CN203644733U - Spraying apparatus for improving substrate etching evenness - Google Patents
Spraying apparatus for improving substrate etching evenness Download PDFInfo
- Publication number
- CN203644733U CN203644733U CN201320762528.3U CN201320762528U CN203644733U CN 203644733 U CN203644733 U CN 203644733U CN 201320762528 U CN201320762528 U CN 201320762528U CN 203644733 U CN203644733 U CN 203644733U
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- sidewall
- etching
- base plate
- inhomogeneity
- apparatus cavity
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Abstract
The utility model provides a spraying apparatus for improving substrate etching evenness. The spraying apparatus comprises an equipment chamber and multiple spraying pipes arranged in parallel. The multiple spraying pipes are arranged in an inclined manner with respect to the sidewalls of the equipment chamber. The equipment chamber comprises a first sidewall, a second sidewall, a third sidewall, a fourth sidewall, and a bottom surface. The first sidewall and the second sidewall are arranged in parallel. The third sidewall and the fourth sidewall are arranged in parallel. A substrate is movably inserted into the third sidewall and the fourth sidewall. Angles between the multiple spraying pipes and first sidewall and the second sidewall of the equipment chamber are from 1 to 45 degrees. The spraying apparatus for improving substrate etching evenness controls the substrate etching pressure evenness by changing the angles of the spraying pipes, resolves an uneven spraying etching pressure phenomenon, and improves etching evenness.
Description
Technical field
The utility model relates to a kind of spray equipment, relates in particular to a kind of inhomogeneity spray equipment of base plate carving and corrosion that increases.
Background technology
In FPD industry, wet etching mainly refers to the lithographic technique that adopts liquid chemical medicine to remove etching thing, adopt suitable etching liquid, carry out chemical reaction with etching thing, change the structure of etching thing, make the part covering without photoresist depart from substrate surface, and the region that has photoresist to cover is preserved, so just obtained needed figure at substrate surface.
Spray etching is as a kind of conventional wet etching form, its principle is that the etching liquid that utilizes jet pipe to spray high pressure by nozzle carries out etching to etchant, its etch rate is fast, live width is controlled well, but because pressure under nozzle is greater than nozzle ambient pressure, thereby make etching pressure inhomogeneous, cause etching homogeneity poor.
Utility model content
Technical problem to be solved in the utility model, for a kind of inhomogeneity spray equipment of base plate carving and corrosion that increases is provided, by changing jet pipe angle control base plate carving and corrosion pressure uniformity, has solved the inhomogeneous phenomenon of spray etching pressure, increases the uniformity of etching.
The utility model provides a kind of inhomogeneity spray equipment of base plate carving and corrosion that increases, and comprises apparatus cavity and the multiple jet pipes that be arranged in parallel, and described multiple jet pipes are with respect to the sidewall slope setting of apparatus cavity.
Further, the sidewall of described apparatus cavity comprises the first side wall, the second sidewall, the 3rd sidewall and the 4th sidewall, described the first side wall and the second sidewall opposing parallel arrange, described the 3rd sidewall and the 4th sidewall opposing parallel arrange, and described substrate activity is interspersed in the 3rd sidewall and the 4th sidewall.
Further, the angle between the first side wall and second sidewall of described multiple jet pipe and apparatus cavity is 1 °～45 °.
Further, the angle between the first side wall and second sidewall of described multiple jet pipe and apparatus cavity is 5 °～10 °.
Further, described apparatus cavity also comprises bottom surface, and described multiple jet pipes parallel with the bottom surface of apparatus cavity.
Further, described multiple jet pipe is connected with jet pipe tumbler.
The advantage the utlity model has is:
The spray equipment that the utility model provides a kind of substrate to increase etching homogeneity, by changing jet pipe angle control base plate carving and corrosion pressure uniformity, has solved the inhomogeneous phenomenon of spray etching pressure, increases the uniformity of etching.
Brief description of the drawings
The jet pipe vertical view of the inhomogeneity spray equipment of increase base plate carving and corrosion that Fig. 1 provides for the utility model;
The schematic perspective view of the inhomogeneity spray equipment of increase base plate carving and corrosion that Fig. 2 provides for the utility model;
The spray view of the inhomogeneity spray equipment of increase base plate carving and corrosion that Fig. 3 provides for the utility model.
In figure: 101-angle, 102-jet pipe, 103-apparatus cavity, 104-nozzle, 105-substrate, the strongest region of 106-nozzle exit pressure, 107-single-nozzle figure.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, so that those skilled in the art can better understand the utility model being implemented, but illustrated embodiment is not as to restriction of the present utility model.
The present embodiment provides a kind of inhomogeneity spray equipment of base plate carving and corrosion that increases, as shown in FIG. 1 to 3, comprise apparatus cavity 103, there is relative the first side wall, the second sidewall, and the 3rd relative sidewall, the 4th sidewall, four sidewalls are interconnected to form the apparatus cavity 103 into tetragonal structure.In described apparatus cavity 103, be provided with the multiple jet pipes 102 that are spaced in intervals and are arranged parallel to each other, and in the same plane of described multiple jet pipe 102 in paralleling with the bottom surface of apparatus cavity 103.Each jet pipe 102 of horizontal direction all has spaced multiple nozzle 104 downward, nozzle 104 belows are provided with substrate to be etched 105, this substrate 105 interts and is active in the 3rd sidewall and the 4th sidewall, and then can in the time of etching, be active in apparatus cavity 103.
Described jet pipe 102 is roughly along the first side wall, the second sidewall setting of apparatus cavity 103, and at an angle 101 with the first side wall, the second sidewall, and this angle 101 is preferably 1 °～45 °, more preferably 5 °～10 °.Ejection pressure under each nozzle 104 is the strongest, the single-nozzle figure 107 of the border circular areas that the etching liquid that each nozzle 104 sprays covers above substrate 105 is overlapped, as shown in Figure 3, the overlapped region that in same jet pipe, adjacent two nozzles spray etching liquid forms is comprehensively the strongest region 106 of nozzle exit pressure.Due to the motion of substrate 105, nozzle 104 strong pressure regions can cover whole substrate 105 along with the movement of substrate 105, thereby realize the surperficial Zone Full of substrate 105, to reach pressure even, and then can further control etching homogeneity.
The present embodiment medium dip arranges jet pipe 102 and can also make the distribution of substrate 105 surface each nozzle 104 of correspondence straggly, and then, in the time that substrate 105 moves, the equal correspondence in each position on substrate 105 surfaces can be accepted the injection the most by force under each nozzle 104, and then, can make the pressure of whole substrate 105 even, thereby while avoiding jet pipe 104 to be horizontally disposed with along apparatus cavity 103 inwalls, only can make the nozzle 104 of substrate 105 corresponding each straight line settings in surface form the line that etching degree is stronger, and affect etching homogeneity.In the utility model, all right connecting spray nozzle tumbler of jet pipe 102 is realized the rotation of jet pipe 102, thereby is better reached etching homogeneity in the spray process of etching liquid.
To sum up, adopt the inhomogeneity spray equipment of increase base plate carving and corrosion that provides of the utility model, can effectively increase the uniformity of etching, solved the inhomogeneous phenomenon of spray etching pressure.
The above embodiment is only the preferred embodiment for absolutely proving that the utility model is lifted, and protection range of the present utility model is not limited to this.What those skilled in the art did on the utility model basis is equal to alternative or conversion, all within protection range of the present utility model.Protection range of the present utility model is as the criterion with claims.
Claims (6)
1. increase the inhomogeneity spray equipment of base plate carving and corrosion, the multiple jet pipes (102) that comprise apparatus cavity (103) and be arranged in parallel, is characterized in that, described multiple jet pipes (102) are with respect to the sidewall slope setting of apparatus cavity (103).
2. the inhomogeneity spray equipment of increase base plate carving and corrosion according to claim 1, it is characterized in that, the sidewall of described apparatus cavity (103) comprises the first side wall, the second sidewall, the 3rd sidewall and the 4th sidewall, described the first side wall and the second sidewall opposing parallel arrange, described the 3rd sidewall and the 4th sidewall opposing parallel arrange, and described substrate (105) activity is interspersed in the 3rd sidewall and the 4th sidewall.
3. the inhomogeneity spray equipment of increase base plate carving and corrosion according to claim 2, is characterized in that, the angle (101) between described multiple jet pipes (102) and the first side wall and second sidewall of apparatus cavity (103) is 1 °～45 °.
4. the inhomogeneity spray equipment of increase base plate carving and corrosion according to claim 3, is characterized in that, the angle (101) between described multiple jet pipes (102) and the first side wall and second sidewall of apparatus cavity (103) is 5 °～10 °.
5. the inhomogeneity spray equipment of increase base plate carving and corrosion according to claim 4, is characterized in that, described apparatus cavity (103) also comprises bottom surface, and described multiple jet pipes (102) parallel with the bottom surface of apparatus cavity (103).
6. the inhomogeneity spray equipment of increase base plate carving and corrosion according to claim 5, is characterized in that, described multiple jet pipes (102) are connected with jet pipe tumbler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320762528.3U CN203644733U (en) | 2013-11-28 | 2013-11-28 | Spraying apparatus for improving substrate etching evenness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320762528.3U CN203644733U (en) | 2013-11-28 | 2013-11-28 | Spraying apparatus for improving substrate etching evenness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203644733U true CN203644733U (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320762528.3U Expired - Fee Related CN203644733U (en) | 2013-11-28 | 2013-11-28 | Spraying apparatus for improving substrate etching evenness |
Country Status (1)
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| CN (1) | CN203644733U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104888996A (en) * | 2015-06-29 | 2015-09-09 | 深圳市华星光电技术有限公司 | Spraying module and wet-etching device provided with same |
| WO2016044986A1 (en) * | 2014-09-23 | 2016-03-31 | 安徽省大富光电科技有限公司 | Etching equipment, developing equipment, cleaning equipment and film removing equipment, spray processing equipment and method |
| CN111447751A (en) * | 2020-04-25 | 2020-07-24 | 深圳市科路迪机械设备有限公司 | Precision etching device and etching spray frame thereof |
-
2013
- 2013-11-28 CN CN201320762528.3U patent/CN203644733U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016044986A1 (en) * | 2014-09-23 | 2016-03-31 | 安徽省大富光电科技有限公司 | Etching equipment, developing equipment, cleaning equipment and film removing equipment, spray processing equipment and method |
| CN104888996A (en) * | 2015-06-29 | 2015-09-09 | 深圳市华星光电技术有限公司 | Spraying module and wet-etching device provided with same |
| CN111447751A (en) * | 2020-04-25 | 2020-07-24 | 深圳市科路迪机械设备有限公司 | Precision etching device and etching spray frame thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20151128 |