CN203203124U - Heating floor - Google Patents
Heating floor Download PDFInfo
- Publication number
- CN203203124U CN203203124U CN 201320194374 CN201320194374U CN203203124U CN 203203124 U CN203203124 U CN 203203124U CN 201320194374 CN201320194374 CN 201320194374 CN 201320194374 U CN201320194374 U CN 201320194374U CN 203203124 U CN203203124 U CN 203203124U
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- heating
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- wire
- floor according
- heating floor
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Abstract
The utility model discloses a heating floor. According to the technical scheme, the heating floor is characterized by comprising a plurality of floor blocks which are assembled together. Each floor block mainly comprises a base plate, a surface layer and an electricity conduction heating layer arranged between the base plate and the surface layer. Pieces of copper foil are arranged among the electricity conduction heating layers and the base plates. The two sides of each base plate are respectively provided with a through hole. The two sides, opposite to each base plate, of each electricity conduction heating layer are respectively provided with a contactor. The two sides, opposite to each base plate, of each piece of copper foil are respectively provided with a contactor. The contactors are respectively connected with leads to penetrate through corresponding through holes in the base plates. The leads on one side are connected with a sealing plug, and the leads on the other side are connected with a sealing socket. The heating floor is higher in safety, low in cost and convenient to install, and is mainly applied to indoor heating.
Description
Technical field
The utility model relates to the indoor floor technical field, is specifically related to a kind of heating floor.
Background technology
In the process of deployment of heating floor, every laying plot plate all needs to be connected with corresponding wire, realizes being connected in parallel between each floorboard of indoor floor at present, and the use amount of electric wire is very big in whole process of deployment like this, causes cost higher.In addition, the process of deployment of general indoor floor all needs to lay floor panels up to a hundred, causes circuit very complicated, and it is very inconvenient to install, and is not only time-consuming but also require great effort, and fault rate is higher in the use procedure.
Summary of the invention
The technical problem that the utility model solves has provided a kind of security heating floor higher, with low cost and easy for installation.
The technical solution of the utility model is: a kind of heating floor, comprise the floorboard that polylith is bolted together, every floor panels mainly comprises substrate, surface layer and be arranged at substrate and surface layer between conductive heating layer, it is characterized in that: be provided with Copper Foil between described conductive heating layer and the substrate, the both sides of described substrate have perforation, the conductive heating layer relative with substrate and the both sides of Copper Foil are respectively equipped with contact, connect respectively wire by contact and pass perforation corresponding on the substrate, wherein the wire of a side is connected with sealing plug, and the wire of opposite side is connected with seal socket.
Conductive heating layer described in the utility model is the brilliant plate of carbon, the brilliant plate of this carbon comprises the brilliant epoxy resin board with being coated on the brilliant both sides of heating carbon of heating carbon, described substrate is the High-Temperature Strengthening composite plate, and described surface layer is wood floors, is provided with epoxy resin board between described substrate and the Copper Foil.
The contact of conductive heating layer described in the utility model both sides is respectively two, and described sealing plug and seal socket are respectively three sealing plugs and three hole seal sockets.
Be connected with seal socket by sealing plug between adjacent two floor panels described in the utility model, be connected in series between the described floorboard.
The wire that is connected with conductive heating layer one side contact described in the utility model is connected with live wire with the zero line of power supply respectively, and the wire that is connected with the Copper Foil contact is connected with the ground wire of power supply.
Floorboard of the present utility model connects by the form of connecting, and the interface of line and line adopts the sealing ring sealing of specialty, has played waterproof and dampproof effect, has avoided the leaky of intaking or making moist and cause because of the floor.In addition; easy to connect between each floorboard; installation process is time saving and energy saving and with low cost; heating floor is installing the earth leakage protective while additional; installed the Copper Foil that one deck is connected with ground wire additional at conductive heating layer again; played like this effect of duplicate protection, also can not cause any harm to human body even really accomplished centesimal Accidental occurrence leaky.
Description of drawings
Fig. 1 is structural representation of the present utility model, and Fig. 2 is that Fig. 1 is along the cutaway view of A-A direction.
Drawing explanation: 1, substrate, 2, surface layer, 3, heating carbon is brilliant, 4, Copper Foil, 5, contact, 6, epoxy resin board.
The specific embodiment
Describe by reference to the accompanying drawings embodiment in detail.A kind of heating floor, comprise the floorboard that polylith is bolted together, every floor panels mainly comprises substrate 1, surface layer 2 and be arranged at substrate and surface layer between conductive heating layer, wherein substrate 1 is the High-Temperature Strengthening composite plate, surface layer 2 is wood floors, conductive heating layer is the brilliant plate of carbon, the brilliant plate of this carbon comprises heating carbon brilliant 3 and is coated on the epoxy resin board 6 of the brilliant both sides of heating carbon, be provided with Copper Foil 4 between described conductive heating layer and the substrate 1, the both sides of substrate 1 have perforation, the conductive heating layer relative with substrate 1 and the both sides of Copper Foil 4 are respectively equipped with contact 5, connect respectively wire by contact 5 and pass perforation corresponding on the substrate 1, wherein the wire of a side is connected with sealing plug, and the wire of opposite side is connected with seal socket, is provided with epoxy resin board 6 between described substrate 1 and the Copper Foil 4.
The contact of conductive heating layer described in the utility model both sides is respectively two; described sealing plug and seal socket are respectively three sealing plugs and three hole seal sockets; be connected with seal socket by sealing plug between adjacent two floor panels; and then realize being connected in series between all floorboard; the wire that will be connected with conductive heating layer one side contact 5 at last is connected with the live wire line with the zero line of power supply respectively; the wire that is connected with Copper Foil 4 contacts 5 is connected with the ground wire of power supply; so namely finish the connection of whole heating floor; connection between each floorboard is very convenient; installation process is time saving and energy saving and with low cost; heating floor is installing the earth leakage protective while additional; installed the Copper Foil that one deck is connected with ground wire additional at conductive heating layer again; played the effect of duplicate protection, also can not cause any harm to human body even really accomplished centesimal Accidental occurrence leaky.
Claims (10)
1. heating floor, comprise the floorboard that polylith is bolted together, every floor panels mainly comprise substrate, surface layer and be arranged at substrate and surface layer between conductive heating layer, it is characterized in that: be provided with Copper Foil between described conductive heating layer and the substrate, the both sides of described substrate have perforation, the conductive heating layer relative with substrate and the both sides of Copper Foil are respectively equipped with contact, connect respectively wire by contact and pass perforation corresponding on the substrate, wherein the wire of a side is connected with sealing plug, and the wire of opposite side is connected with seal socket.
2. heating floor according to claim 1 is characterized in that: described conductive heating layer is the brilliant plate of carbon, and the brilliant plate of this carbon comprises that heating carbon is brilliant and is coated on the epoxy resin board of the brilliant both sides of heating carbon.
3. heating floor according to claim 1, it is characterized in that: described substrate is the High-Temperature Strengthening composite plate.
4. heating floor according to claim 1, it is characterized in that: described surface layer is wood floors.
5. heating floor according to claim 1 is characterized in that: be provided with epoxy resin board between described substrate and the Copper Foil.
6. heating floor according to claim 1, it is characterized in that: the contact of described conductive heating layer both sides is respectively two.
7. heating floor according to claim 1, it is characterized in that: described sealing plug and seal socket are respectively three sealing plugs and three hole seal sockets.
8. heating floor according to claim 1 is characterized in that: be connected with seal socket by sealing plug between described adjacent two floor panels.
9. heating floor according to claim 1 is characterized in that: be connected in series between the described floorboard.
10. heating floor according to claim 1, it is characterized in that: the described wire that is connected with conductive heating layer one side contact is connected with live wire with the zero line of power supply respectively, and the wire that is connected with the Copper Foil contact is connected with the ground wire of power supply.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320194374 CN203203124U (en) | 2013-04-18 | 2013-04-18 | Heating floor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320194374 CN203203124U (en) | 2013-04-18 | 2013-04-18 | Heating floor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203203124U true CN203203124U (en) | 2013-09-18 |
Family
ID=49147227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201320194374 Expired - Fee Related CN203203124U (en) | 2013-04-18 | 2013-04-18 | Heating floor |
Country Status (1)
Country | Link |
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CN (1) | CN203203124U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103196173A (en) * | 2013-04-18 | 2013-07-10 | 新乡市沃姆尔采暖设备有限公司 | Heating floor |
GB2557870A (en) * | 2016-02-16 | 2018-07-04 | Fazi Jafari Abul | Self heat tile |
-
2013
- 2013-04-18 CN CN 201320194374 patent/CN203203124U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103196173A (en) * | 2013-04-18 | 2013-07-10 | 新乡市沃姆尔采暖设备有限公司 | Heating floor |
GB2557870A (en) * | 2016-02-16 | 2018-07-04 | Fazi Jafari Abul | Self heat tile |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130918 Termination date: 20140418 |