CN203461812U - Capacitor type micro-inertial sensor with self calibration - Google Patents
Capacitor type micro-inertial sensor with self calibration Download PDFInfo
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- CN203461812U CN203461812U CN201320442802.9U CN201320442802U CN203461812U CN 203461812 U CN203461812 U CN 203461812U CN 201320442802 U CN201320442802 U CN 201320442802U CN 203461812 U CN203461812 U CN 203461812U
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0882—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system for providing damping of vibrations
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Abstract
The utility model relates to a capacitor type micro-inertial sensor with a self-calibration function. Existing sensors with the self-calibration function have small calibration ranges. According to the capacitor type micro-inertial sensor with the self-calibration function, a sensor mass block is a rectangular silicon wafer etched with grid wells, two corresponding ends of the rectangular silicon wafer are connected with anchor points through silicon support beams, and the other two corresponding ends of the rectangular silicon wafer are provided with rectangular silicon bars; driver mass blocks are arranged on both sides of the sensor mass block, the middle of each driver mass block is etched with a ring-shaped groove, both sides of each driver mass block is provided with movable mass block driving silicon bars and driver driving silicon bars, and the silicon bars connected with the sensor mass block are combined with the corresponding mass block driving silicon bars into mass block driving capacitors; comb bars of fixed driving silicon bars and the movable driver driving silicon bars compose driver driving capacitors; comb silicon bars and fixed detection silicon bars, which are connected with the sensor mass block, grid-shaped electrodes and interdigital aluminum electrodes on the surface of a substrate compose a detection capacitor. The capacitor type micro-inertial sensor with the self-calibration function increases the driving capacitance of the mass blocks and accordingly reduces the driving voltage.
Description
Technical field
The utility model belongs to micro-electronic mechanical skill field, relates to a kind of micro-inertia sensor, is specifically related to a kind of high accuracy micro-inertia sensor containing self-calibrating function.
Background technology
Recently for over ten years, with the accelerometer that micro mechanical technology is made, obtain development rapidly, mainly contained acceleration by light degree meter, electromagnetic accelerometer, capacitance accelerometer etc.In these sensors, capacitance acceleration transducer, little owing to having temperature coefficient, highly sensitive, the advantages such as good stability, are maximum class acceleration transducers of developing at present.Along with the development of acceleration transducer, the scaling method of acceleration transducer has also obtained development rapidly.The conventional scaling method of acceleration transducer is had to the test of 1g dynamic overturn, high g value centrifuge test, vibration impact experiment etc.Tradition need to make sensor receive the effect of known inertia force while demarcating acceleration transducer, the relation of observed and recorded sensor output signal and extraneous acceleration.This scaling method often needs high-precision instrument that acceleration signal is provided, expense is more expensive, and complicated operation, someone studied and with electrostatic force, sensor is carried out to oneself and demarcate successively afterwards, the inertia force that replaces extraneous acceleration to produce, can reduce costs, but the voltage applying while producing electrostatic force easily surpasses the operating voltage of acceleration transducer.
Summary of the invention
The purpose of this utility model is to provide a kind of high accuracy micro-inertia sensor containing self-calibrating function.
The condenser type micro-inertia sensor that the utility model provides comprises glass substrate, sensor mass, drive mass piece, fixed drive silicon strip, fixed test silicon strip and drives wire.
Sensor mass is divided into bar shaped sensor mass and a pair of grid shape sensor mass.Bar shaped sensor mass is comprised of rectangular block and bar shaped sensor mass rectangular preiection, and two corresponding end of bar shaped sensor mass are connected with sensor anchor point by the U-shaped silicon brace summer of sensor, and sensor anchor point is fixedly installed in glass substrate.A pair of grid shape sensor mass lays respectively at bar shaped sensor mass both sides, each grid shape sensor mass is comprised of longitudinal equidistant, horizontal parallel grid electrode and grid type sensor mass rectangular preiection, and its longitudinal length is identical with the principal length of bar shaped sensor mass; Grid shape sensor mass rectangular preiection is relative with bar shaped mass rectangular preiection, forms electric capacity adjusting play.Two corresponding end of grid shape sensor mass are respectively arranged with two groups of rectangle silicon strip groups, every group of silicon strip group comprises the m bar silicon strip be arrangeding in parallel, m >=2, the silicon strip number at grid shape sensor mass two ends is identical, position is corresponding, and silicon strip is vertical with grid shape sensor mass side; Another two corresponding end of grid shape sensor mass are respectively arranged with two groups of comb type silicon strip groups, every group of silicon strip group is comprised of with the rectangle silicon strip that is connected broach n equally spaced broach, n >=2, broach arranges with rectangle silicon strip is vertical, the broach number at grid shape sensor mass two ends is identical, position is corresponding, and rectangle silicon strip is vertical with grid shape sensor mass side; The corresponding glass substrate of grid shape sensor mass is simultaneously etched with the rectangle grizzly bar shape well parallel with rectangle silicon strip.Grid shape sensor mass and bar shaped sensor mass are connected by two pairs of U-shaped sensor tie-beams between grid shape sensor mass and bar shaped sensor mass, and these two pairs of U-shaped sensor tie-beams are symmetrical arranged along the cross central line of bar shaped sensor mass.
The both sides of sensor mass are respectively arranged with two drive mass pieces; Described drive mass piece is rectangle silicon chip, and two corresponding end of drive mass piece are connected with anchor point by driver U-shaped brace summer, and driver anchor point is fixedly installed in glass substrate, and drive mass piece and glass substrate be arranged in parallel; One side of each drive mass piece is provided with m driver drives silicon strip, opposite side is provided with m mass and drives silicon strip, it is comb teeth-shaped that described mass drives silicon strip, on tooth, be etched with spill amortisseur bar, mass driving silicon strip is parallel with the rectangle silicon strip that sensor mass connects, position is corresponding, and the rectangle silicon strip that sensor mass connects drives silicon strip to form mass driving electric capacity with corresponding mass; The side's of being carved with cannelure in the middle of drive mass piece.
The fixed drive silicon strip of two comb teeth-shapeds is fixedly installed in glass substrate, and the comb teeth bar of each fixed drive silicon strip is corresponding with driver drives silicon strip position; The composition driver drives electric capacity of the comb teeth bar of fixed drive silicon strip and corresponding driver drives silicon strip; Two fixed drive silicon strips are connected anchor point by the lead-in wire on glass substrate surface and driver outside and connect.
The fixed test silicon strip of four comb teeth-shapeds is fixedly installed in glass substrate, fixed test silicon strip is comprised of the rectangle silicon strip of comb teeth bar and connection comb teeth bar, comb teeth bar position in the comb teeth-shaped silicon strip group that the comb teeth bar of each fixed test silicon strip connects with sensor mass is corresponding, and the comb teeth bar in the comb teeth bar of fixed test silicon strip and comb teeth-shaped silicon strip group forms Detection capacitance; Four fixed test comb teeth bars are connected anchor point by the lead-in wire in glass substrate with outside and connect.
Drive wire to have two, be longitudinally arranged at respectively on the inner side frame of corresponding grid shape sensor mass, every drives one end of wire to be connected by the plain conductor extraction electrode of laying on the U-shaped silicon brace summer of the sensor tie-beam along corresponding and sensor.Between connecting line between driving wire and connection driving wire and electrode and responsive grid mass corresponding part, be provided with electric insulation layer.
Corresponding two the sensor anchor point positions of glass substrate surface are provided with two sensor mass anchor points, and sensor mass solder joint is connected with sensor anchor point; The corresponding sensor mass of glass substrate surface is provided with interdigital aluminium electrode, and on sensor mass, the rectangular limit of the grizzly bar shape well of etching is interdigital corresponding with in interdigital aluminium electrode every pair.
The basic design of the utility model is the high accuracy micro-inertia sensor designing with self-calibrating function, increases the calibration range of sensor simultaneously.Sensor mass piece drives the initial designs spacing of electric capacity larger, thereby solution deep reaction ion etching depth-to-width ratio is less than 30:1 and can not does thick restriction to the quality of sensor vibration generator, then by driver, reduced capacitor plate spacing, thereby the initial mass piece that has increased sensor drives electric capacity to increase the calibration range of sensor, on driver, apply again voltage, produce electrostatic force and drive sensitive-mass piece, make sensitive-mass piece on sensitive direction, produce skew, be equivalent to and apply extraneous acceleration, realize self-calibrating function.Meanwhile, by field drives grid shape sensor mass, reduce Detection capacitance spacing, thereby increase the initial detecting electric capacity of sensor, improve sensor accuracy, reduce testing circuit noise.The utility model is etching grid-shaped strip well on sensor mass also, and reduced circuit noise with the interdigital aluminium electrode composition Differential Detection electric capacity on substrate, and in grizzly bar shape well and glass substrate, interdigital differential shows as slide-film damping characteristic, thereby also reduced Blang's noise.Thereby the utility model reduces press mold air damping by etching spill amortisseur bar on the mass driving silicon strip at driver and reduces mechanical noise.In addition, by changing the size of brace summer and mass, can also change range and the response characteristic of sensor.
The micro-inertia sensor that the utility model provides has increased oscillator quality greatly, thereby reduced Blang's noise, and reduced capacitor plate spacing by driver, and drive etching amortisseur bar on silicon strip at the mass of driver, increase mass and driven electric capacity, reduced mass driving voltage, increased calibration range, reduced press mold air damping simultaneously, thereby mechanical noise and circuit noise have been reduced, and the broach of variable area formula to sensor mass on during newly-increased grid-shaped strip well capacitance difference componental movement air damping show as slide-film damping, thereby reduced Blang's noise, also increased Detection capacitance simultaneously.
The high accuracy micro-inertia sensor novel structure that the utility model relates to, resolution ratio and highly sensitive, manufacture craft is simple, is conducive to reduce costs and improve yield rate, is a kind of micro-inertia sensor that can practical application.
Accompanying drawing explanation
Fig. 1 is glass substrate and the lip-deep structural representation of utility model;
Fig. 2 is the utility model structure top view;
Fig. 3 is the profile of grizzly bar shape well of the present utility model.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is further illustrated, but the utility model only limits to by no means introduced embodiment.
The utility model provides a kind of high accuracy micro-inertia sensor with self-calibration structure, adopts bulk micromachining can improve the quality of sensor chip, thereby reduces noise, improves stability, improves sensitivity.Shortcoming is that volume is slightly large, but can produce high-precision micro-mechanical inertia sensor.Driving voltage in order to reduce to drive sensitive-mass piece, makes driving voltage be no more than the operating voltage of sensor, can be by increasing the method for the static drive electric capacity of sensor, thus reduce mechanical noise and circuit noise.And for using bulk silicon technological as the capacitance type sensor of the comb teeth-shaped of dark reaction particle etching (Deep RIE) processing, the depth-to-width ratio of its plates capacitance is generally less than 30:1, this has just limited reducing of capacitor plate spacing.And for little spacing plates capacitance, its press mold air damping is larger, increased the mechanical noise of sensor.Reducing this mechanical noise can be by etching amortisseur bar on pole plate.
As shown in Figure 1,2 and 3, a kind of micro-inertia sensor of demarcating with oneself comprises glass substrate 1, sensor mass 20, drive mass piece 14, fixed drive silicon strip 16, fixed test silicon strip 27 and drives wire 35.
Sensor mass is divided into bar shaped sensor mass 41 and a pair of grid shape sensor mass 20.Bar shaped sensor mass 41 is comprised of rectangular block 40 and bar shaped sensor mass rectangular preiection 37, two corresponding end of bar shaped sensor mass 41 are connected with sensor anchor point 19 by the U-shaped silicon brace summer 18 of sensor, and sensor anchor point 19 is fixedly installed in glass substrate 1.A pair of grid shape sensor mass 20 lays respectively at bar shaped sensor mass 41 both sides, each grid shape sensor mass 41 is by longitudinal equidistant, horizontal parallel grid electrode (21,22) and grid type sensor mass rectangular preiection 38 form, its longitudinal length is identical with the principal length of bar shaped sensor mass; Grid shape sensor mass rectangular preiection 38 is relative with bar shaped mass rectangular preiection 37, forms electric capacity adjusting play 39.Two corresponding end of grid shape sensor mass 20 are respectively arranged with two groups of rectangle silicon strip groups, every group of rectangle silicon strip group comprises two silicon strips 23 that be arranged in parallel, the quantity of grid shape sensor mass 20 two ends silicon strips 23 is identical, position is corresponding, and silicon strip 23 is vertical with the side of grid shape sensor mass 20; Another two corresponding end of grid shape sensor mass 20 are respectively arranged with two groups of comb type silicon strip groups, every group of silicon strip group is comprised of with the rectangle silicon strip 31 that is connected broach two equally spaced broach 30, broach 30 setting vertical with rectangle silicon strip 31, the broach number at grid shape sensor mass 20 two ends is identical, position is corresponding, and rectangle silicon strip 31 is vertical with grid shape sensor mass 20 sides; The corresponding glass substrate one side of grid shape sensor mass 20 is equidistantly etched with 12 the rectangle grizzly bar shape wells 22 parallel with silicon strip 23; The connection of sensor mass and outer enclosure realizes by the sensor mass solder joint 5 in glass substrate 1, the rectangular limit 21 of the grizzly bar shape well of grid shape sensor mass 20 lower surfaces be positioned at electrode pair that the interdigital aluminium electrode of substrate 9 forms directly over.The U-shaped sensor tie-beam between grid shape sensor mass 20 and bar shaped sensor mass 41 36 is connected by two pairs for grid shape sensor mass 20 and bar shaped sensor mass 41, and these two pairs of U-shaped sensor tie-beams 36 are symmetrical arranged along the cross central line of bar shaped sensor mass 41.
The both sides of sensor mass are respectively arranged with two drive mass pieces 14, drive mass piece 14 is rectangle silicon chip, two corresponding end of drive mass piece 14 are connected with driver anchor point 17 by driver U-shaped silicon brace summer 10, driver anchor point 17 is fixedly installed in glass substrate 1, and drive mass piece 14 be arranged in parallel with glass substrate 1; One side of each drive mass piece 14 is provided with two driver drives silicon strips 11, opposite side is provided with two masses and drives silicon strip 25, wherein mass drives on silicon strip 25 and is etched with spill amortisseur bar 24, to reduce press mold air damping, mass driving silicon strip 25 is parallel with the rectangle silicon strip 23 that sensor mass 20 connects, position is corresponding, and the rectangle silicon strip 23 that sensor mass connects drives silicon strip 25 to form masses driving electric capacity with corresponding mass; Between drive mass piece 14 and rectangle isolated island 13, form square annular groove 12.Drive mass piece 14 corresponding to sensor mass both sides is connected with solder joint 4 by the lip-deep lead-in wire 8 of glass substrate 1.
The fixed drive silicon strip 16 of two comb teeth-shapeds is fixedly installed in glass substrate 1, and the comb teeth bar 15 of each fixed drive silicon strip 16 is corresponding with driver drives silicon strip 11 positions; The composition driver drives electric capacity of the comb teeth bar 15 of fixed drive silicon strip 16 and corresponding driver drives silicon strip 11; Two fixed drive silicon strips 16 are connected with solder joint 2 by the lip-deep lead-in wire 3 of glass substrate 1.Square annular groove groove width on drive mass piece is less than the spacing between driver drives silicon strip 11 and the comb teeth bar 15 of fixed drive silicon strip 16, and the spacing between driver drives silicon strip 11 and the comb teeth bar 15 of fixed drive silicon strip 16 is less than silicon strip 23 and mass drives the spacing between silicon strip 25.The initial driving spacing of sensor capacitance is that silicon strip 23 and mass drive spacing between silicon strip 25 and the difference of square cannelure groove width.
The fixed test silicon strip 27 of two groups of comb teeth-shapeds is fixedly installed in glass substrate 1, fixed test silicon strip 27 is comprised of the rectangle silicon strip 28 of comb teeth bar 26 and connection comb teeth bar 26, and the comb teeth bar 26 of each fixed test silicon strip 27 is corresponding with silicon strip 30 positions that sensor mass 20 connects; The composition Detection capacitance of the silicon strip 30 that the comb teeth bar 26 of fixed test silicon strip 27 connects with corresponding sensor mass; Two fixed test silicon strips 27 are connected with solder joint 6 by the lip-deep lead-in wire 7 of glass substrate 1.
Glass substrate 1 corresponding two sensor anchor point 19 positions, surface are provided with two sensor mass solder joints 5, and sensor mass solder joint 5 is connected with sensor anchor point 19.The surperficial corresponding sensor mass of glass substrate 1 20 positions are provided with interdigital aluminium electrode 9, and interdigital aluminium electrode 9 is by aluminium solder joint 6 access test signal voltage.
In conjunction with Fig. 1, Fig. 2, Fig. 3, Fundamentals of Sensors are described.The self-calibrating function of this sensor is to apply voltage on drive mass piece 14, make the electrostatic force that on driver drives silicon strip 11 and sensitive-mass piece, rectangle silicon strip 23 produces be equivalent to the extraneous acceleration that will apply, make sensitive-mass piece on sensitive direction, produce skew, the broach of variable area formula to sensor mass on newly-increased grid-shaped strip well capacitance difference componental movement detect the side-play amount of sensitive-mass piece.
The groove width 12 use d1 of drive mass piece 14 top cannelures represent, the spacing of fixed drive silicon strip 15 and driver drives silicon strip 11 represents with d2, the rectangle silicon strip 23 that sensor mass connects and mass drive the spacing of silicon strip 24 to represent with d3, and d3>d2>d1.By outside gold ball bonding technology, with gold thread, fixed drive silicon strip solder joint is connected with encapsulating package pin, apply DC offset voltage, with Vd1, represent, the electrostatic force producing drives drive mass piece, make drive mass piece 14 and cannelure 13 that adhesive occur, on sensitive-mass piece, rectangle silicon strip 23 is d3-d1 with the spacing of mass driving silicon strip 24; The solder joint of driver is connected with encapsulating shell pin, apply voltage and represent (Vd2<<Vd1 with Vd2, do not affect the adhesive of driver and fixed drive silicon strip), upper and lower driver can apply different voltage signals, making to drive sensitive-mass piece on sensitive direction, to be subject to electrostatic force is offset, thereby reach the effect that replaces extraneous acceleration, realize self-calibrating function.When Vd2 is quiescent voltage signal, can realize the static demarcating of sensor; When Vd2 is dynamic voltage signal, can simulating vibration table demarcate and the demarcation of frequency characteristic etc.Meanwhile, reduced mass drive capacitor plate spacing by driver, the initial mass piece that has increased sensor drives electric capacity to reduce the driving voltage of mass, increases transducer calibration scope.
Electric capacity adjusting play 39 use d4 between bar shaped sensor mass rectangular preiection 37 and grid shape sensor mass rectangular preiection 38 represent, the gap 29 use d5 of fixed test silicon strip and the comb type silicon strip 30 being connected with sensitive-mass piece represent.The driving wire that is positioned at bar shaped sensor mass left side, by outside gold ball bonding technology, with gold thread, extraction electrode 32 on the left of driving wire is connected respectively on encapsulating package pin, and accesses constant-current source.The driving wire that is positioned at bar shaped sensor mass right side, by outside gold ball bonding technology, with gold thread, driving wire right side extraction electrode 33 is connected respectively on encapsulating package pin, and the constant-current source of the driving wire opposite phase in access and left side.The outside extraction electrode 5 and 6 of sensor is connected respectively to encapsulating package pin, and with V1 and V2, represents respectively.The uniform magnetic field of proper orientation is set in the encapsulating package cap directly over sensor construction, make the direction of the Ampere force that produces in two metal driving lead all point to the longitudinal centre line of bar shaped sensor mass, and vertical with the longitudinal centre line of bar shaped sensor mass.Two drive the Ampere force on wire to make the electric capacity adjusting play 39 between bar shaped sensor mass rectangular preiection 37 and grid shape sensor mass rectangular preiection 38 be decreased to zero, now, sensor initial detecting electric capacity spacing is d5-d4, because the spacing of electric capacity reduces greatly, thereby the initial detecting electric capacity of sensor increases greatly.At V1, V2 end, power up respectively carrier signal again, sensor mass is connected to ground by anchor point.While having acceleration signal on sensitive direction, effect due to inertia force, produce displacement, thereby cause grid electrode 21 and the fixing stack area change of differential capacitance and the stack area change of corresponding fixed test silicon strip 27 and the differential capacitance of the comb type silicon strip 30 corresponding compositions that are connected with sensor mass that electrode 9a is formed with 9b of intersection comb teeth-shaped for detection on grid shape sensor mass 20, and then cause the variation that electric capacity is larger, this size that changes electric capacity and outside inertial signal is linear, by Detection capacitance, change the size that just can obtain acceleration on sensitive direction, and due to the feature of sensor construction design, Detection capacitance is differential variation, this has increased the range of linearity and the range of sensor.
The high accuracy micro-inertia sensor of the utility model design, because broach electric capacity spacing can reduce with drive mass piece, and the mass of drive mass piece drives etching spill amortisseur bar on silicon strip, these factors reduce the mechanical noise of sensor and circuit noise greatly, thereby the driving voltage of sensitive-mass piece is reduced greatly; And on sensor mass, there are the grid-shaped strip well electric capacity of slide-film damping and the broach of variable area formula to electric capacity is detected, thereby make sensor can reach very high precision; The utility model etches the rectangle isolated island of anti-adhesive short circuit on drive mass piece, prevents from being short-circuited and permanent adhesive between electric capacity.The utility model is adopted as mechanical technique making simultaneously, and technique is simple, is conducive to improve yield rate and reduces manufacturing cost.
Claims (1)
1. a condenser type micro-inertia sensor of demarcating with oneself, comprises glass substrate, sensor mass, drive mass piece, fixed drive silicon strip, fixed test silicon strip and drives wire, it is characterized in that:
Sensor mass is divided into bar shaped sensor mass and a pair of grid shape sensor mass; Bar shaped sensor mass is comprised of rectangular block and bar shaped sensor mass rectangular preiection, and two corresponding end of bar shaped sensor mass are connected with sensor anchor point by the U-shaped silicon brace summer of sensor, and sensor anchor point is fixedly installed in glass substrate; A pair of grid shape sensor mass lays respectively at bar shaped sensor mass both sides, each grid shape sensor mass is comprised of longitudinal equidistant, horizontal parallel grid electrode and grid type sensor mass rectangular preiection, and its longitudinal length is identical with the principal length of bar shaped sensor mass; Grid shape sensor mass rectangular preiection is relative with bar shaped mass rectangular preiection, forms electric capacity adjusting play; Two corresponding end of grid shape sensor mass are respectively arranged with two groups of rectangle silicon strip groups, every group of silicon strip group comprises the m bar silicon strip be arrangeding in parallel, m >=2, the silicon strip number at grid shape sensor mass two ends is identical, position is corresponding, and silicon strip is vertical with grid shape sensor mass side; Another two corresponding end of grid shape sensor mass are respectively arranged with two groups of comb type silicon strip groups, every group of silicon strip group is comprised of with the rectangle silicon strip that is connected broach n equally spaced broach, n >=2, broach arranges with rectangle silicon strip is vertical, the broach number at grid shape sensor mass two ends is identical, position is corresponding, and rectangle silicon strip is vertical with grid shape sensor mass side; The corresponding glass substrate of grid shape sensor mass is simultaneously etched with the rectangle grizzly bar shape well parallel with rectangle silicon strip; Grid shape sensor mass and bar shaped sensor mass are connected by two pairs of U-shaped sensor tie-beams between grid shape sensor mass and bar shaped sensor mass, and these two pairs of U-shaped sensor tie-beams are symmetrical arranged along the cross central line of bar shaped sensor mass;
The both sides of sensor mass are respectively arranged with two drive mass pieces; Described drive mass piece is rectangle silicon chip, and two corresponding end of drive mass piece are connected with anchor point by driver U-shaped brace summer, and driver anchor point is fixedly installed in glass substrate, and drive mass piece and glass substrate be arranged in parallel; One side of each drive mass piece is provided with m driver drives silicon strip, opposite side is provided with m mass and drives silicon strip, it is comb teeth-shaped that described mass drives silicon strip, on tooth, be etched with spill amortisseur bar, mass driving silicon strip is parallel with the rectangle silicon strip that sensor mass connects, position is corresponding, and the rectangle silicon strip that sensor mass connects drives silicon strip to form mass driving electric capacity with corresponding mass; The side's of being carved with cannelure in the middle of drive mass piece;
The fixed drive silicon strip of two comb teeth-shapeds is fixedly installed in glass substrate, and the comb teeth bar of each fixed drive silicon strip is corresponding with driver drives silicon strip position; The composition driver drives electric capacity of the comb teeth bar of fixed drive silicon strip and corresponding driver drives silicon strip; Two fixed drive silicon strips are connected anchor point by the lead-in wire on glass substrate surface and driver outside and connect;
The fixed test silicon strip of four comb teeth-shapeds is fixedly installed in glass substrate, comb teeth bar position in the comb teeth-shaped silicon strip group that the comb teeth bar of each fixed test silicon strip connects with sensor mass is corresponding, and the comb teeth bar in the comb teeth bar of fixed test silicon strip and comb teeth-shaped silicon strip group forms Detection capacitance; Four fixed test comb teeth bars are connected anchor point by the lead-in wire in glass substrate with outside and connect;
Drive wire to have two, be longitudinally arranged at respectively on the inner side frame of corresponding grid shape sensor mass, every drives one end of wire to be connected by the plain conductor extraction electrode of laying on the U-shaped silicon brace summer of the sensor tie-beam along corresponding and sensor; Between connecting line between driving wire and connection driving wire and electrode and responsive grid mass corresponding part, be provided with electric insulation layer;
Corresponding two the sensor anchor point positions of glass substrate surface are provided with two sensor mass anchor points, and sensor mass solder joint is connected with sensor anchor point; The corresponding sensor mass of glass substrate surface is provided with interdigital aluminium electrode, and on sensor mass, the rectangular limit of the grizzly bar shape well of etching is interdigital corresponding with in interdigital aluminium electrode every pair.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103344785A (en) * | 2013-07-22 | 2013-10-09 | 杭州电子科技大学 | Capacitive micro inertial sensor with self calibration function |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103344785A (en) * | 2013-07-22 | 2013-10-09 | 杭州电子科技大学 | Capacitive micro inertial sensor with self calibration function |
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