CN203660273U - Bfm light detector assembly - Google Patents
Bfm light detector assembly Download PDFInfo
- Publication number
- CN203660273U CN203660273U CN201420001279.0U CN201420001279U CN203660273U CN 203660273 U CN203660273 U CN 203660273U CN 201420001279 U CN201420001279 U CN 201420001279U CN 203660273 U CN203660273 U CN 203660273U
- Authority
- CN
- China
- Prior art keywords
- heat sink
- bfm
- light detector
- detector assembly
- gold
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010931 gold Substances 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims abstract description 10
- 241000218202 Coptis Species 0.000 claims description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 8
- 230000027455 binding Effects 0.000 claims description 5
- 238000009739 binding Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 abstract description 4
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 12
- 238000012544 monitoring process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model relates to a BFM light detector assembly. The BFM light detector assembly comprises a detector chip and a heat sink, wherein the front face and two parallel side faces of the heat sink are provided with conductive layers, the detector chip is mounted at the front face of the heat sink and is bound by utilizing a gold wire, and the side faces of the heat sink are mounted on an electrical board through the conductive layers. The BFM light detector assembly has a simple structure, through mounting the light detection chip on the front face of the heat sink of which the front face and the two parallel side faces are plated with gold, the heat sink is then mounted on the electrical board to be in direct grounding connection through the gold-plated layers of which the side faces are conductive, after gold wire bonding in the assembly mode, the dark current is relatively small; the BFM light detector assembly further employs advantages of a light detector having no heat sink, the BFM light detector assembly is mounted on the electrical board to be in direct grounding connection, the dark current is reduced, and sensitivity is improved. As one end is in direct grounding connection, only one gold wire is needed, reverse bias is exerted, compared with two gold-plated faces, the BFM light detector assembly is more suitable for wire bonding, and thereby production efficiency is improved.
Description
Technical field
The utility model relates to optical communication device field, is especially applied in generating laser, as the BFM photo-detector assembly of the chief component of automatic power control circuitry (APC).
Background technology
Along with the development of optical communication, miniaturized high-speed rate transmitter module has become the main demand in market, BFM(Back Facet Monitor) photo-detector is as the primary clustering of transmitter module, its effect is that light signal is converted to the signal of telecommunication, by the luminous power of monitoring laser two device chips, thereby detect its characteristic.Therefore to BFM photo-detector assembly in performance, in volume and flexibility, had higher requirement, and need can ease of assembly, be applicable to producing in enormous quantities.The major parameter of the BFM light photo-detector in generating laser is dark current, and it directly affects responsiveness and the sensitivity of photo-detector.
The assembly of BFM photo-detector generally using in the market has two kinds: a kind of is that detection chip is mounted on gold-plated heat sink in two sides, heat sink mounting again on electroplax, can be by moving forward and backward heat sink and rotating heat sink, change back facet current size, this assembly has many deficiencies, as volume is large, beat gold thread inconvenience, dark current is large; Another kind is not use heat sink BFM photo-detector, directly BFM photo-detector is mounted in the groove of electroplax, and the maximum weak point of this assembly is to be not easy to change the back facet current of surveying.
Summary of the invention
The object of utility model is to provide a kind of simple in structure, can effectively control back facet current size, reduces dark current and highly sensitive BFM photo-detector assembly.
The utility model solves the technical scheme that prior art problem adopts: BFM photo-detector assembly, comprise detector chip and heat sink, described heat sink front and two parallel side are provided with conductive layer, on the described side that is provided with conductive layer therein, add reverse biased; Described detector chip is mounted on described heat sink front and utilizes gold thread binding, and described heat sink side is mounted on electroplax by conductive layer.
Described conductive layer is Gold plated Layer.
The beneficial effects of the utility model are: the utility model is simple in structure, by optical detection chip being attached to the gold-plated heat sink front of front and two parallel side, one of them heat sink side makes detector in normal operating conditions by the Gold plated Layer applied reverse bias voltage of conduction, another heat sink parallel side is directly mounted on electroplax by the Gold plated Layer of conduction, reaches directly grounded this assembly object.After the binding of this kind of assembling mode gold thread, dark current is less; This assembly is also adopted the advantage that there is no heat sink photo-detector, and assembly is mounted on to direct ground connection on electroplax, reduces dark current, improves its sensitivity.Due to the direct ground connection in one end, only need to make a call to a gold thread, add reverse biased, gold-plated than two sides, it is more suitable for routing, and then has improved production efficiency.
Brief description of the drawings
Fig. 1 is stereogram of the present utility model;
Fig. 2 is the assembling schematic diagram after gold thread binding of the present utility model;
Fig. 3 is the scheme of installation of the utility model BFM photo-detector assembly and chip of laser;
Fig. 4 is the stereogram of Fig. 3.
In figure, 1-photo detector chip, 2-is heat sink, 3-gold thread, 4-chip of laser, 5-is added with the heat sink side of reverse biased, and 51-is mounted on the heat sink side on electroplax.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described:
Fig. 1 is the stereogram of the utility model BFM photo-detector assembly.BFM photo-detector assembly, comprises photo detector chip 1 and heat sink 2, and optical detection chip 1 technology of this assembly adopts InGaAs/InP material, coordinates 1260-1620nm wavelength light range of receiving, has good responsiveness; Heat sink 2 front and two parallel side 5 are provided with the Gold plated Layer of conduction, detector chip 1 is mounted on described heat sink 2 front and utilizes gold thread 3 to bind (as shown in Figure 2), heat sink 2 side 5 makes detector in normal operating conditions by the Gold plated Layer applied reverse bias voltage of conduction, thereby reach the effect of monitoring laser performance, another parallel side of heat sink 2 is the heat sink side 51 being mounted on electroplax, Gold plated Layer by conduction provided thereon is directly mounted on electroplax heat sink 2, reaches directly grounded this assembly object.
Fig. 3,4 is respectively scheme of installation and the stereogram of BFM photo-detector assembly and chip of laser.It is heat sink 2 that this assembly can all around move and rotate in the time of monitoring laser chip 1 performance, effectively controls back facet current size.In the time of the shady face of chip of laser 4 and angulation α >=7, front of BFM photo-detector of the present utility model °, can effectively avoid it to affect the performance of laser receiving produced simultaneously light reflection of light.This assembly has also been adopted the advantage that there is no heat sink photo-detector, by direct assembly ground connection, has effectively reduced dark current, improves its sensitivity.Due to one end of photo-detector 1 be attached to heat sink on, and heat sink 2 side 51 is mounted on electroplax by the Gold plated Layer of conduction, reach directly grounded assembly object, so only need make a call to a gold thread by detector chip 1 and heat sink 2 bindings, gold-plated than two sides, it is more suitable for routing, and then has improved production efficiency.
The optical power control circuit that this assembly is realized can remain that laser has a constant Output optical power, concrete novel way of realization: in the time that the Output optical power of its laser is degenerated because of variation of ambient temperature or because of chip of laser, its Output optical power all can change, by being arranged on the light Output optical power of BFM photo-detector monitoring laser device of laser shady face, the light signal that photo-detector is detected converts signal of telecommunication output to and feeds back to drive circuit, and in the time that optical output power of laser declines, its drive current increases to improve luminous power; In the time that optical output power of laser increases, its drive current declines to reduce luminous power, thereby keeps laser to have a constant Output optical power.
Above content is in conjunction with concrete optimal technical scheme further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (2)
1.BFM photo-detector assembly, comprises detector chip and heat sink, it is characterized in that, described heat sink front and two parallel side are provided with conductive layer, on the described side that is provided with conductive layer therein, adds reverse biased; Described detector chip is mounted on described heat sink front and utilizes gold thread binding, and described heat sink side is mounted on electroplax by conductive layer.
2. BFM photo-detector assembly according to claim 1, is characterized in that, described conductive layer is Gold plated Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420001279.0U CN203660273U (en) | 2014-01-02 | 2014-01-02 | Bfm light detector assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420001279.0U CN203660273U (en) | 2014-01-02 | 2014-01-02 | Bfm light detector assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203660273U true CN203660273U (en) | 2014-06-18 |
Family
ID=50926625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420001279.0U Expired - Lifetime CN203660273U (en) | 2014-01-02 | 2014-01-02 | Bfm light detector assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203660273U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810724A (en) * | 2015-05-06 | 2015-07-29 | 大连藏龙光电子科技有限公司 | Coaxially-packaged DFB laser transmitter with refrigeration function |
| CN106785890A (en) * | 2017-03-03 | 2017-05-31 | 大连藏龙光电子科技有限公司 | 10G minimizes the photo-detector assembling structure of EML lasers |
| WO2022242309A1 (en) * | 2021-05-17 | 2022-11-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2014
- 2014-01-02 CN CN201420001279.0U patent/CN203660273U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810724A (en) * | 2015-05-06 | 2015-07-29 | 大连藏龙光电子科技有限公司 | Coaxially-packaged DFB laser transmitter with refrigeration function |
| CN106785890A (en) * | 2017-03-03 | 2017-05-31 | 大连藏龙光电子科技有限公司 | 10G minimizes the photo-detector assembling structure of EML lasers |
| WO2022242309A1 (en) * | 2021-05-17 | 2022-11-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140618 |
|
| CX01 | Expiry of patent term |