CN203434143U - High hot-fluid density heat dissipation gilled radiator - Google Patents
High hot-fluid density heat dissipation gilled radiator Download PDFInfo
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- CN203434143U CN203434143U CN201320421765.3U CN201320421765U CN203434143U CN 203434143 U CN203434143 U CN 203434143U CN 201320421765 U CN201320421765 U CN 201320421765U CN 203434143 U CN203434143 U CN 203434143U
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- radiator
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Abstract
The utility model discloses a high hot-fluid density heat dissipation gilled radiator. The high hot-fluid density heat dissipation gilled radiator comprises a radiator substrate and radiating fins. Power devices are closely attached to the surface of the radiator substrate. The high hot-fluid density heat dissipation gilled radiator is characterized in that the radiator substrate is formed by soldering radiating fins and isolation slices through high temperature. Compared to a conventional section bar and a sheet embedded power device radiator, the high hot-fluid density heat dissipation gilled radiator has lower thermal resistance and better thermal property, is superior than a sheet embedded (teeth inlaid) radiator with a copper base plate under the condition of the same size, and has performance approaching or reaching the performance of a heat pipe radiator.
Description
Technical field
The utility model relates to a kind of radiator, refers in particular to a kind of finned radiator for power semiconductor heat radiation, is mainly used in the above high-power thyristor of 200A, the above thyristor of 25A and rectification module, the above high-power IGBT of 50A.
Background technology
Large power semiconductor device can produce a large amount of heat in running, in order to be unlikely to burn out power device, all must help its heat radiation by radiator now; Wherein, finned radiator is a kind of conventional radiator, heat transfer and the heat sinking function of the main load power device of finned radiator.
Current finned radiator is substantially all by two unit combinations, fin and substrate, and fin mainly plays heat sinking function, and substrate plays heat transmission function.General finned radiator is when processing and fabricating, all first to make respectively substrate and fin, again fin is inserted on substrate, then by welding, fin and substrate are welded, form finned radiator, it is larger that this radiator has heat radiation power, and therefore feature stable and reliable for performance is used widely.Yet along with the power density of power device is increasing, the density of heat flow rate of radiator is also more and more higher, the heat-sinking capability of the radiator of requirement is more and more stronger.For improving the heat-sinking capability of unit volume, only have by improving the thermal conductivity of area of dissipation and material and realize.The main method of existing raising radiator area is mainly to adopt porous fin or corrugated plate to improve area of dissipation, but except existing, flow resistance is large, the poor defect such as large of air inlet power device radiator temperature successively, also there are following two defects: one along with the increasing of fin height, and the efficiency of fin is low; Second radiator cannot be used integral section moulding, can only adopt dummy slider or inserted technique; If but in order to increase area of dissipation, by the minimizing of inter fin space, dummy slider and inserted technique realize difficulty will be increased, cause quality unstable, therefore more than the minimum spacing 2.5mm of the fin of existing section bar, embedding (edge) sheet heat radiator, heat-sinking capability is limited, when power density is larger, only has the radiator that adopts alternate manner.The method that improves radiator area increases heat pipe in addition below power device, utilizes heat pipe the heat of power device to be transmitted to other position of base plate, by reducing density of heat flow rate, reduces temperature rise.And in order to improve material thermal conductivity two kinds of ways of main employing at present:
1, be in the substrate of radiator, to increase many heat pipes, by heat pipe, promote substrate heat-transfer effect, take the heat in substrate to fin place fast, by fin, heat is shed.Mainly there are following some shortcomings in this kind of method:
1) because the faying face of power device and radiator base plate requirement flatness and roughness requirement are high, heat pipe is packed into after substrate, must process guarantee flatness and roughness.This just requires: one, heat pipe and substrate require the flatness of heat pipe integral body essential little after flattening; Two, when the plane of substrate processing and heat pipe, must strict controlled working amount.If control the bad wall thickness that there will be heat pipe, the leak rate of heat pipe increases, and affects the life-span of heat pipe, when serious, directly heat pipe wall processing is penetrated, and causes inside heat pipe vacuum breaking and loses efficacy.Because above-mentioned reason causes disqualification rate in the course of processing of heat-pipe radiator to raise, quality cost is high; After the attenuation of heat pipe wall thickness, thickness and vaccum leakage rate are very difficult to be detected, and causes part heat-pipe radiator because this kind of reason life-span reduces and be difficult to be selected by the method for detection, causes quality risk high.
2) current heat pipe sheathing material mostly is T2 red copper, and baseplate material mostly is aluminium alloy, conventionally adopts the soldering of low temperature tin or cementing filling heat pipe and substrate forming gap afterwards.The shortcoming of low temperature tin lead welding is: one, before weldering, must carry out to radiator the surface treatments such as whole nickel plating or copper facing, welding and surface treatment cause cost high.Two, soldering very difficult assurance heat pipe and the filling of Al-alloy based board plane are full, there will be localized voids, and because heat pipe is below power device, density of heat flow rate are large, and space can cause power device to occur that local temperature rise is high, and causes device loss.The gap shortcoming that adopts cementing scheme to fill between heat pipe and substrate is: one, the common life requirements of power device radiator is more than 20 years or higher, and the life-span of glue conventionally about 5 ~ 10 years, be difficult to guarantee the life requirements of radiator.Two, the thermal conductivity of glue is low, is usually less than 1Wm-1K-1, adopts glue to fill the thermal resistance that can increase radiator, reduces the performance of radiator.
3) adopt this kind of heat-pipe radiator can not improve the radiator heat-dissipation ability of unit volume, just the heat of power device is derived, the volume of heat-pipe radiator can increase, and can make the volume of power electronic equipment increase, thereby cause cost to increase.
2, another kind of method is that substrate portion adopts copper soleplate, to improve the thermal conductivity of substrate, reduces the temperature rise of radiator.This kind of method also comes with some shortcomings.
1) although the thermal conductivity of red copper can be higher than aluminium alloy, the ratio that accounts for whole radiator because of the thermal-conduction resistance of substrate in power device radiator is low, by adopting copper soleplate to reduce the limited in one's ability of thermal-conduction resistance.Mainly by the heat-sinking capability of copper soleplate extended device periphery, but because the coefficient of conductivity of copper can reach between 380 ~ 400Wm-1K-1, but compare the materials such as heat pipe, can be much lower, therefore adopt the scheme of part copper base plate to improve limited to the performance of radiator.
2) a substrate part is red copper at present, and another part is aluminium alloy, conventionally adopts the soldering of low temperature tin or cementing filling heat pipe and substrate forming gap afterwards.The shortcoming of low temperature tin lead welding is: one, before weldering, must to radiator, carry out the surface treatments such as whole nickel plating or copper facing, the material cost of copper coin own is high, welding and surface treatment cost also high, cause the cost of this kind of process program high.The gap shortcoming that adopts cementing scheme to fill between copper coin and substrate is: one, the common life requirements of power device radiator is more than 20 years or higher, and the life-span of glue conventionally about 5 ~ 10 years, be difficult to guarantee the life requirements of radiator.Two, the thermal conductivity of glue is low, is usually less than 1Wm-1K-1, adopts glue to fill the thermal resistance that can increase radiator, reduces the performance of radiator.
3) substrate portion copper, part aluminium alloy, can bring the poor long-time corrosion causing of different potentials between copper aluminium, reduces radiator life and reliability.
4) when same radiator is installed a plurality of power devices at air inlet and air outlet direction, in the temperature rise hole of wind, reach more than 20 ℃, because the difference of wind-warm syndrome, the power device of air outlet can be than the power device temperature rise of air inlet more than 15 ℃, but when the temperature contrast of power device is large, make the life-span of power device different, can affect the control characteristic of power device simultaneously.
By patent retrieval, arrive some about the patent of radiator aspect, but do not find the patented technology identical with the utility model, the patent relevant to the utility model technology mainly contains following:
1, number of patent application is CN201010611031.2, utility model name is called " a kind of fin-inserted radiator and have the heat abstractor of fin-inserted radiator ", this patent discloses a kind of fin-inserted radiator and has had the heat abstractor of fin-inserted radiator, fin-inserted radiator is provided with substrate and is installed on the radiating fin of described substrate, described radiating fin carries out air blast by being arranged at the air blast of its underpart, described radiating fin is provided with arc notch, and described arc notch is corresponding with the position of described air blast.The heat abstractor of fin-inserted radiator, is provided with support, is installed on the fin-inserted radiator of described support and is arranged at the air blast of described support bottom; Fin-inserted radiator is provided with substrate and is installed on the radiating fin of described substrate, and described radiating fin is provided with arc notch, and described arc notch is positioned at described air blast upper position.
2, number of patent application is CN201110453400.4, utility model name is called " a kind of conduction refrigeration mode high-power semiconductor laser and preparation method thereof " this patent and discloses a kind of conduction cooling type high-power semiconductor laser and preparation method thereof, comprises radiator and one or more semiconductor laser element; Described semiconductor laser element is by chip, form with the substrate that plays radiation conductive effect of chips welding and with the insulating trip that plays insulating radiation effect that substrate welds, and semiconductor laser element is welded on radiator by insulating trip.
3, number of patent application is CN201210491876.1, utility model name be called "; utility model name is called " a kind of interruption dislocation air-cooled radiator "; this patent discloses a kind of interruption dislocation air-cooled radiator; comprise substrate, baffle plate and fins set, it is characterized in that: described fins set comprises wide tooth pitch fins set and narrow tooth pitch fins set; Described substrate two ends are fixed with described baffle plate, between described substrate and described baffle plate, form the spatial accommodation that can hold described wide tooth pitch fins set and described narrow tooth pitch fins set, described wide tooth pitch fins set and described narrow tooth pitch fins set are fixed in described spatial accommodation; Between described wide tooth pitch fins set and described narrow tooth pitch fins set, be provided with and be interrupted district.
Though above-mentioned these patents all relate to finned radiator, be all still all the radiator being formed by fin and two unit combinations of substrate, therefore all still there are more said problems above, so necessary, this is further improved.
Utility model content
Technical problem to be solved in the utility model is for the existing some shortcomings of existing finned radiator, a kind of new finned radiator is provided, this kind of radiator be not containing heat pipe, without two kinds of different materials of copper aluminium, while is without the radiator of cementation process, heat dispersion reaches or approaches heat-pipe radiator, meet or exceed the heat dispersion of part copper substrate radiator, can eliminate the impact of wind-warm syndrome on power device temperature rise simultaneously.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme: a kind of high heat flux finned radiator, comprise radiator base plate and fin, on the surface of radiator base plate, be close to power device is installed, it is characterized in that, described radiator base plate is to be constituted by high temperature brazing by fin and distance piece.
Further, described radiator base plate is by two fin clamping a slice distance pieces, then gets up formed by Welding.
Further, described fin is arranged together according to the combination of determined interval by 3 above single fin, between every two fin, is inserted with distance piece, by distance piece, guarantees the gap between fin.
Further, the gap between described fin is any gap that is less than or equal to 2.5mm.
The utility model is by utilizing fin self and distance piece to weld the substrate of made radiator by high temperature brazing, can adjust the gap between fin by adjusting the minimum thickness of distance piece, make the minimum spacing≤2.5mm of fin, making the area of dissipation of unit volume radiator compare other radiator can increase, thereby improves the heat-sinking capability of radiator.The exchange capability of heat of radiator is to be determined by area of dissipation, and under same volume, the area of radiator is that the quantity by fin determines, by section bar and dummy slider (inserted) process, is difficult to realize the spacing below fin 2.5mm.Soldering radiator of the present utility model can be easy to the inter fin space below 2.5mm, by improving the area of unit volume fin, reduces the heat exchange thermal resistance of radiator, improves the hot property of radiator.Compare heat-pipe radiator simultaneously, reduced the volume of radiator and power electronic equipment, reduced system cost.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is texture edge schematic diagram of the present utility model;
Fig. 3 is the enlarged diagram of the utility model substrate portion.
Wherein: 1, substrate, 2, fin, 3, distance piece, 4, braze, 5, top spacer, 6, top board, 7, power device.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
Embodiment mono-
Shown in accompanying drawing, can know and find out that the utility model relates to a kind of manufacture method of high heat flux finned radiator, the fin of radiator is cut according to needed length, and the head rest as heat-radiating substrate is neat, make fin termination as one of heat-radiating substrate in same plane; And between every two fin, fill in the distance piece in gap between guaranteed fin; Then fin and distance piece are got up by Welding each other, fin and distance piece are fused into one, make the radiator that is combined to form substrate by fin self and distance piece.
Further, the welding of described fin and distance piece at least comprises the following steps:
(A) aluminium is manufactured as required to required single fin and distance piece;
(B) ready single fin is put into soldering mould, and make the single fin of every a slice as in the weld mold of one of fin substrate in one plane;
(C) between every two fin, according to the size of space, need to insert identical or not identical distance piece, guarantee the gap between fin, when inserting distance piece, need to keep simultaneously single fin as the top of one of fin substrate still in same plane;
(D) by braze, by high temperature brazing, fin and distance piece are welded each other, fin and distance piece are fused into one, form required radiator base plate;
(E) radiator base plate soldering being formed, carries out shaping processing according to the requirement of heat-radiating substrate, makes it reach the installation requirement of device.
Further, described fin is arranged together according to the combination of determined interval by 3 above single fin, between every two fin, is inserted with distance piece, by distance piece, guarantees the gap between fin.
Further, any gap that inter fin space is less than or equal to 2.5mm can be easily realized in the gap between described fin;
Further, described fin and distance piece each other by Welding get up be distance piece is inserted between fin after by high temperature brazing, fin and distance piece are fused into one; Welding temperature is 500-650 ℃.
Further, described fin and distance piece all adopt high-purity aluminium sheet, and AL content >=99.6% can improve the heat conductivility of radiator so greatly.
A radiator of making according to the method described above, comprises radiator base plate and fin, on the surface of radiator base plate, is close to power device is installed, and it is characterized in that, described radiator base plate is to be constituted by high temperature brazing by fin and distance piece.
Further, described radiator base plate is by two fin clamping a slice distance pieces, then gets up formed by Welding.
Further, described fin is arranged together according to the combination of determined interval by 3 above single fin, between every two fin, is inserted with distance piece, by distance piece, guarantees the gap between fin.
Further, the gap between described fin is any gap that is less than or equal to 2.5mm.
Further, on the other end of the described non-substrate of fin, for firm needs, by inserting top spacer, and by between top spacer and fin, by high temperature brazing, weld formation top board.
The utility model is by utilizing fin self and distance piece to weld the substrate of made radiator by high temperature brazing, can adjust the gap between fin by adjusting the minimum thickness of distance piece, make the minimum spacing≤2.5mm of fin, making the area of dissipation of unit volume radiator compare other radiator can increase, thereby improves the heat-sinking capability of radiator.The exchange capability of heat of radiator is to be determined by area of dissipation, and under same volume, the area of radiator is that the quantity by fin determines, by section bar and dummy slider (inserted) process, is difficult to realize the spacing below fin 2.5mm.Soldering radiator of the present utility model can be easy to the inter fin space below 2.5mm, by improving the area of unit volume fin, reduces the heat exchange thermal resistance of radiator, improves the hot property of radiator.Compare heat-pipe radiator simultaneously, reduced the volume of radiator and power electronic equipment, reduced system cost.Advantage of the present utility model mainly contain following some:
Advantage 1: compare traditional section bar and dummy slider power device radiator, thermal resistance is lower, and hot property is better can be better than dummy slider (inserted) radiator containing copper soleplate in the situation that of same volume size, and performance approaches or reaches heat-pipe radiator.
Advantage 2: do not have the heat pipe life-span of heat-pipe radiator to be difficult to ensure card, the problem such as conforming product rate is low and cost price is high.
Advantage 3: the samming that can realize different capacity device by a high temperature brazing moulding.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within being all included in protection range of the present utility model.
Claims (5)
1. a high heat flux finned radiator, comprises radiator base plate and fin, on the surface of radiator base plate, is close to power device is installed, and it is characterized in that, described radiator base plate is to be constituted by high temperature brazing by fin and distance piece.
2. high heat flux finned radiator as claimed in claim 1, is characterized in that, described radiator base plate is by two fin clamping a slice distance pieces, then gets up formed by Welding.
3. high heat flux finned radiator as claimed in claim 1, it is characterized in that, described fin is arranged together according to the combination of determined interval by 3 above single fin, between every two fin, be inserted with distance piece, by distance piece, guarantee the gap between fin.
4. high heat flux finned radiator as claimed in claim 1, is characterized in that, the gap between described fin is any gap that is less than or equal to 2.5mm.
5. high heat flux finned radiator as claimed in claim 1, is characterized in that, on the other end of the described non-substrate of fin, by inserting top spacer, and by between top spacer and fin, by high temperature brazing, welds formation top board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201320421765.3U CN203434143U (en) | 2013-07-16 | 2013-07-16 | High hot-fluid density heat dissipation gilled radiator |
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| CN201320421765.3U CN203434143U (en) | 2013-07-16 | 2013-07-16 | High hot-fluid density heat dissipation gilled radiator |
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| CN203434143U true CN203434143U (en) | 2014-02-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107966061A (en) * | 2017-11-27 | 2018-04-27 | 苏州惠琪特电子科技有限公司 | A kind of heat dissipation element |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107966061A (en) * | 2017-11-27 | 2018-04-27 | 苏州惠琪特电子科技有限公司 | A kind of heat dissipation element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160707 Address after: 411201, Xiangtan, Hunan (Jiu Hua) 9 West legend Road, innovation and Entrepreneurship Center No. 10 Patentee after: Hunan Zhi hot technology Limited by Share Ltd Address before: 412007 Industrial Park, E Industrial Zone, Tianyuan, Hunan, China Patentee before: Zhuzhou Zhire Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20180716 |