The utility model content
The purpose of this utility model is to provide a kind of novel break-through lithographic method, can on device, form darker microchannel.Another purpose of the present utility model is to provide a kind of device architecture with the microchannel that runs through whole device.
The method of microfluidic device provided by the utility model, comprise the steps:
Step 1: to substrate surface, deposit successively the first deposited material and the second deposited material from top to bottom;
Step 2: utilize respectively graphical this first deposited material of photoetching or etch process, and the second deposited material, expose this base material;
Step 3: utilize graphical this base material of photoetching or etch process, form one or more groove;
Step 4: utilize etch process to remove this first deposited material and the second deposited material on base material;
Step 5: to substrate surface, deposit successively the 3rd deposited material and the 4th deposited material from top to bottom;
Step 6: utilize respectively graphical the 3rd deposited material of photoetching or etch process, reach the 4th deposited material, expose at least a portion of this groove, form expose portion;
Step 7: utilize the break-through etching technics, penetrate one or more microchannels of this base material in this expose portion formation one.
Preferably, the above-mentioned the first, the second, three, the 4th deposited material is selected from photoresist, silica, silicon nitride, silicon oxynitride, one or more in metal film, above-mentioned substrate material is selected from one or more in silicon, germanium, GaAs, pottery, glass, macromolecule polymeric material.
Preferably, the break-through etching technics is selected from dry etching, wet etching, a kind of and multiple in laser ablation.Most preferably, the break-through etching technics is for first carrying out dry etching and carry out the wet etching that ultrasonic wave or mega sonic wave strengthen again or first carrying out ultrasonic wave or wet etching that mega sonic wave strengthens dry etching again, the method that the wet etching that dry etching and ultrasonic wave or mega sonic wave strengthen combines.
The condition of above-mentioned laser ablation is: select multiband pulse laser etching system, optical maser wavelength 220-550nm, pulsewidth 1-25ns, the continuous adjustable 50-800mJ of pulse energy; The condition of this dry etching is: the ionic reaction room pressure is greater than 40mtorr, etching gas flow 400-900sccm, and RF energy 1-9Kw, time 10-50min, wherein etching gas comprises CF4, CHF3, HBr, SF6 etc.; The condition of described wet etching: adopt strong acid or highly basic buffered etch liquid, wherein corrosive liquid comprises acid, alkali is slow or acid-base buffer, example hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, hydrofluoric acid, glacial acetic acid, NaOH, potassium hydroxide, ammonium fluoride etc.; Temperature 20-75 ℃, time 20-300min, corrosion process introduces ultrasonic wave or mega sonic wave is auxiliary.
Of the present utility modelly be on the other hand to provide a kind of microfluidic device for fluid detection, this microfluidic device comprises base material and is deposited on successively the 3rd deposited material and the 4th deposited material on this base material from top to bottom, and be provided with one or more detecting units on this microfluidic device, the one side of this microfluidic device has one or more grooves, and is provided with one or more microchannels that run through this microfluidic device in this groove.
Preferably, this microfluidic device further comprises connecting passage, between this groove, by this connecting passage, is communicated with.
Preferably, this microfluidic device further comprises a slab construction, for covering this groove.
Preferably, this substrate material is selected from one or more in silicon, germanium, GaAs, pottery, glass, macromolecule polymeric material, and the three, four deposited material is selected from photoresist, silica, silicon nitride, silicon oxynitride, one or more in metal film.
Adopt break-through etching technics provided by the utility model, be different from traditional lithographic method (adopting single dry etching or wet etching or take wherein a kind of is the auxiliary lithographic method of main another kind) the utility model that two kinds of etchings are laid equal stress on and by ultrasonic wave or mega sonic wave introduce wet etching and and dry etching combine, enhanced etching speed, reach the effect of the thick material of etching to break-through.Adopt etching technics of the present utility model, the device specific region can be etched to the hole of hollow out, thereby make on device of the present utility model to have various fine structures, can form the stacking of multiple thin-film material, can with ic process compatibility can large quantities of volume productions, this device has groove can be for laterally circulation, there is again microchannel and can realize vertical circulation, and there is interface channel between groove, realized the circulation between groove, the encapsulation and integration that is conducive to like this device, the particularly upside-down mounting of device and stacking, can set up powerful analyzing and testing system, can be better for biochemical analysis and disease detection, can greatly improve the efficiency of analyzing and testing, sensitivity and specificity.
The specific embodiment
Further set forth advantage of the present utility model below in conjunction with accompanying drawing and specific embodiment.
Consult Fig. 2 a and Fig. 3, structural representation for the utility model device architecture one preferred embodiment, this device 201 comprises base material 208 and is deposited on successively the 3rd deposited material 206 and the 4th deposited material 207 on this base material from top to bottom, and be provided with three detecting unit 202a on this microfluidic device, 202b, 202c, the one side of this microfluidic device has a groove 203, this groove 203 is a groove structure, the two ends up and down of running through device 201, and be provided with a microchannel 204 that runs through this microfluidic device in this groove.Wherein, the type of flow of fluid is direction as shown in arrow in Fig. 2 a, and fluid flows in groove 203, and during through microchannel 204, segment fluid flow flows into microchannel 204, and part continues to flow along groove 203.
Wherein, the three, four deposited material 206 and 207 is selected from photoresist, silica, silicon nitride, silicon oxynitride, one or more in metal film.Preferably, the material of this base material 208 is selected from one or more in silicon, germanium, GaAs, pottery, glass, macromolecule polymeric material.
Wherein, detecting unit 202b can be these detecting units that need contacting with fluid just can be detected such as flow surface charge detection unit or surface tension of liquid detecting unit, and detecting unit 202a and 202c can be fluid calorifics detecting unit or these detecting units that do not need contacting with fluid also can be detected of fluid radiance detecting unit.Those skilled in the art can be understood that easily, device in the utility model, can be by the detecting unit of difference in functionality be set arbitrarily, thereby the various character that detect the fluid flow through include but are not limited to electricity, magnetics, electromagnetism, calorifics, optics, photoelectricity, acoustics, biology, chemistry, electromechanics, electrochemistry, electrooptics, electricity, electrochemical machinery, biochemistry, biomethanics, bioelectromagnetics, Photobiology, biothermics, biophysics, the biological electricity mechanics, bioelectrochemistry, biological electricity optics, biological electricity calorifics, bio-mechanical optics, biothermodynamics, biological heat optics, bioelectrochemistry optics, biological dynamo-electric optics, the biological electricity thermo-optical, biological electrochemical mechanics, physics or mechanical property, or their combination.
Wherein, those skilled in the art also can be understood that easily, as device 201 comprises plurality of grooves 203, and, in order to realize the connection of groove 203, one or more connecting passage (not shown)s can be set.
Consult Fig. 2 b, structural representation for another preferred embodiment of the utility model device architecture, in this device 201, be provided with groove 203, and the device architecture in difference and Fig. 2 a, this groove 203 is not the groove structure, does not run through the two ends up and down of device 201, in this groove 203, be provided with two microchannels 204 that run through this microfluidic device.Wherein, the type of flow of fluid is direction as shown in arrow in Fig. 2 b, and fluid flows in groove 203 by one of them microchannel 204, and subsequently, segment fluid flow flows out device 201 by another microchannel 204.
And preferably, as shown in Figure 2 c, microfluidic device further comprises a slab construction 205, for covering groove 203.The type of flow of fluid direction as shown in arrow in Fig. 2 c wherein, by drive units such as micropumps, fluid flows in grooves 203 by one of them microchannel 204, and subsequently, segment fluid flow flows out devices 201 by another microchannel 204.By adding slab construction 205, on the one hand can be for closed channel, on the other hand, by this slab construction, can be used as an expansion platform, the function of extended device, for example this device can be a board structure of circuit, comprise various circuit (microsensors on this circuit board, logic circuit, communicating circuit, I/O mouth etc.), can expand measuring ability, again for example, this flat board can be also an imageing sensor (CMOS or CIS), can the real-time monitored passage in.The material of this slab construction can be conductor material, semi-conducting material, pottery, glass, polymer etc., and flat board can be transparent or opaque, and combined method dull and stereotyped and device includes but are not limited to physics, chemistry, biological method.
Consult Fig. 4 and can be the flow chart for preparing the utility model device, the method for microfluidic device provided by the utility model, comprise the steps:
Step 1: as shown in Fig. 4 a, deposit successively the first deposited material 209 and the second deposited material 210 from top to bottom to base material 208 surfaces;
Step 2: as shown in Fig. 4 b and 4c, utilize respectively graphical this first deposited material 209 of photoetching or etch process, reach the second deposited material 210, expose the surface of this base material 208;
Step 3: as shown in Fig. 4 d, utilize graphical this base material of photoetching or etch process, form a groove 203;
Step 4: utilize etch process to remove this first deposited material and the second deposited material (not shown) on base material;
Step 5 and six: as shown in Fig. 4 e, deposit successively the 3rd deposited material 206 and the 4th deposited material 207 from top to bottom to base material 208 surfaces; Utilize respectively graphical the 3rd deposited material 206 of photoetching or etch process, reach the 4th deposited material 207, expose at least a portion of this groove 203, form expose portion 211;
Step 7: as shown in Fig. 4 f, utilize the break-through etching technics, penetrate a microchannel 204 of this base material in these expose portion 211 formation one.
Preferably, the above-mentioned the first, the second, three, the 4th deposited material is selected from photoresist, silica, silicon nitride, silicon oxynitride, one or more in metal film, above-mentioned substrate material is selected from one or more in silicon, germanium, GaAs, pottery, glass, macromolecule polymeric material.
Preferably, the break-through etching technics is selected from dry etching, wet etching, a kind of and multiple in laser ablation.Most preferably, the break-through etching technics is for first carrying out dry etching and carry out the wet etching that ultrasonic wave or mega sonic wave strengthen again or first carrying out ultrasonic wave or wet etching that mega sonic wave strengthens dry etching again, the method that the wet etching that dry etching and ultrasonic wave or mega sonic wave strengthen combines.
The condition of above-mentioned laser ablation is: select multiband pulse laser etching system, optical maser wavelength 220-550nm, pulsewidth 1-25ns, the continuous adjustable 50-800mJ of pulse energy; The condition of this dry etching is: the ionic reaction room pressure is greater than 40mtorr, etching gas flow 400-900sccm, RF energy 1-9Kw, time 10-50min; The condition of described wet etching: adopt strong acid or highly basic buffered etch liquid, temperature 20-75 ℃, time 20-300min, corrosion process introduces ultrasonic wave or mega sonic wave is auxiliary, wherein the auxiliary ultrasonic frequency scope of using is generally 15 to 200KHz, and the auxiliary megasonic frequency scope of using is generally 800 to 1000KHz.
In general, photoetching is a kind of institute's deposition materials on substrate and substrate to be carried out to patterned a kind of technology, comprise substrate cleaning, drying, spin coating photoresist, soft baking, aim at the operations such as exposure, rear baking, development, hard baking, each working procedure parameter scope is: glue spreader rotating speed 500-5000r/min; Soft baking 1-40min, 50-90 ℃; Time for exposure 3s-60s; Rear baking, 50-90 ℃, development 20s-25min; The hard baking, 70-140 ℃, 10-60min.Etching is to utilize corrosive liquids or plasma to remove part or all of a kind of technique of certain material, and wherein corrosive liquid comprises acid, alkali is slow or acid-base buffer, example hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, hydrofluoric acid, glacial acetic acid, NaOH, potassium hydroxide, ammonium fluoride etc.; Gas for generation of plasma comprises CF4, CHF3, HBr, SF6 etc.
Those skilled in the art can be understood that easily, aforementioned photoetching or etch process are the common preparation technology in this area, specifically comprise substrate cleaning, drying, spin coating photoresist, soft baking, aim at exposure, rear baking, development, baking, wet etching, dry etching, the operation such as remove photoresist firmly.The condition adopted is also process conditions common in prior art, for example: glue spreader rotating speed 500-5000r/min; Soft baking 1-40min, 50-90 ℃; Time for exposure 3s-60s; Rear baking, 50-90 ℃, development 20s-25min; The hard baking, 70-140 ℃, 10-60min.
Adopt break-through etching technics provided by the utility model, the device specific region can be etched to the hole of hollow out, thereby make on device of the present utility model to have various fine structures, can form the stacking of multiple thin-film material, can with ic process compatibility can large quantities of volume productions, this device has groove can be for laterally circulation, there is again microchannel and can realize vertical circulation, and there is interface channel between groove, realized the circulation between groove, the encapsulation and integration that is conducive to like this device, the particularly upside-down mounting of device and stacking, can set up powerful analyzing and testing system, can be better for biochemical analysis and disease detection, can greatly improve the efficiency of analyzing and testing, sensitivity and specificity.
Should be noted that, embodiment of the present utility model has preferably implementation, and not the utility model is done to any type of restriction, any person skilled in art of being familiar with may utilize the technology contents change of above-mentioned announcement or be modified to the effective embodiment be equal to, in every case do not break away from the content of technical solutions of the utility model, any modification or equivalent variations and the modification above embodiment done according to technical spirit of the present utility model, all still belong in the scope of technical solutions of the utility model.