CN203596798U - Power amplifier circuit and printed circuit board thereof - Google Patents
Power amplifier circuit and printed circuit board thereof Download PDFInfo
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- CN203596798U CN203596798U CN201320823966.6U CN201320823966U CN203596798U CN 203596798 U CN203596798 U CN 203596798U CN 201320823966 U CN201320823966 U CN 201320823966U CN 203596798 U CN203596798 U CN 203596798U
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Abstract
The utility model provides a power amplifier circuit and a printed circuit board thereof. The power amplifier circuit comprises a radio frequency amplifying circuit. The radio frequency amplifying circuit comprises a preceding-stage amplifying circuit, a last-stage amplifying circuit, a combiner circuit and a feedback output circuit, wherein the preceding-stage amplifying circuit and the last-stage amplifying circuit are connected in series. The power amplifier circuit is characterized in that the last-stage amplifying circuit comprises a main amplifying tube and an auxiliary amplifying tube, the main amplifying tube and the auxiliary amplifying tube are connected in parallel, the front of the auxiliary amplifying tube is connected with a first transmission line of lambada/4, and the back of the main amplifying circuit is connected with a second transmission line of lambada/4; the power amplifier circuit further comprises a monitoring control circuit and a power supply circuit; the monitoring control circuit is connected with all modules of the radio frequency amplifying circuit in a communication mode and used for monitoring and controlling operation of the radio frequency amplifying circuit; the monitoring control circuit comprises an MCU main monitoring module; the power supply circuit is connected with the MCU main monitoring module to supply power to each circuit; the monitoring control circuit further comprises a temperature detection circuit which is connected with the MCU main monitoring module and used for detecting the temperature. By the application of the power amplifier circuit, the energy consumption of power amplifying is greatly lowered on the condition of the same output power.
Description
Technical field
The utility model relates to the communications field, concrete, relates to power amplifier and printed circuit board (PCB) thereof.
Background technology
Along with wireless communication technique, the particularly development of CDMA third generation communication network, operator and user are more and more higher to coverage requirement.In order to meet user's demand, realize widely and covering, reduce the quantity of base station to cut operating costs simultaneously, just require higher power to cover wider place.But high-power product has also brought high energy consumption, high energy consumption can cause again the problems such as base station aging speed is fast, failure rate is high.Comprise filter, LNA and power amplifier at a typical direct discharging station, its intermediate power amplifier is the most important parts in rear end, repeater, it has consumed repeater overwhelming majority power, therefore for a repeater, if reduced the power consumption of power amplifier, also just reduce the power consumption of complete machine.
In prior art, Doherty power amplifier technology improves the favor that obviously and is more and more subject to industry due to simplicity of design, to power amplification efficiency.Doherty power amplifier technology is by using two dissimilar power amplifier units to bear respectively different input signal powers, guarantee that as far as possible two power amplifier units are all operated in saturation region separately, thereby guarantee that whole power amplification device all maintains higher signal power trying one's best within the scope of large input signal power.But in reaching high power effect, still to consider the energy consumption of sacrifice, existing traditional power amplifier technology can not solve the too high problem of energy consumption well, therefore, needs one badly and can reduce power amplifier energy consumption and guarantee again enough high-power power amplifier devices simultaneously.
Utility model content
In view of the too high problem of energy consumption in prior art, the utility model proposes corresponding solution, the utility model mainly provides the power amplifier of a kind of high power, low energy consumption.
The technical scheme that the utility model provides is:
A kind of power amplifier, comprise radio frequency amplifying circuit, described radio frequency amplifying circuit comprise series connection preamplifying circuit and final stage amplifying circuit, close road circuit and feedback output circuit, it is characterized in that: described final stage amplifying circuit comprises main amplifier tube and auxiliary amplifier tube in parallel, before described auxiliary amplifier tube, be connected to the first transmission line of λ/4, after described main amplifier tube, be connected to the second transmission line of λ/4; Described power amplifier also comprises monitoring control circuit and power supply circuits, and each module of described monitoring control circuit and described radio frequency amplifying circuit keeps communication connection for monitoring and control the operation of described radio frequency amplifying circuit; Described monitoring control circuit comprises the main monitoring module of MCU, and described power supply circuits are connected with the main monitoring module of described MCU, is each circuit supply; Described monitoring control circuit also comprises temperature sensing circuit, and described temperature sensing circuit is connected with the main monitoring module of described MCU, for detection of temperature.
As a kind of preferred version, described main amplifier tube three transmission line that afterwards access λ/4 in parallel with described auxiliary amplifier tube; Described power supply circuits comprise step-down controller, digital to analog converter.
As a kind of preferred version, described preamplifying circuit comprises first order amplifying circuit, second level amplifying circuit, the third level amplifying circuit of serial connection; To first order amplifying circuit, be serially connected with successively ALC control circuit and ATT numerical control attenuation circuit at signal input port; Described monitoring control circuit also comprises the current detection circuit for detection of size of current, and described current detection circuit one end connects the main monitoring module of described MCU, and the other end connects described power supply circuits; The main monitoring module of described MCU is connected with ALC control circuit, keeps fixing peak power output for controlling power amplifier under different temperatures environment; The main monitoring module of described MCU is connected with ATT numerical control attenuation circuit, for controlling the pad value of ATT numerical control attenuation circuit; Between described first order amplifying circuit and described second level amplifying circuit, be serially connected with Temperature compensation for gain circuit; The main monitoring module of described MCU is connected with described Temperature compensation for gain circuit.
As a kind of preferred version, between preamplifying circuit and final stage amplifying circuit, be serially connected with isolator, between final stage amplifying circuit and signal output port, be serially connected with and close road circuit and circulator; Described monitoring control circuit also comprises backward power testing circuit, and described backward power testing circuit one end connects circulator, and the other end connects the main monitoring module of MCU, for detection of the reflection power of delivery outlet; Described monitoring control circuit also comprises forward power testing circuit, and described forward power testing circuit one end is connected with described circulator, and the other end connects the main monitoring module of described MCU, for detection of the size of the power output of delivery outlet; Described feedback output circuit, described forward power testing circuit are connected with the main monitoring module of MCU, complete for extracting output signal.
As a kind of method for optimizing, described backward power testing circuit comprises peak detection pipe; Described forward power testing circuit comprises average detection tube.
The utility model also provides a kind of printed circuit board (PCB) of power amplifier:
Comprise RF Amplifier Module, described RF Amplifier Module comprise series connection prime amplification module and final stage amplification module, close road module and feedback output module, it is characterized in that: described final stage amplification module comprises main amplifier tube and auxiliary amplifier tube in parallel, before described auxiliary amplifier tube, be connected to the first transmission line of λ/4, after described main amplifier tube, be connected to the second transmission line of λ/4; Described power amplifier also comprises monitoring control module and supply module, and each module of described monitoring control module and described RF Amplifier Module keeps communication connection for monitoring and control the operation of described RF Amplifier Module; Described monitoring control module comprises the main monitoring module of MCU, and described supply module is connected with the main monitoring module of described MCU, is each module for power supply; Described monitoring control module also comprises temperature detecting module, and described temperature detecting module is connected with the main monitoring module of described MCU, for detection of temperature.
As a kind of preferred version, described main amplifier tube three transmission line that afterwards access λ/4 in parallel with described auxiliary amplifier tube; Described power supply circuits comprise step-down controller, digital to analog converter.
As a kind of preferred version, described prime amplification module comprises first order amplification module, second level amplification module, the third level amplification module of serial connection; To first order amplification module, be serially connected with successively ALC control module and ATT numerical control attenuation module at signal input port; Described monitoring control module also comprises the current detection module for detection of size of current, and described current detection module one end connects the main monitoring module of described MCU, and the other end connects described supply module; The main monitoring module of described MCU is connected with ALC control module, keeps fixing peak power output for controlling power amplifier under different temperatures environment; The main monitoring module of described MCU is connected with ATT numerical control attenuation module, for controlling the pad value of ATT numerical control attenuation module; Between described first order amplification module and described second level amplification module, be serially connected with Temperature compensation for gain module; The main monitoring module of described MCU is connected with described Temperature compensation for gain module.
As a kind of preferred version, described first order amplification module comprises the first amplifier tube, the losses at different levels that produce from signal input part to signal output part for compensating signal; Described second level amplification module comprises the second amplifier tube; Described third level amplification module comprises the 3rd amplifier tube, and described the 3rd amplifier tube is plus and blowup pipe; Described ALC control circuit comprises two voltage-controlled diodes; Described ATT numerical control attenuation module comprises attenuator serial chip; Between first order amplification module and second level amplification module, be connected with Temperature compensation for gain module; The main monitoring module of described MCU is connected with described Temperature compensation for gain module; Described Temperature compensation for gain module comprises feedback chip.
As a kind of preferred version,, described circuit board has signals layer and floor file layer, and the cabling of radio frequency link is arranged on described signals layer; Described printed panel comprises some independently cavitys.
Compared to existing technology, the utility model at least has following beneficial effect:
Because the utility model has been selected Doherty mixer, two field effect transistor are closed to road through Doherty mixer, can in the situation that remaining unchanged, power output make power amplifier power consumption greatly reduce, as power amplifier power consumption in the time that radio frequency power output reaches 80W only has 250W left and right.The utility model has also increased monitoring control circuit, monitors more efficiently the ruuning situation of each link and makes corresponding adjustment, has improved the efficiency of power amplifier, has reduced unnecessary power consumption.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of power amplifier of providing of the utility model;
Fig. 2 is the structural representation of the He of power amplifier shown in Fig. 1 road circuit;
Fig. 3 is the cavity distribution schematic diagram of a kind of printed circuit board (PCB) of providing of the utility model.
Embodiment
With reference to figure 1, Fig. 2, power amplifier provided by the utility model, mainly comprises: radio frequency amplifying circuit, monitoring control circuit and power supply circuits.Wherein, radio frequency amplifying circuit comprise some series connection preamplifying circuit and final stage amplifying circuit 27, close road circuit 29 and feedback output circuit 47.Each module of monitoring control circuit and radio frequency amplifying circuit keeps communication connection, for monitoring and control the operation of radio frequency amplifying circuit.Monitoring control circuit comprises the main monitoring module 39 of MCU, ALC control circuit 13, ATT numerical control attenuation circuit 15, current detection circuit 37, backward power testing circuit 43, forward power testing circuit 41, temperature sensing circuit 45.The signal of main monitoring module 39 received current testing circuits 37, temperature sensing circuit 45, backward power testing circuit 43, forward power testing circuit 41.Power supply circuits 35 are connected with the main monitoring module 39 of MCU, are each circuit supply.Preamplifying circuit comprises first order amplifying circuit 17, second level amplifying circuit 21, the third level amplifying circuit 23 of serial connection.Radiofrequency signal enters ALC control circuit 13 by signal input part (RFIN) 11, ALC control circuit 13 is for stabilization signal, in the time that external environment condition changes, thereby the ALC control circuit 13 automatically variation of induction external environment condition is adjusted input signal, automatically the cheap level of correction is got back to the numerical value of requirement, makes signal keep stable.Signal enters ATT numerical control attenuation circuit 15 afterwards, and ATT numerical control attenuation circuit 15 is providing a path when undamped, if MCU main monitoring module 39 can send instruction and makes ATT numerical control attenuation circuit 15 decay to designated value while needing the gain of power amplifier to reduce.Signal enters first order amplification module 17 after ATT numerical control attenuation circuit 15, and first order amplification module 17 comprises the first amplifier tube, and the first amplifier tube is mainly used to the at different levels losses of compensating signal in circuit before.Signal enters Temperature compensation for gain circuit 19 afterwards, and Temperature compensation for gain circuit 19, for guaranteeing the gain stabilization of power amplifier under different temperatures, specifically provides different attenuations to guarantee that power amplifier gain stabilization is in indication range exactly under different temperatures.After Temperature compensation for gain circuit 19, signal enters second level amplifying circuit 21, and second level amplifying circuit 21 comprises the second amplifier tube.The second amplifying circuit 21 is mainly as the promotion circuit of third level amplifying circuit 23, signal enters third level amplifying circuit 23 afterwards, third level amplifying circuit 23 comprises the plus and blowup pipe of an IC class, gain is 30dB, P1 is at 46dBm, it just has enough surpluses to provide stable signal for rear class power amplifier module like this, and operating frequency is in 2000 to 2200MHz scopes.Signal through third level amplifying circuit 23 enters isolator 25, for level before and after isolating plays matching effect.
Signal enters final stage amplifying circuit 27 afterwards, final stage amplifying circuit 27 comprises two amplifier tubes in parallel, one of them is main amplifier tube 271, another is auxiliary amplifier tube 273, single tube P1 can arrive 182W, thereby design bandwidth guarantees that at 2.11GHz-2.17GHz design bandwidth in module passband fluctuation and linearity within the scope of 2.13GHz-2.16GHz meet the demands.Before auxiliary amplifier tube 273, be connected to the first transmission line 277 of λ/4, after described main amplifier tube 271, be connected to the second transmission line 275 of λ/4, after main amplifier tube 271 is in parallel with auxiliary amplifier tube 273, be connected the 3rd transmission line 279.Final stage amplifying circuit 27 also comprises power splitter 272, and signal is by laggard amplifier tube 271 and the auxiliary amplifier tube 273 of becoming owner of of power splitter 272.
Last signal, through circulator 31 arriving signal outputs 33, is exported from signal output part 33.Signal through circulator 31 is also divided into two-way by coupler, and a road is to forward power testing circuit 41, for detection of the size of power output; Another road exports feedback output circuit 47 to, for extracting the reference of output signal as DPD calibration.Linear condition and the main signal of this signal are more approaching, and DPD calibration effect just can be better.The testing circuit of backward power shown in figure 43, the state while being connected other devices for judge module with outside; Temperature sensing circuit 45 is connected with the main monitoring module 39 of MCU, and the actual temperature while being made for for detection of module, plays a protective role.
With reference to figure 1-Fig. 3, the utility model also provides a kind of printed circuit board (PCB) of power amplifier.The principle of this printed circuit board (PCB) is described above.Printed circuit board (PCB) mainly comprises: RF Amplifier Module, monitoring control module and supply module 36.Wherein, RF Amplifier Module comprise some series connection prime amplification module and final stage amplification module 28, close road module 30 and feedback output module 80, each module of monitoring control module and RF Amplifier Module keeps communication connection, for monitoring and control the operation of described RF Amplifier Module.Monitoring control module mainly comprises: the main monitoring module 39 of MCU, ALC control module 14, ATT numerical control attenuation module 16, current detection module, backward power detection module 44, forward power detection module 42, temperature detecting module.Supply module 36 is connected with the main monitoring module of MCU, is each module for power supply.Prime amplification module comprises first order amplification module, second level amplification module and the third level amplification module of serial connection.In the present embodiment, the planar dimension of printed circuit board (PCB) is 200mm*140mm, has two-ply.Upper strata is signals layer, and copper thickness is 0.035mm, is mainly used in the cabling of radio frequency link, and bottom is mainly floor file layer, and copper thickness is 0.035mm.Whole printed circuit board (PCB) is divided into 11 independently cavitys, the main monitoring module 39 of the first cavity 71 built-in MCU, supply module 36, current detection module 38 and the built-in ALC control module 14 of temperature detecting module 46, the second cavity 72, ATT numerical control attenuation module 16, first order amplification module 18.The built-in Temperature compensation for gain module 20 of the 3rd cavity 73, second level amplification module 22.The 4th cavity 74 is reserved cavity.The built-in third level amplification module 24 of the 5th cavity 75.The 6th cavity 76 and the built-in final stage amplification module 28 of the 7th cavity 77, close road module 30, isolator 25, the 6th cavity 76 and the 7th cavity 77 run through mutually, wherein, the 6th cavity 76 is built-in with auxiliary amplifier tube 273, the 7th cavity 77 is built-in with main amplifier tube 271, between the 6th cavity 76 and the 7th cavity 77, is provided with and closes road module 30 and isolator 25.The built-in circulator 32 of the 8th cavity 78, signal output port 34.The built-in forward power testing circuit 42 of the 9th cavity 79.The built-in backward power testing circuit 44 of the tenth cavity 80.The built-in feedback output circuit 48 of the 11 cavity 81.
For the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a power amplifier, comprises radio frequency amplifying circuit, described radio frequency amplifying circuit comprise series connection preamplifying circuit and final stage amplifying circuit, close road circuit and feedback output circuit, it is characterized in that:
Described final stage amplifying circuit comprises main amplifier tube and auxiliary amplifier tube in parallel, is connected to the first transmission line of λ/4 before described auxiliary amplifier tube, is connected to the second transmission line of λ/4 after described main amplifier tube;
Described power amplifier also comprises monitoring control circuit and power supply circuits, and each module of described monitoring control circuit and described radio frequency amplifying circuit keeps communication connection for monitoring and control the operation of described radio frequency amplifying circuit;
Described monitoring control circuit comprises the main monitoring module of MCU, and described power supply circuits are connected with the main monitoring module of described MCU, is each circuit supply;
Described monitoring control circuit also comprises temperature sensing circuit, and described temperature sensing circuit is connected with the main monitoring module of described MCU, for detection of temperature.
2. power amplifier as claimed in claim 1, is characterized in that: described main amplifier tube three transmission line that afterwards access λ/4 in parallel with described auxiliary amplifier tube;
Described power supply circuits comprise step-down controller, digital to analog converter.
3. power amplifier as claimed in claim 1, is characterized in that:
Described preamplifying circuit comprises first order amplifying circuit, second level amplifying circuit, the third level amplifying circuit of serial connection; To first order amplifying circuit, be serially connected with successively ALC control circuit and ATT numerical control attenuation circuit at signal input port;
Described monitoring control circuit also comprises the current detection circuit for detection of size of current, and described current detection circuit one end connects the main monitoring module of described MCU, and the other end connects described power supply circuits;
The main monitoring module of described MCU is connected with ALC control circuit, keeps fixing peak power output for controlling power amplifier under different temperatures environment; The main monitoring module of described MCU is connected with ATT numerical control attenuation circuit, for controlling the pad value of ATT numerical control attenuation circuit;
Between described first order amplifying circuit and described second level amplifying circuit, be serially connected with Temperature compensation for gain circuit; The main monitoring module of described MCU is connected with described Temperature compensation for gain circuit.
4. power amplifier as claimed in claim 1, is characterized in that, between preamplifying circuit and final stage amplifying circuit, is serially connected with isolator, is serially connected with and closes road circuit and circulator between final stage amplifying circuit and signal output port; Described monitoring control circuit also comprises backward power testing circuit, and described backward power testing circuit one end connects circulator, and the other end connects the main monitoring module of MCU, for detection of the reflection power of delivery outlet; Described monitoring control circuit also comprises forward power testing circuit, and described forward power testing circuit one end is connected with described circulator, and the other end connects the main monitoring module of described MCU, for detection of the size of the power output of delivery outlet; Described feedback output circuit, described forward power testing circuit are connected with the main monitoring module of MCU, complete for extracting output signal.
5. power amplifier as claimed in claim 4, is characterized in that, described backward power testing circuit comprises peak detection pipe; Described forward power testing circuit comprises average detection tube.
6. a printed circuit board (PCB) for power amplifier, comprises RF Amplifier Module, described RF Amplifier Module comprise series connection prime amplification module and final stage amplification module, close road module and feedback output module, it is characterized in that:
Described final stage amplification module comprises main amplifier tube and auxiliary amplifier tube in parallel, is connected to the first transmission line of λ/4 before described auxiliary amplifier tube, is connected to the second transmission line of λ/4 after described main amplifier tube;
Described power amplifier also comprises monitoring control module and supply module, and each module of described monitoring control module and described RF Amplifier Module keeps communication connection for monitoring and control the operation of described RF Amplifier Module;
Described monitoring control module comprises the main monitoring module of MCU, and described supply module is connected with the main monitoring module of described MCU, is each module for power supply;
Described monitoring control module also comprises temperature detecting module, and described temperature detecting module is connected with the main monitoring module of described MCU, for detection of temperature.
7. the printed circuit board (PCB) of power amplifier as claimed in claim 6, is characterized in that: described main amplifier tube three transmission line that afterwards access λ/4 in parallel with described auxiliary amplifier tube; Described power supply circuits comprise step-down controller, digital to analog converter.
8. the printed circuit board (PCB) of power amplifier as claimed in claim 6, is characterized in that, described prime amplification module comprises first order amplification module, second level amplification module, the third level amplification module of serial connection; To first order amplification module, be serially connected with successively ALC control module and ATT numerical control attenuation module at signal input port;
Described monitoring control module also comprises the current detection module for detection of size of current, and described current detection module one end connects the main monitoring module of described MCU, and the other end connects described supply module;
The main monitoring module of described MCU is connected with ALC control module, keeps fixing peak power output for controlling power amplifier under different temperatures environment; The main monitoring module of described MCU is connected with ATT numerical control attenuation module, for controlling the pad value of ATT numerical control attenuation module;
Between described first order amplification module and described second level amplification module, be serially connected with Temperature compensation for gain module; The main monitoring module of described MCU is connected with described Temperature compensation for gain module.
9. the printed circuit board (PCB) of power amplifier as claimed in claim 8, is characterized in that, described first order amplification module comprises the first amplifier tube, the losses at different levels that produce from signal input part to signal output part for compensating signal; Described second level amplification module comprises the second amplifier tube; Described third level amplification module comprises the 3rd amplifier tube, and described the 3rd amplifier tube is plus and blowup pipe; Described ALC control circuit comprises two voltage-controlled diodes; Described ATT numerical control attenuation module comprises attenuator serial chip; Between first order amplification module and second level amplification module, be connected with Temperature compensation for gain module; The main monitoring module of described MCU is connected with described Temperature compensation for gain module; Described Temperature compensation for gain module comprises feedback chip.
10. the printed circuit board (PCB) of the power amplifier as described in any one in claim 6 to 9, is characterized in that, described circuit board has signals layer and floor file layer, and the cabling of radio frequency link is arranged on described signals layer; Described printed panel comprises some independently cavitys.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320823966.6U CN203596798U (en) | 2013-12-12 | 2013-12-12 | Power amplifier circuit and printed circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320823966.6U CN203596798U (en) | 2013-12-12 | 2013-12-12 | Power amplifier circuit and printed circuit board thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203596798U true CN203596798U (en) | 2014-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320823966.6U Expired - Fee Related CN203596798U (en) | 2013-12-12 | 2013-12-12 | Power amplifier circuit and printed circuit board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203596798U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105450307A (en) * | 2015-12-11 | 2016-03-30 | 宁波环球广电科技有限公司 | Radio frequency amplification circuit and optical receiver for optical fiber radio frequency communication network |
-
2013
- 2013-12-12 CN CN201320823966.6U patent/CN203596798U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105450307A (en) * | 2015-12-11 | 2016-03-30 | 宁波环球广电科技有限公司 | Radio frequency amplification circuit and optical receiver for optical fiber radio frequency communication network |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140514 Termination date: 20191212 |