CN203446173U - Airfoil-shaped cooling plate with easy heat dissipation characteristic - Google Patents
Airfoil-shaped cooling plate with easy heat dissipation characteristic Download PDFInfo
- Publication number
- CN203446173U CN203446173U CN201320589075.9U CN201320589075U CN203446173U CN 203446173 U CN203446173 U CN 203446173U CN 201320589075 U CN201320589075 U CN 201320589075U CN 203446173 U CN203446173 U CN 203446173U
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- Prior art keywords
- substrate
- heat dissipation
- chip
- fin
- easy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title abstract 6
- 238000001816 cooling Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims description 14
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed in the utility model is an airfoil-shaped cooling plate with the easy heat dissipation characteristic. The cooling plate comprises an oblong substrate and cooling fins arranged at the substrate. The dimension of the substrate is characterized in that the edge of the substrate starts from an edge, approaching other chips, of a chip needing heat dissipation and extends to the edge of a board card relatively to the chip needing heat dissipation; and relatively to a fixed hole position of a superposed board card edge portion, the corresponding substrate position is left in a notch mode. According to the technical scheme, the existing board card dimension is fully utilized and the heat dissipation area is enlarged, so that heat dissipation of the board card chip can be carried out easily.
Description
Technical field
The utility model relates to radiating element field, is specifically related to a kind of aerofoil profile fin that is easy to heat radiation.
Background technology
On small-sized board, often place network chip, raid card chip at present, at present conventional fin area and chip area are suitable, are fixed on chip.But these chip power-consumptions are very large, all, more than 10W, are badly in need of suitable fin and dispel the heat.Because the radiating effect of fin of same material is relevant with the area of fin, fin area is larger, radiating effect is better, but the restriction due to board and die size, the adjacent edge that general chip is positioned at board inside has other chips, and the setting of fin can not affect the heat radiation of other chips; Chip does not generally have other chips near near the of card edge, but conventionally has fixed hole position, and the setting of fin can not hinder the use of fixed hole position on board.
Summary of the invention
Technical problem to be solved in the utility model is: a kind of radiating effect fin is better provided.
Technical solution adopted in the utility model is: a kind of aerofoil profile fin that is easy to heat radiation, comprise rectangular substrate and be positioned at the radiating fin on substrate, the size of wherein said substrate is as follows: with respect to the chip of needs heat radiation, the limit of substrate originates in the limit that chip and other chips close on, extend to the edge of board, wherein, with respect to the fixed hole position of the card edge part overlapping, corresponding substrate position gets out of the way in breach mode.
Radiating fin direction on described substrate is parallel with wind direction, is easy to heat radiation.
The beneficial effects of the utility model are: adopt technology of the present utility model, make full use of in existing board size, strengthen area of dissipation, be easy to the heat radiation of board chip.
Accompanying drawing explanation
Fig. 1 is the structural representation that is positioned at the aerofoil profile fin on board;
Description of reference numerals: 1, board; 2, other chips; 3, substrate; 4, fin; 5, breach; 6, fixed hole position.
Embodiment
Below in conjunction with the drawings and specific embodiments, a kind of aerofoil profile fin that is easy to heat radiation of the present utility model is described further.
A kind of aerofoil profile fin that is easy to heat radiation, comprise rectangular substrate 3 and be positioned at the radiating fin 4 on substrate, the size of wherein said substrate is as follows: with respect to the chip of needs heat radiation, the limit of substrate originates in the limit that chip and other chips 2 close on, extend to the edge of board 1, wherein, with respect to the fixed hole position 6 of board 1 marginal portion overlapping, corresponding substrate 3 positions get out of the way in breach 5 modes.
On the basis of embodiment 1, the radiating fin direction described in the present embodiment on substrate is parallel with wind direction, is easy to heat radiation.
Claims (2)
1. one kind is easy to the aerofoil profile fin dispelling the heat, comprise rectangular substrate and be positioned at the radiating fin on substrate, the size of wherein said substrate is as follows: with respect to the chip of needs heat radiation, the limit of substrate originates in the limit that chip and other chips close on, extend to the edge of board, wherein, with respect to the fixed hole position of the card edge part overlapping, corresponding substrate position gets out of the way in breach mode.
2. a kind of aerofoil profile fin that is easy to heat radiation according to claim 1, is characterized in that: the radiating fin direction on described substrate is parallel with wind direction, is easy to heat radiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320589075.9U CN203446173U (en) | 2013-09-24 | 2013-09-24 | Airfoil-shaped cooling plate with easy heat dissipation characteristic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320589075.9U CN203446173U (en) | 2013-09-24 | 2013-09-24 | Airfoil-shaped cooling plate with easy heat dissipation characteristic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203446173U true CN203446173U (en) | 2014-02-19 |
Family
ID=50097179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320589075.9U Expired - Fee Related CN203446173U (en) | 2013-09-24 | 2013-09-24 | Airfoil-shaped cooling plate with easy heat dissipation characteristic |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203446173U (en) |
-
2013
- 2013-09-24 CN CN201320589075.9U patent/CN203446173U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140219 Termination date: 20180924 |