CN203426835U - Cutting tool - Google Patents
Cutting tool Download PDFInfo
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- CN203426835U CN203426835U CN201320509148.9U CN201320509148U CN203426835U CN 203426835 U CN203426835 U CN 203426835U CN 201320509148 U CN201320509148 U CN 201320509148U CN 203426835 U CN203426835 U CN 203426835U
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- Prior art keywords
- blade body
- cutting
- blade
- wafer
- described blade
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model provides a cutting tool which comprises a blade. The blade comprises a blade body and a plurality of cutting particles. The cross section of the blade body is in a ring shape. The side section of the blade body is in a wedge shape. The width of the outer side edge of the blade body is smaller than the width of the inner side edge of the blade body. The cutting particles are distributed in the blade body. According to the cutting tool, the rectangular side section of an original annular blade is changed into the wedge-shaped side section, so that when the edge of a wafer of a device is cut, a cutting opening of the edge of the wafer of the device is changed into an oblique face, therefore, part of force is removed by the oblique face when the cutting particles on the blade body carry out cutting, and accordingly the probability that small notches are formed in the edge bottom of the wafer of the device is lowered.
Description
Technical field
The utility model relates to a kind of semiconductor device, relates in particular to a kind of cutting element.
Background technology
Semiconductor, in carrying out the process of back side illuminaton technique (BSI), need combine processed wafer, the processing such as chamfered edge and skiving.Particularly, as shown in Figure 1, this processed wafer comprises carrier wafer 52 ' (carrier wafer) and device wafers 51 ' (device wafer), it is upper that device wafers 51 ' is arranged at carrier wafer 52 ', and combine wafer 5 ' (bonding wafer) with common formation of carrier wafer 52 '; As shown in Figure 2, this combination wafer 5 ' is when carrying out chamfered edge processing, and the general cutting element using is common annular blade, and the edge that is positioned at the device wafers 51 ' on carrier wafer 52 ' is eliminated; As shown in Figure 3, after chamfered edge is finished dealing with, then by the thickness of device wafers 51 ' from 725 microns of skiving to 2～3 micron.In above-mentioned technical process, when the object that chamfered edge is processed is to make the skiving of device wafers 51 ' after carrying out to process, its edge can not crack, and affects the quality of this processed wafer.But as shown in Figures 4 to 6; due to blade body 1 ' its side section of common annular blade rectangle for long 9 millimeters (mm), wide 3 millimeters (mm); some cutting particles 2 ' distribute thereon; therefore when carrying out chamfered edge processing; in this blade, the power of cutting particles 2 ' will act on device wafers 51 ' or carrier wafer 52 ' completely, and this makes the edge bottom of device wafers 51 ' usually can after chamfered edge is processed, occur small gap.Particularly at this processed wafer, carrying out chamfered edge and skiving while processing, as shown in Figure 7, generally can be put on objective table 3 ' (chuck table), due to the error of putting, the center of circle of combination wafer 5 ' generally all can be departed from the objective table center 31 ' of objective table 3 ' a little, therefore at combination wafer 5 ', rotate and carry out in the process of chamfered edge processing, when device wafers 51 ' is maximum from the distance of objective table 3 ' all lateral edges near a side of blade, the dynamics of cutting is also maximum, can cause device wafers 51 ' edge bottom to produce small gap by very large probability.This small gap can become jagged breach after skiving is processed, thereby affects the quality of this processed wafer.
Utility model content
The utility model provides a kind of cutting element, so that processed wafer is at the probability that carries out reducing when chamfered edge is processed device crystal round fringes bottom generation breach.
For achieving the above object, the utility model provides a kind of cutting element, it comprises blade, described blade comprises blade body and some cutting particles, described blade body cross section be shaped as annular, described blade body side section be shaped as wedge shape, the width of described annular blade body outer side edges is less than the width of its inner side edge, described some cutting particles distribute and are arranged in described blade body.
Further, described some cutting particles are distributed in the surface of described blade body.
Further, the width of described blade body inner side edge is 3.94 millimeters, and the width of described blade body outer side edges is 3 millimeters.
Further, the inner periphery diameter of described blade body is 40 millimeters, and the excircle diameter of described blade body is 58 millimeters.
Further, described edge cutting tool also comprises objective table and blade grasping drive unit, processed wafer is placed on described objective table, described blade grasping drive unit is arranged at the top of described objective table, described blade is arranged in described blade grasping drive unit, and aims at the position of the required cutting of described wafer.
Further, described objective table is cylinder and can rotates around its central shaft.
Compared with prior art, the utlity model has following beneficial effect:
The cutting element that the utility model provides has changed the rectangle side section of original annular blade into wedge shape side section, like this when the edge of cutting device wafers, the otch at device wafers edge has become inclined-plane, this makes cutting particles in the blade body part power when cutting by the cancellation of described inclined-plane, thereby the edge bottom that has reduced device wafers produces the probability of small gap.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is described in further detail:
Fig. 1 is the structural representation of combination wafer before carrying out chamfered edge processing;
Fig. 2 has carried out the structural representation after chamfered edge processing for combining wafer;
Fig. 3 has carried out the structural representation after skiving processing for combining wafer;
Fig. 4 is the top view of cutting element in prior art;
Fig. 5 is the cutaway view of cutting element in prior art;
Fig. 6 is the partial enlarged drawing of blade body outer ledge in cutting element in prior art;
Fig. 7 combines wafer stressed position view when maximum in carrying out chamfered edge processing procedure in prior art;
The top view of blade in the cutting element that Fig. 8 provides for the utility model embodiment;
The cutaway view of blade in the cutting element that Fig. 9 provides for the utility model embodiment;
Blade in the cutting element that Figure 10 provides for the utility model embodiment is carrying out the position view of chamfered edge while processing;
The cutting element that Figure 11 provides for the utility model embodiment is carrying out the position view of chamfered edge while processing.
In Fig. 1 to Figure 11,
1 ', 1: blade body; 2 ', 2: cutting particles; 3 ', 3: objective table; 31 ', 31: objective table center; 4: blade grasping drive unit; 5 ', 5: combination wafer; 51 ', 51: device wafers; 52 ', 52: carrier wafer.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the cutting element the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of cutting element is provided, it comprises blade, described blade comprises blade body and some cutting particles, described blade body cross section be shaped as annular, described blade body side section be shaped as wedge shape, the width of described annular blade body outer side edges is less than the width of its inner side edge, described some cutting particles distribute and are arranged in described blade body.The cutting element that the utility model provides has changed the rectangle side section of original annular blade into wedge shape side section, like this when the edge of cutting device wafers, the otch at device wafers edge has become inclined-plane, this makes cutting particles in the blade body part power when cutting by the cancellation of described inclined-plane, thereby the edge bottom that has reduced device wafers produces the probability of small gap.
Please refer to Fig. 8 to Figure 11, the top view of blade in the cutting element that Fig. 8 provides for the utility model embodiment; The cutaway view of blade in the cutting element that Fig. 9 provides for the utility model embodiment; Blade in the cutting element that Figure 10 provides for the utility model embodiment is carrying out the position view of chamfered edge while processing; The cutting element that Figure 11 provides for the utility model embodiment is carrying out the position view of chamfered edge while processing.
As shown in Figure 8 and Figure 9, the utility model embodiment provides a kind of cutting element, it comprises blade, described blade comprises blade body 1 and some cutting particles 2, described blade body 1 cross section be shaped as annular, described blade body 1 side section be shaped as wedge shape, the width of described annular blade body outer side edges is less than the width of its inner side edge, described some cutting particles 2 distribute and are arranged in described blade body 1.
Further, described some cutting particles 2 are distributed in the surface of described blade body 1, and it is for carrying out chamfered edge work to combination wafer 5 better.
As shown in figure 10, the cutting element that the utility model embodiment provides has changed the rectangle side section of blade body 1 ' in original annular blade into wedge shape side section, like this when the edge of cutting device wafers 51, the otch at device wafers 51 edges has become inclined-plane, this makes cutting particles 2 in the blade body 1 part power when cutting by the cancellation of described inclined-plane, thereby the edge bottom that has reduced device wafers 51 produces the probability of small gap.
Preferably, in the present embodiment, the width of described blade body 1 inner side edge is 3.94 millimeters, the width of described blade body 1 outer side edges is 3 millimeters, the inner periphery diameter of described blade body 1 is 40 millimeters, the excircle diameter of described blade body 1 is 58 millimeters, the width of blade body 1 outer side edges is identical with the width of the 1 ' outer side edges of blade body in prior art, it can not exerted an influence to the cutting precision of combination wafer 5, and in the present embodiment, although complete the upper surface of the device wafers 51 that chamfered edge processes due to its oblique relation of plane, its width that is cut part is slightly larger than device wafers 51 ' upper surface in prior art and is cut width (differing 0.08 millimeter) partly, but this does not affect the cutting precision of combination wafer 5 yet.
Further, as shown in figure 11, described edge cutting tool also comprises objective table 3 and blade grasping drive unit 4, processed wafer (combination wafer 5) is placed on described objective table 3, described blade grasping drive unit 4 is arranged at the top of described objective table 3, and described blade is arranged in described blade grasping drive unit 4, and aims at the position of described combination wafer 5 required cuttings, described blade grasping drive unit 4 is for clamping described blade, and controls it and move up and down or rotate.Described blade, combination wafer 5 being carried out to chamfered edge while processing, drops to specified altitude assignment, and starts to rotate, and objective table 3 starts to rotate around its central shaft simultaneously, drives combination wafer 5 to rotate together, to carry out accurate chamfered edge processing to combining wafer 5.
Preferably, in the present embodiment, the center of circle of described combination wafer 5 overlaps with described objective table center 31, makes described device wafers 51 stressed even when rotating.What can expect is, even if objective table center 31 is departed from the center of circle of combination wafer 5, the above-mentioned design of the cutting element providing due to the utility model embodiment, when device wafers 51 is maximum from the distance of 3 weeks lateral edges of objective table near a side of blade, while being the cutting dynamics maximum of blade, this cutting element still can reduce the probability that small gap appears in device wafers 51 edge bottom.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if within of the present utility model these are changed and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (6)
1. a cutting element, it is characterized in that, comprise blade, described blade comprises blade body and some cutting particles, described blade body cross section be shaped as annular, described blade body side section be shaped as wedge shape, the width of described annular blade body outer side edges is less than the width of its inner side edge, described some cutting particles distribute and are arranged in described blade body.
2. cutting element according to claim 1, is characterized in that, described some cutting particles are distributed in the surface of described blade body.
3. cutting element according to claim 1, is characterized in that, the width of described blade body inner side edge is 3.94 millimeters, and the width of described blade body outer side edges is 3 millimeters.
4. cutting element according to claim 3, is characterized in that, the inner periphery diameter of described blade body is 40 millimeters, and the excircle diameter of described blade body is 58 millimeters.
5. according to the cutting element described in claim 1 to 4 any one, it is characterized in that, also comprise objective table and blade grasping drive unit, processed wafer is placed on described objective table, described blade grasping drive unit is arranged at the top of described objective table, described blade is arranged in described blade grasping drive unit, and aims at the position of the required cutting of described wafer.
6. cutting element according to claim 5, is characterized in that, described objective table is cylinder and can rotates around its central shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320509148.9U CN203426835U (en) | 2013-08-20 | 2013-08-20 | Cutting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320509148.9U CN203426835U (en) | 2013-08-20 | 2013-08-20 | Cutting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203426835U true CN203426835U (en) | 2014-02-12 |
Family
ID=50055895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320509148.9U Expired - Lifetime CN203426835U (en) | 2013-08-20 | 2013-08-20 | Cutting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203426835U (en) |
-
2013
- 2013-08-20 CN CN201320509148.9U patent/CN203426835U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140212 |