CN203434137U - Vacuum suction nozzle - Google Patents
Vacuum suction nozzle Download PDFInfo
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- CN203434137U CN203434137U CN201320583484.8U CN201320583484U CN203434137U CN 203434137 U CN203434137 U CN 203434137U CN 201320583484 U CN201320583484 U CN 201320583484U CN 203434137 U CN203434137 U CN 203434137U
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- suction nozzle
- pressure head
- suction
- head
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Abstract
The utility model discloses a vacuum suction nozzle. The vacuum suction nozzle is characterized in that the vacuum suction nozzle comprises a pressing head (2); a suction head (4) is arranged in the pressing head (2); the front end of the suction head (4) extends to the outer part of the pressing head (2); a suction surface (6) is arranged on the front end of the suction head (4); at least one attraction hole (8), which penetrates through the suction head (4) and is communicated with the suction surface (6), is arranged in the suction head (4); and a suction hole (10) communicated with the attraction hole (8) is arranged in the pressing head (2). The vacuum suction nozzle provided by the utility model cannot bruise the surface of a chip and has the advantages that the service lifetime is long, the requirement of small size machining is met, and the installation and the change are convenient.
Description
Technical field
This experiment is novel relates to a kind of suction nozzle, relates in particular to a kind of vacuum slot, is specifically applicable to the absorption of semiconductor chip.
Background technology
Suction nozzle, particularly vacuum slot are a kind of more common devices, are widely used in semiconductor packaging or mount technology, its role is to draw semiconductor chip or electronic component and are transferred to ad-hoc location.During use, suction nozzle is arranged on die bonder, and under the control of die bonder, suction nozzle directly contacts with semiconductor chip or electronic component, utilizes vacuum principle to draw semiconductor chip or electronic component, finally completes a series of actions such as transfer and placement.
In actual use, user adopts different suction nozzles according to the application requirements of product conventionally, for example: in MOS integrated circuit, because circuit level is high, circuit is complicated, and adsorption temp mostly is room temperature, thus hardness is partially soft, good springiness, little, simple in structure to chip damage, change rubber suction nozzle efficiently and be widely adopted, yet, but there is quick abrasion, short defect and problem of life-span in this suction nozzle, the limitation because of material cannot meet undersized processing and application simultaneously; For another example: when absorption product is diode, triode, this type of circuit is simple, chip size is little, adsorption temp scope is from room temperature to 420 ℃, therefore the suction nozzle that polyimides engineering plastics, pottery or the wolfram steel material that hardness is high, resistance to wear is good made is widely adopted, yet, this suction nozzle is because hardness is high, thus easily at chip surface, form cut or chip is caused and weighed wounded, and need bulk handling and adjusting while changing, therefore, also there is handling defect and the problem of trouble.
In sum, existing vacuum slot exist quick abrasion, life-span short, cannot meet small size process requirements or easily cause chip damage or handling defect and the problem of trouble because of much higher hard.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind ofly can not weigh chip surface, long service life wounded, can meet undersized processing, and is easy to the vacuum slot installing and change.
For solving the problems of the technologies described above, the utility model provides a kind of vacuum slot, comprise pressure head, in described pressure head, be provided with suction nozzle, the front end of described suction nozzle extends to the outside of described pressure head, the front end of described suction nozzle has an adsorption plane, and the inside of described suction nozzle has at least one attraction hole of running through described suction nozzle and being communicated with described adsorption plane, has the sucker communicating with described attraction hole in described pressure head.
The diameter in described attraction hole is less than the diameter of described sucker.
Described pressure head is rubber pressure head.
Described suction nozzle is engineering plastics suction nozzle.
Compared with prior art, the beneficial effects of the utility model are:
1. because vacuum cups of the present utility model is comprised of pressure head and suction nozzle two parts, the pressure of pressure head available buffer suction nozzle to chip or electronic component during use, also can reduce the embedding injury of cutting silicon bits to suction nozzle simultaneously, so not only can prevent that suction nozzle from weighing chip surface wounded, can also extend the useful life of suction nozzle, therefore the utility model can not weigh chip surface wounded, and useful life is longer.
2. because vacuum cups of the present utility model is comprised of pressure head and suction nozzle two parts, thereby be convenient to processing, particularly undersized processing, and be convenient to install and change.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model the first embodiment;
Fig. 2 is the structural representation of the utility model the second embodiment;
In figure: pressure head 2, suction nozzle 4, adsorption plane 6, attracts hole 8, sucker 10.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details
the first embodiment:
Shown in Figure 1, a kind of vacuum cups of the present utility model, comprise pressure head 2 and be fixed on the suction nozzle 4 in pressure head 2, the front end of suction nozzle 4 extends to the outside of pressure head 2, and the front end of suction nozzle 4 has an adsorption plane 6, the inside of suction nozzle 4 has at least one attraction hole 8 of running through suction nozzle 4 and being communicated with adsorption plane 6, in actual practicality, can the quantity that attract hole 8 be set according to the overall dimension of product, in pressure head 2, be provided with and the sucker 10 that attracts hole to communicate.
During making, the fine class vulcanization of rubber of pressure head 2 preferred fourth compression molding, also can adopt silica type or thermoplastic rubber; And suction nozzle 4 preferably adopts polyimides engineering plastics to make, also can adopt other material, as pottery and metal material, for ease of processing, simplify manufacture craft, the diameter of sucker 10 is greater than the diameter that attracts hole 8.
the second embodiment:
The second embodiment compares basic identical with the first embodiment, difference is tightly the shape of suction nozzle 4, and the extension that is specifically positioned at pressure head 2 outsides on suction nozzle 4 also has the columnar portion contacting with pressure head 2 except frustum portion.
In sum, vacuum slot of the present utility model can not weigh chip surface wounded, and there is long service life simultaneously, can meet small size processing, and the advantage that is easy to installation and changes.
The foregoing is only better embodiment of the present utility model; protection range of the present utility model is not limited with above-mentioned execution mode; in every case the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or is changed, and all should include in the protection range of recording in claims.
Claims (4)
1. a vacuum slot, it is characterized in that: comprise pressure head (2), in described pressure head (2), be provided with suction nozzle (4), the front end of described suction nozzle (4) extends to the outside of described pressure head (2), the front end of described suction nozzle (4) has an adsorption plane (6), the inside of described suction nozzle (4) has at least one attraction hole (8) of running through described suction nozzle (4) and being communicated with described adsorption plane (6), has the sucker (10) communicating with described attraction hole (8) in described pressure head (2).
2. vacuum slot according to claim 1, is characterized in that: the diameter in described attraction hole (8) is less than the diameter of described sucker (10).
3. vacuum slot according to claim 1, is characterized in that: described pressure head (2) is rubber pressure head.
4. vacuum slot according to claim 1, is characterized in that: described suction nozzle (4) is engineering plastics suction nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320583484.8U CN203434137U (en) | 2013-01-15 | 2013-09-22 | Vacuum suction nozzle |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320018213 | 2013-01-15 | ||
| CN201320018213.8 | 2013-01-15 | ||
| CN201320583484.8U CN203434137U (en) | 2013-01-15 | 2013-09-22 | Vacuum suction nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203434137U true CN203434137U (en) | 2014-02-12 |
Family
ID=50063161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320583484.8U Expired - Fee Related CN203434137U (en) | 2013-01-15 | 2013-09-22 | Vacuum suction nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203434137U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106057720A (en) * | 2016-07-01 | 2016-10-26 | 深圳清华大学研究院 | Chip mounter suction nozzle and chip mounter |
| CN106560306A (en) * | 2015-10-06 | 2017-04-12 | 飞刻泰克有限公司 | Manufacturing Method Of Vacuum Nozzle |
| CN112133667A (en) * | 2020-11-25 | 2020-12-25 | 武汉大学 | Micro device transfer device and method |
-
2013
- 2013-09-22 CN CN201320583484.8U patent/CN203434137U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106560306A (en) * | 2015-10-06 | 2017-04-12 | 飞刻泰克有限公司 | Manufacturing Method Of Vacuum Nozzle |
| CN106057720A (en) * | 2016-07-01 | 2016-10-26 | 深圳清华大学研究院 | Chip mounter suction nozzle and chip mounter |
| CN106057720B (en) * | 2016-07-01 | 2019-08-02 | 深圳清华大学研究院 | A kind of chip mounter suction nozzle and chip mounter |
| CN112133667A (en) * | 2020-11-25 | 2020-12-25 | 武汉大学 | Micro device transfer device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20150922 |
|
| EXPY | Termination of patent right or utility model |