CN203617249U - Preparation device for molding interconnection component - Google Patents
Preparation device for molding interconnection component Download PDFInfo
- Publication number
- CN203617249U CN203617249U CN201320871162.3U CN201320871162U CN203617249U CN 203617249 U CN203617249 U CN 203617249U CN 201320871162 U CN201320871162 U CN 201320871162U CN 203617249 U CN203617249 U CN 203617249U
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- China
- Prior art keywords
- molding
- interconnection element
- plastic housing
- wire casing
- dust
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000000465 moulding Methods 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000428 dust Substances 0.000 claims abstract description 17
- 239000003344 environmental pollutant Substances 0.000 claims abstract description 17
- 231100000719 pollutant Toxicity 0.000 claims abstract description 17
- 238000001746 injection moulding Methods 0.000 claims abstract description 13
- 238000001465 metallisation Methods 0.000 claims abstract description 10
- 238000001020 plasma etching Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 19
- 238000010926 purge Methods 0.000 claims description 18
- 229910052705 radium Inorganic materials 0.000 claims description 14
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 238000009832 plasma treatment Methods 0.000 claims description 13
- 239000011148 porous material Substances 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 238000011282 treatment Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 238000007664 blowing Methods 0.000 abstract 3
- 238000005406 washing Methods 0.000 abstract 3
- 238000010147 laser engraving Methods 0.000 abstract 2
- 238000000678 plasma activation Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to a preparation device for a molding interconnection component. The preparation device comprises an injection molding machine for injection molding and forming of a plastic housing of a molding interconnection component, a laser engraving machine through which a circuit pattern is depicted on the surface of the plastic housing and a corresponding wire duct is formed, a vacuum plasma processing device carrying out plasma etching of dust inside the wire duct on the surface of the plastic housing after laser engraving and pollutants splashed outside the wire duct and plasma activation of the surface of the plastic housing after blowing and washing, a blow wash device for blowing and washing dust and pollutants on the surface of the plastic housing after etching, and a plating machine carrying out metallization of the wire duct on the activated plastic housing surface. Dust in the wire duct on the surface of the plastic housing and pollutants splashed outside the wire duct are subjected to plasma etching, blowing, washing and plasma activation treatments, generation of influence of dust and splashed pollutants during the metallization process is avoided, and the qualified rate of molding interconnection components is raised. When the preparation device is compared with the prior art, the human source is saved and the working efficiency is raised.
Description
Technical field
The utility model belongs to field, relates to specifically a kind of preparation facilities of molding interconnection element.
Background technology
Atom after plasma is deprived of by portions of electronics and atom are ionized the ionized gas shape material that the positron-electron of rear generation forms, and it is extensively present in universe, are often considered to be and remove outside solid, liquid, gas, the 4th state that material exists.
At present, what plasma device was general is two electrodes to be set in airtight container form electric field, realize certain vacuum degree with vacuum pump, along with gas is more and more thin, the free movement distance of intermolecular distance and molecule or ion is also more and more long, be subject to electric field action, they bump and form gas ions, the activity of these ions is very high, its energy is enough to destroy nearly all chemical bond, material surface in any exposure causes chemical reaction, thereby structure, composition and the group of material surface are changed, and is met the surface of actual requirement.Plasma reaction speed is fast, treatment effeciency is high, and modification occurs over just material surface, the performance of material internal bulk material is not affected, and be desirable surface modification means.
Electronics manufacturing is more and more pursued miniaturization and the densification of electronic devices and components, because 3D-MID technology can reduce the component number of electronic product, 3D-MID technology is widely used in the fields such as communication, automotive electronics, computer, electromechanical equipment and medicine equipment.3D-MID technology refers on the surface of the plastic casing of injection mo(u)lding, be manufactured with measurements of the chest, waist and hips stereo circuit and the interconnection element of electric function, and traditional PCB can only arrange electronic component on two-dimensional space, 3D-MID reduces the quantity of components and parts and reduces costs by integrating connector, socket or other device.In prior art, the manufacture craft of 3D-MID comprises three key steps: injection mo(u)lding, the processing of laser radium carving and circuit pattern metallization.In above-mentioned manufacture craft, the carving processing of laser radium be when frosting is depicted circuitous pattern also by the ablated surface at light scanning place, make it to present corresponding wire casing on microcosmic, for metallization operation below.But, in laser radium carving process, can produce dust and spatter pollutant outward, can cause coating to come off or short circuit, therefore must be through cleaning before coating.At present be manual operations, increase cost of labor, and efficiency be low.
Therefore, need a kind of processing unit of the molding interconnection element that efficiency can be provided badly.
Utility model content
The purpose of this utility model is to overcome the defect that prior art exists, and a kind of preparation facilities of molding interconnection element is provided.
The technical scheme that realizes the utility model object is: the preparation facilities of molding interconnection element, comprising:
Injection molding machine, described injection molding machine forms the plastic casing of molding interconnection element for injection moulding;
Laser radium carving machine, described laser radium carving machine utilizes laser that the surface of plastic casing is depicted to circuitous pattern and formed corresponding wire casing;
Vacuum plasma treatment equipment, described vacuum plasma treatment equipment is for carrying out the dust of the wire casing inside, plastic casing surface after laser radium carving and the pollutant splashing outside wire casing plasma etching outward and the plastic casing surface after purge is carried out plasma-activated;
Purge means, described purge means is for carrying out purge by the dust of the wire casing inside, plastic casing surface after etching and the pollutant splashing outside wire casing outward;
Plater, described plater is by the wire casing metallization on the plastic casing surface after activation.
Further, described vacuum plasma treatment equipment comprises reaction chamber, high frequency electric source, material tray, source of the gas, negative pressure device and at least one pair of electrode assemblie, every pair of electrode assemblie comprises two plate electrodes that are set in parallel in reaction chamber, described material tray is set in parallel between two plate electrodes, the both positive and negative polarity of described high frequency electric source is connected with every pair of electrode assemblie respectively, and described source of the gas, negative pressure device are connected with described reaction chamber respectively.
Further, on described each plate electrode, offer some electrode pores that run through plate electrode.
Further, on described material tray, offer some pallet pores that run through material tray.
Further, described negative pressure device is vacuum pump or pump group.
Further, the frequency range of described high frequency electric source is 10Khz-100Khz or 13.56MHz.
The utlity model has positive effect: the utility model adopts vacuum plasma treatment equipment that the dust of wire casing inside, plastic casing surface and the pollutant splashing outside wire casing are carried out to plasma etching, purge and plasma-activated outward, avoid dust and spatter pollutant outward exerting an influence in metallization operation, improve the qualification rate of molding interconnection element, compared to prior art, save manpower, improved operating efficiency.
Accompanying drawing explanation
For content of the present utility model is more easily expressly understood, according to specific embodiment also by reference to the accompanying drawings, the utility model is described in further detail below, wherein:
Fig. 1 is workflow diagram of the present utility model;
Fig. 2 is the structural representation of the utility model the first embodiment;
Fig. 3 is the structural representation of the utility model the second embodiment.
Wherein: 1, plate electrode, 2, material tray, 3, pallet pore, 4, electrode pore, 5, reaction chamber.
Embodiment
Embodiment 1
As shown in Figure 1 to Figure 2, as the first preferred embodiment, the present embodiment provides a kind of preparation facilities of molding interconnection element, comprising:
Injection molding machine, injection molding machine forms the plastic casing of molding interconnection element for injection moulding;
Laser radium carving machine, laser radium carving machine utilizes laser that the surface of plastic casing is depicted to circuitous pattern and formed corresponding wire casing;
Vacuum plasma treatment equipment, vacuum plasma treatment equipment is for carrying out the dust of the wire casing inside, plastic casing surface after laser radium carving and the pollutant splashing outside wire casing plasma etching outward and the plastic casing surface after purge is carried out plasma-activated;
Purge means, purge means is for carrying out purge by the dust of the wire casing inside, plastic casing surface after etching and the pollutant splashing outside wire casing outward;
Plater, plater is by the wire casing metallization on the plastic casing surface after activation.
The vacuum plasma treatment equipment that the present embodiment provides comprises reaction chamber 5, high frequency electric source, material tray 2, source of the gas, negative pressure device and two pairs of electrode assemblies, every pair of electrode assemblie comprises two plate electrodes 1 that are set in parallel in reaction chamber, on each plate electrode 1, offer 66 electrode pores 4 that run through plate electrode 1, electrode pore 4 is convenient to reacting gas in plasma treatment procedure and is circulated and be uniformly distributed at reaction chamber 5, improve treatment effeciency, material tray 2 is set in parallel between two plate electrodes 1, the both positive and negative polarity of high frequency electric source is connected with every pair of electrode assemblie respectively, source of the gas, negative pressure device is connected with reaction chamber 5 respectively, negative pressure device is vacuum pump or pump group, can select as required, the frequency range of high frequency electric source is 10Khz-100Khz or 13.56MHz, specifically be not construed as limiting.
Below the operation principle of the present embodiment is described further:
Adopt injection molding machine injection moulding to form the plastic casing of molding interconnection element; Adopt laser radium carving machine to depict circuitous pattern and form corresponding wire casing on the surface of plastic casing; Adopt vacuum plasma equipment to pass into etching gas the dust of wire casing inside and the pollutant splashing outward outside wire casing after plastic casing surface laser radium carving are carried out to plasma etching; Adopt purge means to pass into purge gas the dust after plastic casing surface etch and pollutant are carried out to purge; Adopt vacuum plasma equipment to pass into activated gas and the plastic casing surface after purge is carried out plasma-activated, make the wire casing on plastic casing surface recover to electroplate performance; By the wire casing metallization of the plastic casing surface circuit figure after activation.
The present embodiment adopts vacuum plasma treatment equipment that the dust of wire casing inside, plastic casing surface and the pollutant splashing outside wire casing are carried out to plasma etching, purge and plasma-activated outward, avoid dust and spatter pollutant outward exerting an influence in metallization operation, improve the qualification rate of molding interconnection element, compared to prior art, save manpower, improved operating efficiency.
As shown in Figure 3, as the second preferred embodiment, all the other are identical with embodiment 1, and difference is, offers 66 pallet pores 3 that run through material tray 2 on the material tray 2 that the present embodiment provides.
In the present embodiment, pallet pore 3 is convenient to reacting gas in plasma treatment procedure and is circulated and be uniformly distributed at reaction chamber 5, improves treatment effeciency.
Above-described specific embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only specific embodiment of the utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (6)
1. the preparation facilities of molding interconnection element, is characterized in that, comprising: injection molding machine, and described injection molding machine forms the plastic casing of molding interconnection element for injection moulding;
Laser radium carving machine, described laser radium carving machine utilizes laser that the surface of plastic casing is depicted to circuitous pattern and formed corresponding wire casing;
Vacuum plasma treatment equipment, described vacuum plasma treatment equipment is for carrying out the dust of the wire casing inside, plastic casing surface after laser radium carving and the pollutant splashing outside wire casing plasma etching outward and the plastic casing surface after purge is carried out plasma-activated;
Purge means, described purge means is for carrying out purge by the dust of the wire casing inside, plastic casing surface after etching and the pollutant splashing outside wire casing outward;
Plater, described plater is by the wire casing metallization on the plastic casing surface after activation.
2. the preparation facilities of molding interconnection element according to claim 1, it is characterized in that, described vacuum plasma treatment equipment comprises reaction chamber, high frequency electric source, material tray, source of the gas, negative pressure device and at least one pair of electrode assemblie, every pair of electrode assemblie comprises two plate electrodes that are set in parallel in reaction chamber, described material tray is set in parallel between two plate electrodes, the both positive and negative polarity of described high frequency electric source is connected with every pair of electrode assemblie respectively, and described source of the gas, negative pressure device are connected with described reaction chamber respectively.
3. the preparation facilities of molding interconnection element according to claim 2, is characterized in that, offers some electrode pores that run through plate electrode on described each plate electrode.
4. the preparation facilities of molding interconnection element according to claim 3, is characterized in that, offers some pallet pores that run through material tray on described material tray.
5. the preparation facilities of molding interconnection element according to claim 4, is characterized in that, described negative pressure device is vacuum pump or pump group.
6. the preparation facilities of molding interconnection element according to claim 5, is characterized in that, the frequency range of described high frequency electric source is 10Khz-100Khz or 13.56MHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320871162.3U CN203617249U (en) | 2013-12-27 | 2013-12-27 | Preparation device for molding interconnection component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320871162.3U CN203617249U (en) | 2013-12-27 | 2013-12-27 | Preparation device for molding interconnection component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617249U true CN203617249U (en) | 2014-05-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320871162.3U Expired - Lifetime CN203617249U (en) | 2013-12-27 | 2013-12-27 | Preparation device for molding interconnection component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617249U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700564A (en) * | 2013-12-27 | 2014-04-02 | 苏州市奥普斯等离子体科技有限公司 | Preparation device for molded interconnection device |
-
2013
- 2013-12-27 CN CN201320871162.3U patent/CN203617249U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700564A (en) * | 2013-12-27 | 2014-04-02 | 苏州市奥普斯等离子体科技有限公司 | Preparation device for molded interconnection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170118 Address after: 518000 Guangdong city of Shenzhen province Luohu District Lake Street No. 118 Shennan East Road, Heping Road, the world financial center tower B Bao - Ping Street 0623 Patentee after: SHENZHEN OPS PLAMSMA TECHNOLOGY CO.,LTD. Address before: Taishan road Suzhou City, Jiangsu province 215011 Suzhou high tech Industrial Development Zone No. 2 (Canton Science Park) Patentee before: SUZHOU OPS PLASMA TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140528 |