CN203502898U - Heat dissipating device of DSP chip - Google Patents
Heat dissipating device of DSP chip Download PDFInfo
- Publication number
- CN203502898U CN203502898U CN201320646652.3U CN201320646652U CN203502898U CN 203502898 U CN203502898 U CN 203502898U CN 201320646652 U CN201320646652 U CN 201320646652U CN 203502898 U CN203502898 U CN 203502898U
- Authority
- CN
- China
- Prior art keywords
- opening
- dsp chip
- heat dissipating
- cavity
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipating device of a DSP chip. The heat dissipating device comprises a shell body. A hollow cavity is formed in the shell body. A first opening is formed in the bottom of the shell body and is communicated with the hollow cavity. Two symmetrically-arranged circular arc faces are arranged at the bottom of the hollow cavity in the shell body. A plurality of heat dissipating fins are evenly arranged on the four side faces outside the shell body. A plurality of heat dissipating holes distributed from top to bottom are formed between two adjacent heat dissipating fins. The heat dissipating holes extend to the hollow cavity. A heat dissipating net is arranged in the middle of the first opening. A second opening is formed in the top of the shell body. A fan is arranged in the second opening. At installation time, the DSP chip can be clamped in the first opening so as to enable the first opening to abut against the heat dissipating net. Meanwhile, the shell body is fixed on the upper portion of the DSP chip. Through air from the fan, the heat in the hollow cavity is dissipated through the heat dissipating fins and the heat dissipating holes, so that heat dissipating effect is better, and normal working of the DSP chip can be ensured.
Description
Technical field
The utility model relates to a kind of heat abstractor of dsp chip.
Background technology
Dsp chip is as the core component of computing machine, thermal diffusivity is had to higher requirement, existing radiating mode mostly is employing fan cooling, and the wind-force by fan directly acts on chip, takes away chip heat, due to computer cabinet finite volume, so the heat-sinking capability of the radiator fan that can install is limited, when weather is comparatively hot, high temperature easily causes dsp chip damage, or cause machine blue screen, so need the heat-sinking capability of the dsp chip of increasing.
Summary of the invention
The technical problems to be solved in the utility model is to provide a kind of simple in structure, easy for installation, has the heat abstractor of the dsp chip of good thermal diffusivity.
For addressing the above problem, the utility model adopts following technical scheme:
A kind of heat abstractor of dsp chip, comprise housing, enclosure interior is a cavity, housing bottom is provided with first opening that holds dsp chip, the first opening communicates with cavity, the bottom of described enclosure interior cavity is provided with two symmetrically arranged arc surfaces, arc surface least significant end and the first opening offset, most significant end and inner walls offset, on four sides, outside of described housing, be evenly provided with several radiating fins, between two adjacent radiating fins, be provided with on several, under the louvre of arranging, louvre extends to cavity, the medium position place of described the first opening is provided with radiator-grid, described case top is provided with the second opening, in the second opening, be provided with fan, fan output terminal is relative with cavity.
As preferred technical scheme, described radiating fin is aluminium flake, and aluminium flake has good thermal diffusivity.
As preferred technical scheme, the spacing between described two adjacent radiating fins is 5mm-8mm.
As preferred technical scheme, the aperture of described louvre is 3mm-4mm.
As preferred technical scheme, described fan is connected with connection terminal.
The beneficial effects of the utility model are: the utility model comprises housing, enclosure interior is a cavity, housing bottom is provided with first opening that holds dsp chip, the first opening communicates with cavity, the bottom of described enclosure interior cavity is provided with two symmetrically arranged arc surfaces, arc surface least significant end and the first opening offset, most significant end and inner walls offset, on four sides, outside of described housing, be evenly provided with several radiating fins, between two adjacent radiating fins, be provided with on several, under the louvre of arranging, louvre extends to cavity, the medium position place of described the first opening is provided with radiator-grid, described case top is provided with the second opening, in the second opening, be provided with fan, fan output terminal is relative with cavity, when installing, dsp chip can be stuck in the first opening, the first opening and radiator-grid are offseted, housing can be fixed on to dsp chip top simultaneously, the wind that falls apart and locate by fan, heat in cavity is distributed by radiating fin and louvre, make better heat-radiation effect, can guarantee that dsp chip normally works, and this device is manufactured comparatively simple and convenient, be applicable to promoting the use of.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the heat abstractor of the utility model dsp chip.
Embodiment
below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that, protection domain of the present utility model is made to more explicit defining.
Consult the heat abstractor of a kind of dsp chip shown in Fig. 1, comprise housing 1, housing 1 inside is a cavity, housing 1 bottom is provided with first opening 101 that holds dsp chip, the first opening 101 communicates with cavity, the bottom of described housing 1 internal cavities is provided with two symmetrically arranged arc surfaces 102, arc surface 102 least significant ends and the first opening 101 offset, most significant end and housing 1 inwall offset, on four sides, outside of described housing 1, be evenly provided with several radiating fins 2, between two adjacent radiating fins 2, be provided with on several, under the louvre 103 of arranging, louvre 103 extends to cavity, the medium position place of described the first opening 101 is provided with radiator-grid 4, described housing 1 top is provided with the second opening (not shown), in the second opening, be provided with fan 5, fan 5 output terminals are relative with cavity.
Wherein, described radiating fin 2 is aluminium flake, and aluminium flake has good thermal diffusivity.
Spacing between described two adjacent radiating fins 2 is 5mm-8mm, and the spacing between described two adjacent radiating fins 2 is 6mm in the present embodiment.
The aperture of described louvre 103 is 3mm-4mm, and the aperture of described louvre 103 is 3mm in the present embodiment.
Described fan 5 is connected with connection terminal 6.
The beneficial effects of the utility model are: the utility model comprises housing, enclosure interior is a cavity, housing bottom is provided with first opening that holds dsp chip, the first opening communicates with cavity, the bottom of described enclosure interior cavity is provided with two symmetrically arranged arc surfaces, arc surface least significant end and the first opening offset, most significant end and inner walls offset, on four sides, outside of described housing, be evenly provided with several radiating fins, between two adjacent radiating fins, be provided with on several, under the louvre of arranging, louvre extends to cavity, the medium position place of described the first opening is provided with radiator-grid, described case top is provided with the second opening, in the second opening, be provided with fan, fan output terminal is relative with cavity, when installing, dsp chip can be stuck in the first opening, the first opening and radiator-grid are offseted, housing can be fixed on to dsp chip top simultaneously, the wind that falls apart and locate by fan, heat in cavity is distributed by radiating fin and louvre, make better heat-radiation effect, can guarantee that dsp chip normally works, and this device is manufactured comparatively simple and convenient, be applicable to promoting the use of.
More than show and described ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and instructions, describes just illustrates principle of the present utility model; under the prerequisite that does not depart from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (5)
1. the heat abstractor of a dsp chip, comprise housing, enclosure interior is a cavity, housing bottom is provided with first opening that holds dsp chip, the first opening communicates with cavity, it is characterized in that: the bottom of described enclosure interior cavity is provided with two symmetrically arranged arc surfaces, arc surface least significant end and the first opening offset, most significant end and inner walls offset, on four sides, outside of described housing, be evenly provided with several radiating fins, between two adjacent radiating fins, be provided with on several, under the louvre of arranging, louvre extends to cavity, the medium position place of described the first opening is provided with radiator-grid, described case top is provided with the second opening, in the second opening, be provided with fan, fan output terminal is relative with cavity.
2. the heat abstractor of dsp chip according to claim 1, is characterized in that: described radiating fin is aluminium flake.
3. the heat abstractor of dsp chip according to claim 1, is characterized in that: the spacing between described two adjacent radiating fins is 5mm-8mm.
4. the heat abstractor of dsp chip according to claim 1, is characterized in that: the aperture of described louvre is 3mm-4mm.
5. the heat abstractor of dsp chip according to claim 1, is characterized in that: described fan is connected with connection terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320646652.3U CN203502898U (en) | 2013-10-21 | 2013-10-21 | Heat dissipating device of DSP chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320646652.3U CN203502898U (en) | 2013-10-21 | 2013-10-21 | Heat dissipating device of DSP chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203502898U true CN203502898U (en) | 2014-03-26 |
Family
ID=50333861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320646652.3U Expired - Fee Related CN203502898U (en) | 2013-10-21 | 2013-10-21 | Heat dissipating device of DSP chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203502898U (en) |
-
2013
- 2013-10-21 CN CN201320646652.3U patent/CN203502898U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140326 Termination date: 20141021 |
|
| EXPY | Termination of patent right or utility model |