CN203929022U - Cell phone mainboard solder paste thickness gauge - Google Patents
Cell phone mainboard solder paste thickness gauge Download PDFInfo
- Publication number
- CN203929022U CN203929022U CN201420242045.5U CN201420242045U CN203929022U CN 203929022 U CN203929022 U CN 203929022U CN 201420242045 U CN201420242045 U CN 201420242045U CN 203929022 U CN203929022 U CN 203929022U
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- CN
- China
- Prior art keywords
- screw mandrel
- axis screw
- cell phone
- fixed
- phone mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The utility model discloses cell phone mainboard solder paste thickness gauge, comprise base plate, frame, X-axis screw mandrel, the first motor, video camera, laser instrument, Y-axis screw mandrel, position plate, slide rail, the second motor and cell phone mainboard fixture, the first motor drives and is connected with X-axis screw mandrel, X-axis screw mandrel is fixed in frame, frame is fixed on base plate, video camera and laser instrument slide and are fixed on X-axis screw mandrel, Y-axis screw mandrel is fixed on base plate, slide rail is located at the both sides of Y-axis screw mandrel, Y-axis screw mandrel drives and is connected with the second motor, cell phone mainboard fixture is fixed on position plate, position plate drives and is connected with Y-axis screw mandrel, its both sides suspend and are connected with slide rail.Advantage of the present utility model is: this cell phone mainboard solder paste thickness gauge is simple in structure, easy to operate, thickness measuring precision is high, and the design of L shaped pressing plate is in having guaranteed positioning precision, to cell phone mainboard not damaged, greatly reduce the rejection rate in this flow process of solder paste thickness measuring in cell phone mainboard production run, be convenient to promote the use of.
Description
Technical field
The utility model belongs to the production field of cell phone mainboard, is specifically related to cell phone mainboard solder paste thickness gauge.
Background technology
In recent years, increasing along with cell phone mainboard packaging density, the gap of welding pin is more and more less, is the reliability that ensures solder joint, and it is particularly important that tin cream thickness wherein detects a step.Solder paste thickness gauge of the prior art obtains shooting picture by video camera and laser instrument, then computer system is calculated the relevant feature parameters of tin cream according to the picture gathering, when the cell phone mainboard thickness difference detecting, and thicknessmeter is in the consistent situation of the positioning height of cell phone mainboard, relatively thick cell phone mainboard can bear larger pressure, and this just causes certain hidden danger to the quality of cell phone mainboard.
Utility model content
Technical problem to be solved in the utility model is to provide simple in structure, easy to operate, and thickness measuring precision is high, and to the undamaged solder paste thickness gauge of cell phone mainboard.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is:
Cell phone mainboard solder paste thickness gauge, comprise base plate, frame, X-axis screw mandrel, the first motor, video camera, laser instrument, Y-axis screw mandrel, position plate, slide rail, the second motor and cell phone mainboard fixture, the first motor drives and is connected with X-axis screw mandrel, X-axis screw mandrel is fixed in frame, frame is fixed on base plate, video camera is vertical also to slide and is fixed on X-axis screw mandrel, laser instrument tilts and slides and is fixed on X-axis screw mandrel, Y-axis screw mandrel is fixed on base plate, slide rail is two, and be located at respectively the both sides of Y-axis screw mandrel, one end of every one slide rail is fixed on base plate by fixed block, its other end is fixed on the fixed head of Y-axis screw mandrel, Y-axis screw mandrel drives and is connected with the second motor, cell phone mainboard fixture is fixed on position plate, position plate drives and is connected with Y-axis screw mandrel, its both sides also suspend and are connected with slide rail, cell phone mainboard fixture is provided with two positioning sliding blocks.
Further, the fixed head of Y-axis screw mandrel is provided with contact induction device, and the bottom of position plate is provided with the inductive head matching with this contact induction device.
Further, above-mentioned position plate is respectively equipped with L shaped pressing plate perpendicular to the both sides of positioning sliding block, and L shaped pressing plate is connected with air cylinder driven.
Further, the surface level crossbeam of above-mentioned L shaped pressing plate inner side is fixed with elastic component.
Further, above-mentioned elastic component is elastic caoutchouc or elasticity silk floss.
Compared with prior art, advantage of the present utility model is: this cell phone mainboard solder paste thickness gauge is simple in structure, easy to operate, thickness measuring precision is high, and the design of L shaped pressing plate is in having guaranteed positioning precision, to cell phone mainboard not damaged, greatly reduce the rejection rate in this flow process of solder paste thickness measuring in cell phone mainboard production run, be convenient to promote the use of.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model.
Wherein, 1, base plate, 2, frame, 3, X-axis screw mandrel, 31, the first motor, 4, video camera, 5, laser instrument, 6, Y-axis screw mandrel, 61, position plate, 7, slide rail, 71, fixed block, 72, contact induction device, 73, the second motor, 8, cell phone mainboard fixture, 81, positioning sliding block, 9, L shaped pressing plate, 91, cylinder.
Embodiment:
Cell phone mainboard solder paste thickness gauge as shown in Figure 1, comprise base plate 1, frame 2, X-axis screw mandrel 3, the first motor 31, video camera 4, laser instrument 5, Y-axis screw mandrel 6, position plate 61, slide rail 7, the second motor 73 and cell phone mainboard fixture 8, the first motor 31 drives and is connected with X-axis screw mandrel 3, X-axis screw mandrel 3 is fixed in frame 2, frame 2 is fixed on base plate 1, video camera 4 is vertical also to slide and is fixed on X-axis screw mandrel 3, laser instrument 5 tilts and slides and is fixed on X-axis screw mandrel 3, Y-axis screw mandrel 6 is fixed on base plate 1, slide rail 7 is two, and be located at respectively the both sides of Y-axis screw mandrel 6, one end of every one slide rail 7 is fixed on base plate 1 by fixed block 71, its other end is fixed on the fixed head of Y-axis screw mandrel 6, Y-axis screw mandrel 6 drives and is connected with the second motor 73, cell phone mainboard fixture 8 is fixed on position plate 61, position plate 61 drives and is connected with Y-axis screw mandrel 6, its both sides also suspend and are connected with slide rail 7, cell phone mainboard fixture 8 is provided with two positioning sliding blocks 81, every positioning sliding block 81 all can be free to slide in cell phone mainboard fixture 8, to adapt to the test request of different in width cell phone mainboard, the fixed head of Y-axis screw mandrel 6 is provided with contact induction device 72, the bottom of position plate 61 is provided with the inductive head (not shown) matching with this contact induction device 72, position plate 61 is respectively equipped with L shaped pressing plate 9 perpendicular to the both sides of positioning sliding block 81, L shaped pressing plate 9 is connected with air cylinder driven, the surface level crossbeam inner side of L shaped pressing plate 9 is fixed with elastic component, cell phone mainboard is by after positioning sliding block 81 horizontal location, L shaped pressing plate 9 moves downward under the effect of cylinder 91, and be depressed into cell phone mainboard, it is fixed in cell phone mainboard fixture 8, be convenient to measure, the air pressure driving force of cylinder 91 to L shaped pressing plate 9, video camera 4, laser instrument 5, X-axis screw mandrel 3, Y-axis screw mandrel 6 is all realized by computer control, ensure the accuracy of cell phone mainboard thickness measuring operation.
Claims (5)
1. cell phone mainboard solder paste thickness gauge, it is characterized in that: comprise base plate, frame, X-axis screw mandrel, the first motor, video camera, laser instrument, Y-axis screw mandrel, position plate, slide rail, the second motor and cell phone mainboard fixture, described the first motor drives and is connected with X-axis screw mandrel, described X-axis screw mandrel is fixed in frame, described frame is fixed on base plate, described video camera is vertical also to slide and is fixed on X-axis screw mandrel, described laser instrument tilts and slides and is fixed on X-axis screw mandrel, described Y-axis screw mandrel is fixed on base plate, described slide rail is two, and be located at respectively the both sides of Y-axis screw mandrel, one end of every described slide rail is fixed on base plate by fixed block, its other end is fixed on the fixed head of Y-axis screw mandrel, described Y-axis screw mandrel drives and is connected with the second motor, described cell phone mainboard fixture is fixed on position plate, described position plate drives and is connected with Y-axis screw mandrel, its both sides also suspend and are connected with slide rail, described cell phone mainboard fixture is provided with two positioning sliding blocks.
2. cell phone mainboard solder paste thickness gauge according to claim 1, is characterized in that: the fixed head of described Y-axis screw mandrel is provided with contact induction device, the bottom of described position plate is provided with the inductive head matching with this contact induction device.
3. cell phone mainboard solder paste thickness gauge according to claim 1, is characterized in that: described position plate is respectively equipped with L shaped pressing plate perpendicular to the both sides of positioning sliding block, described L shaped pressing plate is connected with air cylinder driven.
4. cell phone mainboard solder paste thickness gauge according to claim 3, is characterized in that: the surface level crossbeam inner side of described L shaped pressing plate is fixed with elastic component.
5. cell phone mainboard solder paste thickness gauge according to claim 4, is characterized in that: described elastic component is elastic caoutchouc or elasticity silk floss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420242045.5U CN203929022U (en) | 2014-05-13 | 2014-05-13 | Cell phone mainboard solder paste thickness gauge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420242045.5U CN203929022U (en) | 2014-05-13 | 2014-05-13 | Cell phone mainboard solder paste thickness gauge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203929022U true CN203929022U (en) | 2014-11-05 |
Family
ID=51824824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420242045.5U Expired - Fee Related CN203929022U (en) | 2014-05-13 | 2014-05-13 | Cell phone mainboard solder paste thickness gauge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203929022U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105526863A (en) * | 2015-12-31 | 2016-04-27 | 深圳富强智能系统科技有限公司 | Semi-finished mobile phone detecting device |
| CN107132398A (en) * | 2017-05-26 | 2017-09-05 | 重庆市铭冀电子科技有限公司 | Cell phone mainboard current detecting special purpose device |
| CN107471294A (en) * | 2017-08-09 | 2017-12-15 | 深圳市长亚科技有限公司 | Alignment device |
| CN107876613A (en) * | 2017-11-06 | 2018-04-06 | 浙江长兴和良智能装备有限公司 | A kind of workpiece process for producing line and method for combining pipe end processing and bend pipe processing |
| CN109084694A (en) * | 2018-09-20 | 2018-12-25 | 王顺 | A kind of film thickness detection method |
| CN109297402A (en) * | 2018-08-21 | 2019-02-01 | 苏州图锐智能科技有限公司 | Tin cream detection device based on technique of binocular stereoscopic vision |
-
2014
- 2014-05-13 CN CN201420242045.5U patent/CN203929022U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105526863A (en) * | 2015-12-31 | 2016-04-27 | 深圳富强智能系统科技有限公司 | Semi-finished mobile phone detecting device |
| CN107132398A (en) * | 2017-05-26 | 2017-09-05 | 重庆市铭冀电子科技有限公司 | Cell phone mainboard current detecting special purpose device |
| CN107471294A (en) * | 2017-08-09 | 2017-12-15 | 深圳市长亚科技有限公司 | Alignment device |
| CN107471294B (en) * | 2017-08-09 | 2023-03-31 | 深圳市长亚科技有限公司 | Aligning device |
| CN107876613A (en) * | 2017-11-06 | 2018-04-06 | 浙江长兴和良智能装备有限公司 | A kind of workpiece process for producing line and method for combining pipe end processing and bend pipe processing |
| CN107876613B (en) * | 2017-11-06 | 2024-01-16 | 浙江长兴和良智能装备有限公司 | Workpiece processing production line and method combining pipe end processing and pipe bending processing |
| CN109297402A (en) * | 2018-08-21 | 2019-02-01 | 苏州图锐智能科技有限公司 | Tin cream detection device based on technique of binocular stereoscopic vision |
| CN109084694A (en) * | 2018-09-20 | 2018-12-25 | 王顺 | A kind of film thickness detection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20170513 |