistant protective layer

Country Status (1)

Country Link
CN (1) CN203761673U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105050332A (en) * 2015-08-12 2015-11-11 广东欧珀移动通信有限公司 Manufacturing method of printed circuit board packaged in shell and printed circuit board
CN105451435A (en) * 2015-12-31 2016-03-30 上海摩软通讯技术有限公司 PCB preventing metal contact of card base from short circuit and mobile terminal
CN115023063A (en) * 2022-07-05 2022-09-06 博敏电子股份有限公司 Optical module printed circuit board and anti-scratch method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105050332A (en) * 2015-08-12 2015-11-11 广东欧珀移动通信有限公司 Manufacturing method of printed circuit board packaged in shell and printed circuit board
CN105451435A (en) * 2015-12-31 2016-03-30 上海摩软通讯技术有限公司 PCB preventing metal contact of card base from short circuit and mobile terminal
CN115023063A (en) * 2022-07-05 2022-09-06 博敏电子股份有限公司 Optical module printed circuit board and anti-scratch method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140806