CN203543273U - 环保型多层叠合式无铅制程覆铜板 - Google Patents

环保型多层叠合式无铅制程覆铜板 Download PDF

Info

Publication number
CN203543273U
CN203543273U CN201320235096.0U CN201320235096U CN203543273U CN 203543273 U CN203543273 U CN 203543273U CN 201320235096 U CN201320235096 U CN 201320235096U CN 203543273 U CN203543273 U CN 203543273U
Authority
CN
China
Prior art keywords
layer
flame
environmentally
copper
clad plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320235096.0U
Other languages
English (en)
Inventor
尹湘平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANCHANG KECHUANG INFORMATION CONSULTING CO Ltd
Original Assignee
NANCHANG KECHUANG INFORMATION CONSULTING CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANCHANG KECHUANG INFORMATION CONSULTING CO Ltd filed Critical NANCHANG KECHUANG INFORMATION CONSULTING CO Ltd
Priority to CN201320235096.0U priority Critical patent/CN203543273U/zh
Application granted granted Critical
Publication of CN203543273U publication Critical patent/CN203543273U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

环保型多层叠合式无铅制程覆铜板,它涉及电子元器件技术领域,它包含基本板(1)、阻燃层(2)和铜箔层(3);基本板(1)的外侧设置有阻燃层(2),阻燃层(2)的外侧设置有铜箔层(3)。它为无铅制程,比较环保,对环境危害较小,且其内层设置有阻燃层,实用性强。

Description

环保型多层叠合式无铅制程覆铜板
技术领域:
本实用新型涉及电子元器件技术领域,具体涉及一种环保型多层叠合式无铅制程覆铜板。
背景技术:
覆铜板-----又名基材 。将补强材料浸以树脂,一面或两面覆以铜箔,经热压而成的一种板状材料,称为覆铜箔层压板。 它是做PCB的基本材料,常叫基材。
目前的覆铜板大多数都是有铅的,不环保,对环境影响较大,而且目前的覆铜板没有阻燃层,实用性不强。
实用新型内容:
本实用新型的目的是提一种供环保型多层叠合式无铅制程覆铜板,它为无铅制程,比较环保,对环境危害较小,且其内层设置有阻燃层,实用性强。
为了解决背景技术所存在的问题,本实用新型是采用以下技术方案:它包含基本板1、阻燃层2和铜箔层3;基本板1的外侧设置有阻燃层2,阻燃层2的外侧设置有铜箔层3。
所述的基本板1包含第一基本板1-1和第二基本板1-2,第一基本板1-1和第二基本板1-2的内部设置有屏蔽层4。
本实用新型具有以下有益效果:它为无铅制程,比较环保,对环境危害较小,且其内层设置有阻燃层,实用性强。
附图说明:
图1为本实用新型的结构示意图。
具体实施方式:
参看图1,本具体实施方式采用以下技术方案:它包含基本板1、阻燃层2和铜箔层3;基本板1的外侧设置有阻燃层2,阻燃层2的外侧设置有铜箔层3。
所述的基本板1包含第一基本板1-1和第二基本板1-2,第一基本板1-1和第二基本板1-2的内部设置有屏蔽层4。
本具体实施方式为无铅制程,比较环保,对环境危害较小,且其内层设置有阻燃层,实用性强。

Claims (2)

1.环保型多层叠合式无铅制程覆铜板,其特征在于它包含基本板(1)、阻燃层(2)和铜箔层(3);基本板(1)的外侧设置有阻燃层(2),阻燃层(2)的外侧设置有铜箔层(3)。
2.根据权利要求1所述的环保型多层叠合式无铅制程覆铜板,其特征在于所述的基本板(1)包含第一基本板(1-1)和第二基本板(1-2),第一基本板(1-1)和第二基本板(1-2)的内部设置有屏蔽层(4)。
CN201320235096.0U 2013-05-04 2013-05-04 环保型多层叠合式无铅制程覆铜板 Expired - Fee Related CN203543273U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320235096.0U CN203543273U (zh) 2013-05-04 2013-05-04 环保型多层叠合式无铅制程覆铜板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320235096.0U CN203543273U (zh) 2013-05-04 2013-05-04 环保型多层叠合式无铅制程覆铜板

Publications (1)

Publication Number Publication Date
CN203543273U true CN203543273U (zh) 2014-04-16

Family

ID=50461438

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320235096.0U Expired - Fee Related CN203543273U (zh) 2013-05-04 2013-05-04 环保型多层叠合式无铅制程覆铜板

Country Status (1)

Country Link
CN (1) CN203543273U (zh)

Similar Documents

Publication Publication Date Title
MY186451A (en) Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3026145A4 (en) Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
EP3026144A4 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
MY169238A (en) Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
WO2014184102A3 (en) Method for depositing thick copper layers onto sintered materials
CN203446104U (zh) 绝缘导热基板
CN204031568U (zh) 柔性印刷电路板
CN202918582U (zh) 一种软硬结合板的混压叠层结构
CN203543273U (zh) 环保型多层叠合式无铅制程覆铜板
CN204180377U (zh) 空腔电路板的压合结构
CN204707342U (zh) 具有散热效果的多层电路板
CN205430772U (zh) 一种双面pcb电路板
CN104159397A (zh) 空腔pcb板的压合结构及空腔pcb板的压合方法
CN204180376U (zh) 空腔pcb板的压合结构
CN203407071U (zh) 压接盲孔线路板
CN202310291U (zh) 一种快速散热型玻纤布覆铜板
CN205378338U (zh) 一种防电磁干扰印刷线路板
CN203543261U (zh) 一种高韧性结构覆铜
CN105142335A (zh) 一种反面主线为铜箔的双面柔性led线路板及生产工艺
CN207443200U (zh) 一种防止补强板气泡的柔性线路板
CN202652701U (zh) 一种耐高温的玻璃纤维无纺布单面覆铜板
CN203340419U (zh) 一种柔性线路板
CN203157258U (zh) 一种具有高玻璃化转变温度结构的覆铜板
CN202507609U (zh) 基材
CN201690675U (zh) 环氧酚醛漂白木纤维纸玻璃布单面覆铜板

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Yichun City space flight epoch Industrial Co., Ltd.

Assignor: Nanchang Kechuang Information Consulting Co., Ltd.

Contract record no.: 2014360000196

Denomination of utility model: Environment-friendly multilayer superposed lead-free process copper clad plate

Granted publication date: 20140416

License type: Exclusive License

Record date: 20140715

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140416

Termination date: 20150504

EXPY Termination of patent right or utility model