CN203896601U - Etching and spraying device - Google Patents
Etching and spraying device Download PDFInfo
- Publication number
- CN203896601U CN203896601U CN201420130005.1U CN201420130005U CN203896601U CN 203896601 U CN203896601 U CN 203896601U CN 201420130005 U CN201420130005 U CN 201420130005U CN 203896601 U CN203896601 U CN 203896601U
- Authority
- CN
- China
- Prior art keywords
- shower
- etching
- group
- connecting gear
- spraying device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 title claims abstract description 59
- 238000005507 spraying Methods 0.000 title claims abstract description 51
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 239000007921 spray Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The utility model provides an etching and spraying device used for etching and spraying a circuit board. The etching and spraying device includes a conveying mechanism used for conveying the circuit board, and a first etching assembly and a second etching assembly used for spraying the circuit board. The first etching assembly includes a first liquid inlet pipe, and a first upper spraying pipe set and a first lower spraying pipe set communicated with the first liquid inlet pipe. The first upper spraying pipe is arranged above the conveying mechanism. The first lower spraying pipe set is arranged below the conveying mechanism. The second etching assembly includes a second liquid inlet pipe, and a second upper spraying pipe set and a second lower spraying pipe set communicated with the second liquid inlet pipe. The second upper spraying pipe set is arranged above the conveying mechanism. The second lower spraying pipe set is arranged below the conveying mechanism. Pipe pressure sensors are arranged in the first liquid inlet pipe and the second liquid inlet pipe. According to the utility model, a required pressure value of etching liquid can be adjusted, so that spraying effect is guaranteed. The etching and spraying device is simple in operation and high in reliability.
Description
Technical field
The utility model relates to a kind of circuit board process equipment, relates in particular to a kind of spraying device for etching.
Background technology
In prior art, spraying device for etching is the crucial production equipment of circuit board, and it,, by etching solution pressurization is sprayed on plate face, etches away unwanted copper face, and the part reservation being protected by resist layer forms circuit.Existing spraying device for etching arranges a pressure valve on each group spray piping, reaches the effect of pressure uniformity by adjusting each valve, work loaded down with trivial details and easily make mistakes, pressure valve is also easily stopped up or is damaged, and as do not found in time, can cause the batch of plate to scrap.
Utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of spraying device for etching, for circuit board is carried out to spray etching, described spraying device for etching comprises for the connecting gear of transfer circuit plate and the first etch component and the second etch component for circuit board is sprayed, described the first etch component comprise the first feed tube and be communicated in the first feed tube first on shower group, first time shower group, on described first, shower group is arranged at described connecting gear top, described first time shower group is arranged at described connecting gear below, described the second etch component comprise the second feed tube and be communicated in the second feed tube second on shower group, second time shower group, on described second, shower group group is arranged at described connecting gear top, described second time shower group is arranged at described connecting gear below, described pipe pressure sensor is arranged at the first feed tube and the second feed tube.
Further, on described first, shower group and first time shower group are provided with a plurality of for spraying the shower of etching liquid, on described first, the shower of shower group is arranged as two row that are parallel to each other, its arragement direction is consistent with the direction of transfer of connecting gear, two side settings that are oppositely arranged of the circuit board that the shower of shower group transmits near connecting gear on described first.
Further, it is row that the shower of described first time shower group is arranged, and its bearing of trend is consistent with the direction of transfer of connecting gear, and the middle part of the circuit board that the shower of described first time shower group transmits near connecting gear arranges.
Further, on described second, shower group and second time shower group are provided with a plurality of for spraying the shower of etching liquid, the shower of described second time shower group is arranged as two row that are parallel to each other, its arragement direction is consistent with the direction of transfer of connecting gear, two side settings that are oppositely arranged of the circuit board that the shower of described second time shower group transmits near connecting gear.
Further, to arrange be row to the shower of shower group on described second, and its bearing of trend is consistent with the direction of transfer of connecting gear, and the middle part of the circuit board that the shower of shower group transmits near connecting gear on described second arranges.
Further, described spraying device for etching is also provided with the 3rd etch component, and described the 3rd etch component is provided with a plurality of showers that wave.
Further, described in, wave the swaying direction of shower perpendicular to described circuit board direction of transfer.
Compared to prior art, spraying device for etching of the present utility model can be adjusted the force value of needed etching liquid, guarantees spraying effect, and the first etch component, the second etch component are set, and realizes repeatedly etching spray, guarantees etch effect.Spraying device for etching of the present utility model is simple to operate and reliability is high, to guaranteeing that production quality and the improving production efficiency of circuit board all has very big meaning.
Accompanying drawing explanation
Fig. 1 is the structural representation of spraying device for etching of the present utility model.
Embodiment
Below in conjunction with accompanying drawing explanation and embodiment, the utility model is further illustrated.
Refer to Fig. 1, the utility model provides a kind of spraying device for etching 10, comprises connecting gear 20 and the first etch component 30 and the second etch component 40 for circuit board is sprayed for transfer circuit plate.The first etch component 30 and the second etch component 40 set gradually along the direction of transfer of connecting gear 20.Be understandable that, spraying device for etching 10 of the present utility model can adopt all kinds of connecting gears of the prior art 20, and its structure and operation logic are consistent with related device in prior art, do not repeat them here.
Described the first etch component 30 comprise the first feed tube 31 and be communicated in the first feed tube 31 first on shower group 33, first time shower group 35.On first, shower group 33 is arranged at described connecting gear 20 tops, thereby circuit board upper surface is sprayed.First time shower group 35 is arranged at described connecting gear 20 belows, thereby circuit board lower surface is sprayed.On described first, shower group 33 and first time shower group 35 are provided with a plurality of for spraying the shower of etching liquid.In the present embodiment, the shower of shower group 33 is arranged as two row that are parallel to each other on first, and its arragement direction is consistent with the direction of transfer of connecting gear 20.Two side settings that are oppositely arranged of the circuit board that in the present embodiment, the shower of shower group 33 transmits near connecting gear 20 on first.In the present embodiment, it is row that the shower of first time shower group 35 is arranged, and its bearing of trend is consistent with the direction of transfer of connecting gear 20.The middle part of the circuit board that in the present embodiment, the shower of first time shower group 35 transmits near connecting gear 20 arranges.During use, when circuit board under connecting gear 20 transmits through the first etch component 30, the first on shower group 33 and first time shower group 35 ejection etching liquid, circuit board is carried out to etching.
Described the second etch component 40 comprise the second feed tube 41 and be communicated in the second feed tube 41 second on shower group 43, second time shower group 45.On second, 43 groups of shower groups are arranged at described connecting gear 20 tops, thereby circuit board upper surface is sprayed.Second time shower group 45 is arranged at described connecting gear 20 belows, thereby circuit board lower surface is sprayed.On described second, shower group 43 and second time shower group 45 are provided with a plurality of for spraying the shower of etching liquid.Contrary with the first etch component 30, in the present embodiment, the shower of second time shower group 45 is arranged as two row that are parallel to each other, and its arragement direction is consistent with the direction of transfer of connecting gear 20.Two side settings that are oppositely arranged of the circuit board that in the present embodiment, the shower of second time shower group 45 transmits near connecting gear 20.In the present embodiment, to arrange be row to the shower of shower group 43 on second, and its bearing of trend is consistent with the direction of transfer of connecting gear 20.The middle part of the circuit board that in the present embodiment, the shower of shower group 43 transmits near connecting gear 20 on second arranges.
Described spraying device for etching 10 is also provided with pipe pressure sensor 60, and described pipe pressure sensor 60 is arranged at the first feed tube 31 and the second feed tube 41.Be understandable that, described pipe pressure sensor 60 can adopt probe form to go deep in the first feed tube 31 and the second feed tube 41, and its concrete mounting means and operation principle are consistent with correlation technique in prior art, do not repeat them here.
Because shower group 33 correspondences on first are arranged at the side of circuit board, the etching liquid through etching reaction in spray process can be flowed away by board edge, thereby guarantees to participate in the concentration of the liquid of etching reaction.After the first etch component 30 spray, again by the second etch component 40 second on shower group 43 spray, guarantee that circuit board etching reaction is even.And described spraying device for etching 10 is also provided with pipe pressure sensor 60, user can carry out sensing by the pressure of 60 pairs of etching liquids of pipe pressure sensor, thereby controls the spraying intensity of the first etch component 30 and the second etch component 40.
Spraying device for etching 10 of the present utility model is also provided with the 3rd etch component (not shown), and described the 3rd etch component is provided with a plurality of showers that wave, described in wave shower swaying direction perpendicular to described circuit board direction of transfer.Be understandable that, by pipe pressure sensor 60 is set, user can further arrange the force value of needed etching liquid, by adjustment, be connected in the power of the circulating pump of the first feed tube 31 and the second feed tube 41, the force value of etching liquid and the spray flux in the unit interval are adjusted.
Spraying device for etching 10 of the present utility model can be adjusted the force value of needed etching liquid, guarantees spraying effect, and the first etch component 30, the second etch component 40 are set, and realizes repeatedly etching spray, guarantees etch effect.Spraying device for etching 10 of the present utility model is simple to operate and reliability is high, to guaranteeing that production quality and the improving production efficiency of circuit board all has very big meaning.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (2)
1. a spraying device for etching, for circuit board is carried out to spray etching, it is characterized in that: described spraying device for etching comprises for the connecting gear of transfer circuit plate and the first etch component and the second etch component for circuit board is sprayed, described the first etch component comprise the first feed tube and be communicated in the first feed tube first on shower group, first time shower group, on described first, shower group is arranged at described connecting gear top, described first time shower group is arranged at described connecting gear below, described the second etch component comprise the second feed tube and be communicated in the second feed tube second on shower group, second time shower group, on described second, shower group group is arranged at described connecting gear top, described second time shower group is arranged at described connecting gear below, described spraying device for etching is also provided with pipe pressure sensor, described pipe pressure sensor is arranged at the first feed tube and the second feed tube.
2. spraying device for etching according to claim 1, it is characterized in that: on described first, shower group and first time shower group are provided with a plurality of for spraying the shower of etching liquid, on described first, the shower of shower group is arranged as two row that are parallel to each other, its arragement direction is consistent with the direction of transfer of connecting gear, two side settings that are oppositely arranged of the circuit board that the shower of shower group transmits near connecting gear on described first.
3. spraying device for etching according to claim 2, it is characterized in that: it is row that the shower of described first time shower group is arranged, its bearing of trend is consistent with the direction of transfer of connecting gear, and the middle part of the circuit board that the shower of described first time shower group transmits near connecting gear arranges.
4. spraying device for etching according to claim 1, it is characterized in that: on described second, shower group and second time shower group are provided with a plurality of for spraying the shower of etching liquid, the shower of described second time shower group is arranged as two row that are parallel to each other, its arragement direction is consistent with the direction of transfer of connecting gear, two side settings that are oppositely arranged of the circuit board that the shower of described second time shower group transmits near connecting gear.
5. spraying device for etching according to claim 4, it is characterized in that: on described second, to arrange be row to the shower of shower group, its bearing of trend is consistent with the direction of transfer of connecting gear, and the middle part of the circuit board that the shower of shower group transmits near connecting gear on described second arranges.
6. spraying device for etching according to claim 1, is characterized in that: described spraying device for etching is also provided with the 3rd etch component, and described the 3rd etch component is provided with a plurality of showers that wave.
7. spraying device for etching according to claim 6, is characterized in that: described in wave shower swaying direction perpendicular to described circuit board direction of transfer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420130005.1U CN203896601U (en) | 2014-03-21 | 2014-03-21 | Etching and spraying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420130005.1U CN203896601U (en) | 2014-03-21 | 2014-03-21 | Etching and spraying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203896601U true CN203896601U (en) | 2014-10-22 |
Family
ID=51722947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420130005.1U Expired - Lifetime CN203896601U (en) | 2014-03-21 | 2014-03-21 | Etching and spraying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203896601U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113564597A (en) * | 2021-09-28 | 2021-10-29 | 南通汉瑞通信科技有限公司 | Spraying type etching equipment for printed circuit |
-
2014
- 2014-03-21 CN CN201420130005.1U patent/CN203896601U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113564597A (en) * | 2021-09-28 | 2021-10-29 | 南通汉瑞通信科技有限公司 | Spraying type etching equipment for printed circuit |
| CN113564597B (en) * | 2021-09-28 | 2021-12-07 | 南通汉瑞通信科技有限公司 | Spraying type etching equipment for printed circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141022 |