CN203521866U - Pressing connecting device of high-density printed board connector - Google Patents

Pressing connecting device of high-density printed board connector Download PDF

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Publication number
CN203521866U
CN203521866U CN201320465696.6U CN201320465696U CN203521866U CN 203521866 U CN203521866 U CN 203521866U CN 201320465696 U CN201320465696 U CN 201320465696U CN 203521866 U CN203521866 U CN 203521866U
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CN
China
Prior art keywords
protective cover
connecting device
column
base
high density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320465696.6U
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Chinese (zh)
Inventor
朱维民
郑小平
施海栋
吴大伟
刘秀茹
陈祖豪
胡志勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 23 Research Institute
Original Assignee
CETC 23 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 23 Research Institute filed Critical CETC 23 Research Institute
Priority to CN201320465696.6U priority Critical patent/CN203521866U/en
Application granted granted Critical
Publication of CN203521866U publication Critical patent/CN203521866U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a pressing connecting device of a high-density printed board connector. The pressing connecting device comprises a base and a protective cover. The protective cover is arranged on the base, a jack is arranged in the protective cover, a handle and a knob are arranged on the protective cover, stand columns are arranged at the two sides of the protective cover and fixedly connected to the base, and a movable beam, cushion blocks, springs, upper beams and gaskets are sequentially arranged on the stand columns. The movable beam is fixed on the stand columns through copper bushes, and the springs are fixed on the stand columns through the upper beams, the gaskets and nuts. The pressing connecting device especially meets pressing connection of a long pin connector, the double-stand-column gantry type structure is adopted, therefore, sliding lifting is stable and reliable, and rigid-flexible joint pressing force is achieved and even and uniform.

Description

High density PCB connector compression bonding apparatus
Technical field
The utility model relates to a kind of high density PCB connector compression bonding apparatus
Background technology
For the electric connector of press-fit type and printed circuit board are interconnected, the crimping mode adopting in the market has manual crimping and automatic, semi-automatic crimping apparatus crimping, the basic motion mode crimping adopting from top to down, when facing larger electric connector, often need to adopt larger pressure just can be pressed in printed circuit board.Can be with hundred figure place meters of the contact pin number of electric connector to estimating roughly of pressure (Yi Dun unit's meter).For example: for a Rxxx-404 electric connector that has 404 contact pins, desired pressure is greatly about 4 tons of left and right.Pressure is larger, and impulsive force is just larger, causes like this speed of crimping, very easily damages printed board and connector, and scrappage is high.The frock clamp plate simultaneously adopting in the market generally thickness is 0.50-1.0inch(12.7~25.4mm) and the bore position the same with printed circuit board, difficulty of processing is large, and cost is high.So the crimping of high density PCB minute hand connector is a great problem of circuit assembly.
Utility model content
The purpose of this utility model is just to overcome above-mentioned existing technologies defect, and a kind of high density PCB connector compression bonding apparatus is provided, and meets especially the crimping of minute hand connector.This device adopts two column gantry formula structures, and slip lifting is steadily reliable, the hard and soft combination of thrust, uniformity.
The utility model is achieved through the following technical solutions: a kind of high density PCB connector compression bonding apparatus, comprise base, protective cover, on described base, be provided with protective cover, in described protective cover, be provided with jack, described protective cover is provided with handle and knob, described protective cover both sides are equipped with column, described column is fixedly connected on described base, on described column, be provided with successively moving crossbeam, cushion block, spring, entablature and packing ring, described moving crossbeam is fixed on described column by copper sheathing, described spring passes through entablature, packing ring and nut are fixed on described column.
As preferably, described moving crossbeam is provided with lower mold holder.
As preferably, in described moving crossbeam, be provided with supporting bracket.
As preferably, the material of described base is LF6,45# steel.
As preferably, the material of described column is 20CrMnTi.
As preferably, the material of described copper sheathing is H62.
As preferably, described lower mold holder is that the mould bases made of the template made with epoxy plate and aluminium alloy is assembled.
The utility model mainly solves the crimping of high density PCB connector, meets especially the crimping of minute hand connector, adopts two column gantry formula structures, and slip lifting is steadily reliable, the hard and soft combination of thrust, uniformity.Under the effect of jack, make crossbeam do from bottom to top jacking campaign, under the effect of two columns and spring, lower mold holder, printed board and connector three can be fitted tightly, solved preferably reliability, fail safe and ease for operation that connector crimping should possess.
Accompanying drawing explanation
Fig. 1 is the stereogram of a kind of high density PCB connector of the utility model compression bonding apparatus;
Fig. 2 is the left hand view of a kind of high density PCB connector of the utility model compression bonding apparatus.
Embodiment
For making the technical problems to be solved in the utility model, technical scheme and advantage clearer, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
With reference to Fig. 1-2, this embodiment is by the following technical solutions: a kind of high density PCB connector compression bonding apparatus, comprise base 1, protective cover 2, on described base 1, be provided with protective cover 2, in described protective cover 2, be provided with jack 3, described protective cover 2 is provided with handle 4 and knob 5, described protective cover 2 both sides are equipped with column 6, described column 6 is fixedly connected on described base 1, on described column 6, be provided with successively moving crossbeam 7, cushion block 8, spring 9, entablature 10 and packing ring 11, described moving crossbeam 7 is fixed on described column 6 by copper sheathing 12, described spring 9 is by entablature 10, packing ring 11 and nut 13 are fixed on described column 6.
It should be noted that described moving crossbeam 7 is provided with lower mold holder 14.
It should be noted that in described moving crossbeam 7 and be provided with supporting bracket 15.
Material that it should be noted that described base 1 is LF6,45# steel.
Material that it should be noted that described column 6 is 20CrMnTi.
Material that it should be noted that described copper sheathing 12 is H62.
In addition, described lower mold holder 14 is that the mould bases made of the template made with epoxy plate and aluminium alloy is assembled, wherein, and in the whole crimping process of electric connector, it is smooth that printed circuit board must keep, and only in this way just can guarantee that all contact pins insert the identical degree of depth.And realize this goal, just need to adopt a combined down molds frame 14.This frock is bearing in the bottom position of printed circuit board, prevents that printed circuit board is in crimping process, because the active force being applied on plated-through hole causes printed circuit board plate face to produce bow type metaboly.The template of this frock adopts and the duplicate material of printed circuit board, and we have designed distinctive thickness has the same bore position with printed circuit board, these lower mold holder 14 easy making process, and cost is low.
The important technological parameters of this device:
Maximum working pressure (MWP) 5T;
Maximum functional stroke 150mm;
Can meet the crimping of all kinds of connectors of width≤270mm.
During use, under effect by jack 3, make crossbeam 7 from bottom to top do jacking campaign, under the effect of two columns 6 and spring 9, lower mold holder 14, printed board and connector three can be fitted tightly, reliability, fail safe and ease for operation that connector crimping should possess have been solved preferably.
The above is preferred implementation of the present utility model; should be understood that; for those skilled in the art; do not departing under the prerequisite of principle described in the utility model; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.

Claims (4)

1. a high density PCB connector compression bonding apparatus, comprise base (1), protective cover (2), it is characterized in that, on described base (1), be provided with protective cover (2), in described protective cover (2), be provided with jack (3), described protective cover (2) is provided with handle (4) and knob (5), described protective cover (2) both sides are equipped with column (6), described column (6) is fixedly connected on described base (1), on described column (6), be provided with successively moving crossbeam (7), cushion block (8), spring (9), entablature (10) and packing ring (11), described moving crossbeam (7) is fixed on described column (6) by copper sheathing (12), described spring (9) is by entablature (10), packing ring (11) and nut (13) are fixed on described column (6).
2. a kind of high density PCB connector compression bonding apparatus according to claim 1, is characterized in that, described moving crossbeam (7) is provided with lower mold holder (14).
3. a kind of high density PCB connector compression bonding apparatus according to claim 1, is characterized in that, is provided with supporting bracket (15) in described moving crossbeam (7).
4. a kind of high density PCB connector compression bonding apparatus according to claim 2, is characterized in that, described lower mold holder (14) is that the mould bases made of the template made with epoxy plate and aluminium alloy is assembled.
CN201320465696.6U 2013-07-31 2013-07-31 Pressing connecting device of high-density printed board connector Expired - Lifetime CN203521866U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320465696.6U CN203521866U (en) 2013-07-31 2013-07-31 Pressing connecting device of high-density printed board connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320465696.6U CN203521866U (en) 2013-07-31 2013-07-31 Pressing connecting device of high-density printed board connector

Publications (1)

Publication Number Publication Date
CN203521866U true CN203521866U (en) 2014-04-02

Family

ID=50380741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320465696.6U Expired - Lifetime CN203521866U (en) 2013-07-31 2013-07-31 Pressing connecting device of high-density printed board connector

Country Status (1)

Country Link
CN (1) CN203521866U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103441405A (en) * 2013-07-31 2013-12-11 中国电子科技集团公司第三十二研究所 High-density printed board connector crimping device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103441405A (en) * 2013-07-31 2013-12-11 中国电子科技集团公司第三十二研究所 High-density printed board connector crimping device
CN103441405B (en) * 2013-07-31 2015-12-02 中国电子科技集团公司第三十二研究所 High-density printed board connector crimping device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20140402

Effective date of abandoning: 20151202

AV01 Patent right actively abandoned

Granted publication date: 20140402

Effective date of abandoning: 20151202

C25 Abandonment of patent right or utility model to avoid double patenting