CN203503703U

CN203503703U - LED packaging gel application structure

Info

Publication number: CN203503703U
Application number: CN201320486605.7U
Authority: CN
Inventors: 李静静; 孙大兵; 吉思浩; 赵荣荣
Original assignee: Nanjing Handson Science & Technology Corp
Current assignee: Jiangsu Jingbang Lighting Technology Co., Ltd.
Priority date: 2013-08-12
Filing date: 2013-08-12
Publication date: 2014-03-26
Anticipated expiration: 2023-08-12

Abstract

The utility model provides an LED packaging gel application structure. The structure comprises an LED packaging substrate having a functional region for wafer fixation and an anode and a cathode for connection with an external pad. The packaging gel is applied to the functional region and extends to a non-functional region more than 2mm away from the periphery of the functional region except for the anode and the cathode in connection with the external pad. The packaging structure is obtained in the steps of: preparing a packaging silica gel according to a required proportion; stirring the packaging silica gel until it is homogeneously mixed; putting the packaging silica gel into a deaeration machine for deaeration; pouring the gel into a gel dispensing barrel, and placing the gel dispensing barrel in a vacuum machine until no bubble exists; and meanwhile, placing a semi-finished product with fluorescence gel onto a heating platform, and preheating the semi-finished product with an appropriate temperature on the platform; after the vacuumization of the gel, applying the gel uniformly to the functional region of the semi-finished product and the entire upper surface of the substrate slowly; and then adjusting the temperature of the heating platform to initially cure the gel. The LED packaging gel applying structure provided by the utility model can solve the cracking problem of the product, thereby ensuring the reliability of the product.

Description

LED packaging plastic coated structure

Technical field

The utility model relates to a kind of LED packaging plastic painting method and encapsulating structure thereof, belongs to LED technical field.

Background technology

The coating of colloid is step encapsulation essential and most crucial in LED encapsulation, and general LED encapsulating products is all coated on colloid in the functional areas of substrate, and final colloid height flushes with functional areas.This scheme shortcoming is colloid and to form functional substrate district material thermal expansion coefficient variant, after lighting for a long time, is easy to produce slight crack between the two, particularly at the contact-making surface place of colloid edge and substrate.Cause light source unfailing performance degradation, especially for customized substrate, how different the material property that forms functional areas is, and this phenomenon is especially serious.

As shown in Figure 1, on LED base plate for packaging 1, be provided for the functional areas 2 of die bond and the both positive and negative polarity 3 of the external pad of substrate, functional areas 2 are recessed down, shown in Fig. 2, the interior covering packing colloid 4 in functional substrate district 2, the periphery of functional areas 2 covers without colloid, and when encapsulation, the height of packing colloid 4 flushes with functional areas 2.

Summary of the invention

For solving above-mentioned problems of the prior art, the purpose of this utility model is to provide a kind of LED packaging plastic coated structure by a kind of novel colloid painting method, can effectively solve product crack problem, has guaranteed product reliability energy.

By following scheme, realize:

A kind of LED packaging plastic coated structure, comprise LED base plate for packaging, on base plate for packaging, be provided for the functional areas of die bond and the both positive and negative polarity of external pad, more than packing colloid is coated on functional areas and extends to the nonfunctional area 2mm except external pad both positive and negative polarity of its periphery.

Further, the upper surface of the whole substrate except external pad both positive and negative polarity is coated with packing colloid.

For obtaining above-mentioned encapsulating structure, the LED packaging plastic painting method adopting, after comprising the steps: that proportional arrangement completes as requested with silica gel by encapsulation, be stirred to and mix, put into defoamer deaeration, after colloid is poured in a plastic pin cylinder, be placed in vacuum machine extremely without till bubble, meanwhile, the LED packaging semi-finished product of having put fluorescent glue is placed on heating platform, heating platform temperature is suitable, semi-finished product are carried out to preheating, after treating that colloid vacuumizes, slowly it is evenly coated on to functional areas and the whole upper surface of base plate of LED packaging semi-finished product, and then regulate heating platform temperature to make colloid primary solidification.

Compared with prior art, the utility model is coated on packaging plastic the upper surface of the whole substrate that comprises functional areas rather than only limits to be coated on functional areas, LED encapsulating products of the present utility model also be there will not be between colloid and functional areas substrate after lighting for a long time and produce slight crack, guaranteed the unfailing performance of product.

Accompanying drawing explanation

Fig. 1 is base plate for packaging schematic diagram in prior art;

Fig. 2 only applies packing colloid schematic diagram in functional areas in prior art;

Fig. 3 all applies packing colloid schematic diagram inside and outside the utility model functional areas.

Embodiment

The painting method of the utility model LED packaging plastic, its concrete processing step is as follows:

1. packaging semi-finished product is placed on heating platform, heating platform temperature regulates suitably, to reach the object to basal plate preheating;

2. the colloid of encapsulation use is disposed in container in accordance with the appropriate ratio, stirs 10-15min, till treating that colloid mixes;

3. the above-mentioned colloid stirring is proceeded to and in defoamer, carry out deaeration;

4. the colloid after deaeration in step 2 is carefully proceeded in syringe slowly, notice that glue slowly flows down along needle cylinder wall;

5. the syringe of filling colloid in step 3 is proceeded to vacuumize and in instrument, vacuumize processing;

6. colloid in step 5 is first evenly coated on to whole substrate surface, this step need to reach following some: 1) colloid height must be higher than functional areas; 2) colloid must be evenly; 3) colloid can not the external pad of covered substrate;

7. regulate heating platform temperature, make colloid primary solidification, notice that in this process, colloid surface can not have Bubble formation;

8. the product of primary solidification in step 7 is moved in photoelectricity baking box and carries out regelate.

In above-mentioned processing step, step 6 is utility model point of the present utility model, is different from a traditional technique at functional areas coating packing colloid, in this step, colloid is not only coated on to the upper surface that functional areas but also expansion are coated to whole substrate.

The LED packing colloid coated structure obtaining by this method as shown in Figure 3, recessed die bond functional areas 2 are set on LED base plate for packaging 1, packing colloid 4 is coated on the upper surface of the whole substrate that comprises functional areas, the inside and the peripheral nonfunctional area that are functional areas 2 all cover packing colloid 4, easily understand, the height of colloid 4 is higher than functional areas 2, and both positive and negative polarity 3 regions of external pad can not be covered by colloid 4.

Above-mentioned is preferred embodiment, in other embodiments, is not limited to colloid to apply whole substrate, as long as coating functions district extend to the object that its peripheral nonfunctional area 2mm can reach free from flaw and disengaging between colloid edge and substrate above.

Claims

1. a LED packaging plastic coated structure, comprise LED base plate for packaging, on base plate for packaging, be provided for the functional areas of die bond and the both positive and negative polarity of external pad, it is characterized in that: more than packing colloid is coated on functional areas and extends to the nonfunctional area 2mm except external pad both positive and negative polarity of its periphery.

2. LED packaging plastic coated structure according to claim 1, is characterized in that: the upper surface of the whole substrate except external pad both positive and negative polarity is coated with packing colloid.