CN107863986A - Integrated power amplifier module structure - Google Patents
Integrated power amplifier module structure Download PDFInfo
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- CN107863986A CN107863986A CN201711305359.XA CN201711305359A CN107863986A CN 107863986 A CN107863986 A CN 107863986A CN 201711305359 A CN201711305359 A CN 201711305359A CN 107863986 A CN107863986 A CN 107863986A
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- 238000012544 monitoring process Methods 0.000 claims description 43
- 230000003321 amplification Effects 0.000 claims description 25
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 25
- 230000005611 electricity Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 abstract description 9
- 230000006855 networking Effects 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 description 11
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 11
- 238000012937 correction Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 208000002925 dental caries Diseases 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
- H03F1/0288—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Amplifiers (AREA)
Abstract
The present invention relates to a kind of integrated power amplifier module structure, including：For the multiplexer to connect with antenna, the power amplifier module A being connected with multiplexer, the digiboard A being connected with power amplifier module A；The power amplifier module B being connected with the multiplexer, the digiboard B being connected with power amplifier module B；The power amplifier module A, power amplifier module B include the first link portions, the second link portions, the 3rd link portions；The power amplifier module A also includes the 4th link portions, and the power amplifier module B also includes the 5th link portions.The integrated power amplifier module structure of the present invention is using power amplifier module A and power amplifier module B combination networking, support multiple standards, multiple frequency range mixed networking, three net Joint construction and sharings can be achieved, the problems such as can solve the problem that significant wastage, the engineering construction difficulty of repeated construction resource, and output power, more places can be covered, low in energy consumption, cost is low.
Description
【Technical field】
The present invention relates to mobile communication technology field, and MIMO (multiple-input, multiple-output) technologies and DPD are supported more particularly, to one kind
The steel tower High-efficiency integral power amplifier module structure of (digital pre-distortion) correction.
【Background technology】
China telecommunication market, always by movement, UNICOM, telecommunications Big Three in occupation of, with the market demand improve and
The fieriness of market competition, three big operators have to continue to increase infrastructure to adapt to the demand of the marketization.But early stage this
Kind do things in his own way, disorderly competition and repeated construction, cause the significant wastage to resource, overlapping investment outstanding problem, network money
Source utilization rate is generally relatively low.With the rapid development of technology, infrastructure of telecommunication Joint construction and sharing level is improved, the integration of three networks is must
Right trend.
Constantly promote and be rooted in the hearts of the people in the whole world with green, low-carbon economy theory, operator is for mobile communication
The efficiency of base station proposes higher and higher demand.And in base station equipment, the energy consumption of RF power amplification accounts for the 60% of total energy consumption
Left and right, therefore, high efficiency, inexpensive integrated power amplifier become following mobile operator and cut operating costs, realize
The maximally efficient means of green energy conservation.
One of the core component of power amplifier module as wireless transceiver system, traditional A classes and AB classes power amplifier (rollback 10-
15dB) efficiency can only typically accomplish 10%-15% or so, and the power exported is small, cover place less, system power dissipation is big, body
Product is big, and cost is high.
【The content of the invention】
It is an object of the invention to overcome the shortcomings of above-mentioned technology, there is provided a kind of small volume, output power, it is low in energy consumption,
The low integrated power amplifier module structure of cost.
A kind of integrated power amplifier module structure provided by the invention, including：For the multiplexer and multiplexing to connect with antenna
The power amplifier module A of device connection, the digiboard A being connected with power amplifier module A；The power amplifier module B and power amplifier being connected with the multiplexer
The digiboard B of module B connections；The power amplifier module A, power amplifier module B include the first link portions, the second link portions, the
Three link portions；The power amplifier module A also includes the 4th link portions, and the power amplifier module B also includes the 5th link portions.
Further, first link portions include the first downlink and the first up-link；Described first is descending
Link include be sequentially connected the first downlink port match circuit, the first voltage-controlled attenuator, the first prime power amplifier, first
Two-stage power amplifier, the first isolator, the first electric bridge, the first final power amplifier and first annular device；On described first
Line link includes the first primary low-noise amplifier, the first final stage low-noise amplifier, the first radio frequency sound table filter being sequentially connected
Ripple device and the first uplink port match circuit.
Further, first downlink also includes the first coupling being connected with first final power amplifier
Device, the first radio-frequency joint；First coupler is used to couple the radiofrequency signal of first final power amplifier output
Institute is respectively outputted into first via radiofrequency signal and the second tunnel radiofrequency signal and by first via radiofrequency signal, the second tunnel radiofrequency signal
The power detecting unit of the first radio-frequency joint, monitoring module is stated, the DAC-circuit of first voltage-controlled attenuator and monitoring module connects
Connect.
Further, second link portions include the second downlink and the second up-link；Described second is descending
The structure of link is identical with the structure of the first downlink of first link portions, the structure of second up-link with
The structure of first up-link of first link portions is identical.
Further, the 3rd link portions include the 3rd downlink, the 3rd up-link and are connected to the 3rd
Power switch circuit between downlink and the 3rd up-link, the 3rd downlink include be sequentially connected the 3rd under
Row port match circuit, the 3rd voltage-controlled attenuator, the 3rd prime power amplifier, the 3rd two-stage power amplifier, the 3rd isolation
Device, the 3rd primary electric bridge, the 3rd final power amplifier and the 3rd circulator；3rd up-link includes what is be sequentially connected
3rd primary low-noise amplifier, the 3rd final stage low-noise amplifier, the 3rd radio frequency SAW filter and the 3rd uplink port
With circuit；3rd circulator is connected by the first RF switch with the 3rd primary low-noise amplifier.
Further, the 3rd downlink also includes the 3rd coupling being connected with the 3rd final power amplifier
Device, the 3rd final stage electric bridge and the 3rd radio-frequency joint being connected with the 3rd coupler, the 3rd coupler are used for described the
The signal of three final power amplifiers output is coupled into the 3rd tunnel road radiofrequency signal, and the 3rd final stage electric bridge is used for described the
Three tunnel radiofrequency signals be divided into the first via output radiofrequency signal and the second tunnel output radiofrequency signal and by the first via export radiofrequency signal,
Second tunnel output radiofrequency signal is respectively outputted to the 3rd radio-frequency joint, the power detecting unit of monitoring module, and the described 3rd
The DAC-circuit of voltage-controlled attenuator and monitoring module connects.
Further, the 4th link portions include the 4th downlink and the 4th up-link, and the described 4th is descending
Link include be sequentially connected the 4th downlink port match circuit, the 4th voltage-controlled attenuator, the 4th wave filter, the 4th prime power
Amplifier, the 4th final power amplifier and fourth annular device, the 4th up-link include the 4th primary being sequentially connected
Low-noise amplifier, the 4th final stage low-noise amplifier, the 4th radio frequency SAW filter and the 4th uplink port match circuit.
Further, the 4th downlink also includes the 4th coupling being connected with the 4th final power amplifier
Device, the 4th electric bridge and the second RF switch being connected with the 4th coupler, the 4th coupler are used for the described 4th end
The signal of stage power amplifier output is coupled into the 4th tunnel radiofrequency signal, and the 4th electric bridge is used to believe the 4th road radio frequency
Number it is divided into the 3rd tunnel output radiofrequency signal and the 4th tunnel output radiofrequency signal and the 3rd tunnel is exported into radiofrequency signal through described second
RF switch is output to the 3rd radio-frequency joint of the 3rd link portions, the 4th tunnel output radiofrequency signal is output into monitoring mould
The power detecting unit of block, the DAC-circuit connection of the 4th voltage-controlled attenuator and monitoring module.
Further, in addition to monitoring module A and monitoring module B, the monitoring module A and monitoring module B include master
Control unit and power detecting unit, current detecting unit, temperature detecting unit, the DAC-circuit being connected with main control unit.
Further, the power amplifier module A and monitoring module A are integrated on A pcb boards；The power amplifier module B and monitoring
Module B is integrated on B pcb boards.
The present invention integrated power amplifier module structure using power amplifier module A and power amplifier module B combination networking, comprising 2G, 3G,
4G multiple networks, and MIMO technology and DPD corrections are supported, multiple standards, multiple frequency range mixed networking are supported, three nets can be achieved altogether
Build shared, the problems such as can solve the problem that significant wastage, the engineering construction difficulty of repeated construction resource.Simultaneously relatively conventional A classes and
AB classes power amplifier is compared under same consumption conditions, exportable bigger power, covers more places；Exporting same power
In the case of, system power dissipation is greatly to reduce, more energy-conserving and environment-protective, and radiator structure and outward appearance can be made smaller, this
The metal material that sample can not only be saved, and can save installing space, substantially reduces construction cost, is more easy to allow user
Received.
【Brief description of the drawings】
Fig. 1 is a kind of schematic diagram for integrated power amplifier module structure that one embodiment of the invention provides；
Fig. 2 is the monitoring module A of integrated power amplifier module structure, monitoring module B schematic diagram shown in Fig. 1；
Fig. 3 is the power amplifier module A of integrated power amplifier module structure shown in Fig. 1, power amplifier module B the first link portions and
The schematic diagram of two link portions；
Fig. 4 is the power amplifier module A of integrated power amplifier module structure the 3rd link portions and the 4th link portion shown in Fig. 1
The schematic diagram divided；
Fig. 5 is the power amplifier module B of integrated power amplifier module structure the 3rd link portions and the 5th link portion shown in Fig. 1
The schematic diagram divided.
【Embodiment】
The invention will be further described with reference to the accompanying drawings and examples.
With reference to figure 1 and Fig. 2, a kind of integrated power amplifier module structure provided by the invention, including：For with antenna (MS) phase
The multiplexer 90 that connects, the power amplifier module A 10 being connected with multiplexer 90, the digiboard A 70 being connected with power amplifier module A 10；With it is more
The power amplifier module B 30 of the connection of work device 90, the digiboard B 80 being connected with power amplifier module B 30.Wherein, digiboard A 70 and numeral
Plate B 80 is respectively used to be connected to corresponding optical fiber.Preferably, antenna is retransmitting antenna.
Power amplifier module A 10, power amplifier module B 30 include the first link portions 11, the second link portions 15, the 3rd link
Part 17.Power amplifier module A 10 also includes the 4th link portions 19, and power amplifier module B 30 also includes the 5th link portions 21.
First link portions 11 include the first downlink 111 and the first up-link 122.Second link portions 15 include
Second downlink 151 and the second up-link 152.It is up that 3rd link portions 17 include the 3rd downlink 171 and the 3rd
Link 183.4th link portions 19 include the 4th downlink 191 and the 4th up-link 201.5th link portions 21 include
5th downlink 211 and the 5th up-link 218.
Power amplifier module A 10 and power amplifier module B 30 each link portions all have uplink downlink.Power amplifier module A 10,
The downlink of 30 each link portions of power amplifier module B mainly amplify base station signal is easy to mobile phone to receive, Base Transmitter it is descending
Signal couples progress electro-optic conversion by front end machine and entered through fiber optic stretch to remote termination, then through digiboard A 70, digiboard B 80
Row processing and opto-electronic conversion, respectively enter corresponding power amplifier module A10, the downlink of 30 each link portions of power amplifier module B enters
The descending amplification of row, most sends amplified downstream signal to mobile phone through multiplexer 90 and retransmitting antenna afterwards.Amplified signal
It is easy to mobile phone to receive.Power amplifier module A 10, the up-link of 30 each link portions of power amplifier module B mainly amplify mobile phone signal
It is easy to base station to receive, retransmitting antenna receives the signal that mobile phone is sent, and is introduced into multiplexer 90 and filters, then respectively enters power amplifier mould
Block A 10, the up-link of 30 each link portions of power amplifier module B carry out up amplification, pass through corresponding digiboard A 70, numeral
Plate B 80 carries out opto-electronic conversion, and through fiber optic stretch to near-end machine, it is that upward signal is sent to base station to carry out opto-electronic conversion, so as to reach
To expanding, zoom out, optimize the purpose of mobile communication signal.
In the present embodiment, power amplifier module A 10 includes following 4 kinds of standard signal frequency ranges：Telecommunications LTE FDD2.1G, UNICOM
WCDMA2100, mobile TD-LTE (E frequency ranges), telecommunications CDMA800.Wherein, telecommunications LTE FDD2.1G, UNICOM WCDMA2100 this
Two frequency ranges correspond to power amplifier module A 10 the first link portions 11 and the second link portions 15, power amplifier module A 10 the first chain
As function with the second link portions 15 is realized in road part 11, telecommunications LTE2.1G MIMO technologies are supported.Mobile TD-LTE (E frequencies
Section) this frequency range corresponds to power amplifier module A 10 the 3rd link portions 17, and this frequency range of telecommunications CDMA800 corresponds to power amplifier module A
10 the 4th link portions 19.
Power amplifier module B 30 includes following 6 kinds of standard signal frequency ranges：Mobile GSM1800, UNICOM DCS1.8G, telecommunications LTE
FDD1.8G, mobile TD-LTE (E frequency ranges), movement/UNICOM GSM900.Wherein, mobile GSM1800, UNICOM DCS1.8G, telecommunications
These three frequency ranges of LTE FDD1.8G correspond to power amplifier module B 30 the first link portions 11 and the second link portions 15, power amplifier mould
As block B 30 the first link portions 11 with the second link portions 15 realize function, telecommunications LTE FDD1.8G MIMO skills are supported
Art.Mobile TD-LTE (E frequency ranges) this frequency range corresponds to power amplifier module B 30 the 3rd link portions 17, movement/UNICOM GSM900
This frequency range corresponds to power amplifier module B 30 the 5th link portions 21.
The present invention can support to support LTE signals by the way that power amplifier module A 10 and power amplifier module B 30 are combined into networking
MIMO technology, including mobile GSM1800, support MIMO；UNICOM DCS1800/LTE FDD1.8G, support LTE MIMO；Telecommunications
LTE FDD1.8G, support LTE MIMO；Telecommunications LTE FDD2.1G, support LTE MIMO；UNICOM WCDMA2100, support MIMO；
Mobile TD-LTE (E frequency ranges), supports LTE MIMO.Relatively conventional A classes and AB classes power amplifier are compared under same consumption conditions,
Exportable bigger power, cover more places；In the case where exporting same power, system power dissipation is greatly to reduce, more
The energy-conserving and environment-protective added, and radiator structure and outward appearance can be made smaller, so can not only to save metal material, and can
Installing space is saved, construction cost is substantially reduced, is more easy to allow user to be received.
Power amplifier module A10 and power amplifier module B30 is two independent power amplifier modules, it is possible to understand that ground, power amplifier module A10 and
Power amplifier module B30 also can be used alone.
Present invention additionally comprises monitoring module A and monitoring module B.Monitoring module A is used to be monitored power amplifier module A10.
Monitoring module B is used to be monitored power amplifier module B 30.As shown in Fig. 2 monitoring module A and monitoring module B include master control
Unit 58 and the power detecting unit 51 being connected with main control unit 58, current detecting unit 52, temperature detecting unit 53, DAC
Circuit 54, power interface 55, communication interface 56 and control interface 57.It is described in detail, monitors by taking monitoring module A as an example below
The principle that module B is monitored is identical with monitoring module A, therefore will not be repeated here.Monitoring module A includes：
Main control unit 58 is a MCU microprocessors, and MCU microprocessors are 32 single-chip microcomputers (ATMEGA32).
DAC (DA change-over circuits, that is, data signal is converted into the circuit of analog signal output) circuit 54 includes：a、
Grid voltage adjusts part, includes and power tube grid voltage is adjusted under normal temperature so that its Performance optimization and according to power amplifier module A's 10
Temperature is modified compensation to power amplifier module A 10 grid voltage；B, ALC (auto level control) Power Controls part, for controlling
The peak power output of the downlink of power amplifier module A 10 each link portions, mainly by controlling power amplifier module A 10
The voltage-controlled attenuators of downlink of each link portions realize the regulation of power output；C, PA switching control sections, use
In the on off state of the downlink of control power amplifier module A10 each link portions.
Power detecting unit 51 is used to enter the power output of the downlink of power amplifier module A 10 each link portions
The positive detection of row.Power detecting unit 51 improves accuracy of detection using average detector.
Temperature detecting unit 53 is used to detect power amplifier module A 10 temperature and is sent to main control unit 58.Main control unit 58
The temperature value provided according to temperature detecting unit 53, to the output work of the downlink of power amplifier module A 10 each link portions
Rate controlling value is modified compensation.
Current detecting unit 52 is used to detect power amplifier module A 10 electric current and is sent to main control unit 58.Main control unit 58
The drain current value provided according to current detecting unit 52, to judge the downlink of power amplifier module A 10 each link portions
Power amplification circuit switch whether close, power amplifying device whether normal work.
Communication interface 56 is used for and PERCOM peripheral communication.Power interface 55 is used to connect power supply to realize to the confession of power amplifier module structure
Electricity.Control interface 57 is used to be connected such as computer with external equipment, whole to power amplifier module A10 by external equipment so as to realize
The control of body.
With reference to figure 3, power amplifier module A 10, power amplifier module B 30 the first link portions 11 include the first downlink 111
With the first up-link 201.
First downlink 111 includes the first downlink port match circuit 112, the first voltage-controlled attenuator being sequentially connected
113rd, the first prime power amplifier 114, the first two-stage power amplifier 115, the first isolator 116, the first electric bridge 117,
One final power amplifier 118 and first annular device 119.Input radio frequency signal exports through the first downlink port match circuit 112,
Power primary amplification is carried out by first the 113 to the first prime power of voltage-controlled attenuator amplifier 114.First voltage-controlled attenuator
113 use MA4P7455 voltage-controlled attenuators, and adjustable damping scope reaches 30dB (decibel).First prime power amplifier 114 uses
BG13 amplifier tubes, it is output to the first two-stage power amplifier 115 after radiofrequency signal amplification and carries out power diode amplification.First two level
Power amplifier 115 promotes pipe using AFT27S010NT1, and operating frequency range is 728-2700M (million), and (1dB compresses P1dB
Point, refer to the performance parameter of power output) power output reaches 40dBm (dBm), be output to after radiofrequency signal amplification first every
Divide after being isolated from device 116 through the first electric bridge 117 for two paths of signals, be separately input to the first final power amplifier 118 and enter
Row power amplification.First final power amplifier 118 uses the two-tube power amplifications of A2718H100-25S or A2T21H100-25S
Pipe, i.e. on a tube, P1dB power outputs reach 50dBm to two die packages, using reverse Doherty (Doherty) structure
Design is transoid Doherty structures, improves power amplification efficiency, is exported after radiofrequency signal amplification through first annular device 119, the first ring
Shape device 119 uses 8G circulators.
First downlink 111 also includes the first coupler, the first radio frequency being connected with the first final power amplifier 118
Joint 121.First coupler is used to the radiofrequency signal that the first final power amplifier 118 exports being coupled into first via radio frequency letter
Number and the second tunnel radiofrequency signal and by first via radiofrequency signal, the second tunnel radiofrequency signal be respectively outputted to the first radio-frequency joint 121,
The power detecting unit 51 of monitoring module 50.First voltage-controlled attenuator 113 is connected with the DAC-circuit 54 of monitoring module 50.Power
Detection unit 51 is used to carry out positive detection to the second tunnel radiofrequency signal.Direct current signal after detection divides two-way：It is transported to all the way
Main control unit 58 realizes that forward power detects, and another way is then fed back on the first voltage-controlled attenuator 113 through DAC-circuit 54, realizes
The ALC controls of first downlink 111.
First radio-frequency joint 121 of power amplifier module A 10 the first link portions 11 can pass through cable connection to digiboard A
70, thus it is output to digiboard A after the first via radiofrequency signal of the first coupler coupling is output to the first radio-frequency joint 121
70, which do DPD corrections, uses, so as to realize that the DPD of the output signal of power amplifier module A 10 the first link portions 11 is corrected.
First radio-frequency joint 121 of power amplifier module B 30 the first link portions 11 can pass through cable connection to digiboard B
80, thus it is output to digiboard B after the first via radiofrequency signal of the first coupler coupling is output to the first radio-frequency joint 121
80, which do DPD corrections, uses, so as to realize that the DPD of the output signal of power amplifier module B 30 the first link portions 11 is corrected.
The first primary low noise that power amplifier module A 10, power amplifier module B the first up-link 122 include being sequentially connected is put
Big device 123, the first final stage low-noise amplifier 124, the first radio frequency SAW filter 125 and the first uplink port match circuit
126.Radiofrequency signal is output to the second final stage low noise after the first primary low-noise amplifier 123 carries out primary low noise amplification
Amplifier 124 carries out final stage low noise amplification, and the first primary low-noise amplifier 123 is using low noise amplification serial MGA-6
Pipe, noise is smaller, and noise coefficient is in 0.5dB or so, small volume, and matching is simple, and gain is in 2GHz (GHz), frequency range 18dB
Left and right, the second final stage low-noise amplifier 124 use AG50 low noise amplification pipes, have the small stable performance of electric current, matching simple
The features such as.Second final stage low-noise amplifier 124 output signal through the first radio frequency SAW filter 125 filtering after by first on
Row port match circuit 126 is exported.First radio frequency SAW filter 125 uses 2.11G wave filters, has small volume, inserts
Damage the features such as low, Out-of-band rejection is good.
Second link portions 15 include the second downlink 151 and the second up-link 152.Second downlink 151
Structure is identical with the structure of the first downlink 111 of the first link portions 11, structure and the first chain of the second up-link 152
The structure of first up-link 122 of road part 11 is identical, repeats no more here.
With reference to figure 4, power amplifier module A 10 the 3rd link portions 17 include the 3rd downlink 171, the 3rd up-link
183 and the power switch circuit that is connected between the 3rd downlink 171 and the 3rd up-link 183.
3rd downlink 171 includes the 3rd downlink port match circuit 172, the 3rd voltage-controlled attenuator being sequentially connected
173rd, the 3rd prime power amplifier 174, the 3rd two-stage power amplifier 175, the 3rd isolator 176, the 3rd primary electric bridge
177th, the 3rd final power amplifier 178 and the 3rd circulator 179.
Wherein, the 3rd downlink port match circuit 172, the 3rd voltage-controlled attenuator 173, the 3rd prime power amplifier 174,
3rd two-stage power amplifier 175, the 3rd isolator 176, the 3rd primary electric bridge 177 respectively with the first downlink port match circuit
112nd, the first voltage-controlled attenuator 113, the first prime power amplifier 114, the first two-stage power amplifier 115, the first isolator
116th, the first electric bridge 117 is identical device, is repeated no more here.3rd circulator 179 is penetrated using 2.345G circulators
Frequency signal output.
3rd final power amplifier 178 is used to carry out final power amplification to radiofrequency signal.3rd final power amplifies
Device 178 is made up of two A2T27S020N power amplifier tubes, two A2T27S020N power amplifier tubes form one it is traditional
Doherty structural circuits, to improve the efficiency of final power amplification.
3rd downlink 171 also includes the 3rd coupler and the 3rd coupling being connected with the 3rd final power amplifier 178
The 3rd final stage electric bridge 181 and the 3rd radio-frequency joint 182 of clutch connection.3rd coupler is used to amplify the 3rd final power
The signal that device 178 exports is coupled into the 3rd tunnel road radiofrequency signal, and the 3rd final stage electric bridge 181 is used to the 3rd tunnel radiofrequency signal being divided into
The first via exports radiofrequency signal and the second tunnel output radiofrequency signal and the first via is exported into radiofrequency signal, the second tunnel output radio frequency letter
Number it is respectively outputted to the power detecting unit 51 of the 3rd radio-frequency joint 182, monitoring module 50.3rd voltage-controlled attenuator 173 and prison
The DAC-circuit 54 of control module 50 connects.Power detecting unit 51 is used to carry out positive detection to the second tunnel radiofrequency signal.After detection
Direct current signal divide two-way：Main control unit 58 is transported to all the way and realizes that forward power detects, and another way is then fed back through DAC-circuit 54
Onto the 3rd voltage-controlled attenuator 173, the ALC controls of the 3rd downlink 171 are realized.
3rd radio-frequency joint 182 of power amplifier module A 10 the 3rd link portions 17 can pass through cable connection to digiboard A
70, thus it is output to number after the first via output radiofrequency signal of the 3rd coupler coupling is output to the 3rd radio-frequency joint 182
Letter stencil A 70 does DPD corrections and used, so as to realize that the DPD of the output signal of power amplifier module A10 the 3rd link portions 17 is corrected.
The 3rd primary low-noise amplifier 184 that power amplifier module A10 the 3rd up-link 183 includes being sequentially connected, the
Three final stage low-noise amplifiers 185, the 3rd radio frequency SAW filter 186 and the 3rd uplink port match circuit 187.3rd is primary
Low-noise amplifier 184, the 3rd uplink port match circuit 187 are up with the first primary low-noise amplifier 123, first respectively
Port match circuit 126 is identical device, is repeated no more here.3rd final stage low-noise amplifier 185 uses BG8C low noises
Sound amplifier tube is used to carry out low noise amplification to the radiofrequency signal of input.3rd radio frequency SAW filter 186 is filtered using 2.345G
Ripple device is used to be filtered the radiofrequency signal of input.
3rd circulator 179 is connected by the first RF switch 188 with the 3rd primary low-noise amplifier 184.3rd chain
Road part 17 belongs to time-division system, the first RF switch 188 and power switch circuit together, for switching the 3rd downlink
171 and the 3rd up-link 183 working condition, increase the isolation of the 3rd downlink 171 and the 3rd up-link 183.
Power amplifier module A 10 the 4th link portions 19 include the 4th downlink 191 and the 4th up-link 201.
4th downlink 191 includes the 4th downlink port match circuit 192, the 4th voltage-controlled attenuator being sequentially connected
193rd, the 4th wave filter 194, the 4th prime power amplifier 195, the 4th final power amplifier 196 and fourth annular device 197.
Wherein, the 4th downlink port match circuit 192, the 4th voltage-controlled attenuator 193 respectively with the 3rd downlink port match circuit 172,
3rd voltage-controlled attenuator 173 is identical device, is repeated no more here.4th wave filter 194 is using 800M wave filters to input
Radiofrequency signal be filtered.4th prime power amplifier 195 uses 65162 power amplifier tubes, for the radio frequency to input
Signal carries out prime power amplification.4th final power amplifier 196 use A2T27S020N single tube power amplifier tubes, for pair
The radiofrequency signal of input carries out power amplification.Fourth annular device 197 carries out radiofrequency signal output using 800M circulators.
4th downlink 191 also includes the 4th coupler and the 4th coupling being connected with the 4th final power amplifier 196
The 4th electric bridge 199 and the second RF switch 200 of clutch connection.4th coupler is used for the 4th final power amplifier
The signal of 196 outputs is coupled into the 4th tunnel radiofrequency signal.4th electric bridge 199 is defeated for the 4th tunnel radiofrequency signal to be divided into the 3rd road
Go out radiofrequency signal and the 4th tunnel output radiofrequency signal and the 3rd tunnel is exported into radiofrequency signal and be output to the through the second RF switch 200
3rd radio-frequency joint 182 of three link portions 17, the 4th tunnel is exported to the power detection that radiofrequency signal is output to monitoring module 50
Unit 51.4th voltage-controlled attenuator 193 is connected with the DAC-circuit 54 of monitoring module 50.Power detecting unit 51 is used for the 4th
Road radiofrequency signal carries out positive detection.Direct current signal after detection divides two-way：Main control unit 58 is transported to all the way realizes positive work(
Rate is detected, and another way is then fed back on the 4th voltage-controlled attenuator 193 through DAC-circuit 54, realizes the ALC of the 4th downlink 191
Control.
Power amplifier module A 10 the 4th link portions 19 are by the 3rd radio-frequency joint 182 through cable connection to digiboard A
10, thus it is output to number after the 3rd tunnel output radiofrequency signal of the 4th coupler coupling is output to the 3rd radio-frequency joint 182
Letter stencil A 70 does DPD corrections and used, so as to realize that the DPD of the output signal of power amplifier module A 10 the 4th link portions 19 is corrected.
The 4th primary low-noise amplifier 202 that power amplifier module A 10 the 4th up-link 201 includes being sequentially connected, the
Four final stage low-noise amplifiers 203, the 4th radio frequency SAW filter 204 and the 4th uplink port match circuit 205.Wherein,
Four primary low-noise amplifiers 202, the 4th uplink port match circuit 205 respectively with the 3rd primary low-noise amplifier 184,
Three uplink port match circuits 187 are identical device, are repeated no more here.4th final stage low-noise amplifier 203 uses
F235 low noise amplification pipes, for carrying out low noise amplification to the radiofrequency signal of input.4th radio frequency SAW filter 204 uses
2.11G wave filters, for being filtered to the radiofrequency signal of input.
With reference to figure 5, power amplifier module B 30 the 3rd link portions 17 and power amplifier module A 10 phase of the 3rd link portions 17
Together, repeat no more here.Wherein, the 3rd radio-frequency joint 182 of power amplifier module B 30 the 3rd link portions 17 can pass through cable
Digiboard B 80 is connected to, thus the first via output radiofrequency signal through the coupling of the 3rd coupler is output to the 3rd radio-frequency joint
Digiboard B 80 is output to after 182 and does DPD correction use, so as to realize the output of power amplifier module B 30 the 3rd link portions 17
The DPD corrections of signal.
Power amplifier module B 30 the 5th link portions 21 include the 5th downlink 211 and the 5th up-link 218.
5th downlink 211 includes the 5th downlink port match circuit 212, the 5th voltage-controlled attenuator being sequentially connected
213rd, the 5th wave filter 214, the 5th prime power amplifier 215, the 5th final power amplifier 216 and the 5th circulator 217.
Wherein, the 5th downlink port match circuit 212, the 5th voltage-controlled attenuator 213, the 5th prime power amplifier 215, the 5th final stage
Power amplifier 216 is distinguished, the 5th circulator 217 respectively with the 4th downlink port match circuit 192, the 4th voltage-controlled attenuator
193rd, the 4th prime power amplifier 195, the 4th final power amplifier 196, fourth annular device 197 are identical device, this
In repeat no more.5th wave filter 214 uses 900M wave filters, for being filtered to the radiofrequency signal of input.
5th downlink 211 also includes the 5th coupler and the 5th coupling being connected with the 5th final power amplifier 216
The 5th electric bridge 223 and the 3rd RF switch 224 of clutch connection.5th coupler, the 5th electric bridge 223, the 3rd RF switch
224 be respectively identical device with the 4th coupler, the 4th electric bridge 199, the second RF switch 200, is repeated no more here.3rd
RF switch 224 is connected with the 3rd radio-frequency joint 182 of power amplifier module B 30 the 3rd link portions 17.
The 5th primary low-noise amplifier 219, the 5th final stage low noise that 5th up-link 218 includes being sequentially connected are put
Big device 220, the 5th radio frequency SAW filter 221 and the 5th uplink port match circuit 222.Wherein, the 5th primary low noise is put
Big device 219, the 5th final stage low-noise amplifier 220, the 5th radio frequency SAW filter 221, the 5th uplink port match circuit 222
Respectively with the 4th primary low-noise amplifier 203, the 4th final stage low-noise amplifier 203, the 4th radio frequency SAW filter 204,
4th uplink port match circuit 205 is identical device, is repeated no more here.
To sum up, power amplifier module A 10 and power amplifier module B 30 all the first link portions 11, the second link portions 15, the 3rd chain
Road part 17, and in power amplifier module A 10 the 4th link portions 19 and power amplifier module B 30 the 5th link portions 21, only
The device that 4th wave filter 194 and the 5th wave filter 213 use is differed, thus the species of adoptable device is greatly reduced,
Warehousing pressure and cost can be greatly lowered.
In the present embodiment, power amplifier module A 10 and monitoring module A are integrated on A pcb boards.Power amplifier module B 30 and monitoring
Module B is integrated on B pcb boards.
A pcb boards and B pcb boards are all made up of four laminates：Sheet material uses the (U.S.'s Ross outstanding person's import sheet materials of Rogers 4350
One kind) with a kind of FR-4 (being code name of flame resistant material grade) sheet material mixing laminated combinations, the one or two laminate timber-used Rogers
4350, other layers are FR-4 sheet materials；Total thickness of slab 1.6mm.
First layer (top layer) microwave panel, copper thickness 0.035mm, the master for being mainly used in radio frequency wiring and control circuit
Connect up；The second layer is stratum, copper thickness 0.035mm；Third layer is bus plane, is mainly used in the wiring of power supply；4th
Layer is earth plate, is mainly used in the wiring of portion radio frequency circuit and part control detection circuit.
In order to prevent link self-excitation, prevent digital circuit mutual radio frequency link interference and each link radio frequency signals
Interference, whole pcb board is divided into the three parts such as big signal, small-signal and control in terms of layout, and totally 29 cavitys are isolated to increase
Degree, 29 cavitys all can individual screen wirings.
It is the downlink port match circuit of 10 each downlinks of power amplifier module A in descending first cavity of A pcb boards,
It is the voltage-controlled attenuator and prime power amplifier and monitoring module A of 10 each downlinks of power amplifier module A in second cavity
DAC-circuit 54 ALC Power Controls part, (promoted for the two level of each downlinks of power amplifier module A10 in the 3rd cavity
Level) power amplifier, the 4th interior final power amplifier for 10 each downlinks of power amplifier module A of cavity, the 5th cavity
The interior circulator or isolator for including 10 each downlinks of power amplifier module A, the 6th interior power for monitoring module A of cavity are examined
Survey unit 51.10 each up-links of power amplifier module A are entirely included in a cavity.The layout of each cavity of B pcb boards with
The layout of each cavity of A pcb boards is consistent, repeats no more here.
Power amplifier module A 10 the first link portions 11, the 4th link portions 19 are laid out up and down the two of A pcb boards respectively
Side, power amplifier module B 30 the first link portions 11, the 5th link portions 21 are laid out in the both sides up and down of B pcb boards, work(respectively
Amplification module A10, power amplifier module B30 the two links between as far as possible be located remotely from each other, improve the isolation between two links as far as possible,
To prevent the rank of descending output 2 of power amplifier module A10 the 4th link portions 19, power amplifier module B30 the 5th link portions 21 mutual
Signal is adjusted to fall in the band of the first up-link 122 of corresponding power amplifier module A10 the first link portions 11, power amplifier module
In the band of first up-link 122 of B30 the first link portions 11, so as to power amplifier module A10 the first link portions 11,
The upward signal of power amplifier module B the first link portions 11 forms interference.
Above example only expresses the preferred embodiment of the present invention, and its description is more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, it is such as special to the difference in each embodiment
Sign is combined, and these belong to protection scope of the present invention.
Claims (10)
- A kind of 1. integrated power amplifier module structure, it is characterised in that：Including：For the multiplexer to connect with antenna, the power amplifier module A being connected with multiplexer, the digiboard A being connected with power amplifier module A；The power amplifier module B being connected with the multiplexer, the digiboard B being connected with power amplifier module B；The power amplifier module A, power amplifier module B include the first link portions, the second link portions, the 3rd link portions；It is described Power amplifier module A also includes the 4th link portions, and the power amplifier module B also includes the 5th link portions.
- 2. integrated power amplifier module structure according to claim 1, it is characterised in that：First link portions include the One downlink and the first up-link；First downlink include be sequentially connected the first downlink port match circuit, First voltage-controlled attenuator, the first prime power amplifier, the first two-stage power amplifier, the first isolator, the first electric bridge, first Final power amplifier and first annular device；First up-link includes the first primary low noise amplification being sequentially connected Device, the first final stage low-noise amplifier, the first radio frequency SAW filter and the first uplink port match circuit.
- 3. integrated power amplifier module structure according to claim 2, it is characterised in that：First downlink also includes The first coupler, the first radio-frequency joint being connected with first final power amplifier；First coupler is used for institute The radiofrequency signal for stating the output of the first final power amplifier is coupled into first via radiofrequency signal and the second tunnel radiofrequency signal and by the Radiofrequency signal, the second tunnel radiofrequency signal are respectively outputted to first radio-frequency joint, the power detecting unit of monitoring module all the way, The DAC-circuit connection of first voltage-controlled attenuator and monitoring module.
- 4. integrated power amplifier module structure according to claim 1, it is characterised in that：Second link portions include the Two downlinks and the second up-link；First descending chain of the structure of second downlink and first link portions The structure on road is identical, the structure phase of the structure of second up-link and the first up-link of first link portions Together.
- 5. integrated power amplifier module structure according to claim 1, it is characterised in that：3rd link portions include the Three downlinks, the 3rd up-link and the power switch electricity being connected between the 3rd downlink and the 3rd up-link Road, the 3rd downlink include the 3rd downlink port match circuit, the 3rd voltage-controlled attenuator, the 3rd primary being sequentially connected Power amplifier, the 3rd two-stage power amplifier, the 3rd isolator, the 3rd primary electric bridge, the 3rd final power amplifier and Three circulators；The 3rd primary low-noise amplifier, the 3rd final stage low noise that 3rd up-link includes being sequentially connected are put Big device, the 3rd radio frequency SAW filter and the 3rd uplink port match circuit；3rd circulator passes through the first RF switch It is connected with the 3rd primary low-noise amplifier.
- 6. integrated power amplifier module structure according to claim 5, it is characterised in that：3rd downlink also includes The 3rd coupler being connected with the 3rd final power amplifier, the 3rd final stage electric bridge and being connected with the 3rd coupler Three radio-frequency joints, the 3rd coupler are used to the signal of the 3rd final power amplifier output being coupled into the 3rd tunnel road Radiofrequency signal, the 3rd final stage electric bridge are used to the 3rd tunnel radiofrequency signal being divided into first via output radiofrequency signal and second Road exports radiofrequency signal and the first via is exported into radiofrequency signal, the second tunnel output radiofrequency signal is respectively outputted to the 3rd radio frequency The power detecting unit of joint, monitoring module, the DAC-circuit connection of the 3rd voltage-controlled attenuator and monitoring module.
- 7. integrated power amplifier module structure according to claim 1, it is characterised in that：4th link portions include the Four downlinks and the 4th up-link, the 4th downlink include be sequentially connected the 4th downlink port match circuit, 4th voltage-controlled attenuator, the 4th wave filter, the 4th prime power amplifier, the 4th final power amplifier and fourth annular device, 4th up-link include be sequentially connected the 4th primary low-noise amplifier, the 4th final stage low-noise amplifier, the 4th Radio frequency SAW filter and the 4th uplink port match circuit.
- 8. integrated power amplifier module structure according to claim 7, it is characterised in that：4th downlink also includes The 4th coupler that is connected with the 4th final power amplifier, the 4th electric bridge being connected with the 4th coupler and second are penetrated Frequency switchs, and the 4th coupler is used to the signal of the 4th final power amplifier output being coupled into the 4th road radio frequency letter Number, the 4th electric bridge is used to the 4th tunnel radiofrequency signal being divided into the 3rd tunnel output radiofrequency signal and the 4th tunnel exports radio frequency Signal and the 3rd radio frequency that the 3rd tunnel output radiofrequency signal is output to the 3rd link portions through second RF switch Joint, the 4th tunnel is exported to the power detecting unit that radiofrequency signal is output to monitoring module, the 4th voltage-controlled attenuator and prison Control the DAC-circuit connection of module.
- 9. integrated power amplifier module structure according to claim 1, it is characterised in that：Also include monitoring module A and monitoring Module B, the monitoring module A and monitoring module B all include main control unit and be connected with main control unit power detecting unit, Current detecting unit, temperature detecting unit, DAC-circuit.
- 10. integrated power amplifier module structure according to claim 9, it is characterised in that：The power amplifier module A and monitoring mould Block A is integrated on A pcb boards；The power amplifier module B and monitoring module B are integrated on B pcb boards.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711305359.XA CN107863986B (en) | 2017-12-11 | 2017-12-11 | Integrated power amplifier module structure |
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|---|---|---|---|
| CN201711305359.XA CN107863986B (en) | 2017-12-11 | 2017-12-11 | Integrated power amplifier module structure |
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| CN110445543A (en) * | 2019-08-22 | 2019-11-12 | 和源通信（上海）股份有限公司 | A kind of Optical fiber relay remote device |
| CN112332788A (en) * | 2020-10-22 | 2021-02-05 | 浙江三维利普维网络有限公司 | Radio frequency power amplifier module |
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| CN201528431U (en) * | 2009-09-23 | 2010-07-14 | 京信通信系统（中国）有限公司 | CDMA digital optical fiber repeater system based on far-end integral module |
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|---|---|
| CN107863986B (en) | 2023-10-27 |
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