CN205211718U - Wafer monolithic corrodes device - Google Patents
Wafer monolithic corrodes device Download PDFInfo
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- CN205211718U CN205211718U CN201521107729.5U CN201521107729U CN205211718U CN 205211718 U CN205211718 U CN 205211718U CN 201521107729 U CN201521107729 U CN 201521107729U CN 205211718 U CN205211718 U CN 205211718U
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- nozzle
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- jet pipe
- jet
- shower nozzle
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Abstract
The utility model provides a wafer monolithic corrodes device, it includes shower nozzle and spray tube subassembly, and the side of shower nozzle tip is the conical surface, is equipped with first nozzle and second nozzle on the conical surface of the relative both sides of shower nozzle tip respectively, and the spray tube subassembly includes first spray tube and second spray tube, first spray tube and the equal connection nozzle of second spray tube, just first spray tube is linked together with first nozzle, and the second spray tube is linked together with the second nozzle. In this way, the utility model discloses can improve the corruption homogeneity on wafer surface.
Description
Technical field
The utility model relates to semiconductor etching apparatus field, particularly relates to a kind of wafer monolithic corrosion device.
Background technology
Semiconductor can be applicable to the industry such as LED, solar energy, at present, market is applied to semiconductor corrosion monolithic etching machine shower nozzle on only have a nozzle, this nozzle is connected with a jet pipe, jet pipe is arranged the flow that a flow control valve carrys out Control Nozzle, in wafer rotary course, shower nozzle moves back and forth along the radial direction of wafer, chemical corrosion liquid is spread upon crystal column surface by nozzle simultaneously, because wafer is in rotation, chemical corrosion liquid is rolled to crystal round fringes gradually from wafer center, thus can obtain erosional surface.
But, because this monolithic etching machine only has a nozzle, so chemical corrosion liquid is all rolled to crystal round fringes along with wafer rotates major part, cause the effect that crystal round fringes too corrodes.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of wafer monolithic corrosion device, can improve the erosion uniformity of crystal column surface.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of wafer monolithic corrosion device, comprise shower nozzle and nozzle component, the side of described shower nozzle end is the conical surface, the relative both sides conical surface of described shower nozzle end is respectively equipped with first jet and second nozzle, described nozzle component comprises the first jet pipe and the second jet pipe, described first jet pipe is all connected described shower nozzle with the second jet pipe, and described first jet pipe is connected with described first jet, described second jet pipe is connected with described second nozzle.
Preferably, described first jet pipe is provided with first flow control valve, and described second jet pipe is provided with second control valve.
Preferably, the end face of described shower nozzle is plane, and described shower nozzle end face is also provided with the 3rd nozzle, and described nozzle component also comprises the 3rd jet pipe, and described 3rd jet pipe connects described shower nozzle, and described 3rd jet pipe is connected with described 3rd nozzle.
Preferably, described 3rd jet pipe is provided with the 3rd flow control valve.
Preferably, the flow of described first jet is 1.2-1.6 times of the flow of described 3rd nozzle, and the flow of described first jet is 1.5-1.8 times of the flow of described second nozzle.
Be different from the situation of prior art, the beneficial effects of the utility model are: by adopting two respectively to central authorities and the edge injection chemical corrosion liquid of wafer, the effect that crystal round fringes too corrodes can be made to be neutralized, thus the erosion uniformity of crystal column surface can be improved, the rate of finished products of wafer can be improved, enhance productivity and economic benefit.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model one embodiment improves the monolithic corrosion device of wafer erosion uniformity.
Fig. 2 is the enlarged diagram of the shower nozzle of the monolithic corrosion device shown in Fig. 1.
Fig. 3 is the structural representation that another embodiment of the utility model improves the monolithic corrosion device of wafer erosion uniformity.
Fig. 4 is the enlarged diagram of the shower nozzle of the monolithic corrosion device shown in Fig. 3.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
In the lump see Fig. 1 and Fig. 2, it is the structural representation that the utility model one embodiment improves the monolithic corrosion device of wafer erosion uniformity.The monolithic corrosion device of the improvement wafer erosion uniformity of the present embodiment comprises shower nozzle 1 and nozzle component 2, the side of shower nozzle 1 end is the conical surface, the relative both sides conical surface of shower nozzle 1 end is respectively equipped with first jet 11 and second nozzle 12, nozzle component 2 comprises the first jet pipe 21 and the second jet pipe 22, first jet pipe 21 is all connected shower nozzle 1 with the second jet pipe 22, and the first jet pipe 21 is connected with first jet 11, the second jet pipe 22 is connected with second nozzle 12.
The monolithic corrosion device of the present embodiment in use, is placed in above wafer 100, and first jet 11 is towards wafer 100 central authorities, and second nozzle 12 is towards wafer frontside edge.Wafer 100 is towards a direction High Rotation Speed, first jet 11 is ceaselessly to wafer 100 central injection chemical corrosion liquid, even if the chemical corrosion liquid of wafer 100 central authorities flows to wafer frontside edge with certain speed, the corrosion rate of wafer 100 central authorities also can reach consistent with the corrosion rate of wafer frontside edge, thus improves the erosion uniformity on wafer 100 surface.Further, the flow that can control first jet 11 and second nozzle 12 carrys out control corrosion rate speed, specifically, first jet pipe 21 is provided with first flow control valve 211, second jet pipe 22 is provided with second control valve 221, controlled the flow of first jet 11 and second nozzle 12 by first flow control valve 211 and second control valve 221, the erosion uniformity of wafer 100 can be made more easily to be controlled and perfect.
In the lump see Fig. 3 and Fig. 4, it is the structural representation that another embodiment of the utility model improves the monolithic corrosion device of wafer erosion uniformity.The monolithic corrosion device of the improvement wafer erosion uniformity of the present embodiment is on the basis of previous embodiment, the end face of shower nozzle 1 is plane, shower nozzle 1 end face is also provided with the 3rd nozzle 13, nozzle component 2 also comprises the 3rd jet pipe 23,3rd jet pipe 23 connects shower nozzle 1, and the 3rd jet pipe 23 is connected with the 3rd nozzle 12.
The monolithic corrosion device of the present embodiment in use, is placed in above wafer 100, and first jet 11 is towards wafer 100 central authorities, and the 3rd nozzle 13 is towards the position between the central authorities and edge of wafer 100, and second nozzle 12 is towards wafer frontside edge.Because nozzle quantity is three, the erosion uniformity on wafer 100 surface more easily can be improved.Further, the flow that can control first jet 11, second nozzle 12 and the 3rd nozzle 13 carrys out control corrosion rate speed, specifically, 3rd jet pipe 23 is provided with the 3rd flow control valve 231, controlled the flow of first jet 11, second nozzle 12 and the 3rd jet pipe 23 by first flow control valve 211, second control valve 221 and the 3rd flow control valve 231, the erosion uniformity of wafer 100 can be made more easily to be controlled and perfect.In the present embodiment, the flow of first jet 11 is 1.2-1.6 times of the flow of the 3rd nozzle 13, and the flow of first jet 11 is 1.5-1.8 times of the flow of second nozzle 12.
By the way, the monolithic corrosion device of the improvement wafer erosion uniformity of the utility model embodiment passes through employing two respectively to central authorities and the edge injection chemical corrosion liquid of wafer, the effect that crystal round fringes too corrodes can be made to be neutralized, thus the erosion uniformity of crystal column surface can be improved, the rate of finished products of wafer can be improved, enhance productivity and economic benefit.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. a wafer monolithic corrosion device, it is characterized in that, comprise shower nozzle and nozzle component, the side of described shower nozzle end is the conical surface, the relative both sides conical surface of described shower nozzle end is respectively equipped with first jet and second nozzle, and described nozzle component comprises the first jet pipe and the second jet pipe, and described first jet pipe is all connected described shower nozzle with the second jet pipe, and described first jet pipe is connected with described first jet, described second jet pipe is connected with described second nozzle.
2. wafer monolithic corrosion device according to claim 1, is characterized in that, described first jet pipe is provided with first flow control valve, and described second jet pipe is provided with second control valve.
3. the wafer monolithic corrosion device according to any one of claim 1 or 2, it is characterized in that, the end face of described shower nozzle is plane, described shower nozzle end face is also provided with the 3rd nozzle, described nozzle component also comprises the 3rd jet pipe, described 3rd jet pipe connects described shower nozzle, and described 3rd jet pipe is connected with described 3rd nozzle.
4. wafer monolithic corrosion device according to claim 3, is characterized in that, described 3rd jet pipe is provided with the 3rd flow control valve.
5. wafer monolithic corrosion device according to claim 4, is characterized in that, the flow of described first jet is 1.2-1.6 times of the flow of described 3rd nozzle, and the flow of described first jet is 1.5-1.8 times of the flow of described second nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521107729.5U CN205211718U (en) | 2015-12-25 | 2015-12-25 | Wafer monolithic corrodes device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521107729.5U CN205211718U (en) | 2015-12-25 | 2015-12-25 | Wafer monolithic corrodes device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205211718U true CN205211718U (en) | 2016-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201521107729.5U Active CN205211718U (en) | 2015-12-25 | 2015-12-25 | Wafer monolithic corrodes device |
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| CN (1) | CN205211718U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020078191A1 (en) * | 2018-10-18 | 2020-04-23 | 北京北方华创微电子装备有限公司 | Spraying device and cleaning apparatus |
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2015
- 2015-12-25 CN CN201521107729.5U patent/CN205211718U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020078191A1 (en) * | 2018-10-18 | 2020-04-23 | 北京北方华创微电子装备有限公司 | Spraying device and cleaning apparatus |
| US11823917B2 (en) | 2018-10-18 | 2023-11-21 | Beijing Naura Microelectronics Equipment Co., Ltd. | Spray device and cleaning apparatus |
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