CN203536416U - Large-power integrated heating device equal-temperature bracket and large-power integrated heating device assembly - Google Patents
Large-power integrated heating device equal-temperature bracket and large-power integrated heating device assembly Download PDFInfo
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- CN203536416U CN203536416U CN201320692425.4U CN201320692425U CN203536416U CN 203536416 U CN203536416 U CN 203536416U CN 201320692425 U CN201320692425 U CN 201320692425U CN 203536416 U CN203536416 U CN 203536416U
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- heat pipe
- power integrated
- heater members
- integrated heater
- samming
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 26
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 230000000694 effects Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 230000003416 augmentation Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- 238000003491 array Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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Abstract
The utility model relates to a large-power integrated heating device equal-temperature bracket and a large-power integrated heating device assembly applying the same. The equal-temperature bracket comprises a plate-shaped heat pipe. The plate-shaped heat pipe has a flat plate structure which is formed through squeezing or punching metal material and is provided with an array of two or more parallelly arranged micro heat pipes. The side walls of the micro heat pipes are interconnected. The equivalent diameter of each micro heat pipe is 0.2-3.8mm. The micro heat pipes are independent from each other. The plate-shaped heat pipe has a plate-shaped surface which contacts with the heating surface of the large-power integrated heating device. The large-power integrated heating device equal-temperature bracket has the following advantages: high reliability, high heat conduction efficiency, high machinability, high pressure resistance, high heat resistance and low cost.
Description
Technical field
The utility model belongs to heat conduction technical field, particularly a kind of high-power integrated heater members samming support and adopt the integrated heater members assembly of novel high-power of this samming support.
Background technology
Volume is little, the feature of high light efficiency as LED integrated chip has conventionally for the high-power integrated heater members that existing semiconductor chip manufacturing technology is made, increase in when work along with its caloric value and density of heat flow rate, thereby the heat of high-power integrated heater members is effectively spread apart, easily to realize efficiently radiates heat be the problem that must solve.Existing great power LED integrated chip or COB(Chip on Board, chip on board) substrate generally adopts the material that heat conductivility is good, or temperature-uniforming plate is derived the heat of high-power integrated heater members, but the capacity of heat transmission of general Heat Conduction Material can not meet system radiating requirement.Structure as shown in Figure 1, tradition temperature-uniforming plate is also referred to as vapor chamber (VC), comprise the sealing copper coin 1 covering up and down, in copper coin, form cavity, in cavity, be provided with one or more support columns 2 of lower support, each support column 2 only one end and copper coin 1 is welded and fixed, and the phase-change heat-exchange carrying out when the work by the liquid working substance in copper coin 1 cavity conducts to the heat that fits in the high-power integrated heater members 3 on copper coin surface the each several part of temperature-uniforming plate.The copper coin the covering 1 periphery sealing technology of the temperature-uniforming plate of this structure is complicated, cost of manufacture is high, and full-mesh in the cavity of temperature-uniforming plate, even if being revealed, a place also can make temperature-uniforming plate global failure, therefore poor reliability, in addition, the not tension stress of this temperature-uniforming plate, higher than using under liquid working substance boiling temperature, be easily out of shape, thereby cannot weld as solder reflow process, the machining such as can not punch, the high-power integrated heater members such as LED integrated chip cannot effectively be fixed on temperature-uniforming plate.
Utility model content
The utility model is for the heat conductivility wretched insufficiency of COB substrate (support) existence of prior art, and traditional temperature-uniforming plate exist make complicated, machining property is poor, poor reliability, cost is high and the problem of high temperature resistance not, a kind of high-power integrated heater members samming support is provided, this samming support has advantages of high, the high thermal conductance of reliability, can weld and the machining property such as punching and cost low.The utility model also relates to a kind of integrated heater members assembly of novel high-power that adopts this samming support.
The technical solution of the utility model is as follows:
A kind of high-power integrated heater members samming support, it is characterized in that, comprise Platelike heat pipe, described Platelike heat pipe is metal material extruding or the stamping forming slab construction with two or more micro heat pipe arrays that are arranged side by side, the pipe sidewall interconnection of each micro heat pipe, the equivalent diameter of described each micro heat pipe is 0.2mm-3.8mm, and each micro heat pipe is separate, and described Platelike heat pipe has the tabular plane with the heating plane-plane contact of high-power integrated heater members.
Also comprise metal substrate, the tabular plane of described Platelike heat pipe is by the heating plane-plane contact of metal substrate and high-power integrated heater members.
In described metal substrate, have substrate groove, described Platelike heat pipe is nested in substrate groove.
The thickness of described Platelike heat pipe is 1mm-5mm, and the thickness of groove bottom of the substrate groove of described metal substrate is 2mm-30mm.
On the inwall of each micro heat pipe of described Platelike heat pipe, be provided with some micro-fin with augmentation of heat transfer effect of extrusion modling, the size of described micro-fin and structure are suitable for forming along the capillary structure of micro heat pipe length direction trend with micro heat pipe inwall.
The width of described capillary structure is 0.02mm-0.4mm, and the height of described capillary structure is 0.1mm-2mm.
The integrated heater members assembly of a kind of novel high-power, comprise one or more high-power integrated heater members, it is characterized in that, also comprise above-mentioned high-power integrated heater members samming support, the heating face of described high-power integrated heater members is twisted and to be connect or heat-conducting glue is bonding is fixedly connected with the tabular plane of samming support by welding or screw.
Described high-power integrated heater members is LED integrated chip.
Technique effect of the present utility model is as follows:
The high-power integrated heater members samming support that the utility model provides, specific Platelike heat pipe structure is set, form the stamping forming slab construction with micro heat pipe array of extruding, the pipe sidewall interconnection of each micro heat pipe, the separate work of each micro heat pipe, the phase-change heat-exchange self-assembling formation heat pipe effect that each micro heat pipe is undertaken by inner liquid working substance, the tabular plane for the heating plane-plane contact with one or more high-power integrated heater members having by Platelike heat pipe is as heat absorption conducting surface, the heat of high-power integrated heater members is conducted to the each several part of Platelike heat pipe, it is the effect that Platelike heat pipe plays heat balance conduction, this has just been avoided heat to concentrate causing high-power integrated heater members excess Temperature, the problem of the low and lost of life of luminous efficiency.Hot pipe technique has advantages of that heat transfer efficiency is high, the pipe sidewall interconnection of Platelike heat pipe extruding or punch forming and each micro heat pipe, strengthened the anti-pressure ability of whole Platelike heat pipe, because each micro heat pipe is separate, even if certain micro heat pipe is damaged like this, as there is leakage, also can not affect the work of other micro heat pipe, improved reliability, and be convenient to security maintenance, if avoided prior art one place to reveal the problem of the poor reliability that also can make temperature-uniforming plate global failure and cause.Platelike heat pipe is owing to adopting extruding or punch forming, therefore the problem that the copper coin of having avoided prior art employing to cover up and down seals, Platelike heat pipe manufacture craft of the present utility model is simple, tension stress, not yielding under high-temperature condition, have and can weld and the machining property such as punching, and reduced cost, improved reliability.
The tabular plane of Platelike heat pipe can be directly or indirectly and the heating plane-plane contact of high-power integrated heater members, when indirect contact, it is the heating plane-plane contact by metal substrate and high-power integrated heater members, one or more Platelike heat pipes can be combined with metal substrate, or Platelike heat pipe is nested in the substrate groove of metal substrate, Platelike heat pipe and metal substrate structure match, under the cooperating of metal substrate and Platelike heat pipe, the heat of high-power integrated heater members heating face (metal substrate and Platelike heat pipe) on samming support can be conducted evenly fast, this setting can be played the effect of further protection Platelike heat pipe, high-power so integrated heater members can directly be fixed on metal substrate by certain technique, and do not affect the Platelike heat pipe in metal substrate, further improved the reliability of whole samming support.
The thickness that Platelike heat pipe is set is 1mm-5mm, and the thickness of groove bottom of the substrate groove of described metal substrate is 2mm-30mm, the capacity of heat transmission of the liquid working substance in guaranteeing Platelike heat pipe when flowing, and can more effectively reduce contact heat resistance.
Some micro-fin with augmentation of heat transfer effect of extrusion modling is preferably set on the inwall of each micro heat pipe of Platelike heat pipe, can promote flowing of liquid working substance, further strengthen the exchange capability of heat of liquid working, the size of micro-fin and structure are suitable for forming along the capillary structure of micro heat pipe length direction trend with micro heat pipe inwall, can produce high-intensity phase-change heat-exchange.The width that capillary structure is set is 0.02mm-0.4mm, and the height of capillary structure is 0.1mm-2mm, makes Platelike heat pipe can have very high heat-transfer capability, and can strengthen the mechanical properties such as Platelike heat pipe and even the bending resistance of whole samming support own, heat resistanceheat resistant.
The utility model also relates to a kind of integrated heater members assembly of novel high-power that adopts this samming support, this assembly matches high-power integrated heater members samming support with one or more high-power integrated heater members two parts, the heating face of all high-power integrated heater members is twisted and to be connect or heat-conducting glue is bonding is fixedly connected with the tabular plane of samming support by welding or screw, make two parts be joined together to form an integral body, form one and can when high-power integrated heater members work, heat conduction also play fast the integrated heater members assembly of novel high-power of samming effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing COB temperature-uniforming plate.
Fig. 2 is the first structural representation of the high-power integrated heater members samming support of the utility model.
Fig. 3 is the second structural representation of the high-power integrated heater members samming support of the utility model.
Fig. 4 is the first structural representation of the high-power integrated heater members assembly of the utility model.
Fig. 5 is the cross section structure schematic diagram of Fig. 4.
Fig. 6 is the second structural representation of the high-power integrated heater members samming support of the utility model.
Fig. 7 is the cross section structure schematic diagram of Fig. 6.
In figure, each label lists as follows:
1-copper coin; 2-support column; The high-power integrated heater members of 3-; The high-power integrated heater members samming support of 4-; 5-Platelike heat pipe; 6-micro heat pipe; The tabular plane of 7-; 8-metal substrate; 9-screw.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described.
The utility model relates to a kind of high-power integrated heater members samming support, its structure as shown in Figure 2, high-power integrated heater members samming support 4 comprises Platelike heat pipe 5, this Platelike heat pipe 5 is metal material extruding or the stamping forming slab construction with two or more micro heat pipe being arranged side by side 6 arrays, be that a plurality of micro heat pipes 6 form micro heat pipe array, the pipe sidewall interconnection of each micro heat pipe 6, the equivalent diameter (or being called equivalent internal diameter) that each micro heat pipe 6 is set is 0.2mm-3.8mm, each micro heat pipe 6 is separate, Platelike heat pipe 5 has the tabular plane 7 with the heating plane-plane contact of high-power integrated heater members.In embodiment illustrated in fig. 2, the tabular plane 7 of Platelike heat pipe 5 is for heating plane-plane contact direct and high-power integrated heater members.
Fig. 3 is the another kind of preferred structure of the high-power integrated heater members samming support 4 of the utility model, high-power integrated heater members samming support 4 comprises Platelike heat pipe 5 and metal substrate 8, in metal substrate 8, there is substrate groove, Platelike heat pipe 5 integral body are nested in the substrate groove of metal substrate 8, Platelike heat pipe 5 matches with metal substrate 8 structures, the tabular plane 7 of the Platelike heat pipe 5 of this embodiment is the heating plane-plane contacts with high-power integrated heater members by metal substrate 8, the tabular plane 7 that is Platelike heat pipe 5 is heating plane-plane contact indirect and high-power integrated heater members.In addition, metal substrate can also be flat structure, now, Platelike heat pipe 5 is without nested, but be directly fixedly connected with metal substrate, one or more Platelike heat pipes 5 also can be set and combine with metal substrate, Platelike heat pipe 5 passes through metal substrate indirectly and the heating plane-plane contact of the integrated heater members of power.
For the capacity of heat transmission of the liquid working substance in guaranteeing Platelike heat pipe 5 when flowing, and can more effectively reduce contact heat resistance, the thickness that Platelike heat pipe 5 is preferably set is 1mm-5mm, and the thickness of groove bottom that the substrate groove of metal substrate 8 is set is 2mm-30mm.The cross section of the micro heat pipe 6 of Platelike heat pipe 5 can be circle as shown in Figure 2, also can be rectangle as shown in Figure 3, can also be oval, other shape such as triangle, for further strengthening the exchange capability of heat of liquid working, and enhancing Platelike heat pipe and even the bending resistance of whole samming support own, the mechanical properties such as heat resistanceheat resistant, can on the inwall of each micro heat pipe 6 of Platelike heat pipe 5, be provided with some micro-fin with augmentation of heat transfer effect of extrusion modling, in figure, do not show, the size of micro-fin and structure are suitable for forming along the capillary structure of micro heat pipe 6 length direction trends with micro heat pipe 6 inwalls, the width that capillary structure is preferably set is 0.02mm-0.4mm, the height of capillary structure is 0.1mm-2mm.
The utility model also relates to the integrated heater members assembly of a kind of novel high-power, this assembly comprises one or more high-power integrated heater members 3, this high-power integrated heater members 3 can be LED integrated chip, can be also other power electronic device, as controllable silicon etc.; Also comprise the high-power integrated heater members samming support 4 shown in Fig. 2 and Fig. 3, the heating face of high-power integrated heater members 3 is twisted and to be connect or heat-conducting glue is bonding and direct or indirect the reaching of tabular plane 7 of high-power integrated heater members samming support 4 is fixedly connected with by welding or screw.The first structural representation as shown in Figure 4, Fig. 5 is its cross section structure schematic diagram, the integrated heater members assembly of novel high-power of this embodiment comprises the high-power integrated heater members samming support 4 shown in one or more high-power integrated heater members 3 and Fig. 2, the heating face of high-power integrated heater members 3 by as welding or screw twist and to connect or heat-conducting glue is bonding etc. that technique is directly fixedly connected with the tabular plane 7 of high-power integrated heater members samming support 4, this embodiment be adopt screw 9 stubborn connect fixing.Adopt screw to twist while connecing fixedly, when screw penetrates micro heat pipe array, screw position can be solid band, can be also micro heat pipe, and when being micro heat pipe, this micro heat pipe can be destroyed, but affects hardly the overall performance of micro heat pipe array.Fig. 6 is the second structural representation of the integrated heater members assembly of novel high-power, Fig. 7 is its cross section structure schematic diagram, the integrated heater members assembly of novel high-power of this embodiment comprises the high-power integrated heater members samming support 4 shown in one or more high-power integrated heater members 3 and Fig. 3, the heating face of high-power integrated heater members 3 is twisted and to be connect or the metal substrate 8 of the technique such as heat-conducting glue is bonding by high-power integrated heater members samming support 4 is fixedly connected with tabular plane 7 by welding or screw, this embodiment be adopt screw 9 stubborn connect fixing.The integrated heater members assembly of novel high-power of the present utility model matches high-power integrated heater members samming support 4 with high-power integrated heater members 3 these two parts, be fixed together and form an integral body, formed an integrated heater members assembly of novel high-power that carries out heat conduction and play fast samming effect when high-power integrated heater members work.
It should be pointed out that the above embodiment can make the invention of those skilled in the art's comprehend, but do not limit the present invention in any way creation.Therefore; although this specification has been described in detail the invention with reference to drawings and Examples; but; those skilled in the art are to be understood that; still can modify or be equal to replacement the invention; in a word, all do not depart from technical scheme and the improvement thereof of the spirit and scope of the invention, and it all should be encompassed in the middle of the protection range of the invention patent.
Claims (8)
1. a high-power integrated heater members samming support, it is characterized in that, comprise Platelike heat pipe, described Platelike heat pipe is metal material extruding or the stamping forming slab construction with two or more micro heat pipe arrays that are arranged side by side, the pipe sidewall interconnection of each micro heat pipe, the equivalent diameter of described each micro heat pipe is 0.2mm-3.8mm, and each micro heat pipe is separate, and described Platelike heat pipe has the tabular plane with the heating plane-plane contact of high-power integrated heater members.
2. high-power integrated heater members samming support according to claim 1, is characterized in that, also comprise metal substrate, the tabular plane of described Platelike heat pipe is by the heating plane-plane contact of metal substrate and high-power integrated heater members.
3. high-power integrated heater members samming support according to claim 2, is characterized in that in described metal substrate, having substrate groove, and described Platelike heat pipe is nested in substrate groove.
4. high-power integrated heater members samming support according to claim 3, is characterized in that, the thickness of described Platelike heat pipe is 1mm-5mm, and the thickness of groove bottom of the substrate groove of described metal substrate is 2mm-30mm.
5. according to the high-power integrated heater members samming support one of claim 1 to 4 Suo Shu, it is characterized in that, on the inwall of each micro heat pipe of described Platelike heat pipe, be provided with some micro-fin with augmentation of heat transfer effect of extrusion modling, the size of described micro-fin and structure are suitable for forming along the capillary structure of micro heat pipe length direction trend with micro heat pipe inwall.
6. high-power integrated heater members samming support according to claim 5, is characterized in that, the width of described capillary structure is 0.02mm-0.4mm, and the height of described capillary structure is 0.1mm-2mm.
7. the integrated heater members assembly of novel high-power, comprise one or more high-power integrated heater members, it is characterized in that, also comprise the high-power integrated heater members samming support that one of claim 1 to 6 is described, the heating face of described high-power integrated heater members is twisted and is connect or heat-conducting glue is bonding is fixedly connected with the tabular plane of samming support by welding or screw.
8. the integrated heater members assembly of novel high-power according to claim 7, is characterized in that, described high-power integrated heater members is LED integrated chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320692425.4U CN203536416U (en) | 2013-11-05 | 2013-11-05 | Large-power integrated heating device equal-temperature bracket and large-power integrated heating device assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320692425.4U CN203536416U (en) | 2013-11-05 | 2013-11-05 | Large-power integrated heating device equal-temperature bracket and large-power integrated heating device assembly |
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| Publication Number | Publication Date |
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| CN203536416U true CN203536416U (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320692425.4U Expired - Lifetime CN203536416U (en) | 2013-11-05 | 2013-11-05 | Large-power integrated heating device equal-temperature bracket and large-power integrated heating device assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571499A (en) * | 2015-10-08 | 2017-04-19 | 赵耀华 | Thermal management system and method of cuboid battery pack |
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2013
- 2013-11-05 CN CN201320692425.4U patent/CN203536416U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571499A (en) * | 2015-10-08 | 2017-04-19 | 赵耀华 | Thermal management system and method of cuboid battery pack |
| CN106571499B (en) * | 2015-10-08 | 2023-05-12 | 赵耀华 | Thermal management system and method for cuboid battery pack |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140409 |
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| CX01 | Expiry of patent term |