CN203747235U - Packaging outer shell for laser device of CTP laser printing industry - Google Patents
Packaging outer shell for laser device of CTP laser printing industry Download PDFInfo
- Publication number
- CN203747235U CN203747235U CN201420086993.4U CN201420086993U CN203747235U CN 203747235 U CN203747235 U CN 203747235U CN 201420086993 U CN201420086993 U CN 201420086993U CN 203747235 U CN203747235 U CN 203747235U
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- CN
- China
- Prior art keywords
- lead
- laser
- cavity
- ctp
- printing industry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Semiconductor Lasers (AREA)
- Lasers (AREA)
Abstract
The utility model discloses a packaging outer shell for a laser device of a CTP laser printing industry. The packaging outer shell comprises a shell body, a lead, a grounding pin and a fiber outgoing tube, wherein the shell body comprises a bottom part and side walls from the first to the fourth, a cavity body is enclosed by the side walls from the first to the fourth and the bottom part, the first side wall is provided with a fiber outgoing tube mounting hole, the fiber outgoing tube is mounted in the fiber outgoing tube mounting hole and penetrates the first side wall to be communicated with the cavity body, the third side wall is provided with a lead mounting hole, the lead is mounted in the lead mounting hole and penetrates the third side wall to extend to the bottom part of the cavity body, the lead is mounted in the lead mounting hole by adopting a glass packaging manner, and the grounding pin is arranged on the third side wall. According to the packaging outer shell, the lead is packaged by adopting the glass packaging manner, the packaging outer shell has good sealing strength, good air tightness, high safety and long service life, is beneficial to reducing volume of the packaging outer shell, and is conducive to the miniaturization development of products.
Description
Technical field
The utility model relates to field of lasers, relates in particular to a kind of laser package casing of CTP laser printing industry.
Background technology
Along with the development of Laser Devices and correlation technique thereof, the application of laser in all trades and professions developed rapidly.For example, be applied to CTP laser printing industry, the needed light source that exposes in printing process is provided.High power laser tube core and coupling fiber are fixed on to package casing inside, by certain electric current and voltage being provided to high power laser tube core, to export the light of 830nm.But this package casing is to adopt early stage external packaged type, uses plastics to encapsulate, air-tightness and poor reliability, useful life is short.
Therefore, there is defect in prior art, needs to improve.
Utility model content
Technical problem to be solved in the utility model is: a kind of laser package casing of CTP laser printing industry is provided, to solve air-tightness and the poor reliability of package casing in prior art, and useful life short problem.
The technical solution of the utility model is as follows: the utility model provides a kind of laser package casing of CTP laser printing industry, comprise: housing, lead-in wire, grounding pin and fiber pipe, described housing comprises: bottom and first to fourth sidewall, described first to fourth sidewall and described bottom surround a cavity, described the first side wall is provided with fiber pipe installing hole, described fiber pipe is installed on described fiber pipe installing hole, and run through the first side wall and be communicated with described cavity, described the 3rd sidewall is provided with lead-in wire installing hole, described lead-in wire is installed on described lead-in wire installing hole, and run through described the 3rd sidewall and extend to described cavity bottom, described lead-in wire adopts glass packaging mode to be installed on described lead-in wire installing hole, described grounding pin is located on the 3rd sidewall.
Described cavity bottom inner side is provided with the first screwed hole, and described the first screwed hole is for fixed laser chip; Described the 3rd sidewall outside is also provided with the second screwed hole, and described the second screwed hole is for being connected with external module.
On described the first side wall, be also arranged with first and second tapped through hole, described the 3rd sidewall is provided with the 3rd tapped through hole.
Described cavity comprises the first cavity and is positioned at the second cavity of described the first cavity top, and described the first cavity is used for installing chip of laser, and described the second cavity is for encapsulation cover plate.
Described housing is one-body molded by oxygen-free copper.
Described fiber pipe is provided with two slotted eyes away from shell ends.
Described surface of shell and described wire surface are coated with nickel and gold.
Adopt such scheme, the laser package casing of the utility model CTP laser printing industry, its lead-in wire adopts glass packaging mode, there is good sealing strength, while air-tightness is good, safe, long service life, and be conducive to reduce package casing volume, be conducive to product and develop towards microminiaturization.
Brief description of the drawings
Fig. 1 is the vertical view of package casing for the laser of the utility model CTP laser printing industry.
Fig. 2 is the end view of package casing for the laser of the utility model CTP laser printing industry.
Fig. 3 is the profile of A-A in Fig. 1.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.
Refer to Fig. 1 to Fig. 3, the utility model provides a kind of laser package casing of CTP laser printing industry, comprise: housing 11, lead-in wire 19, grounding pin 14 and fiber pipe 17, described housing 11 comprises: bottom 35 and first to fourth sidewall 31, 32, 33, 34, described first to fourth sidewall 31, 32, 33, 34 surround a cavity 20 with described bottom 35, described cavity 20 comprises the first cavity 12 and is positioned at the second cavity 13 of described the first cavity 12 tops, described the first cavity 12 is for installing chip of laser, described the second cavity 13 is for encapsulation cover plate.Described fiber pipe 17 is for connecting inside and outside optical fiber, and described the first side wall 31 is provided with fiber pipe installing hole (not indicating), and described fiber pipe 17 is installed on described fiber pipe installing hole, and runs through the first side wall 31 and be communicated with described the first cavity 12.Described fiber pipe 17 is provided with two slotted eyes 18 away from housing 11 ends, and these two slotted eyes 18 are for carrying out optical fiber observation and fixing.Described lead-in wire 19 is for the transmission of the inside and outside signal of telecommunication, described the 3rd sidewall 33 is provided with lead-in wire installing hole (not indicating), described lead-in wire 19 is installed on described lead-in wire installing hole, and run through described the 3rd sidewall 32 and extend to described the first cavity 12 bottoms, described lead-in wire 19 adopts glass packaging mode to be installed on described lead-in wire installing hole, sealing strength is high, and while air-tightness is good, safe, long service life.Described grounding pin 14 is for connecting ground wire, and it is specifically located on the 3rd sidewall 33, and described grounding pin 14 can be one-body molded with housing 11.
Described cavity 20 bottom inside are provided with the first screwed hole 16, and the first cavity 12 bottoms are provided with the first screwed hole 16, and described the first screwed hole 16 is for fixed laser chip; Described the 3rd sidewall 33 outsides are also provided with the second screwed hole 15, and described the second screwed hole 15 is for being connected with external module.
On described the first side wall 31, be also arranged with first and second tapped through hole 21,22, described the 3rd sidewall 11 is provided with the 3rd tapped through hole 23.The described first to the 3rd screw thread 21,22,23 through holes are used for fixing this package casing.
Described housing 11 is one-body molded by oxygen-free copper, good heat conductivity.Meanwhile, utilize the characteristic of oxygen-free copper, select the devitrified glass, the lead-in wire (composite leg) 19 that adapt, adopt the mode of pressure sealing, lead-in wire 19, housing 11 and devitrified glass are melted to envelope and be integrated.Described housing 11 surfaces are coated with nickel and gold with described lead-in wire 19 surfaces, can meet well and use required physical characteristic.
In sum, the utility model provides a kind of laser package casing of CTP laser printing industry, its lead-in wire adopts glass packaging mode, there is good sealing strength, while air-tightness is good, safe, long service life, and be conducive to reduce package casing volume, be conducive to product and develop towards microminiaturization.
These are only preferred embodiment of the present utility model, be not limited to the utility model, all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (7)
1. the laser package casing of a CTP laser printing industry, it is characterized in that, comprise: housing, lead-in wire, grounding pin and fiber pipe, described housing comprises: bottom and first to fourth sidewall, described first to fourth sidewall and described bottom surround a cavity, described the first side wall is provided with fiber pipe installing hole, described fiber pipe is installed on described fiber pipe installing hole, and run through the first side wall and be communicated with described cavity, described the 3rd sidewall is provided with lead-in wire installing hole, described lead-in wire is installed on described lead-in wire installing hole, and run through described the 3rd sidewall and extend to described cavity bottom, described lead-in wire adopts glass packaging mode to be installed on described lead-in wire installing hole, described grounding pin is located on the 3rd sidewall.
2. the laser package casing of CTP laser printing industry according to claim 1, is characterized in that, described cavity bottom inner side is provided with the first screwed hole, and described the first screwed hole is for fixed laser chip; Described the 3rd sidewall outside is also provided with the second screwed hole, and described the second screwed hole is for being connected with external module.
3. the laser package casing of CTP laser printing industry according to claim 1, is characterized in that, is also arranged with first and second tapped through hole on described the first side wall, and described the 3rd sidewall is provided with the 3rd tapped through hole.
4. the laser package casing of CTP laser printing industry according to claim 1, it is characterized in that, described cavity comprises the first cavity and is positioned at the second cavity of described the first cavity top, and described the first cavity is used for installing chip of laser, and described the second cavity is for encapsulation cover plate.
5. the laser package casing of CTP laser printing industry according to claim 1, is characterized in that, described housing is one-body molded by oxygen-free copper.
6. the laser package casing of CTP laser printing industry according to claim 1, is characterized in that, described fiber pipe is provided with two slotted eyes away from shell ends.
7. the laser package casing of CTP laser printing industry according to claim 1, is characterized in that, described surface of shell and described wire surface are coated with nickel and gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420086993.4U CN203747235U (en) | 2014-02-28 | 2014-02-28 | Packaging outer shell for laser device of CTP laser printing industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420086993.4U CN203747235U (en) | 2014-02-28 | 2014-02-28 | Packaging outer shell for laser device of CTP laser printing industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203747235U true CN203747235U (en) | 2014-07-30 |
Family
ID=51346995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420086993.4U Expired - Fee Related CN203747235U (en) | 2014-02-28 | 2014-02-28 | Packaging outer shell for laser device of CTP laser printing industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203747235U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114039271A (en) * | 2021-10-27 | 2022-02-11 | 深圳市宏钢机械设备有限公司 | Integrated glass packaging tube seat and production process thereof |
-
2014
- 2014-02-28 CN CN201420086993.4U patent/CN203747235U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114039271A (en) * | 2021-10-27 | 2022-02-11 | 深圳市宏钢机械设备有限公司 | Integrated glass packaging tube seat and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140730 Termination date: 20180228 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |