CN203657265U - Semiconductor refrigeration system - Google Patents
Semiconductor refrigeration system Download PDFInfo
- Publication number
- CN203657265U CN203657265U CN201320887309.8U CN201320887309U CN203657265U CN 203657265 U CN203657265 U CN 203657265U CN 201320887309 U CN201320887309 U CN 201320887309U CN 203657265 U CN203657265 U CN 203657265U
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- CN
- China
- Prior art keywords
- cooling water
- refrigeration system
- water flat
- semiconductor refrigeration
- semiconductor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 238000005057 refrigeration Methods 0.000 title claims abstract description 40
- 239000000498 cooling water Substances 0.000 claims abstract description 57
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a refrigeration system, and aims to provide a semiconductor refrigeration system which is simple in structure, good in refrigeration effect, and small in size. The refrigeration system includes a plurality of cooling water flat tubes (1), a left collecting pipe (2) communicated with the left ends of the plurality of cooling water flat tubes (1), a right collecting pipe (3) communicated with the right ends of the plurality of cooling water flat tubes (1), and a plurality of semiconductor refrigeration sheets (4) arranged on the flat panels of the cooling water flat tubes (1), the heating surfaces of the plurality of semiconductor refrigeration sheets (4) are attached to the flat panels of the cooling water flat tubes (1), During the refrigeration, the plurality of semiconductor refrigeration sheets (4) are connected with a power supply, cooling water accesses to the plurality of cooling water flat tubes (1), and heat generated by the semiconductor refrigeration sheets (4) can be absorbed by the cooling water. The refrigeration system provided is applicable to the technical field of semiconductor refrigeration systems.
Description
Technical field
The utility model relates to a kind of refrigeration system, particularly a kind of semiconductor refrigeration system.
Background technology
Semiconductor chilling plate is also thermoelectric module, and it is without cold-producing medium, in the time of galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, can absorb heat and emit heat at the two ends of galvanic couple, can realize the object of refrigeration.Semiconductor refrigerating technology is widely used in, in the middle of life, such as with semiconductor refrigerating technology, water being freezed, can greatly reducing volume and the energy consumption of water dispenser on water dispenser at present, can also reduce to a certain extent mechanicalness noise.Some enterprise is also by semiconductor refrigerating technology application field of air conditioning, all adopts air-cooledly on the refrigeration of semiconductor chilling plate and the two sides of heat production, after the cold wind of semiconductor chilling plate both sides and hot blast mix, can not produce any refrigerating capacity, poor refrigerating efficiency.
Utility model content
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, and a kind of simple in structure, good refrigeration effect and the little semiconductor refrigeration system of volume are provided.
The technical scheme that the utility model adopts is: the utility model comprises some cooling water flat tubes, the left header being connected with some described cooling water flat tube left ends, the right header being connected with some described cooling water flat tube right-hand members, be arranged on several semiconductor chilling plates on the flat horizontal surface of described cooling water flat tube, described in several, the heating face of semiconductor chilling plate is fitted on the flat horizontal surface of described cooling water flat tube, when refrigeration, described in several, semiconductor chilling plate switches on power, some described cooling water flat tubes all pass into cooling water, the heat that described in several, semiconductor chilling plate produces is absorbed by cooling water.
Described in several, on the chill surface of semiconductor chilling plate, be provided with fin.
Described in several, on the chill surface of semiconductor chilling plate, be provided with chilled water flat tube.
Some described cooling water flat tubes all be arranged in parallel.
The flat horizontal surface of some described cooling water flat tubes is positioned on horizontal plane.
Described power supply is sun-generated electric power.
The utility model also comprise some desk fans and with some the fan hubs that described fan is suitable, some described cooling water flat tubes are positioned at described fan hub, when work, described in several, semiconductor chilling plate freezes to the air in described fan hub, and some described fans blow out cold air again.
Described fan is DC fan.
On described fan hub, be provided with air-inlet grille.
The beneficial effects of the utility model are: because the utility model comprises some cooling water flat tubes, the left header being connected with some described cooling water flat tube left ends, the right header being connected with some described cooling water flat tube right-hand members, be arranged on several semiconductor chilling plates on the flat horizontal surface of described cooling water flat tube, described in several, the heating face of semiconductor chilling plate is fitted on the flat horizontal surface of described cooling water flat tube, when refrigeration, described in several, semiconductor chilling plate switches on power, some described cooling water flat tubes all pass into cooling water, the heat that described in several, semiconductor chilling plate produces is absorbed by cooling water, so, the utility model is simple in structure, in the time of refrigeration, heat can completely cut off and open well, and employing modularized design, make the utlity model has good good refrigeration effect, volume can also be reduced greatly little.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is partial structurtes structural representation of the present utility model;
Fig. 3 is the structure for amplifying schematic diagram at the A place of Fig. 2;
Fig. 4 is the partial structurtes structural representation at another visual angle of the present utility model;
Fig. 5 is rearview of the present utility model;
Fig. 6 is perspective view of the present utility model.
The specific embodiment
As shown in Figures 1 to 6, the utility model comprises some cooling water flat tubes 1, the left header 2 being connected with some described cooling water flat tube 1 left ends, the right header 3 being connected with some described cooling water flat tube 1 right-hand members, be arranged on several semiconductor chilling plates 4 on the flat horizontal surface of described cooling water flat tube 1, described in several, the heating face of semiconductor chilling plate 4 is fitted on the flat horizontal surface of described cooling water flat tube 1, when refrigeration, described in several, semiconductor chilling plate 4 switches on power, some described cooling water flat tubes 1 all pass into cooling water, the heat that described in several, semiconductor chilling plate 4 produces is absorbed by cooling water, in the present embodiment, the quantity of described cooling water flat tube 1 is ten, on each flat horizontal surface of described cooling water flat tube 1, be provided with five described semiconductor chilling plates 4.
In the present embodiment, on the chill surface of described semiconductor chilling plate 2, be provided with fin 5.
In the present embodiment, ten described cooling water flat tubes 1 all be arranged in parallel.
In the present embodiment, the flat horizontal surface of ten described cooling water flat tubes 1 is positioned on horizontal plane.
The utility model also comprise two desk fans 6 and with the suitable fan hub 7 of described fan 6, on described fan hub 7, be provided with air-inlet grille 8, ten described cooling water flat tubes 1 are positioned at described fan hub 7, when work, described semiconductor chilling plate 4 freezes to the air in described fan hub 7, two described fans 6 blow out cold air again, and in the present embodiment, described fan 6 is DC fan.
In the present embodiment, described power supply is sun-generated electric power, when refrigeration, described semiconductor chilling plate 4 and described DC fan are all electrically connected with described sun-generated electric power, described left header 2 is assigned to cooling water in each described cooling water flat tube 1, the heat that the flat horizontal surface of described cooling water flat tube 1 produces the heating face of described semiconductor chilling plate 4 is delivered in the cooling water in described cooling water flat tube 1, cooling water after heat absorption flows out by described right header 3 again, in the process of whole refrigeration, the heat that the heating face of described semiconductor chilling plate 4 produces only has minute quantity by absorption of air, and the cold air of the hot-air of the heating face of described semiconductor chilling plate 4 generation and chill surface generation can not mix, good refrigeration effect.
The utility model is applied to the technical field of semiconductor refrigeration system.
Although embodiment of the present utility model describes with practical solution, but do not form the restriction to the utility model implication, such as, described in several, on the chill surface of semiconductor chilling plate 2, can be provided with chilled water flat tube, thereby can carry out cooling to water, for those skilled in the art, the modification according to this description to its embodiment and with the combination of other schemes be all apparent.
Claims (9)
1. a semiconductor refrigeration system, it is characterized in that: described a kind of semiconductor refrigeration system comprises some cooling water flat tubes (1), the left header (2) being connected with some described cooling water flat tubes (1) left end, the right header (3) being connected with some described cooling water flat tubes (1) right-hand member, be arranged on several semiconductor chilling plates (4) on the flat horizontal surface of described cooling water flat tube (1), the heating face of semiconductor chilling plate described in several (4) is fitted on the flat horizontal surface of described cooling water flat tube (1), when refrigeration, semiconductor chilling plate described in several (4) switches on power, some described cooling water flat tubes (1) all pass into cooling water, the heat that semiconductor chilling plate described in several (4) produces is absorbed by cooling water.
2. a kind of semiconductor refrigeration system according to claim 1, is characterized in that: on the chill surface of semiconductor chilling plate described in several (2), be provided with fin (5).
3. a kind of semiconductor refrigeration system according to claim 1, is characterized in that: on the chill surface of semiconductor chilling plate described in several (2), be provided with chilled water flat tube.
4. a kind of semiconductor refrigeration system according to claim 1, is characterized in that: some described cooling water flat tubes (1) all be arranged in parallel.
5. a kind of semiconductor refrigeration system according to claim 4, is characterized in that: the flat horizontal surface of some described cooling water flat tubes (1) is positioned on horizontal plane.
6. a kind of semiconductor refrigeration system according to claim 1, is characterized in that: described power supply is sun-generated electric power.
7. according to a kind of semiconductor refrigeration system described in claim 1 to 6 any one, it is characterized in that: described a kind of semiconductor refrigeration system also comprise some desk fans (6) and with the suitable fan hub (7) of some described fans (6), some described cooling water flat tubes (1) are positioned at described fan hub (7), when work, semiconductor chilling plate described in several (4) freezes to the air in described fan hub (7), and some described fans (6) blow out cold air again.
8. a kind of semiconductor refrigeration system according to claim 7, is characterized in that: described fan (6) is DC fan.
9. a kind of semiconductor refrigeration system according to claim 7, is characterized in that: on described fan hub (7), be provided with air-inlet grille (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320887309.8U CN203657265U (en) | 2013-12-31 | 2013-12-31 | Semiconductor refrigeration system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320887309.8U CN203657265U (en) | 2013-12-31 | 2013-12-31 | Semiconductor refrigeration system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203657265U true CN203657265U (en) | 2014-06-18 |
Family
ID=50923646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320887309.8U Expired - Fee Related CN203657265U (en) | 2013-12-31 | 2013-12-31 | Semiconductor refrigeration system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203657265U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108168143A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of semiconductor heat exchanger |
| CN108168142A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of heat pipe-type semiconductor heat-exchange system |
-
2013
- 2013-12-31 CN CN201320887309.8U patent/CN203657265U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108168143A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of semiconductor heat exchanger |
| CN108168142A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of heat pipe-type semiconductor heat-exchange system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 519070 Zhuhai Province, Xiangzhou Province, the former industrial zone,, No. 2 A Patentee after: RENOVO ZHUHAI LTD. Address before: 519070 Zhuhai Province, Xiangzhou Province, the former industrial zone,, No. 2 A Patentee before: Zhuhai Quangao Electromechanical Equipment Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |
Address after: 519000 Zhuhai City, Xiangzhou Province before the mountains of the mountain all the way up the mountain star road, building No. 37 Patentee after: RENOVO ZHUHAI LTD. Address before: 519070 Zhuhai Province, Xiangzhou Province, the former industrial zone,, No. 2 A Patentee before: RENOVO ZHUHAI LTD. |
|
| CP02 | Change in the address of a patent holder | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Establishing and unsteady state performance analysis methods for semiconductor refrigeration system Effective date of registration: 20170531 Granted publication date: 20140618 Pledgee: Bank of Communications Ltd. Zhuhai branch Pledgor: RENOVO ZHUHAI LTD. Registration number: 2017980000216 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20191125 Granted publication date: 20140618 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20221125 Granted publication date: 20140618 |
|
| PD01 | Discharge of preservation of patent | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 |