CN110164829A - Waterproof fingerprint mould group - Google Patents
Waterproof fingerprint mould group Download PDFInfo
- Publication number
- CN110164829A CN110164829A CN201910161834.3A CN201910161834A CN110164829A CN 110164829 A CN110164829 A CN 110164829A CN 201910161834 A CN201910161834 A CN 201910161834A CN 110164829 A CN110164829 A CN 110164829A
- Authority
- CN
- China
- Prior art keywords
- becket
- base plate
- mould group
- circuit base
- waterproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011241 protective layer Substances 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 238000012797 qualification Methods 0.000 abstract description 2
- 208000028659 discharge Diseases 0.000 description 34
- 239000007789 gas Substances 0.000 description 25
- 230000000694 effects Effects 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 238000001723 curing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Casings For Electric Apparatus (AREA)
- Input From Keyboards Or The Like (AREA)
Abstract
Waterproof fingerprint mould group provided by the invention, is related to fingerprint mould technical group field.The waterproof fingerprint mould group includes becket, fingerprint chip and circuit base plate.Fingerprint chip is connected on circuit base plate, and becket is connect with circuit base plate, and fingerprint chip is located on the inside of becket.Becket extends to form protruding portion far from one end of circuit base plate radially inwards, and protruding portion lid is located at the top edges of fingerprint chip；At least one air discharge duct is offered on protruding portion.The waterproof fingerprint mould group has good waterproof performance, and during glue-line baking-curing, gas can be discharged from air discharge duct, improves product qualification rate.
Description
Technical field
The present invention relates to fingerprint mould technical group fields, in particular to a kind of waterproof fingerprint mould group.
Background technique
In conventional fingerprint module design, becket is isolated with inside complete machine by rubberizing, realizes the waterproof inside complete machine.
But in actual production manufacturing process, becket, fingerprint chip and circuit base plate will form one after glue and glue-line bonding
A seal cavity, during baking-curing, gas meeting expanded by heating in seal cavity generates following bad risk:
Becket is inflated gas support greatly and rises, and glue-line and glue are inflated gas and wash open, influences becket and route
The connection effect of substrate seriously affects the waterproof performance of fingerprint mould group.
Summary of the invention
The purpose of the present invention includes providing a kind of waterproof fingerprint mould group, gas can be kept smooth during baking-curing
Discharge avoids in seal cavity when gases are heated, they expand from generating bad risk.
It is that it is realized by adopting the following technical scheme that the present invention, which improves its technical problem,.
A kind of waterproof fingerprint mould group provided by the invention, including becket, fingerprint chip and circuit base plate.
The fingerprint chip is connected on the circuit base plate, and the becket is connect with the circuit base plate, the finger
Line chip is located on the inside of the becket.
The becket extends to form protruding portion, the protruding portion lid far from one end of the circuit base plate radially inwards
It is located at the top edges of the fingerprint chip；At least one air discharge duct is offered on the protruding portion, it is described for that will be sealed in
Gas on the inside of becket is discharged outside to.
Further, the air discharge duct is provided with the protruding portion close to the side of the fingerprint chip.
Further, there are gap, the air discharge ducts between the inner wall of the becket and the edge of the fingerprint chip
With the gap area.
Further, the quantity of the air discharge duct is multiple, and multiple air discharge ducts are along the circumferential uniform of the becket
Interval setting.It further, further include protective layer, the protective layer is covered on the fingerprint chip far from the circuit base plate
Side, the protruding portion lid are located at the edge of the protective layer, and the air discharge duct is provided with the protruding portion close to the protection
The side of layer.
Further, the becket includes endless wall and male part, and the protruding parts are remote in the endless wall
One end from the circuit base plate, the male part are located at the endless wall close to one end of the circuit base plate；It is described outer
Protrusion is extended along the endless wall radially towards outside.
Further, the male part includes the upper and lower surfaces being oppositely arranged, the lower surface and the route
Substrate bonding.
It further, further include casing, the casing offers installation through-hole, described for accommodating the endless wall
The upper surface of male part is fixedly connected with the casing.
Further, the inside of the endless wall and the male part junction are equipped with chamfering.
Further, it is connected between the fingerprint chip and the circuit base plate by conductive material, the conductive material
Periphery be equipped with sealing glue.
Waterproof fingerprint mould group provided by the invention have the following aspects the utility model has the advantages that
Waterproof fingerprint mould group provided by the invention, the one end of becket far from circuit base plate extend to form prominent radially inwards
Portion out by the way that protruding portion is arranged in the upper end of becket, and enables protruding portion to cover the top edges of fingerprint chip, plays
The function of covering type waterproof.Meanwhile air discharge duct is opened up over the projections, during baking-curing, air discharge duct can guide gas
Body is smoothly discharged outside complete product, avoids in seal cavity when gases are heated, they expand from generating bad risk, is conducive to improve product
Quality improves production qualification rate.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the schematic diagram of the section structure for the waterproof fingerprint mould group that the specific embodiment of the invention provides；
Fig. 2 is the partial enlarged view in Fig. 1 at A；
Fig. 3 is the overall structure diagram of the becket for the waterproof fingerprint mould group that the specific embodiment of the invention provides.
Icon: 100- waterproof fingerprint mould group；101- casing；110- circuit base plate；120- fingerprint chip；130- protective layer；
140- conductive material；150- becket；151- protruding portion；153- air discharge duct；155- endless wall；157- male part；161- glue
Layer；163- seals glue.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
In the description of the present invention, it is to be understood that, the orientation or positional relationship of the instructions such as term " on ", "lower" is base
In orientation or positional relationship shown in the drawings or product of the present invention using when the orientation or positional relationship usually put, or
Person is the orientation or positional relationship that those skilled in the art usually understand, is merely for convenience of description of the present invention and simplification of the description,
Rather than the equipment or element of indication or suggestion meaning must have a particular orientation, is constructed and operated in a specific orientation, because
This is not considered as limiting the invention.
" first " of the invention, " second " etc., are only used to distinguish between description, have no special meaning.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be
It is connected directly, it can also be indirectly connected through an intermediary.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Fig. 1 is the schematic diagram of the section structure for the waterproof fingerprint mould group 100 that the specific embodiment of the invention provides, and please refers to Fig. 1.
A kind of waterproof fingerprint mould group 100 provided in this embodiment, including casing 101, becket 150, protective layer 130, refer to
Line chip 120 and circuit base plate 110.Fingerprint chip 120 is connected on circuit base plate 110, and protective layer 130 is covered on fingerprint chip
120 sides far from circuit base plate 110, becket 150 are connect with circuit base plate 110, and fingerprint chip 120 and protective layer
130 are respectively positioned on the inside of becket 150.Becket 150 extends to form protrusion far from one end of circuit base plate 110 radially inwards
Portion 151, protruding portion 151 cover the top edges for setting fingerprint chip 120, and optionally, protruding portion 151 covers the side for being located at protective layer 130
Edge offers at least one air discharge duct 153 on protruding portion 151, and air discharge duct 153 will be for that will be sealed in 150 inside of becket
Gas be discharged outside to.In actual production manufacturing process, it is related to baking-curing technique, complete machine inside is (in such as becket 150
Side) when gases are heated, they expand, and due to offering air discharge duct 153, the gas in complete machine can be expelled to complete product along air discharge duct 153
Outside, so that gas be avoided to destroy 150 structure of becket in complete machine, or the connection effect of becket 150 and circuit base plate 110 is destroyed
Fruit.
Fingerprint chip 120 is fixed on circuit base plate 110 by conductive material 140, and the border of fingerprint chip 120 uses glue
Water-stop to protect conductive material 140, while realizing that the part that circuit base plate 110 is connect with fingerprint chip 120 has waterproof function
Energy.Protective layer 130 is covered on the upper surface of fingerprint chip 120, plays a protective role to fingerprint chip 120.
Fig. 2 is the partial enlarged view in Fig. 1 at A, referring to figure 2..
Specifically, becket 150 further includes endless wall 155 and male part 157, protruding portion 151 is located at endless wall 155
Close to one end of protective layer 130, radially inside extension of the protruding portion 151 to endless wall 155 covers in the outer of protective layer 130
Edge blocks the gap of 155 inside of fingerprint chip 120 and endless wall, can not only play waterproof and dustproof effect, also have
There is aesthetic appeal.Male part 157 is located at the one end of endless wall 155 far from protruding portion 151, and male part 157 is along annular
Wall body 155 is extended radially towards outside.Male part 157 includes the upper and lower surfaces being oppositely arranged, lower surface and line
Base board 110 is bonded, and upper surface is Nian Jie with casing 101.
Preferably, in the present embodiment, it is equipped with glue-line 161 between the lower surface and circuit base plate 110 of male part 157, realizes
Lower surface is bonding with circuit base plate 110.Glue-line 161, table in realization are equipped between the upper surface and casing 101 of male part 157
Face is bonding with casing 101.It is readily appreciated that, installation through-hole is offered on casing 101, installation through-hole is for accommodating endless wall
155, i.e. the endless wall 155 of becket 150 and protruding portion 151 is respectively positioned in the installation through-hole of casing 101.Also, evagination
The upper surface in portion 157 is bonded with casing 101 by glue-line 161, is achieved a fixed connection.
Optionally, the inside of endless wall 155 and 157 junction of male part are equipped with chamfering, in order in conductive material 140
Border filling with sealant water 163, realize sealing, play waterproof action.Preferably, chamfering is 45 degree of chamferings, certainly, and not only
It is limited to this, can also be rounded corner or other structures form, be not especially limited here.Due to endless wall 155 inside with
There is certain gap between the outer rim of fingerprint chip 120, when glue-line 161 is arranged in the lower surface of male part 157 and circuit base plate 110
The border filling glue sealing of gluing, sealing, the border of fingerprint chip 120 and conductive material 140, the covering of protruding portion 151 are being protected
The outer edge of sheath 130 and after being bonded with protective layer 130, so that the seam between the inside of endless wall 155 and fingerprint chip 120
Gap forms one section of seal cavity.In the present embodiment, at least one air discharge duct 153 is opened up on protruding portion 151, so that air discharge duct
153 are connected to the seal cavity.In gas in baking and cure stage, complete machine, and sealing glue 163, glue-line 161
Gas can will not cause bad shadow to be discharged to outside complete machine from seal cavity by air discharge duct 153 to complete machine structure
It rings, forms preferable waterproof effect.
It is readily appreciated that, if the intracorporal gas of seal chamber cannot be smoothly discharged to complete machine, it is possible that:
Seal chamber is intracorporal, and when gases are heated, they expand, supports big by becket 150 and rises, and glue-line 161 and glue are inflated gas
Body is washed open, and sealing performance is seriously destroyed；It also will affect the connection effect between becket 150 and circuit base plate 110 simultaneously, or
After the glue of 140 border of conductive material is rushed to open, the conductive material 140 of complete machine inside and the bottom of fingerprint chip 120 is exposed,
It is communicated with the outside world, waterproof performance is seriously affected.
Fig. 3 is the overall structure signal of the becket 150 for the waterproof fingerprint mould group 100 that the specific embodiment of the invention provides
Figure, referring to figure 3..
By opening up at least one air discharge duct 153 on protruding portion 151 in the present embodiment, conveniently dexterously overcome above-mentioned
Defect, processing and fabricating is convenient, simple process, good reliability, and while realizing gas discharge, it is good to be also able to achieve complete product
Waterproof effect.
Specifically, in the present embodiment, air discharge duct 153 is provided with protruding portion 151 close to the side of protective layer 130, also,
There are gap, air discharge duct 153 and gaps to connect between the inner wall of the endless wall 155 of becket 150 and the edge of fingerprint chip 120
It is logical, in order to be smoothly discharged out the gas in seal cavity to complete machine.Preferably, air discharge duct 153 is provided with protrusion
Portion 151 had both been able to achieve air discharge duct 153 and gap close to the side of protective layer 130, the i.e. inside of protruding portion 151, in this way setting
It is directly connected to, does not also see 153 structure of air discharge duct from the appearance, do not influence the aesthetics of product, meanwhile, waterproof and dustproof effect
More preferably.
The quantity of air discharge duct 153 can be one or more, it is preferable that circumferential direction of multiple air discharge ducts 153 along becket 150
Uniform intervals setting.In the present embodiment, the quantity of air discharge duct 153 is preferably 4, in symmetrical two-by-two, so that seal cavity
Interior gas energy is uniform, is smoothly discharged.Certainly, it is not limited to that, the quantity of air discharge duct 153 is also possible to two, three
Or five etc., multiple air discharge ducts 153 can be both arranged along the axial uniform intervals of protruding portion 151, be also possible to irregularly with
Meaning distribution, as long as meet the intracorporal gas of seal chamber can smooth discharge complete machine outside, be not especially limited here.
Waterproof fingerprint mould group 100 provided by the invention, installation process and working principle are as follows:
Becket 150 includes endless wall 155, protruding portion 151 and male part 157, opens up installation through-hole on casing 101,
Endless wall 155 and protruding portion 151 are contained in installation through-hole.Fingerprint chip 120 passes through conductive material 140 and circuit base plate
110 connections, protective layer 130 are covered on side of the fingerprint chip 120 far from circuit base plate 110, fingerprint chip 120 and protective layer
130 are located at 155 inside of endless wall, and the border filling with sealant water 163 of conductive material 140 realizes sealing and waterproof, to conduction
Material 140 and circuit base plate 110 play a protective role.Protruding portion 151 covers in the outer edge of protective layer 130 and and protective layer
130 fittings are played the role of covering gap and aesthetic appeal.The upper surface of male part 157 is Nian Jie with casing 101, male part 157
Lower surface it is Nian Jie with circuit base plate 110.
At least one air discharge duct 153 is opened up in the inside of protruding portion 151, makes protruding portion 151, endless wall 155, male part
157, the closing surrounded between glue-line 161, circuit base plate 110, glue, conductive material 140, fingerprint chip 120 and protective layer 130
Cavity is connected to air discharge duct 153, and in the baking-curing stage, the intracorporal gas of seal chamber can be smoothly discharged out through air discharge duct 153
Outside complete machine, avoiding seal chamber, intracorporal when gases are heated, they expand and destroys complete machine structure, influences connection reliability and leakproofness.
In conclusion waterproof fingerprint mould group 100 provided by the invention have the following aspects the utility model has the advantages that
Waterproof fingerprint mould group 100 provided by the invention, structure is simple, opens up exhaust on the protruding portion 151 of becket 150
Slot 153 can allow the gas in complete machine to be smoothly discharged, and avoiding seal chamber, intracorporal when gases are heated, they expand and destroys complete machine structure, shadow
Ring connection reliability and leakproofness.Secondly, air discharge duct 153 is provided with protruding portion 151 close to the side of protective layer 130, to product
Appearance does not influence.Protruding portion 151 is used to cover the edge of protective layer 130 and is bonded with protective layer 130, and aesthetics is higher.Most
Afterwards, it in the border filling with sealant water 163 of conductive material 140, can play a protective role to conductive material 140, while to line
Base board 110 plays the effect of waterproof and dustproof.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the present invention can have various changes, combination and variation.All within the spirits and principles of the present invention, made
Any modification, equivalent substitution, improvement and etc. should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of waterproof fingerprint mould group, which is characterized in that including becket, fingerprint chip and circuit base plate；
The fingerprint chip is connected on the circuit base plate, and the becket is connect with the circuit base plate, the fingerprint core
Piece is located on the inside of the becket；
The becket extends to form protruding portion far from one end of the circuit base plate radially inwards, and the protruding portion lid sets institute
State the top edges of fingerprint chip；At least one air discharge duct is offered on the protruding portion, for the becket will to be sealed in
The gas of inside is discharged outside to.
2. waterproof fingerprint mould group according to claim 1, which is characterized in that the air discharge duct is provided with the protruding portion and leans on
The side of the nearly fingerprint chip.
3. waterproof fingerprint mould group according to claim 1, which is characterized in that the inner wall of the becket and the fingerprint core
There are gap, the air discharge duct and the gap areas between the edge of piece.
4. waterproof fingerprint mould group according to claim 1, which is characterized in that the quantity of the air discharge duct be it is multiple, it is multiple
The air discharge duct is arranged along the circumferential uniform intervals of the becket.
5. waterproof fingerprint mould group according to claim 1, which is characterized in that it further include protective layer, the protective layer covering
In the side of the fingerprint chip far from the circuit base plate, the protruding portion lid is located at the edge of the protective layer, the row
Air drain is provided with the protruding portion close to the side of the protective layer.
6. waterproof fingerprint mould group according to claim 1, which is characterized in that the becket includes endless wall and evagination
Portion, the protruding parts are located at the annular wall in the one end of the endless wall far from the circuit base plate, the male part
Body is close to one end of the circuit base plate；The male part is extended along the endless wall radially towards outside.
7. waterproof fingerprint mould group according to claim 6, which is characterized in that the male part includes the upper table being oppositely arranged
Face and lower surface, the lower surface are Nian Jie with the circuit base plate.
8. waterproof fingerprint mould group according to claim 7, which is characterized in that further include casing, the casing offers peace
Through-hole is filled, for accommodating the endless wall, the upper surface of the male part is fixedly connected with the casing.
9. waterproof fingerprint mould group according to claim 6, which is characterized in that the inside of the endless wall and the evagination
Portion junction is equipped with chamfering.
10. waterproof fingerprint mould group according to any one of claim 1 to 9, which is characterized in that the fingerprint chip and institute
It states and is connected between circuit base plate by conductive material, the periphery of the conductive material is equipped with sealing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910161834.3A CN110164829A (en) | 2019-03-04 | 2019-03-04 | Waterproof fingerprint mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910161834.3A CN110164829A (en) | 2019-03-04 | 2019-03-04 | Waterproof fingerprint mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110164829A true CN110164829A (en) | 2019-08-23 |
Family
ID=67645414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910161834.3A Pending CN110164829A (en) | 2019-03-04 | 2019-03-04 | Waterproof fingerprint mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110164829A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050056926A1 (en) * | 2003-09-15 | 2005-03-17 | Siliconware Precision Industries Co., Ltd. | Heat dissipating structure and semiconductor package with the same |
| CN203503636U (en) * | 2013-07-03 | 2014-03-26 | 群丰科技股份有限公司 | Electronic component and package thereof |
| CN205621020U (en) * | 2016-03-25 | 2016-10-05 | 江苏凯尔生物识别科技有限公司 | A fingerprint module for display screen |
| CN206788885U (en) * | 2017-04-28 | 2017-12-22 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint module |
| CN108428678A (en) * | 2018-04-25 | 2018-08-21 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint module and electronic equipment |
| CN209249446U (en) * | 2019-03-04 | 2019-08-13 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint mould group |
-
2019
- 2019-03-04 CN CN201910161834.3A patent/CN110164829A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050056926A1 (en) * | 2003-09-15 | 2005-03-17 | Siliconware Precision Industries Co., Ltd. | Heat dissipating structure and semiconductor package with the same |
| CN203503636U (en) * | 2013-07-03 | 2014-03-26 | 群丰科技股份有限公司 | Electronic component and package thereof |
| CN205621020U (en) * | 2016-03-25 | 2016-10-05 | 江苏凯尔生物识别科技有限公司 | A fingerprint module for display screen |
| CN206788885U (en) * | 2017-04-28 | 2017-12-22 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint module |
| CN108428678A (en) * | 2018-04-25 | 2018-08-21 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint module and electronic equipment |
| CN209249446U (en) * | 2019-03-04 | 2019-08-13 | 昆山丘钛微电子科技有限公司 | Waterproof fingerprint mould group |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20201209 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshanqiu titanium biometric technology Co., Ltd Address before: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |
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| TA01 | Transfer of patent application right |