CN203415616U - 一种全方位发光的led灯珠 - Google Patents

一种全方位发光的led灯珠 Download PDF

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CN203415616U
CN203415616U CN201320510129.8U CN201320510129U CN203415616U CN 203415616 U CN203415616 U CN 203415616U CN 201320510129 U CN201320510129 U CN 201320510129U CN 203415616 U CN203415616 U CN 203415616U
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wafer
shell
led
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陈跃
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JIEYANG LIYE OPTOELECTRONICS Co Ltd
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JIEYANG LIYE OPTOELECTRONICS Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

本实用新型公开了一种全方位发光的LED灯珠，所述LED灯珠包括晶片、支架、晶片固定装置、连接线、封装体和增透薄膜；所述支架包括正极、负极和外壳，所述支架外壳具有凹槽；所述晶片通过晶片固定装置固定在所述支架的负极上；所述连接线通过焊接将晶片与支架正极连接在一起；所述封装体覆盖于所述支架外壳的凹槽内，并与外壳上端相平；所述封装体与支架外壳的表面涂覆有所述增透薄膜。本实用新型提供的LED灯珠可以实现空间上全角度发光，具有发光效率较高、光色一致性较好等优点，应用于各种LED照明灯具中，可有效较少灯珠的数量，节约生产成本，有利于LED照明的普及。

Description

一种全方位发光的LED灯珠
技术领域
本实用新型涉及LED照明领域领域，尤其涉及一种全方位发光的LED灯珠。
背景技术
LED因其具有体积小、相应速度快、寿命长、可靠性高、功耗低、环保等优点被广泛关注，被认为是将取代白炽灯、荧光灯的第四代照明光源。
与传统白炽灯、荧光灯可以360°全方位发光相比，LED发光的出射角度较小，大多小于120°；这样，LED在原有灯具形式上替代传统光源时，会在发光角度以外的空间位置上出现发光的暗区，也使原有灯具设计中的反射面失效，给LED照明的推广和应用带来一定的阻碍。
发明内容
为解决上述技术问题，本实用新型的目的是提供一种全方位发光的LED灯珠，该灯珠不仅光效高、散热性能好，节约生产成本，而且有效避免发光暗区，减少LED照明灯具的灯珠安装数量，有利于LED照明的普及。
本实用新型的目的通过以下的技术方案来实现：
全方位发光的LED灯珠，包括晶片、支架、晶片固定装置、连接线、封装体和增透薄膜；
所述支架包括正极、负极和外壳，所述支架外壳具有凹槽；
所述晶片通过晶片固定装置固定在所述支架的负极上；
所述连接线通过焊接将晶片与支架正极连接在一起；
所述封装体覆盖于所述支架外壳的凹槽内，并与外壳上端相平；
所述封装体与支架外壳的表面涂覆有所述增透薄膜。
与现有技术相比，本实用新型的一个或多个实施例可以具有如下优点：
可以实现类似传统光源的全发光，用于照明领域时，有效避免现有LED光源出现的发光暗区，并更接近传统光源的发光形态，可以较为便捷地替换传统光源，无需另行根据LED的发光特征设计新的灯具形式，而且厚度相比传统的灯珠减少100%以上，使得灯珠具有散热性能好、光效高、寿命长的优点，节约了生产成本，具有良好的产业化前景和应用前景。
本实用新型的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本实用新型而了解。本实用新型的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本实用新型的进一步理解，并且构成说明书的一部分，与本实用新型的实施例共同用于解释本发明，并不构成对本实用新型的限制。在附图中：
图1是全方位发光的LED灯珠结构示意图；
图2是本实用新型设置增透薄膜和封装胶前的结构示意图；
图3是全方位发光的LED灯珠支架结构示意图。
具体实施方式
容易理解，根据本实用新型的技术方案，在不变更本实用新型的实质精神下，本领域的一般技术人员可以提出本实用新型的多个结构方式和制作方法。因此以下具体实施方式以及附图仅是本实用新型的技术方案的具体说明，而不应当视为本实用新型的全部或者视为本实用新型技术方案的限定或限制。
下面结合实施例及附图对本实用新型作进一步详细的描述。
如图1和图2所示，为全方位发光的LED灯珠结构，包括晶片500、支架、晶片固定装置300、连接线400、封装体200和增透薄膜600；
所述支架包括正极101、负极102和外壳103，所述支架外壳具有凹槽（如图3所示）；
所述晶片通过晶片固定装置固定在所述支架的负极上；
所述连接线通过焊接将晶片与支架正极连接在一起；
所述封装体覆盖于所述支架外壳的凹槽内，并与外壳上端相平；
所述封装体与支架外壳的表面涂覆有所述增透薄膜。
所述透明支架外壳凹槽为从上而下边形收缩结构，且拔模角度为35～40°。
上述封装体由荧光粉和硅胶构成。
上述连接线为金线。
上述固定装置为银胶。
本实施例中，支架外壳采用高透光率透明材料制作，可以实现类似传统光源的全发光，用于照明领域时，有效避免现有LED光源出现的发光暗区，并更接近传统光源的发光形态，而且厚度相比传统的灯珠减少100%以上，使得灯珠具有散热性能好、高效高、寿命长的优点，节约了生产成本，具有良好的产业化前景和应用前景。
虽然本实用新型所揭露的实施方式如上，但所述的内容只是为了便于理解本实用新型而采用的实施方式，并非用以限定本实用新型。任何本实用新型所属技术领域内的技术人员，在不脱离本实用新型所揭露的精神和范围的前提下，可以在实施的形式上及细节上作任何的修改与变化，但本实用新型的专利保护范围，仍须以所附的权利要求书所界定的范围为准。

Claims (3)

1.一种全方位发光的LED灯珠，其特征在于，所述LED灯珠包括晶片、支架、晶片固定装置、连接线、封装体和增透薄膜； 
所述支架包括正极、负极和采用透明材料制作的外壳，所述支架外壳呈凹形结构； 
所述晶片通过晶片固定装置固定在所述支架的负极上； 
所述连接线通过焊接将晶片与支架正极连接在一起； 
所述封装体覆盖于所述支架外壳的凹槽内，并与外壳上端相平； 
所述封装体与支架外壳的表面涂覆有所述增透薄膜。 
2.根据权利要求1所述的全方位发光的LED灯珠，其特征在于，所述支架外壳凹形结构为从上而下边形收缩结构，且拔模角度为35～40°。 
3.根据权利要求1所述的全方位发光的LED灯珠，其特征在于，所述连接线为金线。 
CN201320510129.8U 2013-08-20 2013-08-20 一种全方位发光的led灯珠 Expired - Fee Related CN203415616U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108767086A (zh) * 2018-05-04 2018-11-06 惠州市华瑞光源科技有限公司 Led灯珠及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108767086A (zh) * 2018-05-04 2018-11-06 惠州市华瑞光源科技有限公司 Led灯珠及其制作方法

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