CN107863986B - Integrated power amplifier module structure - Google Patents
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- CN107863986B CN107863986B CN201711305359.XA CN201711305359A CN107863986B CN 107863986 B CN107863986 B CN 107863986B CN 201711305359 A CN201711305359 A CN 201711305359A CN 107863986 B CN107863986 B CN 107863986B
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- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 56
- 238000012544 monitoring process Methods 0.000 claims description 45
- 238000001514 detection method Methods 0.000 claims description 31
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- 238000010168 coupling process Methods 0.000 claims description 7
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- 238000010586 diagram Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 4
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
- H03F1/0288—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Amplifiers (AREA)
Abstract
The invention relates to an integrated power amplifier module structure, which comprises: the antenna comprises a multiplexer connected with an antenna, a power amplification module A connected with the multiplexer and a digital board A connected with the power amplification module A; the power amplifier module B is connected with the multiplexer, and the digital board B is connected with the power amplifier module B; the power amplifier module A and the power amplifier module B comprise a first link part, a second link part and a third link part; the power amplifier module A further comprises a fourth link part, and the power amplifier module B further comprises a fifth link part. The integrated power amplifier module structure adopts the power amplifier module A and the power amplifier module B to build the network in a combined way, supports the mixed networking of a plurality of systems and a plurality of frequency bands, can realize the sharing of the co-building of three networks, can solve the problems of great waste of repeated construction resources, difficult engineering construction and the like, has high output power, can cover more places, and has low power consumption and low cost.
Description
[ field of technology ]
The invention relates to the technical field of mobile communication, in particular to an iron tower high-efficiency integrated power amplifier module structure supporting MIMO (multiple input multiple output) technology and DPD (digital predistortion) correction.
[ background Art ]
In the telecommunication market of China, the telecommunication is occupied by three huge heads of mobile, communication and telecommunication, and along with the improvement of market demands and the white-heat of market competition, three large operators only have to continuously enlarge the infrastructure to adapt to the market demands. However, the early stages are respectively administrative, unordered competition and repeated construction, so that great waste of resources is caused, the problem of repeated investment is outstanding, and the utilization rate of network resources is generally low. With the rapid development of technology, the common building sharing level of telecommunication infrastructures is improved, and three-network integration is a necessary trend.
With the continuous popularization of the environment-friendly and low-carbon economic concepts in the world, operators are increasingly demanding the efficiency of mobile communication base stations. In the base station equipment, the energy consumption of the radio frequency power amplifier accounts for about 60% of the total energy consumption, so that the high-efficiency and low-cost integrated power amplifier becomes the most effective means for reducing the operation cost and realizing green energy conservation for future mobile operators.
The power amplifier module is used as one of the core components of the wireless receiving and transmitting system, the efficiency of the traditional A-class and AB-class power amplifier (rollback 10-15 dB) can only reach about 10% -15%, and the power output is small, the coverage area is small, the system power consumption is large, the volume is large, and the cost is high.
[ invention ]
The invention aims to overcome the defects of the technology and provide an integrated power amplifier module structure with small volume, high output power, low power consumption and low cost.
The invention provides an integrated power amplifier module structure, which comprises: the antenna comprises a multiplexer connected with an antenna, a power amplification module A connected with the multiplexer and a digital board A connected with the power amplification module A; the power amplifier module B is connected with the multiplexer, and the digital board B is connected with the power amplifier module B; the power amplifier module A and the power amplifier module B comprise a first link part, a second link part and a third link part; the power amplifier module A further comprises a fourth link part, and the power amplifier module B further comprises a fifth link part.
Further, the first link portion includes a first downlink and a first uplink; the first downlink comprises a first downlink port matching circuit, a first voltage-controlled attenuator, a first primary power amplifier, a first secondary power amplifier, a first isolator, a first bridge, a first final power amplifier and a first circulator which are sequentially connected; the first uplink comprises a first primary low noise amplifier, a first final low noise amplifier, a first radio frequency acoustic surface filter and a first uplink port matching circuit which are sequentially connected.
Further, the first downlink further includes a first coupler connected to the first final power amplifier, a first radio frequency connector; the first coupler is used for coupling the radio frequency signals output by the first final-stage power amplifier into a first path of radio frequency signals and a second path of radio frequency signals and respectively outputting the first path of radio frequency signals and the second path of radio frequency signals to the first radio frequency connector and the power detection unit of the monitoring module, and the first voltage-controlled attenuator is connected with the DAC circuit of the monitoring module.
Further, the second link portion includes a second downlink and a second uplink; the structure of the second downlink is the same as the structure of the first downlink of the first link section, and the structure of the second uplink is the same as the structure of the first uplink of the first link section.
Further, the third link part comprises a third downlink, a third uplink and a power switch circuit connected between the third downlink and the third uplink, wherein the third downlink comprises a third downlink port matching circuit, a third voltage-controlled attenuator, a third primary power amplifier, a third secondary power amplifier, a third isolator, a third primary bridge, a third final power amplifier and a third circulator which are sequentially connected; the third uplink comprises a third primary low noise amplifier, a third final low noise amplifier, a third radio frequency sound table filter and a third uplink port matching circuit which are sequentially connected; the third circulator is connected to the third primary low noise amplifier through a first radio frequency switch.
Further, the third downlink further comprises a third coupler connected with the third final power amplifier, a third final bridge connected with the third coupler and a third radio frequency connector, the third coupler is used for coupling signals output by the third final power amplifier into third path radio frequency signals, the third final bridge is used for dividing the third path radio frequency signals into a first path of output radio frequency signals and a second path of output radio frequency signals and respectively outputting the first path of output radio frequency signals and the second path of output radio frequency signals to the third radio frequency connector and a power detection unit of the monitoring module, and the third voltage-controlled attenuator is connected with a DAC circuit of the monitoring module.
Further, the fourth link part includes a fourth downlink and a fourth uplink, the fourth downlink includes a fourth downlink port matching circuit, a fourth voltage-controlled attenuator, a fourth filter, a fourth primary power amplifier, a fourth final power amplifier, and a fourth circulator that are sequentially connected, and the fourth uplink includes a fourth primary low noise amplifier, a fourth final low noise amplifier, a fourth radio frequency acoustic table filter, and a fourth uplink port matching circuit that are sequentially connected.
Further, the fourth downlink further includes a fourth coupler connected to the fourth final power amplifier, a fourth bridge connected to the fourth coupler, and a second radio frequency switch, where the fourth coupler is configured to couple signals output by the fourth final power amplifier into a fourth radio frequency signal, the fourth bridge is configured to divide the fourth radio frequency signal into a third output radio frequency signal and a fourth output radio frequency signal, output the third output radio frequency signal to a third radio frequency connector of the third link portion through the second radio frequency switch, output the fourth output radio frequency signal to a power detection unit of the monitoring module, and the fourth voltage-controlled attenuator is connected to a DAC circuit of the monitoring module.
Further, the intelligent monitoring system further comprises a monitoring module A and a monitoring module B, wherein the monitoring module A and the monitoring module B comprise a main control unit, and a power detection unit, a current detection unit, a temperature detection unit and a DAC circuit which are connected with the main control unit.
Further, the power amplifier module A and the monitoring module A are integrated on an A PCB; and the power amplifier module B and the monitoring module B are integrated on a B PCB.
The integrated power amplifier module structure adopts the power amplifier module A and the power amplifier module B to build a network in a combined way, comprises multiple networks of 2G, 3G and 4G, supports MIMO technology and DPD correction, supports multiple systems and multiple frequency bands to realize the co-building sharing of three networks, and can solve the problems of great waste of repeated construction resources, difficult engineering construction and the like. Meanwhile, compared with the traditional A-class and AB-class power amplifiers, under the same power consumption condition, larger power can be output, and more places are covered; under the condition of outputting the same power, the system power consumption is greatly reduced, the system is more energy-saving and environment-friendly, and the heat dissipation structure and the appearance can be smaller, so that not only can the metal materials be saved, but also the installation space can be saved, the construction cost is greatly reduced, and the system is easier to accept by users.
[ description of the drawings ]
Fig. 1 is a schematic diagram of an integrated power amplifier module structure according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a monitoring module a and a monitoring module B of the integrated power amplifier module structure shown in fig. 1;
fig. 3 is a schematic diagram of a first link portion and a second link portion of the power amplifier module a and the power amplifier module B of the integrated power amplifier module structure shown in fig. 1;
fig. 4 is a schematic diagram of a third link portion and a fourth link portion of the power amplifier module a of the integrated power amplifier module structure shown in fig. 1;
fig. 5 is a schematic diagram of a third link portion and a fifth link portion of the power amplifier module B of the integrated power amplifier module structure shown in fig. 1.
[ detailed description ] of the invention
The invention is further described below with reference to the drawings and examples.
Referring to fig. 1 and 2, the integrated power amplifier module structure provided by the present invention includes: a multiplexer 90 for connecting with an antenna (MS), a power amplification module A10 connected with the multiplexer 90, and a digital board A70 connected with the power amplification module A10; a power amplifier module B30 connected with the multiplexer 90, and a digital board B80 connected with the power amplifier module B30. Wherein the digital board a 70 and the digital board B80 are respectively used for being connected to corresponding optical fibers. Preferably, the antenna is a retransmission antenna.
The power amplifier module a10 and the power amplifier module B30 each include a first link portion 11, a second link portion 15, and a third link portion 17. The power amplifier module a10 further comprises a fourth link section 19 and the power amplifier module B30 further comprises a fifth link section 21.
The first link part 11 includes a first downlink 111 and a first uplink 122. The second link part 15 includes a second downlink 151 and a second uplink 152. The third link part 17 includes a third downlink 171 and a third uplink 183. The fourth link part 19 includes a fourth downlink 191 and a fourth uplink 201. The fifth link part 21 includes a fifth downlink 211 and a fifth uplink 218.
Each link portion of the power amplifier module a10 and the power amplifier module B30 has an uplink and a downlink. The downlink of each link part of the power amplification module A10 and the power amplification module B30 is mainly used for amplifying base station signals so as to facilitate mobile phone reception, the downlink signals emitted by the base stations are coupled through a front end machine to be subjected to electro-optical conversion, are far-end to a far end machine through optical fibers, are processed and subjected to photoelectric conversion through a digital board A70 and a digital board B80, enter the downlink of each link part of the corresponding power amplification module A10 and the corresponding power amplification module B30 respectively to be subjected to downlink amplification, and finally the amplified downlink signals are transmitted to the mobile phone through a multiplexer 90 and a retransmission antenna. The amplified signal is convenient for the mobile phone to receive. The uplink of each link part of the power amplification module A10 and the power amplification module B30 is mainly used for amplifying mobile phone signals so as to be convenient for a base station to receive, and the retransmission antenna receives signals sent by the mobile phones, and then the signals enter the multiplexer 90 for filtering, and the uplink of each link part of the power amplification module A10 and the power amplification module B30 is respectively subjected to uplink amplification, and the corresponding digital board A70 and the digital board B80 are used for photoelectric conversion, and the optical fibers are used for pulling the mobile phone signals to a near-end machine for photoelectric conversion and sending the uplink signals to the base station, so that the purposes of expanding, pulling the mobile communication signals and optimizing the mobile communication signals are achieved.
In this embodiment, the power amplifier module a10 includes the following 4 standard signal frequency bands: telecom LTE FDD2.1G, unicom WCDMA2100, mobile TD-LTE (E band), telecom CDMA800. The two frequency bands of telecom LTE FDD2.1G and WCDMA2100 correspond to the first link portion 11 and the second link portion 15 of the power amplifier module a10, and the first link portion 11 and the second link portion 15 of the power amplifier module a10 implement the same functions, so as to support the telecom LTE2.1G MIMO technology. The frequency band of the mobile TD-LTE (E frequency band) corresponds to the third link portion 17 of the power amplifier module a10, and the frequency band of the telecommunications CDMA800 corresponds to the fourth link portion 19 of the power amplifier module a 10.
The power amplifier module B30 comprises the following 6 standard signal frequency bands: mobile GSM1800, unicom DCS1.8G, telecom LTE FDD1.8G, mobile TD-LTE (E band), mobile/unicom GSM900. The three frequency bands of mobile GSM1800, UNICOM DCS1.8G and telecom LTE FDD1.8G correspond to the first link portion 11 and the second link portion 15 of the power amplifier module B30, and the first link portion 11 and the second link portion 15 of the power amplifier module B30 implement the same functions and support telecom LTE FDD1.8G MIMO technology. The frequency band of mobile TD-LTE (E frequency band) corresponds to the third link portion 17 of the power amplifier module B30, and the frequency band of mobile/connected GSM900 corresponds to the fifth link portion 21 of the power amplifier module B30.
According to the invention, the power amplification module A10 and the power amplification module B30 are combined to build the network, so that the MIMO technology supporting LTE signals can be supported, including mobile GSM1800 and MIMO can be supported; DCS1800/LTE FDD1.8G is communicated, and LTE MIMO is supported; telecom LTE FDD1.8G, supporting LTE MIMO; telecom LTE FDD2.1G, supporting LTE MIMO; the WCDMA2100 is connected, supporting MIMO; mobile TD-LTE (E band), supporting LTE MIMO. Compared with the traditional A-class and AB-class power amplifiers, under the same power consumption condition, larger power can be output, and more places are covered; under the condition of outputting the same power, the system power consumption is greatly reduced, the system is more energy-saving and environment-friendly, and the heat dissipation structure and the appearance can be smaller, so that not only can the metal materials be saved, but also the installation space can be saved, the construction cost is greatly reduced, and the system is easier to accept by users.
The power amplifier module a10 and the power amplifier module B30 are two independent power amplifier modules, and it can be appreciated that the power amplifier module a10 and the power amplifier module B30 can be used independently.
The invention also comprises a monitoring module A and a monitoring module B. The monitoring module A is used for monitoring the power amplification module A10. The monitoring module B is used for monitoring the power amplifier module B30. As shown in fig. 2, each of the monitor modules a and B includes a main control unit 58, and a power detection unit 51, a current detection unit 52, a temperature detection unit 53, a DAC circuit 54, a power supply interface 55, a communication interface 56, and a control interface 57, which are connected to the main control unit 58. In the following, the monitoring module a is taken as an example for detailed description, and the principle of monitoring by the monitoring module B is the same as that of the monitoring module a, so that the description is omitted here. The monitoring module A comprises:
the main control unit 58 is an MCU microprocessor, which is a 32-bit single chip microcomputer (ATMEGA 32).
The DAC (DA conversion circuit, that is, a circuit that converts a digital signal into an analog signal output) circuit 54 includes: a. the grid voltage adjusting part comprises a grid voltage adjusting part for adjusting the grid voltage of the power amplification tube at normal temperature so as to optimize the performance of the power amplification tube and correct and compensate the grid voltage of the power amplification module A10 according to the temperature of the power amplification module A10; b. an ALC (automatic level control) power control section for controlling the maximum output power of the downlink of each link section of the power amplification module a10, mainly by controlling the voltage-controlled attenuators of the downlink of each link section of the power amplification module a10 to realize the adjustment of the output power; c. and the PA switch control part is used for controlling the downlink switch state of each link part of the power amplifier module a 10.
The power detection unit 51 is configured to forward detect the output power of the downlink of each link portion of the power amplification module a 10. The power detection unit 51 employs a mean detector to improve detection accuracy.
The temperature detecting unit 53 is configured to detect the temperature of the power amplifier module a10 and send the detected temperature to the main control unit 58. The main control unit 58 corrects and compensates the downlink output power control values of the respective link portions of the power amplifier module a10 according to the temperature value supplied from the temperature detection unit 53.
The current detection unit 52 is configured to detect the current of the power amplifier module a10 and send the current to the main control unit 58. The main control unit 58 determines whether the power amplifying circuit switch of the downlink of each link portion of the power amplifying module a10 is turned off or not according to the drain current value provided by the current detecting unit 52, and whether the power amplifying device operates normally or not.
The communication interface 56 is used for communication with the outside. The power interface 55 is used for connecting a power supply to supply power to the power amplifier module structure. The control interface 57 is used for connecting with an external device such as a computer, etc., so as to realize the control of the whole power amplifier module a10 by the external device.
Referring to fig. 3, the first link part 11 of the power amplification module a10, B30 includes a first downlink 111 and a first uplink 201.
The first downlink 111 includes a first downlink port matching circuit 112, a first voltage controlled attenuator 113, a first primary power amplifier 114, a first secondary power amplifier 115, a first isolator 116, a first bridge 117, a first final power amplifier 118, and a first circulator 119, which are connected in order. The input radio frequency signal is output through the first downlink port matching circuit 112 and is subjected to power primary amplification by the first voltage-controlled attenuator 113 to the first primary power amplifier 114. The first voltage-controlled attenuator 113 adopts a MA4P7455 voltage-controlled attenuator, and the adjustable attenuation range reaches 30dB (decibel). The first primary power amplifier 114 adopts a BG13 amplifier tube, and the radio frequency signal is amplified and then output to the first secondary power amplifier 115 for power secondary amplification. The first two-stage power amplifier 115 adopts AFT27S010NT1 to push the tube, the working frequency range is 728-2700M (megabits), the P1dB (1 dB compression point refers to the performance parameter of the output power) output power reaches 40dBm (decibel milliwatt), the radio frequency signal is amplified and then output to the first isolator 116 for isolation, and then is divided into two paths of signals through the first bridge 117, and the two paths of signals are respectively input to the first final-stage power amplifier 118 for power amplification. The first final power amplifier 118 adopts an A2718H100-25S or an A2T21H100-25S double-tube power amplifier, namely, two tube cores are packaged on one tube, the P1dB output power reaches 50dBm, and adopts a reverse Doherty structure design, namely, an inverse Doherty structure, so that the power amplification efficiency is improved, radio frequency signals are amplified and then output through the first circulator 119, and the first circulator 119 adopts an 8G circulator.
The first downlink 111 further comprises a first coupler, a first radio frequency connection 121, connected to the first final power amplifier 118. The first coupler is used for coupling the radio frequency signals output by the first final power amplifier 118 into a first radio frequency signal and a second radio frequency signal, and outputting the first radio frequency signal and the second radio frequency signal to the first radio frequency connector 121 and the power detection unit 51 of the monitoring module 50 respectively. The first voltage controlled attenuator 113 is connected to the DAC circuit 54 of the monitor module 50. The power detection unit 51 is configured to forward detect the second radio frequency signal. The detected direct current signal is divided into two paths: one path is transmitted to the main control unit 58 to realize forward power detection, and the other path is fed back to the first voltage-controlled attenuator 113 through the DAC circuit 54 to realize ALC control of the first downlink 111.
The first rf connector 121 of the first link portion 11 of the power amplifier module a10 may be connected to the digital board a 70 through a cable, so that the first path of rf signal coupled by the first coupler may be output to the digital board a 70 for DPD correction after being output to the first rf connector 121, thereby implementing DPD correction of the output signal of the first link portion 11 of the power amplifier module a 10.
The first rf connector 121 of the first link portion 11 of the power amplifier module B30 may be connected to the digital board B80 through a cable, so that the first path of rf signal coupled by the first coupler may be output to the digital board B80 for DPD correction after being output to the first rf connector 121, thereby implementing DPD correction of the output signal of the first link portion 11 of the power amplifier module B30.
The first uplink 122 of the power amplifier module a10 and the power amplifier module B includes a first primary low noise amplifier 123, a first final low noise amplifier 124, a first radio frequency acoustic surface filter 125, and a first uplink port matching circuit 126, which are sequentially connected. The radio frequency signal is amplified by the primary low noise amplifier 123 and then output to the second final low noise amplifier 124 for final low noise amplification, the primary low noise amplifier 123 adopts MGA-6 series low noise amplifying tube, the noise is small, the noise coefficient is about 0.5dB, the volume is small, the matching is simple, the gain is about 2GHz (gigahertz), the frequency band is about 18dB, the second final low noise amplifier 124 adopts AG50 low noise amplifying tube, and the characteristics of stable current small performance, simple matching and the like are achieved. The signal output by the second final low noise amplifier 124 is filtered by the first rf acoustic surface filter 125 and then output by the first uplink port matching circuit 126. The first radio frequency acoustic surface filter 125 adopts a 2.11G filter, and has the characteristics of small volume, low insertion loss, good out-of-band rejection, and the like.
The second link part 15 includes a second downlink 151 and a second uplink 152. The structure of the second downlink 151 is the same as that of the first downlink 111 of the first link part 11, and the structure of the second uplink 152 is the same as that of the first uplink 122 of the first link part 11, and will not be described again.
Referring to fig. 4, the third link section 17 of the power amplification module a10 includes a third downlink 171, a third uplink 183, and a power switching circuit connected between the third downlink 171 and the third uplink 183.
The third downlink 171 includes a third downlink port matching circuit 172, a third voltage-controlled attenuator 173, a third primary power amplifier 174, a third secondary power amplifier 175, a third isolator 176, a third primary bridge 177, a third final power amplifier 178, and a third circulator 179, which are sequentially connected.
The third downstream port matching circuit 172, the third voltage-controlled attenuator 173, the third primary power amplifier 174, the third secondary power amplifier 175, the third isolator 176, and the third primary bridge 177 are the same devices as the first downstream port matching circuit 112, the first voltage-controlled attenuator 113, the first primary power amplifier 114, the first secondary power amplifier 115, the first isolator 116, and the first bridge 117, respectively, and are not described herein. The third circulator 179 uses a 2.345G circulator for rf signal output.
The third final power amplifier 178 is used for final power amplification of the radio frequency signal. The third final stage power amplifier 178 is composed of two A2T27S020N power amplifying tubes, and the two A2T27S020N power amplifying tubes form a traditional Doherty structure circuit so as to improve the efficiency of final stage power amplification.
The third downlink 171 further includes a third coupler connected to the third final stage power amplifier 178, a third final stage bridge 181 connected to the third coupler, and a third radio frequency connection 182. The third coupler is used for coupling the signals output by the third final power amplifier 178 into a third path of radio frequency signals, and the third final bridge 181 is used for dividing the third path of radio frequency signals into a first path of output radio frequency signals and a second path of output radio frequency signals and respectively outputting the first path of output radio frequency signals and the second path of output radio frequency signals to the third radio frequency connector 182 and the power detection unit 51 of the monitoring module 50. The third voltage controlled attenuator 173 is connected to the DAC circuit 54 of the monitor module 50. The power detection unit 51 is configured to forward detect the second radio frequency signal. The detected direct current signal is divided into two paths: one path is transmitted to the main control unit 58 to realize forward power detection, and the other path is fed back to the third voltage-controlled attenuator 173 through the DAC circuit 54 to realize ALC control of the third downlink 171.
The third rf connector 182 of the third link portion 17 of the power amplifier module a10 may be connected to the digital board a 70 through a cable, so that the first output rf signal coupled by the third coupler may be output to the digital board a 70 for DPD correction after being output to the third rf connector 182, thereby implementing DPD correction of the output signal of the third link portion 17 of the power amplifier module a 10.
The third uplink 183 of the power amplifier module a10 includes a third primary low noise amplifier 184, a third final low noise amplifier 185, a third radio frequency acoustic surface filter 186, and a third uplink port matching circuit 187, which are connected in sequence. The third primary low noise amplifier 184 and the third uplink port matching circuit 187 are the same devices as the first primary low noise amplifier 123 and the first uplink port matching circuit 126, respectively, and will not be described herein. The third final stage low noise amplifier 185 employs a BG8C low noise amplifier for low noise amplification of the input radio frequency signal. The third radio frequency watch filter 186 employs a 2.345G filter for filtering the incoming radio frequency signal.
The third circulator 179 is connected to a third primary low noise amplifier 184 via a first radio frequency switch 188. The third link section 17 belongs to a time division system, and the first radio frequency switch 188 and the power switching circuit are used together to switch the operation states of the third downlink 171 and the third uplink 183, and increase the isolation of the third downlink 171 and the third uplink 183.
The fourth link section 19 of the power amplifier module a10 includes a fourth downlink 191 and a fourth uplink 201.
The fourth downlink 191 includes a fourth downlink port matching circuit 192, a fourth voltage controlled attenuator 193, a fourth filter 194, a fourth primary power amplifier 195, a fourth final power amplifier 196, and a fourth circulator 197, which are sequentially connected. The fourth downstream port matching circuit 192 and the fourth voltage controlled attenuator 193 are the same devices as the third downstream port matching circuit 172 and the third voltage controlled attenuator 173, and are not described herein. The fourth filter 194 filters the input radio frequency signal using an 800M filter. The fourth primary power amplifier 195 employs a 65162 power amplifier tube for primary power amplification of an input radio frequency signal. The fourth final power amplifier 196 adopts an A2T27S020N single-tube power amplifier tube for power amplifying an input radio frequency signal. The fourth circulator 197 uses an 800M circulator for rf signal output.
The fourth downlink 191 further includes a fourth coupler connected to the fourth final stage power amplifier 196, a fourth bridge 199 connected to the fourth coupler, and a second radio frequency switch 200. The fourth coupler is used to couple the signal output by the fourth final power amplifier 196 into a fourth radio frequency signal. The fourth bridge 199 is configured to split the fourth radio frequency signal into a third output radio frequency signal and a fourth output radio frequency signal, and output the third output radio frequency signal to the third radio frequency connector 182 of the third link portion 17 via the second radio frequency switch 200, and output the fourth output radio frequency signal to the power detection unit 51 of the monitoring module 50. A fourth voltage controlled attenuator 193 is connected to the DAC circuit 54 of the monitor module 50. The power detection unit 51 is configured to forward detect the fourth radio frequency signal. The detected direct current signal is divided into two paths: one path is transmitted to the main control unit 58 to realize forward power detection, and the other path is fed back to the fourth voltage-controlled attenuator 193 through the DAC circuit 54 to realize ALC control of the fourth downlink 191.
The fourth link part 19 of the power amplifier module a10 is connected to the digital board a10 through the third radio frequency connector 182 by a cable, so that the third output radio frequency signal coupled by the fourth coupler is output to the third radio frequency connector 182 and then can be output to the digital board a 70 for DPD correction, thereby realizing DPD correction of the output signal of the fourth link part 19 of the power amplifier module a 10.
The fourth uplink 201 of the power amplification module a10 includes a fourth primary low noise amplifier 202, a fourth final low noise amplifier 203, a fourth radio frequency acoustic surface filter 204, and a fourth uplink port matching circuit 205, which are connected in sequence. The fourth primary low noise amplifier 202 and the fourth uplink port matching circuit 205 are the same devices as the third primary low noise amplifier 184 and the third uplink port matching circuit 187, respectively, and will not be described herein. The fourth final stage low noise amplifier 203 employs an F235 low noise amplifier tube for low noise amplification of the input radio frequency signal. The fourth rf sound table filter 204 employs a 2.11G filter for filtering the input rf signal.
Referring to fig. 5, the third link portion 17 of the power amplifier module B30 is the same as the third link portion 17 of the power amplifier module a10, and will not be described again. The third rf connector 182 of the third link portion 17 of the power amplifier module B30 may be connected to the digital board B80 through a cable, so that the first output rf signal coupled by the third coupler is output to the third rf connector 182 and then output to the digital board B80 for DPD correction, thereby implementing DPD correction of the output signal of the third link portion 17 of the power amplifier module B30.
The fifth link portion 21 of the power amplifier module B30 includes a fifth downlink 211 and a fifth uplink 218.
The fifth downlink 211 includes a fifth downlink port matching circuit 212, a fifth voltage controlled attenuator 213, a fifth filter 214, a fifth primary power amplifier 215, a fifth final power amplifier 216, and a fifth circulator 217, which are sequentially connected. The fifth downstream port matching circuit 212, the fifth voltage-controlled attenuator 213, the fifth primary power amplifier 215, the fifth final power amplifier 216, and the fifth circulator 217 are the same devices as the fourth downstream port matching circuit 192, the fourth voltage-controlled attenuator 193, the fourth primary power amplifier 195, the fourth final power amplifier 196, and the fourth circulator 197, respectively, and are not described herein. The fifth filter 214 employs a 900M filter for filtering the input radio frequency signal.
The fifth downlink 211 further includes a fifth coupler connected to the fifth final stage power amplifier 216, a fifth bridge 223 connected to the fifth coupler, and a third radio frequency switch 224. The fifth coupler, the fifth bridge 223, and the third rf switch 224 are the same devices as the fourth coupler, the fourth bridge 199, and the second rf switch 200, respectively, and are not described herein. The third rf switch 224 is connected to the third rf connector 182 of the third link section 17 of the power amplifier module B30.
The fifth uplink 218 includes a fifth primary low noise amplifier 219, a fifth final low noise amplifier 220, a fifth radio frequency list filter 221, and a fifth uplink port matching circuit 222, which are connected in sequence. The fifth primary low noise amplifier 219, the fifth final low noise amplifier 220, the fifth rf acoustic surface filter 221, and the fifth uplink port matching circuit 222 are the same devices as the fourth primary low noise amplifier 203, the fourth final low noise amplifier 203, the fourth rf acoustic surface filter 204, and the fourth uplink port matching circuit 205, respectively, and are not described herein again.
In summary, the power amplifier module a10 and the power amplifier module B30 each have the first link portion 11, the second link portion 15, and the third link portion 17, and only the fourth filter 194 and the fifth filter 213 are different in the fourth link portion 19 of the power amplifier module a10 and the fifth link portion 21 of the power amplifier module B30, so that the types of the applicable devices are greatly reduced, and the stock pressure and the cost can be greatly reduced.
In this embodiment, the power amplifier module a10 and the monitor module a are integrated on an a PCB. The power amplifier module B30 and the monitoring module B are integrated on a B PCB.
The A PCB and the B PCB are composed of four layers of plates: the board is formed by mixing, laminating and combining Rogers 4350 (one of the imported boards of the United states Luo Sijie) and FR-4 (code of a flame-retardant material grade), wherein the first two layers of boards are formed by Rogers 4350, and the other layers of boards are formed by FR-4 boards; the total plate thickness was 1.6mm.
The first layer (top layer) microwave panel has a copper foil thickness of 0.035mm and is mainly used for radio frequency wiring and main wiring of control circuits; the second layer is stratum, and the thickness of the copper foil is 0.035mm; the third layer is a power layer and is mainly used for wiring of a power supply; the fourth layer is a grounding plate and is mainly used for wiring of part of radio frequency circuits and part of control detection circuits.
In order to prevent link self-excitation, prevent interference of a digital circuit to a radio frequency link and mutual interference among radio frequency signals of each link, the whole PCB is divided into 29 cavities in the aspects of layout, namely large signals, small signals, control and the like, so that isolation is increased, and the 29 cavities can be independently shielded and wired.
The first cavity of the downlink of the A PCB board is a downlink port matching circuit of each downlink of the power amplification module A10, the second cavity is a voltage-controlled attenuator and a primary power amplifier of each downlink of the power amplification module A10 and an ALC power control part of a DAC circuit 54 of the monitoring module A, the third cavity is a secondary (push-stage) power amplifier of each downlink of the power amplification module A10, the fourth cavity is a final power amplifier of each downlink of the power amplification module A10, the fifth cavity is internally provided with a circulator or an isolator of each downlink of the power amplification module A10, and the sixth cavity is a power detection unit 51 of the monitoring module A. The uplinks of the power amplifier module a10 are all included in one cavity. The layout of each cavity of the B PCB is consistent with the layout of each cavity of the A PCB, and will not be described again here.
The first link part 11 and the fourth link part 19 of the power amplification module A10 are respectively arranged on the upper side and the lower side of the A PCB, the first link part 11 and the fifth link part 21 of the power amplification module B30 are respectively arranged on the upper side and the lower side of the B PCB, the two links of the power amplification module A10 and the power amplification module B30 are far away from each other as far as possible, and the isolation degree between the two links is improved as far as possible, so that the downlink output 2-order intermodulation signals of the fourth link part 19 of the power amplification module A10 and the fifth link part 21 of the power amplification module B30 are prevented from falling in the band of the first uplink 122 of the first link part 11 of the corresponding power amplification module A10 and the band of the first uplink 122 of the first link part 11 of the power amplification module B30, and interference is formed on the uplink signals of the first link part 11 of the power amplification module A10 and the first link part 11 of the power amplification module B.
The foregoing examples only illustrate preferred embodiments of the invention, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that modifications and improvements can be made without departing from the spirit of the invention, such as combining different features of the various embodiments, which are all within the scope of the invention.
Claims (7)
1. An integrated power amplifier module structure which is characterized in that: comprising the following steps:
the antenna comprises a multiplexer connected with an antenna, a power amplification module A connected with the multiplexer and a digital board A connected with the power amplification module A;
the power amplifier module B is connected with the multiplexer, and the digital board B is connected with the power amplifier module B;
the power amplifier module A and the power amplifier module B comprise a first link part, a second link part and a third link part; the power amplifier module A further comprises a fourth link part, and the power amplifier module B further comprises a fifth link part; the first link portion includes a first downlink and a first uplink; the first downlink comprises a first downlink port matching circuit, a first voltage-controlled attenuator, a first primary power amplifier, a first secondary power amplifier, a first isolator, a first bridge, a first final power amplifier and a first circulator which are sequentially connected; the first uplink comprises a first primary low noise amplifier, a first final low noise amplifier, a first radio frequency acoustic surface filter and a first uplink port matching circuit which are sequentially connected;
the third link part comprises a third downlink, a third uplink and a power switch circuit connected between the third downlink and the third uplink, wherein the third downlink comprises a third downlink port matching circuit, a third voltage-controlled attenuator, a third primary power amplifier, a third secondary power amplifier, a third isolator, a third primary bridge, a third final power amplifier and a third circulator which are sequentially connected; the third uplink comprises a third primary low noise amplifier, a third final low noise amplifier, a third radio frequency sound table filter and a third uplink port matching circuit which are sequentially connected; the third circulator is connected with the third primary low noise amplifier through a first radio frequency switch; the third downlink also comprises a third coupler connected with the third final power amplifier, a third final bridge connected with the third coupler and a third radio frequency joint, wherein the third coupler is used for coupling signals output by the third final power amplifier into third radio frequency signals, the third final bridge is used for dividing the third radio frequency signals into a first output radio frequency signal and a second output radio frequency signal and respectively outputting the first output radio frequency signal and the second output radio frequency signal to the third radio frequency joint and a power detection unit of the monitoring module, and the third voltage-controlled attenuator is connected with a DAC circuit of the monitoring module.
2. The integrated power amplifier module structure of claim 1, wherein: the first downlink further comprises a first coupler connected with the first final power amplifier and a first radio frequency connector; the first coupler is used for coupling the radio frequency signals output by the first final-stage power amplifier into a first path of radio frequency signals and a second path of radio frequency signals and respectively outputting the first path of radio frequency signals and the second path of radio frequency signals to the first radio frequency connector and the power detection unit of the monitoring module, and the first voltage-controlled attenuator is connected with the DAC circuit of the monitoring module.
3. The integrated power amplifier module structure of claim 1, wherein: the second link portion includes a second downlink and a second uplink; the structure of the second downlink is the same as the structure of the first downlink of the first link section, and the structure of the second uplink is the same as the structure of the first uplink of the first link section.
4. The integrated power amplifier module structure of claim 1, wherein: the fourth link part comprises a fourth downlink and a fourth uplink, the fourth downlink comprises a fourth downlink port matching circuit, a fourth voltage-controlled attenuator, a fourth filter, a fourth primary power amplifier, a fourth final power amplifier and a fourth circulator which are sequentially connected, and the fourth uplink comprises a fourth primary low noise amplifier, a fourth final low noise amplifier, a fourth radio frequency sound table filter and a fourth uplink port matching circuit which are sequentially connected.
5. The integrated power amplifier module structure of claim 4, wherein: the fourth downlink further comprises a fourth coupler connected with the fourth final-stage power amplifier, a fourth bridge connected with the fourth coupler and a second radio frequency switch, the fourth coupler is used for coupling signals output by the fourth final-stage power amplifier into fourth paths of radio frequency signals, the fourth bridge is used for dividing the fourth paths of radio frequency signals into third paths of output radio frequency signals and fourth paths of output radio frequency signals and outputting the third paths of output radio frequency signals to a third radio frequency connector of the third link part through the second radio frequency switch, the fourth paths of output radio frequency signals are output to a power detection unit of the monitoring module, and the fourth voltage-controlled attenuator is connected with a DAC circuit of the monitoring module.
6. The integrated power amplifier module structure of claim 1, wherein: the intelligent monitoring system further comprises a monitoring module A and a monitoring module B, wherein the monitoring module A and the monitoring module B comprise a main control unit, and a power detection unit, a current detection unit, a temperature detection unit and a DAC circuit which are connected with the main control unit.
7. The integrated power amplifier module structure of claim 6, wherein: the power amplifier module A and the monitoring module A are integrated on an A PCB; and the power amplifier module B and the monitoring module B are integrated on a B PCB.
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| CN201711305359.XA CN107863986B (en) | 2017-12-11 | 2017-12-11 | Integrated power amplifier module structure |
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| CN201711305359.XA CN107863986B (en) | 2017-12-11 | 2017-12-11 | Integrated power amplifier module structure |
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| CN110445543A (en) * | 2019-08-22 | 2019-11-12 | 和源通信（上海）股份有限公司 | A kind of Optical fiber relay remote device |
| CN112332788A (en) * | 2020-10-22 | 2021-02-05 | 浙江三维利普维网络有限公司 | Radio frequency power amplifier module |
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| CN201528431U (en) * | 2009-09-23 | 2010-07-14 | 京信通信系统（中国）有限公司 | CDMA digital optical fiber repeater system based on far-end integral module |
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| CN201528431U (en) * | 2009-09-23 | 2010-07-14 | 京信通信系统（中国）有限公司 | CDMA digital optical fiber repeater system based on far-end integral module |
| CN203219304U (en) * | 2013-02-19 | 2013-09-25 | 福建邮科通信技术有限公司 | Energy-efficient multicarrier digital fiber microwave remote extension system |
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