CN103441405B - High-density printed board connector crimping device - Google Patents
High-density printed board connector crimping device Download PDFInfo
- Publication number
- CN103441405B CN103441405B CN201310330494.5A CN201310330494A CN103441405B CN 103441405 B CN103441405 B CN 103441405B CN 201310330494 A CN201310330494 A CN 201310330494A CN 103441405 B CN103441405 B CN 103441405B
- Authority
- CN
- China
- Prior art keywords
- protective cover
- high density
- bonding apparatus
- column
- compression bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002788 crimping Methods 0.000 title abstract description 13
- 230000001681 protective effect Effects 0.000 claims abstract description 20
- 230000006835 compression Effects 0.000 claims abstract description 15
- 238000007906 compression Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 9
- 238000012856 packing Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
Abstract
The invention discloses a high-density printed board connector crimping device which comprises a base and a protective cover, wherein the protective cover is arranged on the base, a jack is arranged in the protective cover, a handle and a knob are arranged on the protective cover, stand columns are arranged on two sides of the protective cover and fixedly connected to the base, a movable cross beam, a cushion block, a spring, an upper cross beam and a gasket are sequentially arranged on the stand columns, the movable cross beam is fixed on the stand columns through copper sleeves, and the spring is fixed on the stand columns through the upper cross beam, the gasket and nuts. The invention particularly meets the compression joint of the long-pin connector, adopts a double-upright-column gantry structure, has stable and reliable sliding and lifting, and has rigid-flexible combination and uniform pressing force.
Description
Technical field
The present invention relates to a kind of high density PCB connector compression bonding apparatus
Background technology
In order to the electric connector of press-fit type and printed circuit board are interconnected, the crimping mode adopted in the market has manipulative compression joint and the crimping of automatic, semi-automatic crimping apparatus, basic employing motion mode crimping from top to down, in time facing larger electric connector, often need to adopt larger pressure just can be pressed in printed circuit board.Roughly can count by hundred figure places of the contact pin number of electric connector estimating of pressure (in ton unit).Such as: for the Rxxx-404 electric connector having 404 contact pins, required pressure is greatly about about 4 tons.Pressure is larger, and impulsive force is larger, causes the speed crimped like this, and very easily damage printed board and connector, scrappage is high.The frock clamp plate simultaneously adopted in the market under normal circumstances thickness is 0.50-1.0inch(12.7 ~ 25.4mm) and the bore position the same with printed circuit board, difficulty of processing is large, and cost is high.So the crimping of high density PCB minute hand connector is a great problem of circuit assembly.
Summary of the invention
Object of the present invention is just to overcome above-mentioned existing technologies defect, provides a kind of high density PCB connector compression bonding apparatus, meets the crimping of minute hand connector especially.This device adopts two column gantry formula structure, and lifting of sliding is steadily reliable, thrust rigid flexible system, uniformity.
The present invention is achieved by the following technical solutions: a kind of high density PCB connector compression bonding apparatus, comprise base, protective cover, described base is provided with protective cover, jack is provided with in described protective cover, described protective cover is provided with handle and knob, described protective cover both sides are equipped with column, described column is fixedly connected on described base, described column is provided with dynamic crossbeam successively, cushion block, spring, entablature and packing ring, described dynamic crossbeam is fixed on described column by copper sheathing, described spring passes through entablature, packing ring and nut are fixed on described column.
As preferably, described dynamic crossbeam is provided with lower mold holder.
As preferably, in described dynamic crossbeam, be provided with supporting bracket.
As preferably, the material of described base is LF6,45# steel.
As preferably, the material of described column is 20CrMnTi.
As preferably, the material of described copper sheathing is H62.
As preferably, described lower mold holder is that the mould bases that the template made with epoxy plate and aluminium alloy are made is assembled.
The present invention mainly solves the crimping of high density PCB connector, meets the crimping of minute hand connector especially, adopts two column gantry formula structure, and lifting of sliding is steadily reliable, thrust rigid flexible system, uniformity.Under the effect of jack, make crossbeam do jacking campaign from bottom to top, under the effect of two column and spring, lower mold holder, printed board and connector three can be fitted tightly, solve connector preferably and crimp reliability, fail safe and the ease for operation that should possess.
Accompanying drawing explanation
Fig. 1 is the stereogram of a kind of high density PCB connector of the present invention compression bonding apparatus;
Fig. 2 is the left hand view of a kind of high density PCB connector of the present invention compression bonding apparatus.
Embodiment
For making the technical problem to be solved in the present invention, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
With reference to Fig. 1-2, this embodiment is by the following technical solutions: a kind of high density PCB connector compression bonding apparatus, comprise base 1, protective cover 2, described base 1 is provided with protective cover 2, jack 3 is provided with in described protective cover 2, described protective cover 2 is provided with handle 4 and knob 5, described protective cover 2 both sides are equipped with column 6, described column 6 is fixedly connected on described base 1, described column 6 is provided with dynamic crossbeam 7 successively, cushion block 8, spring 9, entablature 10 and packing ring 11, described dynamic crossbeam 7 is fixed on described column 6 by copper sheathing 12, described spring 9 is by entablature 10, packing ring 11 and nut 13 are fixed on described column 6.
It should be noted that described dynamic crossbeam 7 is provided with lower mold holder 14.
It should be noted that in described dynamic crossbeam 7 and be provided with supporting bracket 15.
It should be noted that the material of described base 1 is LF6,45# steel.
It should be noted that the material of described column 6 is 20CrMnTi.
It should be noted that the material of described copper sheathing 12 is H62.
In addition, described lower mold holder 14 is that the mould bases that the template made with epoxy plate and aluminium alloy are made is assembled, wherein, in the whole crimping process of electric connector, printed circuit board must keep smooth, only in this way just can guarantee that all contact pins insert the identical degree of depth.And realize this goal, just need employing one combined down molds frame 14.This frock is bearing in the bottom position of printed circuit board, prevents printed circuit board in crimping process, causes printed circuit board plate face to produce arcuate metaboly due to the active force be applied on plated-through hole.The template of this frock adopts and the duplicate material of printed circuit board, and we devise distinctive thickness has the same bore position with printed circuit board, and this lower mold holder 14 easy making process, cost is low.
The important technological parameters of this device:
Maximum working pressure (MWP) 5T;
Maximum functional stroke 150mm;
The crimping of all kinds of connectors of width≤270mm can be met.
During use, crossbeam 7 is made to do jacking campaign from bottom to top under effect by jack 3, under the effect of two column 6 and spring 9, lower mold holder 14, printed board and connector three can be fitted tightly, solve connector preferably and crimp reliability, fail safe and the ease for operation that should possess.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (6)
1. a high density PCB connector compression bonding apparatus, comprise base (1), protective cover (2), it is characterized in that, described base (1) is provided with protective cover (2), jack (3) is provided with in described protective cover (2), described protective cover (2) is provided with handle (4) and knob (5), described protective cover (2) both sides are equipped with column (6), described column (6) is fixedly connected on described base (1), described column (6) is provided with successively dynamic crossbeam (7), cushion block (8), spring (9), entablature (10) and packing ring (11), described dynamic crossbeam (7) is fixed on described column (6) by copper sheathing (12), described spring (9) is by entablature (10), packing ring (11) and nut (13) are fixed on described column (6).
2. a kind of high density PCB connector compression bonding apparatus according to claim 1, is characterized in that, described dynamic crossbeam (7) is provided with lower mold holder (14).
3. a kind of high density PCB connector compression bonding apparatus according to claim 1, is characterized in that, is provided with supporting bracket (15) in described dynamic crossbeam (7).
4. a kind of high density PCB connector compression bonding apparatus according to claim 1, is characterized in that, the material of described column (6) is 20CrMnTi.
5. a kind of high density PCB connector compression bonding apparatus according to claim 1, is characterized in that, the material of described copper sheathing (12) is H62.
6. a kind of high density PCB connector compression bonding apparatus according to claim 2, is characterized in that, described lower mold holder (14) is that the mould bases that the template made with epoxy plate and aluminium alloy are made is assembled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330494.5A CN103441405B (en) | 2013-07-31 | 2013-07-31 | High-density printed board connector crimping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330494.5A CN103441405B (en) | 2013-07-31 | 2013-07-31 | High-density printed board connector crimping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103441405A CN103441405A (en) | 2013-12-11 |
| CN103441405B true CN103441405B (en) | 2015-12-02 |
Family
ID=49695087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310330494.5A Active CN103441405B (en) | 2013-07-31 | 2013-07-31 | High-density printed board connector crimping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103441405B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102185216A (en) * | 2011-03-02 | 2011-09-14 | 聚信科技有限公司 | Floating type electric connector |
| CN201985382U (en) * | 2010-12-13 | 2011-09-21 | 上海华勤通讯技术有限公司 | Connector with shielding function |
| CN203521866U (en) * | 2013-07-31 | 2014-04-02 | 中国电子科技集团公司第三十二研究所 | Pressing connecting device of high-density printed board connector |
-
2013
- 2013-07-31 CN CN201310330494.5A patent/CN103441405B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201985382U (en) * | 2010-12-13 | 2011-09-21 | 上海华勤通讯技术有限公司 | Connector with shielding function |
| CN102185216A (en) * | 2011-03-02 | 2011-09-14 | 聚信科技有限公司 | Floating type electric connector |
| CN203521866U (en) * | 2013-07-31 | 2014-04-02 | 中国电子科技集团公司第三十二研究所 | Pressing connecting device of high-density printed board connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103441405A (en) | 2013-12-11 |
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