CN203628841U - Fan coil with water temperature controllable - Google Patents

Fan coil with water temperature controllable Download PDF

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Publication number
CN203628841U
CN203628841U CN201320736393.3U CN201320736393U CN203628841U CN 203628841 U CN203628841 U CN 203628841U CN 201320736393 U CN201320736393 U CN 201320736393U CN 203628841 U CN203628841 U CN 203628841U
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CN
China
Prior art keywords
cooling device
water
semiconductor cooling
fan coil
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320736393.3U
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Chinese (zh)
Inventor
黄翔
孙哲
薛运
刘佳莉
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Xian Polytechnic University
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Xian Polytechnic University
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Publication date
Application filed by Xian Polytechnic University filed Critical Xian Polytechnic University
Priority to CN201320736393.3U priority Critical patent/CN203628841U/en
Application granted granted Critical
Publication of CN203628841U publication Critical patent/CN203628841U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)

Abstract

The utility model discloses a fan coil with water temperature controllable. The fan coil comprises a fan and an air inlet arranged on the rear side and the front side of a unit respectively, a water supply connector is arranged on the side wall of the unit and provided with a temperature sensor, the water supply connector is connected with a water inlet of a semiconductor refrigerating device which is connected with a coil body through a pipeline, and a water outlet of the coil body is connected with a water return connector. According to the fan coil, water supply temperature can be adjusted, change of water supply temperature is achieved, operation of the dry work condition and the wet work condition is achieved at the same time, and the fan coil has the advantages of being low in power consumption and high in heat exchange efficiency.

Description

The fan coil that a kind of water temperature is controlled
Technical field
The utility model belongs to operation of air conditioning systems technical field, is specifically related to the controlled fan coil of a kind of water temperature.
Background technology
At present, Evaporative Cooling Air Conditioning water-air system extensively adopts in multiple Practical Projects of the Arid Areas such as Xinjiang of China.This system has energy-saving and environmental protection, efficient, economic dispatch feature.But be subject to the impact of outdoor dry bulb and wet bulb, the leaving water temperature of evaporative cooling handpiece Water Chilling Units easily fluctuates in this system, does not have stability, cause the fluctuation of indoor end fan coil supply water temperature, thereby caused the fluctuation of indoor temperature.In addition, the cold water water temperature that evaporative cooling handpiece Water Chilling Units produces is conventionally higher than the dew-point temperature of room air, and dry cooling condition for fan-coil unit operation, can not dehumidify.In humiture autonomous control system, if new wind can not be born humidity load completely, will cause so indoor humidity to increase.
Semiconductor refrigerating technology is an emerging Refrigeration Technique, have environmentally friendly, shockproof, noiselessness, reliability high, the features such as easy are installed.But be subject to the impact that Energy Efficiency Ratio is lower, be not used widely.Adopt the mode of water-cooled to dwindle cold warm end temperature difference, can improve semiconductor refrigerating efficiency.
Utility model content
The purpose of this utility model is to provide the controlled fan coil of a kind of water temperature, utilizes semiconductor refrigerating technology to carry out auxiliary adjustment to supply water temperature, can control thereby realized water temperature, and operating mode can be controlled, and leaving air temp is stable, and semiconductor refrigerating Energy Efficiency Ratio is higher.
The technical scheme that the utility model adopts is, the fan coil that a kind of water temperature is controlled, comprise blower fan and air outlet that unit rear side and front side arrange respectively, on unit sidewall, be provided with water supply interface, on water supply interface, be provided with temperature sensor, water supply interface is connected with the water inlet of semiconductor cooling device, and semiconductor cooling device is connected with coil pipe by pipeline, and the delivery port of coil pipe is connected with backwater interface.
Feature of the present utility model is also,
Also comprise the transformer being connected with semiconductor cooling device.
Also comprise the solidifying water pond that unit bottom arranges, on solidifying water pond, be provided with solidifying water interface.
The structure of semiconductor cooling device is, outer, inside and outside three passages that are separated into by the semi-conducting material be arrangeding in parallel, two outer tunnels are the semiconductor cooling device passage of heat, internal channel is the cold passage of semiconductor cooling device, the cold passage of semiconductor cooling device and two semiconductor cooling device passage of heats form respectively three delivery ports of semiconductor cooling device, and semi-conducting material is provided with the flow deflector that can make to flow into into water guiding the cold passage of semiconductor cooling device or the semiconductor cooling device passage of heat near a port of water inlet.
Coil pipe is contra-flow heat exchanger.
The beneficial effect of the utility model fan coil is,
(1) fan coil of the present utility model can regulate the water-air system supply water temperature that adopts evaporative cooling handpiece Water Chilling Units, realizes the stable of supply water temperature.
(2) fan coil of the present utility model can need to be set dry cooling condition (16~18 ℃ of inlet water temperatures) and two kinds of operating mode water temperatures of wet cooling condition (7~9 ℃ of inlet water temperatures) according to user, realizes the dual needs of cooling and dehumidifying.
(3) fan coil of the present utility model adopts water-cooled semiconductor cooling device, and Energy Efficiency Ratio is than the conventional semiconductors refrigeration height of comparing.
(4) coil pipe employing of the present utility model is reverse-flow, has realized the raising of heat exchange efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model fan coil;
Fig. 2 is the structural representation of semiconductor cooling device in the utility model fan coil;
Fig. 3 is the structural representation of coil pipe in the utility model fan coil.
In figure, 1. blower fan, 2. semiconductor cooling device, 3. coil pipe, 4. solidifying water pond, 5. water supply interface, 6. backwater interface, 7. solidifying water interface, 8. air outlet, 9. transformer, 10. temperature sensor, the cold passage of 11. semiconductor cooling device, the 12. semiconductor cooling device passage of heats, 13. semi-conducting materials, 14. flow deflectors.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.
The structure of the utility model fan coil as shown in Figure 1, comprise blower fan 1 and air outlet 8 that unit rear side and front side arrange respectively, on unit sidewall, be provided with water supply interface 5, on water supply interface 5, be provided with temperature sensor 10, water supply interface 5 is connected with the water inlet of semiconductor cooling device 2, semiconductor cooling device 2 is connected with coil pipe 3 by pipeline, and the delivery port of coil pipe 3 is connected with backwater interface 6.
Also comprise the transformer 9 being connected with semiconductor cooling device 2.
Also comprise the solidifying water pond 4 that unit bottom arranges, on solidifying water pond 4, be provided with solidifying water interface 7.
The structure of semiconductor cooling device 2 as shown in Figure 2, outer, inside and outside three passages that are separated into by the semi-conducting material 13 be arrangeding in parallel, two outer tunnels are the semiconductor cooling device passage of heat 12, internal channel is the cold passage 11 of semiconductor cooling device, the cold passage 11 of semiconductor cooling device and two semiconductor cooling device passage of heats 12 form respectively three delivery ports of semiconductor cooling device 2, and semi-conducting material 13 is provided with the flow deflector 14 that can make to flow into into water guiding the cold passage 11 of semiconductor cooling device or the semiconductor cooling device passage of heat 12 near a port of water inlet.One, semiconductor cooling device 2 waterway inlet interface, three of discharge couplings.
Coil pipe 3 is contra-flow heat exchanger, and structure as shown in Figure 3.
The course of work of the utility model fan coil:
The high temperature cold water of supplying with by Evaporative Cooling Air Conditioning water-air system is fed in semiconductor cooling device 2 by water supply interface 5.In the time that water temperature requires by the satisfied setting of temperature sensor 10 mensuration, semiconductor cooling device 2 no powers.Flow deflector 14 cuts out the semiconductor cooling device passage of heat 12.Supply water direct by coil pipe 3 and the room air generation heat exchange of being sent into by blower fan 1, indoor temperature is reduced.Access return pipe net by backwater interface 6 again.In the time that water temperature requires by the satisfied setting of temperature sensor 10, semiconductor cooling device 2 passes into the direct current of being supplied with by transformer 9, and semi-conducting material 13 produces refrigeration effect.Flow deflector 14 is opened the semiconductor cooling device passage of heat 12 simultaneously.Water by the semiconductor cooling device passage of heat 12 is heated, takes away the heat of semi-conducting material 13.Water by the cold passage 11 of semiconductor cooling device is lowered the temperature, thereby realizes water temperature stability.Pass into again coil pipe 3 and the room air generation heat exchange of being sent into by blower fan 1, indoor temperature is reduced.
In the time of indoor need to dehumidifying, transformer 10 strengthens voltage, and semi-conducting material 13 refrigeration effects strengthen, and water temperature is further reduced, coil pipe 3 wet cooling conditions operations, and the water being condensed is collected by solidifying water interface 7 and is discharged by coagulating water pond 4.

Claims (5)

1. the fan coil that water temperature is controlled, it is characterized in that, comprise blower fan (1) and air outlet (8) that unit rear side and front side arrange respectively, on unit sidewall, be provided with water supply interface (5), on described water supply interface (5), be provided with temperature sensor (10), described water supply interface (5) is connected with the water inlet of semiconductor cooling device (2), described semiconductor cooling device (2) is connected with coil pipe (3) by pipeline, and the delivery port of described coil pipe (3) is connected with backwater interface (6).
2. according to the controlled fan coil of a kind of water temperature claimed in claim 1, it is characterized in that, also comprise the transformer (9) being connected with described semiconductor cooling device (2).
3. according to the controlled fan coil of a kind of water temperature described in claim 1 or 2, it is characterized in that, also comprise the solidifying water pond (4) that unit bottom arranges, on described solidifying water pond (4), be provided with solidifying water interface (7).
4. according to the controlled fan coil of a kind of water temperature described in claim 1 or 3, it is characterized in that, the structure of described semiconductor cooling device (2) is, outside being separated into by the semi-conducting material be arrangeding in parallel (13), in, outer three passages, two outer tunnels are the semiconductor cooling device passage of heat (12), internal channel is the cold passage of semiconductor cooling device (11), the cold passage of described semiconductor cooling device (11) and two semiconductor cooling device passage of heats (12) form respectively three delivery ports of semiconductor cooling device (2), described semi-conducting material (13) is provided with the flow deflector (14) that can make to flow into into water guiding the cold passage of semiconductor cooling device (11) or the semiconductor cooling device passage of heat (12) near a port of water inlet.
5. according to the controlled fan coil of a kind of water temperature claimed in claim 1, it is characterized in that, described coil pipe (3) is contra-flow heat exchanger.
CN201320736393.3U 2013-11-18 2013-11-18 Fan coil with water temperature controllable Expired - Fee Related CN203628841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320736393.3U CN203628841U (en) 2013-11-18 2013-11-18 Fan coil with water temperature controllable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320736393.3U CN203628841U (en) 2013-11-18 2013-11-18 Fan coil with water temperature controllable

Publications (1)

Publication Number Publication Date
CN203628841U true CN203628841U (en) 2014-06-04

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ID=50815313

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320736393.3U Expired - Fee Related CN203628841U (en) 2013-11-18 2013-11-18 Fan coil with water temperature controllable

Country Status (1)

Country Link
CN (1) CN203628841U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109185980A (en) * 2018-09-30 2019-01-11 上海市城市建设设计研究总院(集团)有限公司 Push up vertical fan coil

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109185980A (en) * 2018-09-30 2019-01-11 上海市城市建设设计研究总院(集团)有限公司 Push up vertical fan coil
CN109185980B (en) * 2018-09-30 2024-02-06 上海市城市建设设计研究总院(集团)有限公司 Top vertical fan coil

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140604

Termination date: 20141118

EXPY Termination of patent right or utility model