CN203562536U - Lead structure used for PCB terminal - Google Patents

Lead structure used for PCB terminal Download PDF

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Publication number
CN203562536U
CN203562536U CN201320713638.0U CN201320713638U CN203562536U CN 203562536 U CN203562536 U CN 203562536U CN 201320713638 U CN201320713638 U CN 201320713638U CN 203562536 U CN203562536 U CN 203562536U
Authority
CN
China
Prior art keywords
layer
binding post
bus
encapsulate layer
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320713638.0U
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Chinese (zh)
Inventor
罗会雄
干倓
候文宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU INDUSTRIAL PARK EXCEEDCONN TECHNOLOGY CO., LTD.
Original Assignee
SUZHOU HARVEST TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU HARVEST TECHNOLOGY Co Ltd filed Critical SUZHOU HARVEST TECHNOLOGY Co Ltd
Priority to CN201320713638.0U priority Critical patent/CN203562536U/en
Application granted granted Critical
Publication of CN203562536U publication Critical patent/CN203562536U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a lead structure used for a PCB terminal. The structure comprises a connection bus and at least two connection leads which are connected with the PCB terminal. Each connection lead is connected with a branching in the connection bus via a metal joint. The structure is characterized in that a connection portion of the metal joint and the connection bus is provided with inner and outer layers of insulation rubber packaging layers; the inner layer of insulation rubber packaging layer wraps the outside of the connection leads and the branching; on the inner layer of insulation rubber packaging layer, a through hole is arranged between the adjacent metal joints; the outer layer of the insulation rubber packaging layer wraps the inner layer of insulation rubber packaging layer and is filled in the through hole. According to the structure of the utility model, through arranging the inner and outer layers of insulation rubber packaging layers at the metal joints and arranging the through hole on the inner layer of insulation rubber packaging layer between the adjacent metal joints, electric clearance and a creepage distance are effectively increased; electric leakage is prevented and usage security is increased.

Description

A kind of PCB binding post conductor structure
Technical field
The utility model relates to a kind of pcb board wire, relates in particular to a kind of PCB binding post conductor structure.
Background technology
PCB is the abbreviation of printed circuit board (PCB) (Printed Circuit Board), the PCB electronic equipment that almost we can see all be unable to do without it, little of electronic watch, calculator, general-purpose computer, large to communication apparatus, military armament systems, as long as there are the electronic devices and components such as integrated circuit, between them, electrical interconnection all will be used pcb board, and printed circuit on pcb board is through PCB binding post and the extraneous connection that is electrically connected that is connected wire.
In prior art, on some pcb boards, need to connect a plurality of PCB binding posts, each PCB binding post correspondence is connected with one and connects wire, every connect wire through branch joint be connected bus connection, in said structure, in branch joint, connect wire and the corresponding connection of separated time connecting in bus, concrete connected mode is: 1. connect wire and connect with the separated time in being connected bus through metal joint; 2. connecting wire and the injection mo(u)lding of separated time joint.But there is following some deficiency in this structure:
1. between exposed metal terminal and metal terminal, only has one deck insulating cement, in order to save wiring space and to reduce production costs, distance between adjacent metal terminal can not arrange excessive, electric clearance and creepage distance possibly cannot be guaranteed, easily electric leakage, may cause the components and parts in electrical equipment to damage, security performance is not high;
2. one deck insulating cement is set, easy to wear, cause the harmful effects such as infiltration, electric leakage.
Summary of the invention
The utility model object is to provide a kind of PCB binding post conductor structure, by using this structure, has increased electric clearance and creepage distance between circuit, has improved the fail safe of using.
For achieving the above object, the technical solution adopted in the utility model is: a kind of PCB binding post conductor structure, comprise and connect bus and at least two connection wires that are connected with PCB binding post, every described connection wire is connected with the separated time in being connected bus through metal joint, in described metal joint is provided with the junction that is connected bus, outer two-layer insulating bag glue-line, described primary insulation encapsulate layer is wrapped in outside described connection wire and described separated time, on described primary insulation encapsulate layer, between adjacent described metal joint, be provided with through hole, described outer layer insulation encapsulate layer is wrapped in outside described primary insulation encapsulate layer, and fill in described through hole.
In technique scheme, described outer layer insulation encapsulate layer is wrapped in outside described primary insulation encapsulate layer and described connection bus.
In technique scheme, described outer layer insulation encapsulate layer is provided with a plurality of anti-skidding projections, near with described bus, be connected wire connecting place and be respectively equipped with a plurality of grooves.
In technique scheme, described PCB binding post is provided with a plurality of annular lines, and described annular lines is provided with waterproof encapsulate layer outward, and parcel is to described connection wire.
Because technique scheme is used, the utility model compared with prior art has following advantages:
1. in the utility model, every connection wire is connected with the separated time in being connected bus through metal joint, and in metal joint and the junction that is connected bus, be provided with inside and outside two-layer insulating bag glue-line, on primary insulation encapsulate layer, between adjacent each metal joint, be provided with through hole, between adjacent metal joint, there are like this insulating bag glue-line and air two media, electric clearance and creepage distance have been increased, outer layer insulation encapsulate layer is filled in through hole simultaneously, electric clearance and creepage distance have further been increased, prevent electric leakage, improved the fail safe of using;
2. inside and outside two-layer insulating bag glue-line is set, has improved fastness and the water resistance of wire;
3. on PCB binding post, be provided with a plurality of annular lines, and annular lines is provided with waterproof encapsulate layer outward, and parcel is to described connection wire, annular lines coordinates with waterproof encapsulate layer, effectively increased and connected the fastness being connected between wire and PCB binding post, and promoted the water resistance of binding post;
4. on outer insulating bag glue-line, be provided with a plurality of anti-skidding projections, near with described bus, be connected wire connecting place and be respectively equipped with a plurality of grooves, anti-skidding projection has promoted the non-skid property that wire is used, the setting of groove, can effectively improve the deformation extent of outer insulation, preventing that outer layer insulation encapsulate layer is stressed causes breaking and reduces water resistance, has increased useful life;
5. the utility model is simple in structure, is easy to realize.
Accompanying drawing explanation
Fig. 1 is the structural representation I in the utility model embodiment mono-;
Fig. 2 is the structural representation II (outer layer insulation encapsulate layer does not draw) in the utility model embodiment mono-;
Fig. 3 is the perspective view of Fig. 2;
Fig. 4 is the structural representation of PCB binding post in the utility model embodiment mono-.
Wherein: 1, connect bus; 2, connect wire; 3, metal joint; 4, separated time; 5, PCB binding post; 6, primary insulation encapsulate layer; 7, through hole; 8, outer layer insulation encapsulate layer; 9, anti-skidding projection; 10, groove; 11, annular lines; 12, waterproof encapsulate layer.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment mono-: shown in Fig. 1~4, a kind of PCB binding post conductor structure, comprise and connect bus 1 and two connection wires 2 that are connected with PCB binding post 5, every described connection wire 2 is connected with the separated time 4 in being connected bus 1 through metal joint 3, in described metal joint 3 is provided with the junction that is connected bus 1, outer two-layer insulating bag glue-line, described primary insulation encapsulate layer 6 is wrapped in outside described connection wire 2 and described separated time 4, on described primary insulation encapsulate layer 6, between adjacent described metal joint 3, be provided with through hole 7, described outer layer insulation encapsulate layer 8 is wrapped in outside described primary insulation encapsulate layer 6, and fill in described through hole 7, and outer layer insulation encapsulate layer 8 is wrapped in outside described primary insulation encapsulate layer 6 and described connection bus 1, effectively raise the water proofing property of wire.
As shown in Figure 1, described outer layer insulation encapsulate layer 8 be provided with a plurality of anti-skidding protruding 9, near with the described bus 1 that is connected, connect wire 2 connecting places and be respectively equipped with a plurality of grooves 10, when operating personnel use, anti-skidding protruding 9 and groove 10 can be effectively anti-skidding, and connect wire 2 owing to often can being subject to distortion power, by increasing groove 10, can effectively improve the deformation extent of outer layer insulation encapsulate layer 8, even if outer layer insulation encapsulate layer 8 is subject to distortion power, outer layer insulation encapsulate layer 8 is not easy to crack yet, effectively increased the useful life of outer layer insulation encapsulate layer 8, improved the water resistance of wire.
In the present embodiment, described PCB binding post 5 is provided with a plurality of annular lines 11, the outer waterproof encapsulate layer 12 that is provided with of described annular lines 11, and parcel is to described connection wire 2, annular lines 11 coordinates with waterproof encapsulate layer 12, effectively increased and connected the fastness being connected between wire 2 and PCB binding post 5, and promoted the water resistance of PCB binding post 5, as shown in Figure 3.

Claims (4)

1. a PCB binding post conductor structure, comprise and connect bus and at least two connection wires that are connected with PCB binding post, every described connection wire is connected with the separated time in being connected bus through metal joint, it is characterized in that: in described metal joint is provided with the junction that is connected bus, outer two-layer insulating bag glue-line, described primary insulation encapsulate layer is wrapped in outside described connection wire and described separated time, on described primary insulation encapsulate layer, between adjacent described metal joint, be provided with through hole, described outer layer insulation encapsulate layer is wrapped in outside described primary insulation encapsulate layer, and fill in described through hole.
2. PCB binding post conductor structure according to claim 1, is characterized in that: described outer layer insulation encapsulate layer is wrapped in outside described primary insulation encapsulate layer and described connection bus.
3. PCB binding post conductor structure according to claim 1, is characterized in that: described outer layer insulation encapsulate layer is provided with a plurality of anti-skidding projections, near with described bus, be connected wire connecting place and be respectively equipped with a plurality of grooves.
4. PCB binding post conductor structure according to claim 1, is characterized in that: described PCB binding post is provided with a plurality of annular lines, and described annular lines is provided with waterproof encapsulate layer outward, and parcel is to described connection wire.
CN201320713638.0U 2013-11-13 2013-11-13 Lead structure used for PCB terminal Expired - Fee Related CN203562536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320713638.0U CN203562536U (en) 2013-11-13 2013-11-13 Lead structure used for PCB terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320713638.0U CN203562536U (en) 2013-11-13 2013-11-13 Lead structure used for PCB terminal

Publications (1)

Publication Number Publication Date
CN203562536U true CN203562536U (en) 2014-04-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320713638.0U Expired - Fee Related CN203562536U (en) 2013-11-13 2013-11-13 Lead structure used for PCB terminal

Country Status (1)

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CN (1) CN203562536U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106450852A (en) * 2016-12-13 2017-02-22 上海束联电子有限公司 Connecting structure and method of precision modularized type wire bundle
CN108123407A (en) * 2018-01-24 2018-06-05 深圳市斯派克光电科技有限公司 A kind of manufacturing method of multi-path waterproof junction box and products thereof
CN108568030A (en) * 2017-03-14 2018-09-25 天津市平晨堂生物科技有限公司 A kind of environment-friendly type electrical urethral catheter and its processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106450852A (en) * 2016-12-13 2017-02-22 上海束联电子有限公司 Connecting structure and method of precision modularized type wire bundle
CN108568030A (en) * 2017-03-14 2018-09-25 天津市平晨堂生物科技有限公司 A kind of environment-friendly type electrical urethral catheter and its processing method
CN108123407A (en) * 2018-01-24 2018-06-05 深圳市斯派克光电科技有限公司 A kind of manufacturing method of multi-path waterproof junction box and products thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 215123 workshop No. 26, venture industrial square, Suzhou Industrial Park, Jiangsu

Patentee after: SUZHOU INDUSTRIAL PARK EXCEEDCONN TECHNOLOGY CO., LTD.

Address before: 215123 workshop No. 26, venture industrial square, Suzhou Industrial Park, Jiangsu

Patentee before: Suzhou Harvest Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140423

Termination date: 20181113