CN203386738U - Power semiconductor device cooling device - Google Patents
Power semiconductor device cooling device Download PDFInfo
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- CN203386738U CN203386738U CN201320388953.0U CN201320388953U CN203386738U CN 203386738 U CN203386738 U CN 203386738U CN 201320388953 U CN201320388953 U CN 201320388953U CN 203386738 U CN203386738 U CN 203386738U
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- power semiconductor
- coolant
- medium container
- erector
- cooling device
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Abstract
Provided is a power semiconductor device cooling device which comprises an installation device, a cooling medium container and installation O-shaped rings. An upper surface of the installation device is provided with a power semiconductor device, a lower surface of the installation device is provided with an opening and a side wall of the installation device presents to be an annular shape. The cooling medium container is closely installed below the opening of the installation device. The installation O-shaped rings are installed on and below the installation device. At least one side surface of the cooling medium container is provided with a cooling medium circulation mouth. The upper surface of the cooling medium container is at least provided with one opening. Advantages of the power semiconductor device cooling device are that heat can be evenly radiated, heat exchange efficiency is enhanced and damage to the device caused by oversized temperature rising of a chip and oversized rate of temperature change of the chip is prevented so that the power semiconductor device cooling device is low in cost.
Description
Affiliated technical field
The utility model relates to a kind of power semiconductor cooling device, the particularly cooling device of power semiconductor device module.
Background technology
Power semiconductor is the critical component in Semiconductor Converting Technology.Along with the sharp increase of convertor assembly power capacity, the volume of power semiconductor and heating power are also increasing severely, and cooling device is of crucial importance for the reliability of power semiconductor efficiently.The cooling device of high performance-price ratio becomes the target of the industry of Price Sensitive as the pursuit of new-energy automobile industry.
Power semiconductor modular is usually by the uniform heat-radiating substrate that is welded on module of several chips.Known power semiconductor device module cooling device structure commonly used as shown in Figure 1 at present: power semiconductor device module (1) is arranged on the heat conduction support plate (13) that coolant guiding channel is set, coolant enters cavity from import (3), at channel interior surface advection, carry out heat exchange successively and near the cavity inner surface of entrance and the cavity inner surface of close outlet, from exporting (4) outflow, thereby take away the heat of power semiconductor device module (1).Under this type of cooling, after coolant enters cavity, temperature rises gradually, causes the chip inhomogeneous cooling of power semiconductor modular even, and localized hyperthermia causes module to lose efficacy, and reliability reduces.Between heat conduction support plate (13) and coolant (14), be laminar heat transfer, temperature gradient is little, and thermal resistance is large, the chip temperature rise, and rate of temperature change is large, and device lifetime is low, poor reliability.Common high heat conductivity metal body is also simultaneously as the supporter of housing, and volume is large, and cost performance is low.
The cooling device of Granted publication CN201623026 patent record be on the basis of said structure on coolant guiding channel the vacuum brazing radiating fin, improve heat exchanger effectiveness by the mode that increases area of dissipation.Fail to solve the low and high problem of cost of reliability that the high thermal resistance of the even advection of inhomogeneous cooling causes.The scheme that Granted publication number is the record of CN202656971 patent is to be added in the liquid pipe that parallel densely covered wall that water in-out port staggers successively is divided in above-mentioned water channel, also fails to solve the low and high problem of cost of reliability that the high thermal resistance of the even advection of inhomogeneous cooling causes.
Granted publication number has been put down in writing a kind of micro jet flow cooling system for the patent of CN101005745.Technical scheme is established several cavitys in using, and is provided with the micro spraying jet ejector of the dividing plate of chilly but medium guiding mouth between cavity, coordinates the circulation Micropump and with the liquid reserve tank formation jet cooling system of fan and radiator.This scheme exists such problem: the substrate volume of power semiconductor is little, and thermal capacity is little, and when the surge heat occurs, the device chip variations in temperature is violent, and relies on good coolant circulation fully, and thermal cycle life reduces, and reliability is low.
The cooling device of the patent record that Granted publication number is CN201365388 is being driven installation power semiconductor module substrate on the radiating seat that foraminate L-type next door is divided into upper and lower two cooling ducts, and the substrate of power semiconductor device directly contacts coolant.It is little that this scheme also exists the substrate heat capacity, and variations in temperature acutely and fully relies on good coolant circulation, can not solve the problem that reliability is low.
Summary of the invention
The purpose of this utility model is to provide and addresses the above problem, and the energy Homogeneouslly-radiating is provided and improves heat exchanger effectiveness, prevents that the chip temperature rise is too high, and can reduce the low-cost power semiconductor cooling system of chip temperature rate of change, raising chip cycle life.
The purpose of this utility model is by reaching as lower device:
1. a power semiconductor cooling device, it is characterized in that: have: upper surface installation power semiconductor device, lower surface are provided with coolant medium container under described erector lower surface opening of erector that opening, sidewall are ring-type and close installation and are installed on the above and below O type of described erector circle, side of described coolant medium container is provided with the coolant entrance, described coolant medium container upper surface at least is provided with an opening, and described coolant medium container is equipped with liquid level detector and at least one temperature sensor.
2. according to above-mentioned 1 described power semiconductor cooling device, it is characterized in that: described erector inside upper surface is provided with the cylinder that protrudes lower surface.
3. according to above-mentioned 1 described power semiconductor cooling device, it is characterized in that: described erector upper surface is opening.
4. according to above-mentioned 3 described power semiconductor cooling devices, it is characterized in that: also comprise the attachment base be installed between power semiconductor and described erector, described attachment base lower surface is provided with the cylinder that protrudes lower surface.
5. according to above-mentioned 1 described power semiconductor cooling device, it is characterized in that: described erector side is provided with the coolant outlet.
6. according to above-mentioned 1 described power semiconductor cooling device, it is characterized in that: described coolant medium container sidewall is provided with a coolant outlet, this outlet is separated by the wall in the middle of the two with entrance, and described coolant medium container upper surface is provided with and coolant outlet UNICOM and and the mouth of the inner UNICOM of erector.
7. according to above-mentioned 1 described power semiconductor cooling device, it is characterized in that: the mouth that described coolant medium container upper surface is connected with the coolant entrance is provided with coolant guiding mouth, and coolant guiding mouth exceeds the coolant medium container upper surface.
8. according to above-mentioned 1 or 3 or 4 or 5 or 6 or 7 described power semiconductor cooling devices, it is characterized in that: described coolant medium container material is aluminium sheet or plastics.
9. according to above-mentioned 3 or 4 or 5 or 6 or 7 described power semiconductor cooling devices, it is characterized in that: the contact portion of described coolant medium container and described erector is connected in one with its manufactured materials.
The beneficial effects of the utility model are: according to the power semiconductor modular cooling device of above-mentioned 1-9, coolant in coolant medium container in Isothermal Condition, chip on module, in equal cooling condition, has solved the different problem of the even temperature rise caused of chip inhomogeneous cooling on the module.Coolant sprays formation turbulent flow and power semiconductor modular substrate or the efficient heat-shift of attachment base by opening or the coolant guiding mouth of coolant medium container upper surface, and turbulent heat efficiency is far above advection.Attachment base has increased the thermal capacity of substrate, and when the surge heat occurs, heat is absorbed by attachment base, prevents that chip temperature from changing violent, improves the temperature cycles life-span and improves reliability.Simultaneously, the projection of column has increased heat exchange area, has improved heat exchanger effectiveness.Temperature sensor and liquid level detector can be monitored abnormal conditions in advance, improve reliability.Erector and coolant medium container make the power semiconductor modular cooling device have higher cost performance by the lower cost materials that is easy to moulding.
The accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is prior art scheme sectional structural map.
In Fig. 1: 1. power semiconductor device module, 3. import, 4. outlet, 12. heat-conducting silicone grease layers, 13. heat conduction support plate, 14. coolants
Fig. 2 is the structural map that the utility model has been installed power semiconductor device module.
In Fig. 2: 1. power semiconductor device module, 3. coolant medium container, 4. erector, 6. temperature sensor, 7. liquid level sensor
Fig. 3 is the explosive view that the utility model has been installed the structural map of power semiconductor device module.
In Fig. 3: 1. power semiconductor device module, 2. attachment base, 3. coolant medium container, 4. erector, 5.O type circle, 6. temperature sensor, 7. liquid level sensor
Fig. 4 is an embodiment structural map of the utility model attachment base.
Fig. 5 is the structural map of the utility model coolant medium container.
Embodiment
Below with reference to accompanying drawing, execution mode of the present utility model is described.
Copper-clad in following description is containing fine copper and alloy thereof, and aluminium comprises fine aluminium and alloy thereof, and engineering plastics comprise industrial various plastics.
In the execution mode shown in Fig. 2 and Fig. 3, comprise 1. power semiconductor device modules, 2. with the close-fitting attachment base of the substrate of power semiconductor device module 1,3. be arranged on the coolant medium container under erector 4 lower surface openings, 4. the erector of attachment base is installed, 5. be installed on the sealing O type circle between attachment base 2 and erector 4 and between erector 4 and coolant medium container 3,6. be installed on the temperature sensor of the exit position of coolant medium container 3,7. be installed on the liquid level sensor of the exit position of coolant medium container 3.By the bolt and the embedded nut that is positioned at coolant medium container 3 correspondence positions of additional four installing holes through power semiconductor 1, by power semiconductor device module 1, attachment base 2, O type circle 5, erector 4 with together with coolant medium container 3 closely is fitted in.
Coolant enters coolant medium container inside from entrance 31, and the spurting MEDIA FLOW cooling attachment substrate 4 that forms isothermal at coolant guiding mouth 33 places, flow into coolant outlet 32 by opening 34 after turbulent heat-shift.General, coolant is forced to flow.When the mobile inefficacy of surge heat or cooling media occurs when; heat is absorbed by the attachment base of high thermal conductivity rapidly; medium thermal capacitance can prevent that the temperature rise of semiconductor chip is too high; temperature sensor with thermo-lag can be made a response; provide the temperature sensing approach, to take further safeguard measure.Potential failure and ability that liquid level sensor 7 is initiatively found out coolant reduce, and for controller provides the perception approach, realize providing leading protection.
In other embodiment, when the substrate volume of power semiconductor modular 1 is enough large, attachment base 2 no longer is installed, power semiconductor modular 1 and O type circle 5 are directly installed on erector 4.
In the execution mode shown in Fig. 2 and Fig. 3, coolant medium container 3 possesses: the coolant entrance 31 be connected with coolant medium container 3 inside; The coolant guiding mouth 33 be connected with coolant medium container 3 inside; With the inner UNICOM of erector 4 and and coolant export the opening 34 of 32 UNICOMs.
In the execution mode shown in Fig. 2 and Fig. 3, coolant medium container 3 has coolant entrance 31 and coolant outlet 32, can only be provided with coolant entrance 31 in other embodiments, coolant outlet 32 and opening 34 are cancelled, form solid wall, accordingly, at erector 4 sidewalls, the coolant outlet is set.
The coolant guiding mouth 33 of coolant medium container 3 exceeds coolant medium container 3 upper surfaces, and in the execution mode shown in Fig. 2 and Fig. 3, coolant guiding mouth 33 is cylindrical shapes, can make square tube shape or oval cylinder, preferably square tube shape.In other embodiments, the upper wall of coolant medium container 3 is designed to heavy wall, in coolant guiding mouth 33 positions, opening is set, replace coolant guiding mouth 33.
In the execution mode shown in Fig. 2 and Fig. 3, erector 4 has: the flange 42 contacted with attachment base 2 lower surfaces is provided with the U-shaped groove 41 around erector 4 interior walls in flange 42; With the flange 44 that coolant medium container 3 upper surfaces contact, have the U-shaped groove around erector 4 interior walls in flange face.Erector 4 lower surfaces and upper surface are provided with opening, and coolant medium container 3 is arranged under shed, this opening contact attachment base of the coolant of coolant guiding mouth 33 ejections.The sidewall 43 of erector 4 ring-types makes coolant flow into opening 34.
In other embodiments, coolant medium container 3 only has coolant entrance 31, and coolant outlet 32 and opening 34 are cancelled and while forming solid wall, at erector 4 sidewalls, the coolant outlet be set.
Two O type circles 5 are arranged on respectively in the U-shaped groove 41 of flange, reach the purpose of sealing by compressional deformation.O type circle selection standard part.
In the present embodiment, the material copper of attachment base 2, also can be used aluminium, preferably copper.
In a further embodiment, attachment base 2 and erector 4 use metal material of the same race, as copper or aluminium.Attachment base 2 and erector 4 combine together at contact-making surface, the sealing of formation upper surface, the erector upper inside surface is provided with another structure of protruding surperficial cylinder, and this structure has the feature of attachment base 2 and erector 4, can realize the purpose of this utility model.
In a further embodiment, coolant medium container 3 and erector 4 use metal material of the same race, as engineering plastics or aluminium.Coolant medium container 3 and erector 4 merge at contact-making surface, form and have upper surface open, and inside has another structure of coolant guiding mouth, and this structure has the feature of coolant medium container 3 and erector 4, can realize the purpose of this utility model.
In the execution mode shown in Fig. 2 and Fig. 3, the exit position that temperature sensor is installed on coolant medium container 6 detects the water temperature at the mouth of a river.In a further embodiment, in the position of entrance, separately establish a temperature sensor, detect the temperature of entry position coolant.
The height of liquid level detector 7 tracer liquid coolants, when liquid level is too low, provide the perception approach.
In above-described embodiment mode, only provided a kind of cooling example of power semiconductor modular, above-described embodiment mode and the combination with the utility model feature can be suitable for the power semiconductor device module of other encapsulating structures.
Claims (9)
1. a power semiconductor cooling device, it is characterized in that having: upper surface installation power semiconductor device, lower surface are provided with coolant medium container under described erector lower surface opening of erector that opening, sidewall are ring-type and close installation and are installed on the above and below O type of described erector circle, side of described coolant medium container is provided with the coolant entrance, described coolant medium container upper surface at least is provided with an opening, and described coolant medium container is equipped with liquid level detector and at least one temperature sensor.
2. power semiconductor cooling device according to claim 1 is characterized in that: described erector inside upper surface is provided with the cylinder that protrudes lower surface.
3. power semiconductor cooling device according to claim 1, it is characterized in that: described erector upper surface is opening.
4. power semiconductor cooling device according to claim 3 is characterized in that: also comprise the attachment base be installed between power semiconductor and described erector, described attachment base lower surface is provided with the cylinder that protrudes lower surface.
5. power semiconductor cooling device according to claim 1 is characterized in that: described erector side is provided with the coolant outlet.
6. power semiconductor cooling device according to claim 1, it is characterized in that: described coolant medium container sidewall is provided with a coolant outlet, this outlet is separated by the wall in the middle of the two with entrance, and described coolant medium container upper surface is provided with and coolant outlet UNICOM and and the mouth of the inner UNICOM of erector.
7. power semiconductor cooling device according to claim 1, it is characterized in that: the mouth that described coolant medium container upper surface is connected with the coolant entrance is provided with coolant guiding mouth, and coolant guiding mouth exceeds the coolant medium container upper surface.
8. according to claim 1 or 3 or 4 or 5 or 6 or 7 described power semiconductor cooling devices, it is characterized in that: described coolant medium container material is aluminium sheet or plastics.
9. according to claim 3 or 4 or 5 or 6 or 7 described power semiconductor cooling devices, it is characterized in that: the contact portion of described coolant medium container and described erector is connected in one with its manufactured materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320388953.0U CN203386738U (en) | 2013-07-02 | 2013-07-02 | Power semiconductor device cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320388953.0U CN203386738U (en) | 2013-07-02 | 2013-07-02 | Power semiconductor device cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203386738U true CN203386738U (en) | 2014-01-08 |
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ID=49875194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320388953.0U Expired - Fee Related CN203386738U (en) | 2013-07-02 | 2013-07-02 | Power semiconductor device cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203386738U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426841A (en) * | 2013-07-02 | 2013-12-04 | 北京睿德昂林新能源技术有限公司 | Power semiconductor device cooling unit |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
-
2013
- 2013-07-02 CN CN201320388953.0U patent/CN203386738U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426841A (en) * | 2013-07-02 | 2013-12-04 | 北京睿德昂林新能源技术有限公司 | Power semiconductor device cooling unit |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
| CN106601703B (en) * | 2016-10-27 | 2019-08-02 | 湖北工程学院 | Using the micro-channel heat sink of secondary back refrigerating mode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20180702 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |