CN103196173A - Heating floor - Google Patents
Heating floor Download PDFInfo
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- CN103196173A CN103196173A CN2013101336744A CN201310133674A CN103196173A CN 103196173 A CN103196173 A CN 103196173A CN 2013101336744 A CN2013101336744 A CN 2013101336744A CN 201310133674 A CN201310133674 A CN 201310133674A CN 103196173 A CN103196173 A CN 103196173A
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- heating
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- heating floor
- copper foil
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Abstract
The invention discloses a heating floor. According to the technical scheme, the heating floor comprises a plurality of spliced floor plates. Each floor plate mainly comprises a base plate, a surface layer and a conductive heating layer arranged between the base plate and the surface layer. Copper foil is arranged between the conductive heating layer and the base plate. Two sides of the base plate are provided with through holes. Two sides of the conductive heating layer and the copper foil, opposite to the base plate, are respectively provided with contacts. Leads are respectively connected by contacts and penetrate through the corresponding through holes on the base plate, leads on one side is connected with a sealing plug, and leads on the other side is connected with a sealing socket. The heating floor is higher in safety, low in cost, convenient to mount and mainly applied to indoor warming.
Description
Technical field
The present invention relates to the indoor floor technical field, be specifically related to a kind of heating floor.
Background technology
In the process of deployment of heating floor, every laying plot plate all needs to be connected with corresponding lead, realizes being connected in parallel between each floorboard of indoor floor at present, and the use amount of electric wire is very big in whole process of deployment like this, causes cost higher.In addition, the process of deployment of general indoor floor all needs to lay floor panels up to a hundred, causes circuit very complicated, and it is very inconvenient to install, and is not only time-consuming but also require great effort, and fault rate is higher in the use.
Summary of the invention
The technical problem that the present invention solves has provided a kind of security heating floor higher, with low cost and easy for installation.
Technical scheme of the present invention is: a kind of heating floor, comprise the floorboard that polylith is bolted together, every floor panels mainly comprise substrate, surface layer and be arranged at substrate and surface layer between conductive heating layer, it is characterized in that: be provided with Copper Foil between described conductive heating layer and the substrate, the both sides of described substrate have perforation, the conductive heating layer relative with substrate and the both sides of Copper Foil are respectively equipped with contact, connect lead respectively by contact and pass perforation corresponding on the substrate, wherein the lead of a side is connected with sealing plug, and the lead of opposite side is connected with seal socket.
Conductive heating layer of the present invention is the brilliant plate of carbon, the brilliant plate of this carbon comprises heating carbon crystalline substance and is coated on the epoxy resin board of the brilliant both sides of heating carbon, described substrate is the High-Temperature Strengthening composite plate, and described surface layer is wood floors, is provided with epoxy resin board between described substrate and the Copper Foil.
The contact of conductive heating layer of the present invention both sides is respectively two, and described sealing plug and seal socket are respectively three sealing plugs and three hole seal sockets.
Be connected with seal socket by sealing plug between adjacent two floor panels of the present invention, be connected in series between the described floorboard.
The lead that is connected with conductive heating layer one side contact of the present invention is connected with live wire with the zero line of power supply respectively, and the lead that is connected with the Copper Foil contact is connected with the ground wire of power supply.
Floorboard of the present invention connects by the form of connecting, and the interface of line and line adopts the sealing ring sealing of specialty, has played waterproof and dampproof effect, has avoided the leaky of intaking or making moist and cause because of the floor.In addition; easy to connect between each floorboard; installation process is time saving and energy saving and with low cost; heating floor is installing the earth leakage protective while additional; installed the Copper Foil that one deck is connected with ground wire additional at conductive heating layer again; played the effect of duplicate protection like this, also can not cause any harm to human body even really accomplished the centesimal unexpected leaky that takes place.
Description of drawings
Fig. 1 is structural representation of the present invention, and Fig. 2 is that Fig. 1 is along the cutaway view of A-A direction.
Drawing explanation: 1, substrate, 2, surface layer, 3, heating carbon crystalline substance, 4, Copper Foil, 5, contact, 6, epoxy resin board.
The specific embodiment
Describe embodiment by reference to the accompanying drawings in detail.A kind of heating floor, comprise the floorboard that polylith is bolted together, every floor panels mainly comprises substrate 1, surface layer 2 and be arranged at substrate and surface layer between conductive heating layer, wherein substrate 1 is the High-Temperature Strengthening composite plate, surface layer 2 is wood floors, conductive heating layer is the brilliant plate of carbon, the brilliant plate of this carbon comprises heating carbon brilliant 3 and is coated on the epoxy resin board 6 of the brilliant both sides of heating carbon, be provided with Copper Foil 4 between described conductive heating layer and the substrate 1, the both sides of substrate 1 have perforation, the conductive heating layer relative with substrate 1 and the both sides of Copper Foil 4 are respectively equipped with contact 5, connect lead respectively by contact 5 and pass perforation corresponding on the substrate 1, wherein the lead of a side is connected with sealing plug, and the lead of opposite side is connected with seal socket, is provided with epoxy resin board 6 between described substrate 1 and the Copper Foil 4.
The contact of conductive heating layer of the present invention both sides is respectively two; described sealing plug and seal socket are respectively three sealing plugs and three hole seal sockets; be connected with seal socket by sealing plug between adjacent two floor panels; and then realize being connected in series between all floorboard; the lead that will be connected with conductive heating layer one side contact 5 is connected with the live wire line with the zero line of power supply respectively at last; the lead that is connected with Copper Foil 4 contacts 5 is connected with the ground wire of power supply; so namely finish the connection of whole heating floor; connection between each floorboard is very convenient; installation process is time saving and energy saving and with low cost; heating floor is installing the earth leakage protective while additional; installed the Copper Foil that one deck is connected with ground wire additional at conductive heating layer again; played the effect of duplicate protection, also can not cause any harm to human body even really accomplished the centesimal unexpected leaky that takes place.
Claims (10)
1. heating floor, comprise the floorboard that polylith is bolted together, every floor panels mainly comprise substrate, surface layer and be arranged at substrate and surface layer between conductive heating layer, it is characterized in that: be provided with Copper Foil between described conductive heating layer and the substrate, the both sides of described substrate have perforation, the conductive heating layer relative with substrate and the both sides of Copper Foil are respectively equipped with contact, connect lead respectively by contact and pass perforation corresponding on the substrate, wherein the lead of a side is connected with sealing plug, and the lead of opposite side is connected with seal socket.
2. heating floor according to claim 1 is characterized in that: described conductive heating layer is the brilliant plate of carbon, and the brilliant plate of this carbon comprises that heating carbon is brilliant and is coated on the epoxy resin board of the brilliant both sides of heating carbon.
3. heating floor according to claim 1, it is characterized in that: described substrate is the High-Temperature Strengthening composite plate.
4. heating floor according to claim 1, it is characterized in that: described surface layer is wood floors.
5. heating floor according to claim 1 is characterized in that: be provided with epoxy resin board between described substrate and the Copper Foil.
6. heating floor according to claim 1, it is characterized in that: the contact of described conductive heating layer both sides is respectively two.
7. heating floor according to claim 1, it is characterized in that: described sealing plug and seal socket are respectively three sealing plugs and three hole seal sockets.
8. heating floor according to claim 1 is characterized in that: be connected with seal socket by sealing plug between described adjacent two floor panels.
9. heating floor according to claim 1 is characterized in that: be connected in series between the described floorboard.
10. heating floor according to claim 1, it is characterized in that: the described lead that is connected with conductive heating layer one side contact is connected with live wire with the zero line of power supply respectively, and the lead that is connected with the Copper Foil contact is connected with the ground wire of power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101336744A CN103196173A (en) | 2013-04-18 | 2013-04-18 | Heating floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101336744A CN103196173A (en) | 2013-04-18 | 2013-04-18 | Heating floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103196173A true CN103196173A (en) | 2013-07-10 |
Family
ID=48718884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101336744A Pending CN103196173A (en) | 2013-04-18 | 2013-04-18 | Heating floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103196173A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103470002A (en) * | 2013-09-16 | 2013-12-25 | 江西斯洛特石业有限公司 | Far infrared floor heating stone tile |
| CN103687103A (en) * | 2013-12-20 | 2014-03-26 | 昆山建通电子科技有限公司 | Electric leakage prevention heating floor and manufacturing method thereof |
| CN105971185A (en) * | 2016-07-06 | 2016-09-28 | 昆山桑德勒电子实业有限公司 | Heating composite board structure |
| CN106401142A (en) * | 2016-11-28 | 2017-02-15 | 王长坤 | Environment-friendly type dampproof self-heating glassfiber reinforced plastic floorboard |
| CN109162425A (en) * | 2018-10-30 | 2019-01-08 | 昆山博尔法新材料科技有限公司 | For indoor aluminium alloy ground heating floor structure |
| CN110158910A (en) * | 2018-02-08 | 2019-08-23 | 湖南盛世名嘉热能科技有限公司 | A kind of safety-type graphene carbon crystal heat floor tile |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562917A (en) * | 2009-05-31 | 2009-10-21 | 徐州安诺休闲设备有限公司 | Nano carbon crystal frequency spectrum heating plate |
| CN202026483U (en) * | 2011-04-12 | 2011-11-02 | 杭州暖洋洋科技有限公司 | Anti-creeping carbon-crystal heating fin for floor heating |
| CN203203124U (en) * | 2013-04-18 | 2013-09-18 | 新乡市沃姆尔采暖设备有限公司 | Heating floor |
-
2013
- 2013-04-18 CN CN2013101336744A patent/CN103196173A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562917A (en) * | 2009-05-31 | 2009-10-21 | 徐州安诺休闲设备有限公司 | Nano carbon crystal frequency spectrum heating plate |
| CN202026483U (en) * | 2011-04-12 | 2011-11-02 | 杭州暖洋洋科技有限公司 | Anti-creeping carbon-crystal heating fin for floor heating |
| CN203203124U (en) * | 2013-04-18 | 2013-09-18 | 新乡市沃姆尔采暖设备有限公司 | Heating floor |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103470002A (en) * | 2013-09-16 | 2013-12-25 | 江西斯洛特石业有限公司 | Far infrared floor heating stone tile |
| CN103687103A (en) * | 2013-12-20 | 2014-03-26 | 昆山建通电子科技有限公司 | Electric leakage prevention heating floor and manufacturing method thereof |
| CN103687103B (en) * | 2013-12-20 | 2016-04-06 | 昆山建通电子科技有限公司 | A kind of anticreep ground heating floor and manufacture method thereof |
| CN105971185A (en) * | 2016-07-06 | 2016-09-28 | 昆山桑德勒电子实业有限公司 | Heating composite board structure |
| CN106401142A (en) * | 2016-11-28 | 2017-02-15 | 王长坤 | Environment-friendly type dampproof self-heating glassfiber reinforced plastic floorboard |
| CN110158910A (en) * | 2018-02-08 | 2019-08-23 | 湖南盛世名嘉热能科技有限公司 | A kind of safety-type graphene carbon crystal heat floor tile |
| CN109162425A (en) * | 2018-10-30 | 2019-01-08 | 昆山博尔法新材料科技有限公司 | For indoor aluminium alloy ground heating floor structure |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130710 |