CN203772882U - Positioning framework structure - Google Patents
Positioning framework structure Download PDFInfo
- Publication number
- CN203772882U CN203772882U CN201320891284.9U CN201320891284U CN203772882U CN 203772882 U CN203772882 U CN 203772882U CN 201320891284 U CN201320891284 U CN 201320891284U CN 203772882 U CN203772882 U CN 203772882U
- Authority
- CN
- China
- Prior art keywords
- integrated chip
- chamber
- positioning
- described integrated
- framework structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Abstract
The utility model relates to a positioning framework structure which is used for positioning and centering of an integrated chip. The positioning framework structure comprises an integrated chip bearing component in which a first chamber is defined; and an integrated chip positioning magnet which is arranged in the first chamber of the integrated chip bearing component. The positioning framework structure also comprises an integrated chip maintaining device which is arranged on the integrated chip positioning magnet. The integrated chip is maintained on the integrated chip maintaining device so that positioning and centering of the integrated chip relative to the integrated chip positioning magnet are provided. Positioning and centering of the integrated chip and the positioning magnet on the bearing component can be greatly controlled. Meanwhile, the size of the positioning magnet can be greater than that of the integrated chip through manufacturing. Besides, a larger air gap can also be acquired so that subsequent operation on the integrated chip is facilitated. Furthermore, bonding operation is omitted by the technical scheme so that operation cost is saved.
Description
Technical field
The utility model relates to a kind of positioning framework structure, and particularly, the utility model relates to for the positioning framework structure to neutralization location between integrated chip and positioning magnet accurately.
Background technology
The speed that the non-contact code device of employing magnetic sensor detects target wheel is well-known, for example, can adopt Hall element, anisotropic magnetoresistive sensor and large magnetoresistive transducer.Such sensor can be called as speed pickup, two-wire Hall effect directivity output speed sensor (TOSS for example, Two-Wire Hall Effect Directional Output Speed Sensor), integrated directivity clutch coupling input speed sensor (CISS, Integrated Directional Clutch Input Speed Sensor) and non-directivity input speed sensor (TISS, Non-directional Input Speed Sensor), their function, performance and designing requirement are as known in the art.The rotating speed of the target that speed pickup can sensing vehicle transmission adopts in application.
These speed pickups can be for inputing or outputing encoder applies during target rotation.They have the integrated chip (IC, Integrated Chip) of less encapsulation conventionally, and on the top side of this integrated chip in magnet, and magnet is in bearing carrier.In operating process, need location and the centering of control integration chip on magnet.In the prior art, integrated chip is normally assembled on bearing carrier, and the internal diameter by the hole in bearing carrier carrys out the centering between control integration chip and magnet, and the location of integrated chip is controlled by the rib on bearing carrier.This scheme requires the size of magnet less than the size of integrated chip, otherwise cannot carry out centering, and integrated chip need to carry out bondingly fixing with glue simultaneously, has increased production cost.
Because the dimensional requirement of magnet is less than integrated chip, make this scheme not be suitable for the situation that integrated chip is less.Meanwhile, need to stick with glue and connect integrated chip, also increase the complicacy of operation.Therefore, need a kind of location structure in this area, it can be applicable to the situation that integrated chip is less than positioning magnet, and can simplified structure and operation and reduce costs.
Utility model content
Therefore, the purpose of this utility model is to provide a kind of positioning framework structure, for the positioning framework structure to neutralization location between integrated chip accurately and positioning magnet, can be applicable to the situation that integrated chip is less than positioning magnet, and can omit bonding operation of the prior art, thereby save cost.
Above-mentioned purpose of the present utility model realizes by a kind of positioning framework structure, and this positioning framework structure is for location and the centering of integrated chip, and described positioning framework structure comprises:
Integrated chip bearing carrier, is limited with the first chamber in described integrated chip bearing carrier; And
Integrated chip positioning magnet, described integrated chip positioning magnet is arranged in the first chamber of described integrated chip bearing carrier;
Wherein said positioning framework structure also comprises integrated chip retainer, described integrated chip retainer is arranged on described integrated chip positioning magnet, described integrated chip remains on described integrated chip retainer, so that location and the centering of described integrated chip with respect to described integrated chip positioning magnet to be provided.
In one embodiment, described integrated chip retainer is formed with accommodation section, and described integrated chip remains in described accommodation section.
In one embodiment, the shape and size of described accommodation section are corresponding with the shape and size of described integrated chip, and described integrated chip is arranged in described accommodation section immovably.
In one embodiment, the size of described integrated chip positioning magnet is corresponding with the size of the first chamber of described integrated chip bearing carrier, and described integrated chip positioning magnet is arranged in described the first chamber immovably.
In one embodiment, the size of described integrated chip positioning magnet is larger than the size of described integrated chip.
In one embodiment, in described integrated chip bearing carrier, be also limited with the second chamber, described the second chamber is in described the first chamber top.
In one embodiment, in second chamber of described integrated chip retainer in described integrated chip bearing carrier.
In one embodiment, the size of the second chamber of described integrated chip bearing carrier is greater than the size of the first chamber of described integrated chip bearing carrier.
In one embodiment, between described the first chamber and described the second chamber, form shoulder portion, in second chamber of described integrated chip retainer in described integrated chip bearing carrier and lean against in described shoulder portion.
In one embodiment, it is characterized in that, the Outside Dimensions of described integrated chip retainer is corresponding with the size of the second chamber of described integrated chip bearing carrier, and described integrated chip retainer is arranged in described the second chamber immovably.
By technique scheme, integrated chip and positioning magnet location and the centering on bearing carrier can be controlled and guarantee to positioning framework structure of the present utility model preferably.Meanwhile, due to the existence of integrated chip retainer, positioning magnet can be made for larger than integrated chip, thereby can less integrated chip be operated.In addition, can also obtain larger clearance, to be conducive to that integrated chip is carried out to follow-up operation.
In addition, compare with the integrated chip targeting scheme of prior art, the technical solution of the utility model is owing to having omitted bonding operation, and saved running cost.
Accompanying drawing explanation
Below with reference to accompanying drawing, describe the embodiment of positioning framework structure of the present utility model in detail, wherein:
Fig. 1 is according to the longitudinal sectional view of positioning framework structure of the present utility model;
Fig. 2 is according to the transverse sectional view of positioning framework structure of the present utility model.
Embodiment
With reference to accompanying drawing, below will describe positioning framework structure of the present utility model in detail.Positioning framework structure of the present utility model, for location and the centering of integrated chip, is particularly useful for location and the centering of less integrated chip on larger integrated chip positioning magnet.
Please refer to Fig. 1 and 2, it is respectively according to the longitudinal sectional view of positioning framework structure 100 of the present utility model and transverse sectional view.In Fig. 1 and Fig. 2, positioning framework structure 100 mainly comprises integrated chip bearing carrier 101 and integrated chip positioning magnet 102.In integrated chip bearing carrier 101, be limited with the first chamber 103.In an illustrated embodiment, the xsect of this first chamber 103 is square, but also can expect, the first chamber 103 can have any optional other shape.
Integrated chip positioning magnet 102 is arranged in the first chamber 103 of integrated chip bearing carrier 101.Preferably, the size of integrated chip positioning magnet 102 is corresponding with the size of the first chamber 103 of integrated chip bearing carrier 101, integrated chip positioning magnet 102 can be arranged in the first chamber 103 immovably, can control and guarantee location and the centering between integrated chip positioning magnet 102 and integrated chip bearing carrier 101 thus.
Positioning framework structure 100 of the present utility model is provided with integrated chip retainer 300, and integrated chip retainer 300 is arranged on integrated chip positioning magnet 102.In actual mechanical process, integrated chip 200 is maintained in this integrated chip retainer 300, realizes integrated chip 200 with respect to location and the centering of integrated chip positioning magnet 102 thus by this integrated chip retainer 300.
It should be noted that owing to being provided with integrated chip retainer 300, so the size of integrated chip positioning magnet 102 can be larger than the size of integrated chip 200, meet thus some specific (special) requirements of this area chips encapsulation.Meanwhile, owing to having integrated chip retainer 300, the size of integrated chip 200 can be accomplished very little, once to overcome the less defect that just cannot locate with centering of integrated chip in prior art.
In a preferred embodiment, integrated chip retainer 300 is provided with accommodation section 301, and integrated chip 200 can be contained in this accommodation section 301.Preferably, the shape and size of accommodation section 301 are corresponding with the shape and size of integrated chip 200, but integrated chip 200 can be arranged in accommodation section 301 immovably removedly.
Integrated chip bearing carrier 101 can also be provided with the second chamber 104, in an illustrated embodiment, and the second top of chamber 104 in the first chamber 103.In having the embodiment of the second chamber 104, integrated chip retainer 300 can be arranged in the second chamber 104 of integrated chip bearing carrier 101.
The size of the second chamber 104 of integrated chip bearing carrier 101 can be greater than, be equal to or less than the size of the first chamber 103 of integrated chip bearing carrier 101.In illustrated preferred embodiment, the size of the second chamber 104 is greater than the size of the first chamber 103.In this case, in one embodiment, between the first chamber 103 and the second chamber 104, form shoulder portion 105.In the situation that having shoulder portion 105, integrated chip retainer 300 can lean against in this shoulder portion 105.
In a preferred embodiment, the Outside Dimensions of integrated chip retainer 300 is corresponding with the size of the second chamber 104 of integrated chip bearing carrier 101, but integrated chip retainer 300 can be arranged in this second chamber 104 immovably removedly.By the structural relation of above-mentioned integrated chip bearing carrier 101, integrated chip positioning magnet 102 and integrated chip retainer 300, can guarantee neutralization is located between integrated chip 200 and integrated chip positioning magnet 102.
Integrated chip retainer 300 and the second chamber 104 can have suitable shape, for example, in illustrated embodiment, the xsect of the second chamber 104 is symmetrical hexagon, correspondingly, the xsect of integrated chip retainer 300 is also symmetrical hexagon, roughly corresponding with the xsect of the second chamber 104.In an illustrated embodiment, a plurality of sides of integrated chip retainer 300 (can not be whole sides) are against the corresponding inner side edge of the second chamber 104, so that integrated chip retainer 300 is in position with respect to the second chamber 104.
Obviously, it may occur to persons skilled in the art that, integrated chip retainer 300 and the second chamber 104 also can have any other suitable shape, if can guarantee between integrated chip 200 and integrated chip positioning magnet 102 in and positioning instant can.
In addition, in order further to strengthen integrated chip 200 fixing in the accommodation section 301 of integrated chip retainer 300, extra fixed sturcture can also be set, for example, integrated chip 200 can snap in accommodation section 301.
Integrated chip and positioning magnet location and the centering on bearing carrier can be controlled and guarantee to above-described embodiment of positioning framework structure of the present utility model preferably.Meanwhile, due to the existence of integrated chip retainer, positioning magnet can be made for larger than integrated chip, thereby can less integrated chip be operated.In addition, can also obtain larger clearance, to be conducive to that integrated chip is carried out to follow-up operation.
In addition, compare with the integrated chip targeting scheme of prior art, the technical solution of the utility model is owing to having omitted bonding operation, and saved running cost.
Although above, by means of preferred embodiment, the utility model is described in detail, it will be appreciated by those skilled in the art that the utility model is not limited to above-described embodiment.In the situation that not departing from spirit and scope of the present utility model, can carry out various modifications, variation and replacement to the utility model, these are revised, change and replace and are all encompassed in scope of the present utility model.
Claims (10)
1. a positioning framework structure, its location for integrated chip and centering, described positioning framework structure comprises:
Integrated chip bearing carrier, is limited with the first chamber in described integrated chip bearing carrier; And
Integrated chip positioning magnet, described integrated chip positioning magnet is arranged in the first chamber of described integrated chip bearing carrier;
Wherein said positioning framework structure also comprises integrated chip retainer, described integrated chip retainer is arranged on described integrated chip positioning magnet, described integrated chip remains on described integrated chip retainer, so that location and the centering of described integrated chip with respect to described integrated chip positioning magnet to be provided.
2. positioning framework structure according to claim 1, is characterized in that, described integrated chip retainer is formed with accommodation section, and described integrated chip remains in described accommodation section.
3. positioning framework structure according to claim 2, is characterized in that, the shape and size of described accommodation section are corresponding with the shape and size of described integrated chip, and described integrated chip is arranged in described accommodation section immovably.
4. positioning framework structure according to claim 1, it is characterized in that, the size of described integrated chip positioning magnet is corresponding with the size of the first chamber of described integrated chip bearing carrier, and described integrated chip positioning magnet is arranged in described the first chamber immovably.
5. positioning framework structure according to claim 1, is characterized in that, the size of described integrated chip positioning magnet is larger than the size of described integrated chip.
6. positioning framework structure according to claim 1, is characterized in that, in described integrated chip bearing carrier, is also limited with the second chamber, and described the second chamber is in described the first chamber top.
7. positioning framework structure according to claim 6, is characterized in that, in second chamber of described integrated chip retainer in described integrated chip bearing carrier.
8. positioning framework structure according to claim 6, is characterized in that, the size of the second chamber of described integrated chip bearing carrier is greater than the size of the first chamber of described integrated chip bearing carrier.
9. positioning framework structure according to claim 7, it is characterized in that, between described the first chamber and described the second chamber, form shoulder portion, in second chamber of described integrated chip retainer in described integrated chip bearing carrier and lean against in described shoulder portion.
10. according to the positioning framework structure described in any one in claim 7 to 9, it is characterized in that, the Outside Dimensions of described integrated chip retainer is corresponding with the size of the second chamber of described integrated chip bearing carrier, and described integrated chip retainer is arranged in described the second chamber immovably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320891284.9U CN203772882U (en) | 2013-12-31 | 2013-12-31 | Positioning framework structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320891284.9U CN203772882U (en) | 2013-12-31 | 2013-12-31 | Positioning framework structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203772882U true CN203772882U (en) | 2014-08-13 |
Family
ID=51290060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320891284.9U Withdrawn - After Issue CN203772882U (en) | 2013-12-31 | 2013-12-31 | Positioning framework structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203772882U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104749390A (en) * | 2013-12-31 | 2015-07-01 | 森萨塔科技（常州）有限公司 | Positioning frame structure |
-
2013
- 2013-12-31 CN CN201320891284.9U patent/CN203772882U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104749390A (en) * | 2013-12-31 | 2015-07-01 | 森萨塔科技（常州）有限公司 | Positioning frame structure |
| CN104749390B (en) * | 2013-12-31 | 2020-07-03 | 森萨塔科技（常州）有限公司 | Positioning frame structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2007087507A3 (en) | Firmware socket module for fpga-based pipeline processing | |
| CN203772882U (en) | Positioning framework structure | |
| WO2017050039A1 (en) | Capacitive sensing device, packaging structure, sensor module, and electronic device | |
| CN109037129A (en) | A kind of chip rotation handling device | |
| CN104749390A (en) | Positioning frame structure | |
| CN203434137U (en) | Vacuum suction nozzle | |
| CN103557374A (en) | Freely-turnable sealed pipe clamp for wire harness in automobile | |
| CN206010630U (en) | A kind of straight-line displacement encoder | |
| US10145941B2 (en) | LIDAR sensor attached to an actuator | |
| CN103867776A (en) | Digital flow valve | |
| CN205466238U (en) | Biography dish robot of RFID location | |
| CN102861926A (en) | Turning process of conical bearing | |
| CN104209947A (en) | Four-degree-of-freedom electrohydraulic control motion system | |
| CN202914190U (en) | Central control device with electronic throttle valve | |
| CN203344738U (en) | Automobile fuel gas main valve support | |
| CN102367057A (en) | Big bent arm | |
| CN202080343U (en) | Large curved boom | |
| CN101334147A (en) | Sticker type LED capable of bidirectionally light emitting and producing rectangular optical spot | |
| CN201517595U (en) | Ball screw device | |
| CN204117428U (en) | The baculoviral model teaching aid of helical symmetry | |
| CN203237310U (en) | Magnetic sphere balancing type robot actuator | |
| CN204043616U (en) | With the grating scale of accelerometer | |
| CN104865873A (en) | Four-axis aircraft control circuit | |
| CN203177860U (en) | Electronic compass | |
| CN203567007U (en) | Automatic mechanical film-laminating arm applied to film inserting injection molding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140813 Effective date of abandoning: 20200703 |