CN203503636U - Electronic component and package thereof - Google Patents
Electronic component and package thereof Download PDFInfo
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- CN203503636U CN203503636U CN201320430669.5U CN201320430669U CN203503636U CN 203503636 U CN203503636 U CN 203503636U CN 201320430669 U CN201320430669 U CN 201320430669U CN 203503636 U CN203503636 U CN 203503636U
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Abstract
An electronic component and its packaging part, the electronic component includes packaging part, component body, body of the cover and solidifies and glues, the packaging part has bearing surface, containing groove and channel, the containing groove is formed on the bearing surface, the channel connects containing groove and external environment, the component body connects the packaging part, the body of the cover disposes on the bearing surface, and cover containing groove and component body, solidify and glue and form on the bearing surface, connect body of the cover and packaging part, wherein solidify and glue and pack into in the channel; the utility model also discloses the packaging part that above-mentioned electronic component includes. The utility model utilizes the channel of the packaging part, which can not only discharge the fluid (such as air) in the electronic element in the heating process, so as to reduce the probability of the curing glue being broken; moreover, during the process of installing the packaging part, the curing glue can be automatically filled into the channel to seal the channel, so that moisture or dust can be prevented from entering the inside of the electronic element.
Description
Technical field
The utility model is to provide a kind of electronic component, refers to especially a kind of electronic component and packaging part thereof with encapsulating structure.
Background technology
There are now many chip packing-bodies with air chamber (air cavity), for example CMOS (Complementary Metal Oxide Semiconductor) image sensor (CMOS Image Sensor, CIS, hereinafter to be referred as CMOS image sensor).This chip packing-body has encapsulating shell, chip and support plate conventionally.Encapsulating shell has accommodation space, and encapsulating shell and chip are all installed (mount) on support plate, the whole chip of encapsulating shell cover cap wherein, so chip can position in accommodation space.After encapsulating shell and chip are installed on support plate, in accommodation space, can retain air, and form air chamber.
Encapsulating shell utilizes thermosetting colloid to carry out bonding support plate conventionally, and therefore, in carrying out the process of the bonding support plate of encapsulating shell, the encapsulating shell tentatively being glued by thermosetting colloid and support plate all can be placed in high temperature furnace, to heat and cured thermoset colloid.Generally speaking, encapsulating shell has steam vent, and in the process of heating, the air meeting expanded by heating in accommodation space, discharges from steam vent.So, can avoid thermosetting colloid to be racked by hot-air.
At thermosetting colloid, just solidified and glued after encapsulating shell and support plate, extraneous aqueous vapor and dust can enter from steam vent the accommodation space of encapsulating shell, thereby disturb the running of chip.Therefore, generally can in steam vent, insert curing glue, to seal (sealing) steam vent, thereby the aqueous vapor of preventing or dust enter in the accommodation space at chip place from steam vent.
Utility model content
The purpose of this utility model is to provide a kind of electronic component and packaging part thereof, and this electronic component comprises packaging part and curing glue, and wherein, in the process of installing packaging part, curing glue can automatically be inserted the passage of packaging part.
The utility model proposes a kind of packaging part, it has loading end, storage tank and passage, loading end is used for carrying lid, storage tank is formed at loading end, wherein after loading end carrying lid, lid can hide storage tank, and channel connection storage tank and external environment fill in passage and solidify glue.
In an embodiment of packaging part of the present utility model, it also comprises: a frame pedestal, has a frame mouth and a plane of being close to this frame mouth; An and ring-shaped platform, be configured on this frame pedestal, and there is this loading end and a breach, this ring-shaped platform protrudes from this plane, and this breach exposes this plane, and this loading end is positioned at this frame mouth around, this plane and this breach form this storage tank, wherein, after this loading end carries this lid, this lid hides this frame mouth, and this frame mouth is communicated with this storage tank.
In an embodiment of packaging part of the present utility model, this plane and this breach form this passage, and this storage tank is between this passage and this frame mouth, and the width of this passage the shortest width that is this breach.
In an embodiment of packaging part of the present utility model, this plane is an inclined plane, and this ring-shaped platform successively decreases towards this passage from this frame mouth with respect to the thickness of this plane.
In an embodiment of packaging part of the present utility model, this plane and this breach also form one with the groove of this external environment connect, this channel connection is between this groove and this storage tank.
In an embodiment of packaging part of the present utility model, also comprise a frame wall around this ring-shaped platform, this frame wall is configured on this frame pedestal, and protrude this loading end and this plane, wherein this frame wall has the air discharge duct that an internal face and is formed at this internal face, and this channel connection is between this air discharge duct and this storage tank.
In an embodiment of packaging part of the present utility model, also comprise that one is formed on the protuberance platform in this storage tank, wherein this protuberance platform is less than this ring-shaped platform with respect to the thickness of this plane with respect to the thickness of this plane, and this plane is between this protuberance platform and this frame mouth.
In an embodiment of packaging part of the present utility model, also comprise a frame wall around this ring-shaped platform, this frame wall is configured on this frame pedestal, and protrudes this loading end and this plane, and wherein this passage is formed between this frame wall and this frame pedestal.
In an embodiment of packaging part of the present utility model, this curing glue is utilize capillarity and insert in this passage.
In an embodiment of packaging part of the present utility model, the width of this passage is between 0.2 to 0.4mm.
A kind of electronic component of the another proposition of the utility model, it comprises above-mentioned packaging part, component body, above-mentioned lid and above-mentioned curing glue, component body connection package, lid is configured on loading end, and hide storage tank and component body, curing glue is formed on loading end, and connects lid and packaging part.
In an embodiment of electronic component of the present utility model, this packaging part comprises: a frame pedestal, has a frame mouth and a plane of being close to this frame mouth; An and ring-shaped platform, be configured on this frame pedestal, and there is this loading end and a breach, this ring-shaped platform protrudes from this plane, this breach exposes this plane, and this loading end is positioned at this frame mouth around, and this plane and this breach form this storage tank, wherein this lid hides this frame mouth, and this frame mouth is communicated with this storage tank.
In an embodiment of electronic component of the present utility model, this plane and this breach form this passage, and this storage tank is between this passage and this frame mouth, and the width of this passage the shortest width that is this breach.
In an embodiment of electronic component of the present utility model, this plane is an inclined plane, and this ring-shaped platform successively decreases towards this passage from this frame mouth with respect to the thickness of this plane.
In an embodiment of electronic component of the present utility model, this plane and this breach also form one with the groove of this external environment connect, this channel connection is between this groove and this storage tank.
In an embodiment of electronic component of the present utility model, this packaging part also comprises a frame wall around this ring-shaped platform, this frame wall is configured on this frame pedestal, and protrude this loading end and this plane, wherein this frame wall has the air discharge duct that an internal face and is formed at this internal face, and this channel connection is between this air discharge duct and this storage tank.
In an embodiment of electronic component of the present utility model, this packaging part also comprises that one is formed on the protuberance platform in this storage tank, wherein this protuberance platform is less than this ring-shaped platform with respect to the thickness of this plane with respect to the thickness of this plane, and this plane is between this protuberance platform and this frame mouth.
In an embodiment of electronic component of the present utility model, this packaging part also comprises a frame wall around this ring-shaped platform, and this frame wall is configured on this frame pedestal, and protrudes this loading end and this plane, and wherein this passage is formed between this frame wall and this frame pedestal.
In an embodiment of electronic component of the present utility model, this component body comprises a chip and a support plate, and this chip is installed in this support plate, and this lid hides this chip.
In an embodiment of electronic component of the present utility model, this chip is photoelectric chip, and this lid is transparent panel.
In an embodiment of electronic component of the present utility model, this curing glue is utilize capillarity and insert in this passage.
In an embodiment of electronic component of the present utility model, the width of this passage is between 0.2 to 0.4mm.
Based on said structure, the utility model utilizes the passage of above packaging part, not only can in the process of heating, discharge the fluid (for example air) in electronic component, to reduce, the probability that glue is racked occurs to solidify; And in the process of installing packaging part, curing glue can automatically be inserted passage, with seal channel, thereby the aqueous vapor of preventing or dust enter the inside of electronic component.
The explanation of following execution mode is in order to give an example and to explain feature of the present utility model, and provides protection range of the present utility model to be further explained.For feature of the present utility model and effect can be become apparent, special embodiment below, and coordinate accompanying drawing, be described in detail below.
Accompanying drawing explanation
Figure 1A is the schematic perspective view of the electronic component of the utility model one embodiment;
Figure 1B is the decomposing schematic representation of the electronic component in Figure 1A;
Fig. 1 C is the enlarged diagram of region A in Figure 1B;
Fig. 1 D is the generalized section of Fig. 1 C;
Fig. 2 A is the schematic perspective view of the electronic component of another embodiment of the utility model;
Fig. 2 B is the generalized section that in Fig. 2 A, I-I section along the line is drawn.
[main element description of reference numerals]
100,200: electronic component
110,210: packaging part
112,212: frame pedestal
112s, 212s: plane
114,214: ring-shaped platform
114a: elongated end
116,216: frame wall
116s: internal face
120: component body
122: chip
124: support plate
130: lid
150: solidify glue
212m: protuberance platform
C1, C2: passage
H1: frame mouth
R1, R4: storage tank
R2: air discharge duct
R3: groove
S1, S2: loading end
S3: end face
Embodiment
Figure 1A is the schematic perspective view of the electronic component of the utility model one embodiment, and Figure 1B is the decomposing schematic representation of the electronic component in Figure 1A.Refer to Figure 1A and Figure 1B, electronic component 100 comprises packaging part 110, component body 120 and lid 130.Lid 130 is installed on packaging part 110, and lid 130 and packaging part 110 can be integrated into the cover cap (lid) of an encapsulation use, wherein lid 130 can be metal-back or plastic casing, and the lid 130 that constituent material is plastic cement can be made via the mode of ejection formation.Component body 120 connection packages 110, and can utilize the mode of gluing (adhesive) to carry out connection package 110, so that component body 120 combines with packaging part 110.
With regard to structure, chip 122 can be the integrated circuit component (integrated circuit component, IC component) of packaged (packaged) or the crystal grain (die) that does not pass through encapsulation.With regard to function, chip 122 can be photoelectric chip (optoelectronic chip), it is for example for receiving the optical sensing chip of light, or be used for the luminescence chip of emission of light, wherein above-mentioned light can be visible ray (visible light) or invisible light (invisible light, for example infrared light or ultraviolet light).
Because chip 122 can be above-mentioned photoelectric chip, so chip 122 can be CMOS (Complementary Metal Oxide Semiconductor) image sensing chip (CMOS image sensing chip), charge coupled cell (Charge-Coupled Device, CCD), near-infrafed photodiodes, photo resistance, photoelectric crystal, light-emitting diode (Light Emitting Diode, LED) or laser diode (Laser Diode, LD).In addition, chip 122 can be also to utilize UV-irradiation to carry out the Erasable Programmable Read Only Memory EPROM of obliterated data (Erasable Programmable Read Only Memory, EPROM).
Except photoelectric chip, chip 122 can be also the element of other types.For instance, electronic component 100 can be applied to Display Technique field, projection display technique field for example, and chip 122 can be liquid crystal over silicon (Liquid Crystal On Silicon, LCOS) or digital micromirror device (Digital Micromirror Device, DMD), wherein above-mentioned digital micromirror device can be applied to current digital light and process (Digital Light Processing, DLP) projector or laser projector.Therefore, electronic component 100 can be a kind of projection display element.
Based on above explanation, the kind of electronic component 100 has multiple.For example, electronic component 100 can be photoelectric cell, projection display element, MEMS devices (MEMS device) or the oscillator containing photoelectric chip.Electronic component 100 shown in Figure 1A and Figure 1B is to using photoelectric cell as embodiment, but it must be emphasized that, except photoelectric cell, electronic component 100 can be also the element of other kinds.The utility model does not limit kind, function and the purposes of electronic component 100.
In the electronic component 100 shown in Figure 1A and Figure 1B, packaging part 110 is in order to carry lid 130.Packaging part 110 has loading end S1, and lid 130 is configured in loading end S1 above, and wherein lid 130 can utilize the mode of gluing to be fixed on loading end S1.Packaging part 110 also has storage tank R1 and air discharge duct R2, and wherein storage tank R1 is communicated with air discharge duct R2, and storage tank R1 is formed at loading end S1.From Figure 1B, storage tank R1 is exposed to loading end S1, and can be considered the depression that is positioned at loading end S1.
As shown in Figure 1A, after lid 130 is configured on loading end S1, lid 130 can hide storage tank R1 and component body 120, and air discharge duct R2 is still exposed to lid 130 sides, and is communicated in external environment and storage tank R1.Therefore, even if lid 130 hides storage tank R1, storage tank R1 still can be via air discharge duct R2 and external environment connect, and is positioned at the fluid (fluid) of storage tank R1, and for example air, can flow to external environment from air discharge duct R2.
In the present embodiment, the global shape of packaging part 110 can be shaped as frame.Particularly, packaging part 110 can comprise frame pedestal 112 and ring-shaped platform 114, and wherein ring-shaped platform 114 is configured on frame pedestal 112.Frame pedestal 112 has frame mouth H1, and chip 122 be positioned at frame mouth H1 under.Ring-shaped platform 114 has loading end S1, and can be around frame mouth H1, and wherein loading end S1 is positioned at frame mouth H1 around, and can be close to frame mouth H1, as shown in Figure 1B.
In addition, from Figure 1B, ring-shaped platform 114 also has breach, and the general shape of ring-shaped platform 114 can similarly be C shape ring, and wherein this breach and frame pedestal 112 can form storage tank R1.In other words, the breach position of ring-shaped platform 114 is to be positioned at storage tank R1.In addition, packaging part 110 can also comprise frame wall 116, and frame wall 116 is configured on frame pedestal 112.Frame wall 116 be shaped as shaped as frame, and frame wall 116 is around ring-shaped platform 114 and frame mouth H1, and has air discharge duct R2, as shown in Figure 1B.
After lid 130 is configured on loading end S1, lid 130 not only hides chip 122 and storage tank R1, but also covering frame mouth H1 wherein between lid 130 and support plate 124, can form the accommodation space containing frame mouth H1, and chip 122 meeting positions is in this accommodation space.Now, storage tank R1 is not only communicated with air discharge duct R2, and is communicated with the frame mouth H1 of lid 130 belows, and air discharge duct R2 is communicated in the accommodation space at frame mouth H1 and said chip 122 places via storage tank R1.Therefore, the fluid in accommodation space (for example air) can flow to external environment from air discharge duct R2 via storage tank R1.
Fig. 1 C is the enlarged diagram of region A in Figure 1B, and Fig. 1 D is the generalized section of Fig. 1 C.Refer to Fig. 1 C and Fig. 1 D, packaging part 110 also has the channel C 1 that is formed at loading end S1.Channel C 1 is communicated between storage tank R1 and recess R 3, and recess R 3 is communicated with air discharge duct R2, be that channel C 1 and recess R 3 are communicated between air discharge duct R2 and storage tank R1, so that storage tank R1, channel C 1 and recess R 3 all can be communicated in external environment from air discharge duct R2.Profile at lid 130(Fig. 1 D with dotted lines lid 130) after being configured on loading end S1, the fluid that is positioned at the accommodation space at chip 122 places can sequentially flow to external environment via storage tank R1, channel C 1 and recess R 3 from air discharge duct R2, as shown in Fig. 1 D.
In the embodiment shown in Fig. 1 C and Fig. 1 D, frame pedestal 112 also has the plane 112s of contiguous frame mouth H1, and ring-shaped platform 114 protrudes from plane 112s, the breach exposed planes 112s of ring-shaped platform 114 wherein, and this breach and plane 112s can form storage tank R1, channel C 1 and recess R 3.In addition, frame wall 116 protrudes loading end S1 and plane 112s, and its center wall 116 has internal face 116s, and air discharge duct R2 is formed at internal face 116s, as shown in Fig. 1 C and Fig. 1 D.
Particularly, ring-shaped platform 114 also has a pair of elongated end 114a.These elongated ends 114a is all positioned at above-mentioned indentation, there, and this is to there being gap (gap) between elongated end 114a, and wherein the plane 112s of this gap and its below can form channel C 1, as shown in Figure 1 C.From Fig. 1 C, storage tank R1 position between channel C 1 and frame mouth H1, and this to elongated end 114a all between recess R 3 and storage tank R1, the shortest width that wherein width of channel C 1 is above-mentioned breach.
The mode that lid 130 can stick with glue is fixed on loading end S1.Specifically, electronic component 100 also comprises curing glue 150.Solidifying glue 150 is formed on loading end S1, and connect lid 130 and packaging part 110, the method that wherein forms curing glue 150 can be coating (applying) or laminating (lamination), and solidify glue 150, before solidifying, can be liquid glue material, paste glue material (for example Bingham fluid, Bingham plastic) or semi-solid preparation film (prepreg).In addition, solidify glue 150 and can contain epoxy resin (epoxy), and can there is thermosetting or the curing characteristic of irradiation, so solidify glue 150, can be thermosetting colloid or photo-curable colloid (for example, ultraviolet cured adhesive).
In the present embodiment, solidifying glue 150 is thermosetting resin.Before the glue 150 that is heating and curing, solidifying glue 150 is in B state (B-stage).Although the curing glue 150 under B state has mobility, mobility is on the low side, as glue or Bingham fluid.Lid 130 is being installed in the flow process on loading end S1, and after lid 130 is disposed at the curing glue 150 on loading end S1, the glue 150 that is heating and curing, solidifies so that solidify glue 150, allows curing glue 150 be connected lid 130 and packaging part 110.
In the process of glue 150 that is heating and curing, when the temperature of curing glue 150 does not reach glass transition temperature (glass transition temperature, Tg), solidify glue 150 and still keep mobility on the low side.Now, solidifying glue 150 is only configured on loading end S1, and be not configured in channel C 1, recess R 3, air discharge duct R2 and storage tank R1, so channel C 1, recess R 3, air discharge duct R2 and storage tank R1 still communicate with each other, to such an extent as to fluid (for example air) in the accommodation space at chip 122 places can expanded by heating and be discharged into external environment via storage tank R1, channel C 1, recess R 3 and air discharge duct R2.
When the temperature of curing glue 150 reaches glass transition temperature, the mobility of solidifying glue 150 can improve, to such an extent as to solidify glue 150, is subject to the impact of gravity and flows to storage tank R1, recess R 3 and channel C 1 from loading end S1.When solidifying glue 150 in the good state of above-mentioned mobility, the cohesive force that solidifies glue 150 is less than the adhesive force solidifying between glue 150 and channel C 1 hole wall, and channel C 1 has quite little width, and it is for example between 0.2 to 0.4mm.Now, at curing glue 150 along with the fluid in accommodation space flows and when flowing to channel C 1, solidify between glue 150 and channel C 1 capillarity (capillary action) can occur, and utilize this capillarity, solidifying glue 150 can automatically fill in channel C 1.
From the above, after the temperature of solidifying glue 150 surpasses glass transition temperature, continuous heating solidifies glue 150, so that solidify glue 150 in C state (C-stage).Once solidify glue 150 in C state, solidify glue 150 and can occur to solidify (curing), and connect lid 130 and packaging part 110, and sealing (sealing) channel C 1.So, solidify glue 150 and can stop that extraneous aqueous vapor and dust enter the inside of electronic component 100 from channel C 1, to avoid interference the running of chip 122.
Hence one can see that, compared to the existing encapsulating shell with steam vent, in the process of the curing glue 150 in heating the present embodiment, solidify the capillarity occurring between glue 150 and channel C 1 and can help curing glue 150 automatically to insert in channel C 1, and seal channel C1.So, the present embodiment can be saved over and in steam vent, inserted the step of solidifying glue, and then shortens the time of manufacturing electronic component 100.
But, it should be noted that, the present embodiment is to utilize capillarity to make to solidify glue 150 automatically to fill in channel C 1, but in other embodiment of the present utility model, solidifies glue 150 and also can adopt capillarity means in addition automatically to fill in channel C 1.For example, solidifying glue 150 can automatically fill in channel C 1 according to hydromechanical principle, so the utility model does not limit only to come automatically to solidify glue 150 with the means of capillarity, does not fill in channel C 1.
In addition, curing glue 150 solidify and seal channel C1 after, the fluid (for example air) that is positioned at the accommodation space at chip 122 places is understood some and has been discharged outside to environment.Therefore,, after electronic component 100 has been manufactured, chip 122 can be in atmospheric pressure sealed environment on the low side.So, when the electronic component 100 of having manufactured is heated again, for example electronic component 100 is placed in reflow stove (reflowing oven), although the fluid meeting expanded by heating in above-mentioned accommodation space, but due to original fluid, some is lost to external environment, to such an extent as at this time the volume recruitment of fluid expanded by heating is lowered, thereby reduce the pressure variety in accommodation space.So, can help to reduce electronic component 100 situation of explosion occurs because being heated.
In addition, in the present embodiment, plane 112s can be inclined plane.From Fig. 1 C and Fig. 1 D, can find out, ring-shaped platform 114 is to successively decrease towards channel C 1 from frame mouth H1 with respect to the thickness of plane 112s.That is to say, plane 112s in channel C 1 with the height (level) at recess R 3 places higher than the height near frame mouth H1 place.Therefore,, when the good curing glue 150 of mobility is when plane 112s is upper, solidify glue 150 and can be subject to the impact of gravity and flow towards frame mouth H1.In addition, the plane 112s of this inclination can utilize gravity, the curing glue 150 guide channel C1 that are positioned at recess R 3 places are flowed, so that solidify glue 150 energy backfills in channel C 1, thus increase the effect of solidifying glue 150 seal channel C1.
Fig. 2 A is the schematic perspective view of the electronic component of another embodiment of the utility model, and Fig. 2 B is the generalized section that in Fig. 2 A, I-I section along the line is drawn.Refer to Fig. 2 A and Fig. 2 B, electronic component 200 and electronic component 100 both structural similarities of the present embodiment, effect is identical.For example, electronic component 200 comprises packaging part 210, and packaging part 210 comprises frame pedestal 212, ring-shaped platform 214 and frame wall 216.Frame pedestal 212 also has frame mouth (Fig. 2 A and Fig. 2 B all do not indicate), and ring-shaped platform 214 is all configured on frame pedestal 212 with frame wall 216, and all protrudes the plane 212s of frame pedestal 212.Frame wall 216 is around ring-shaped platform 214, and protrudes loading end S2.In addition, ring-shaped platform 214 also has breach, and the storage tank R4 of packaging part 210 is formed in this breach.
For packaging part 210 and packaging part 110 difference between the two, below cooperation Fig. 2 A and Fig. 2 B are elaborated.As for packaging part 210 and 110 both identical features, it is no longer repeated, also do not repeat to illustrate.
Be different from the packaging part 110 in previous embodiment, the packaging part 210 of the present embodiment also comprises protuberance platform 212m, and plane 212s in Fig. 2 A and Fig. 2 B is horizontal plane, is not inclined plane, its midplane 212s is between protuberance platform 212m and frame mouth, as shown in Figure 2 A.Protuberance platform 212m is formed in storage tank R4, and wherein protuberance platform 212m is less than ring-shaped platform 214 with respect to the thickness of plane 212s with respect to the thickness of plane 212s.Therefore, protuberance platform 212m can protrude plane 212s, and ring-shaped platform 214 can protrude the end face S3 of protuberance platform 212m.So, protuberance platform 212m and plane 212s can form ladder (stair) structure.Hierarchic structure can make the storage tank R4 can the accommodating curing glue 150 flowing down from loading end S2, and can slow down and solidify glue 150 and continue to flow toward frame mouth, thereby reduce chip 122(, please refer to Figure 1B) be stained with the probability of solidifying glue 150.
In the present embodiment, the structure of channel C 2 is different from the structure of the channel C 1 in previous embodiment.Specifically, in the embodiment shown in Fig. 2 A and Fig. 2 B, packaging part 210 does not have recess R 3 as packaging part 110, and channel C 2 is formed between frame wall 216 and frame pedestal 212, wherein channel C 2 also can be formed between protuberance platform 212m and frame wall 216, as shown in Figure 2 A.Channel C 2 can be the perforation (through hole) of packaging part 210, and a wherein port of channel C 2 is exposed to the breach of ring-shaped platform 214, and another port is exposed to the surface of frame wall 216, as shown in Figure 2 B.In addition, channel C 2 can form by the mode of laser processing or machining (mechanism process).For example, channel C 2 can form with machine drilling or laser drilling.
From the above, in the process of glue 150 that is tentatively heating and curing, chip 122(please refer to Figure 1B) fluid (for example air) in the accommodation space at place can expanded by heating and from storage tank R4 and channel C 2 discharges.Compare with the packaging part 110 in previous embodiment, the internal flow of the electronic component 200 in the present embodiment can directly be discharged outside to environment from channel C 2, and therefore in the present embodiment, packaging part 210 can please refer to Fig. 1 C without any need for air discharge duct R2().Yet in other embodiments, the frame wall 216 in Fig. 2 A also can have air discharge duct R2.
The width of the channel C 2 in the present embodiment is identical with the width of the channel C 1 in previous embodiment, and when the temperature of curing glue 150 reaches glass transition temperature, the cohesive force that solidifies glue 150 is less than the adhesive force solidifying between glue 150 and channel C 2 hole walls.Therefore, solidify between glue 150 and channel C 2 capillarity can occur, and utilize this capillarity, mobile curing glue 150 also can automatically fill in channel C 2.So, solidify glue 150 and can not only connection package 210 after solidifying please refer to Figure 1A and Figure 1B with lid 130(), and channel C 2 can also be sealed.In addition, after curing glue 150 seal channel C2, chip 122 also can be in atmospheric pressure sealed environment on the low side, to help reducing electronic component 200, the situation of explosion occurs because being heated.
In sum, in electronic component of the present utility model, packaging part can utilize above-mentioned passage to discharge the fluid (for example air) in accommodation space, and wherein this accommodation space is formed between packaging part and component body.So, in the process of heating, air in accommodation space can expanded by heating and discharge from through hole, to reduce, the probability that glue is racked occurs to solidify.Secondly, the utility model can utilize the capillarity occurring between curing glue and passage to help solidify glue and automatically insert passage, with seal channel.Compare with the existing encapsulating shell with steam vent, the utility model can be saved over and in steam vent, inserted the step of solidifying glue, and then shortens the time of manufacturing electronic component.
The foregoing is only the utility model preferred embodiment, can not limit with this scope of patent protection of this case, the equalization of therefore doing according to this specification changes or modifies, and still belongs to the scope that the utility model is contained.
Claims (22)
1. a packaging part, is characterized in that, this packaging part has:
One loading end, for carrying a lid;
One storage tank, is formed at this loading end, and wherein, after this loading end carries this lid, this lid hides this storage tank; And
One passage, is communicated with this storage tank and an external environment, wherein utilizes a curing glue to fill in this passage.
2. packaging part as claimed in claim 1, is characterized in that, comprising:
One frame pedestal, has a frame mouth and a plane of being close to this frame mouth; And
One ring-shaped platform, be configured on this frame pedestal, and there is this loading end and a breach, this ring-shaped platform protrudes from this plane, and this breach exposes this plane, and this loading end is positioned at this frame mouth around, this plane and this breach form this storage tank, wherein, after this loading end carries this lid, this lid hides this frame mouth, and this frame mouth is communicated with this storage tank.
3. packaging part as claimed in claim 2, is characterized in that, this plane and this breach form this passage, and this storage tank is between this passage and this frame mouth, and the width of this passage the shortest width that is this breach.
4. packaging part as claimed in claim 3, is characterized in that, this plane is an inclined plane, and this ring-shaped platform successively decreases towards this passage from this frame mouth with respect to the thickness of this plane.
5. packaging part as claimed in claim 3, is characterized in that, this plane and this breach also form one with the groove of this external environment connect, this channel connection is between this groove and this storage tank.
6. packaging part as claimed in claim 3, it is characterized in that, also comprise a frame wall around this ring-shaped platform, this frame wall is configured on this frame pedestal, and protrude this loading end and this plane, wherein this frame wall has the air discharge duct that an internal face and is formed at this internal face, and this channel connection is between this air discharge duct and this storage tank.
7. packaging part as claimed in claim 2, it is characterized in that, also comprise that one is formed on the protuberance platform in this storage tank, wherein this protuberance platform is less than this ring-shaped platform with respect to the thickness of this plane with respect to the thickness of this plane, and this plane is between this protuberance platform and this frame mouth.
8. packaging part as claimed in claim 7, is characterized in that, also comprises a frame wall around this ring-shaped platform, and this frame wall is configured on this frame pedestal, and protrudes this loading end and this plane, and wherein this passage is formed between this frame wall and this frame pedestal.
9. packaging part as claimed in claim 1, is characterized in that, this curing glue is utilize capillarity and insert in this passage.
10. packaging part as claimed in claim 1, is characterized in that, the width of this passage is between 0.2 to 0.4mm.
11. 1 kinds of electronic components, is characterized in that, this electronic component comprises:
One packaging part, has:
One loading end;
One storage tank, is formed at this loading end;
One passage, is communicated with this storage tank and an external environment;
One component body, connects this packaging part;
One lid, is configured on this loading end, and hides this storage tank and this component body; And
One solidifies glue, is formed on this loading end, and connects this lid and this packaging part, and wherein this curing glue fills in this passage.
12. electronic components as claimed in claim 11, is characterized in that, this packaging part comprises:
One frame pedestal, has a frame mouth and a plane of being close to this frame mouth; And
One ring-shaped platform, be configured on this frame pedestal, and there is this loading end and a breach, this ring-shaped platform protrudes from this plane, this breach exposes this plane, and this loading end is positioned at this frame mouth around, and this plane and this breach form this storage tank, wherein this lid hides this frame mouth, and this frame mouth is communicated with this storage tank.
13. electronic components as claimed in claim 12, is characterized in that, this plane and this breach form this passage, and this storage tank is between this passage and this frame mouth, and the width of this passage the shortest width that is this breach.
14. electronic components as claimed in claim 13, is characterized in that, this plane is an inclined plane, and this ring-shaped platform successively decreases towards this passage from this frame mouth with respect to the thickness of this plane.
15. electronic components as claimed in claim 13, is characterized in that, this plane and this breach also form one with the groove of this external environment connect, this channel connection is between this groove and this storage tank.
16. electronic components as claimed in claim 13, it is characterized in that, this packaging part also comprises a frame wall around this ring-shaped platform, this frame wall is configured on this frame pedestal, and protrude this loading end and this plane, wherein this frame wall has the air discharge duct that an internal face and is formed at this internal face, and this channel connection is between this air discharge duct and this storage tank.
17. electronic components as claimed in claim 12, it is characterized in that, this packaging part also comprises that one is formed on the protuberance platform in this storage tank, wherein this protuberance platform is less than this ring-shaped platform with respect to the thickness of this plane with respect to the thickness of this plane, and this plane is between this protuberance platform and this frame mouth.
18. electronic components as claimed in claim 17, it is characterized in that, this packaging part also comprises a frame wall around this ring-shaped platform, and this frame wall is configured on this frame pedestal, and protrude this loading end and this plane, wherein this passage is formed between this frame wall and this frame pedestal.
19. electronic components as claimed in claim 11, is characterized in that, this component body comprises a chip and a support plate, and this chip is installed in this support plate, and this lid hides this chip.
20. electronic components as claimed in claim 19, it is characterized in that, this chip is photoelectric chip, and this lid are transparent panels.
21. electronic components as claimed in claim 11, is characterized in that, this curing glue is utilize capillarity and insert in this passage.
22. electronic components as claimed in claim 11, is characterized in that, the width of this passage is between 0.2 to 0.4mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102212502U TWM468011U (en) | 2013-07-03 | 2013-07-03 | Electronic component and its package |
| TW102212502 | 2013-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203503636U true CN203503636U (en) | 2014-03-26 |
Family
ID=50155653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320430669.5U Expired - Fee Related CN203503636U (en) | 2013-07-03 | 2013-07-18 | Electronic component and package thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203503636U (en) |
| TW (1) | TWM468011U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110164829A (en) * | 2019-03-04 | 2019-08-23 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint mould group |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017127023A1 (en) * | 2016-01-20 | 2017-07-27 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having fluid permeable channels and methods for manufacturing the same |
| US11515220B2 (en) | 2019-12-04 | 2022-11-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structures and methods of manufacturing the same |
-
2013
- 2013-07-03 TW TW102212502U patent/TWM468011U/en not_active IP Right Cessation
- 2013-07-18 CN CN201320430669.5U patent/CN203503636U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110164829A (en) * | 2019-03-04 | 2019-08-23 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint mould group |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM468011U (en) | 2013-12-11 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140326 Termination date: 20160718 |