CN203331510U - High-heat-conduction glass fabric basement layer pressing plate - Google Patents

Abstract

The utility model discloses a high-heat-conduction glass fabric basement layer pressing plate which comprises a bismaleimide substrate, wherein a heat conduction coating layer or heat conduction coating layers is or are arranged on a single surface or two surfaces of the bismaleimide substrate; the heat conduction coating layers are DLC (diamond-lie carbon) coated film layers. According to the novel high-heat-conduction glass fabric basement layer pressing plate, heat generated by a heating element on a circuit board can be quickly diffused in a line plane of the substrate by using the high heat conduction capacity characteristic of the heat conduction layers, namely the DLC coated film layers and can be led out by using the heat conduction capacity of the substrate, so that a good heat dissipation effect is achieved; furthermore, the substrate is high in insulation performance, high heat resistance, high reliability and high physical mechanical property.

Description

A kind of high heat-conductive glass-fiber fabric base laminated sheet

Technical field

The utility model belongs to technical field of electronic materials, relates to a kind of high heat-conductive glass-fiber fabric base laminated sheet.

Background technology

As everyone knows, powerful wiring board need to have good heat conduction and heat radiation ability, and traditional FR-4 base circuit board can not meet such requirement, and this just needs to propose some new Cooling Solutions.

For the problems referred to above, at present the heat dissipation for circuit board technology known to widely is mainly to utilize insulating radiation tack coat and heat-dissipating metal sheet (aluminium sheet, aluminium alloy plate and copper coin etc.) to carry out pressing the single or multiple lift printed substrate, the heat of utilizing radiating effect that metal is good to be produced with the runaway electron assembly; This insulating radiation layer, except metal substrate and copper-foil conducting electricity bonding is provided, also must provide good insulating properties and heat dispersion; What this insulating barrier adopted at present is the slim material of common FR-4 (epoxy resin that glass cloth strengthens), but because the thermal conductivity of FR-4 is not high, be only 0.2W/M.K, thereby radiating effect is limited, and if these heats can not scatter and disappear in time, and the heat resistance of insulating barrier is not high, the dimensional stability that will cause insulating barrier changes, heat resistance descends, and reliability reduces, and makes the life-span of electronic equipment reduce.At present, also there is larger limitation in the application of double-face aluminium substrate, processing technology is one of them importance, for the connection conducting that guarantees the levels wiring board the purpose that reaches insulation, the critical process of current double-face aluminium substrate production is that consent is processed, and the conductive hole that the PCB finished product requires need to once be holed on aluminium base, insulating materials filling perforation, finally secondary drilling on the filling perforation material.Current filling perforation material very easily produces defect, and the metal level when short circuit caused as the filling perforation cavity, thermal shock is peeled off etc., and complex process.In addition, the cost of metal substrate is higher, and this is also one of key factor of its extensive application of restriction.

Summary of the invention

The purpose of this utility model is to provide a kind of high heat-conductive glass-fiber fabric base laminated sheet.

To achieve the above object of the invention, the technical solution adopted in the utility model is: a kind of high heat-conductive glass-fiber fabric base laminated sheet, comprise the dimaleoyl imino plate, and the single or double of described dimaleoyl imino plate is provided with heat conducting coating; Described heat conducting coating is the DLC film plating layer.

Above, described dimaleoyl imino plate can be prior art, this dimaleoyl imino plate adds stirring solvent evenly to make glue in a kind of high heat conduction compositions of thermosetting resin, with glass-fiber-fabric, floods this glue, then under 100 ~ 170 ℃, toasts and within 1 ~ 15 minute, obtains prepreg; Prepreg is cut into to certain size and folds and join by thickness requirement, two sides is covered with separated type material, on press, through certain pressing program, suppresses to obtain laminate, after the removal separated type material, obtains the dimaleoyl imino plate, and thickness is 0.5 ~ 5 millimeter.

Above-mentioned high heat conduction compositions of thermosetting resin, by weight, comprise 100 parts of bimaleimide resins, 10 ~ 100 parts of allyl compounds, 0 ~ 30 part of modified resin, 250 ~ 600 parts of high heat fillings, 0.1 ~ 5 part of curing accelerator;

Described bimaleimide resin is selected from 4,4 '-diphenyl methane dimaleimide resin, 4,4 '-Diphenyl Ether Bismaleimide resin and 4, one or more in 4 '-diphenyl sulphone (DPS) bimaleimide resin;

Described allyl compound is selected from one or more in diallyl bisphenol, diallyl bisphenol S, diallyl diphenyl ether, allyl phenoxy resin, allyl phenol urea formaldehyde and pi-allyl tribromo phenylate.

Described modified resin is selected from one or more in epoxy resin, cyanate, phenoxy resin and polyphenylene oxide resin;

Described high heat filling is selected from one or more in metal nitride, metal oxide, carbide and diamond; Wherein, metal nitride is aluminium nitride, boron nitride or silicon nitride, and metal oxide is aluminium oxide, magnesia or beryllium oxide, and carbide is carborundum or boron carbide;

Described curing accelerator is imidazoles, is selected from one or more in glyoxal ethyline, 2-ethyl-4-methylimidazole and 2-phenylimidazole.

The polymer that bimaleimide resin generates by curing reaction, the many and more easily polarization of institute's polar functionalities, so its thermal conductivity is higher than ordinary epoxy resin, thermal conductivity is the twice left and right of common bisphenol A type epoxy resin, can reach 0.4W/m.K; As everyone knows, the thermal conductivity that improves resin with improve thermal conductivity and compare by filling more high heat filling, the former is larger on the heat conductivility impact of sheet material, therefore the material of making high heat conduction with bimaleimide resin has more advantage than common epoxy, and compare with epoxy resin, there is more excellent heat resistance.

Described DLC film plating layer is prior art, also claims DLC coating (Diamond-like Carbon), is the splendid diamond-like coating of the capacity of heat transmission.The DLC film plating layer has than metal high super-high heat-conductive performance also, the heat that chip can be produced spreads and comes equably rapidly in the horizontal direction, and then by the substrate Large-Area-Uniform distribute, this point and conventional aluminium substrate vertical direction heat radiation, heat mainly accumulates in the insulating barrier difference.

In technique scheme, the thickness of described dimaleoyl imino plate is 0.5 ~ 5 millimeter.

In technique scheme, between described dimaleoyl imino plate and heat conducting coating, also be provided with the transition film plating layer.

In technique scheme, described transition film plating layer is a kind of in Si film plating layer, Cr film plating layer, Al film plating layer, Ti film plating layer and Ni film plating layer, and its thickness is 0.1 ~ 1 micron.Preferably, described transition zone plated film is the Si film plating layer, and its thickness is 0.1 ~ 1 micron, and what in the magnetron sputtering technique of described generation Si film plating layer, use is the single crystalline Si target of purity more than 99.99%.

In technique scheme, the thickness of described DLC film plating layer is 1 ~ 5 micron.

In technique scheme, also be provided with the Cu film plating layer on described heat conducting coating.

In technique scheme, the thickness of described Cu film plating layer is 4 ~ 6 microns.What in the magnetron sputtering technique of described generation Cu film plating layer, use is that purity is at the Cu target more than 95%.

Preferably, also be provided with the solder mask of anti-welding and protective effect or the surface-treated layer shielded on described Cu film plating layer, or, on the surface of solder mask, surface-treated layer is set again.

In addition, in order to reach the requirement of conduction or other process aspects, the surface of described Cu film plating layer also is provided with the thick copper layer that adds prepared by electro-plating method; Further, the described thick copper layer that adds is provided with anti-welding and solder mask protective effect, and/or the surface-treated layer shielded.

Because technique scheme is used, the advantage that the utility model compared with prior art has is:

1. the utility model has designed a kind of new high heat-conductive glass-fiber fabric base laminated sheet, adopt the dimaleoyl imino plate, and on this substrate, heat conducting coating is set, the high capacity of heat transmission characteristic of the 800W/m.K left and right that utilizes the DLC film plating layer to have, make the heat produced diffusion rapidly in the base plate line plane of heating element on wiring board, and utilize substrate self capacity of heat transmission that heat is derived, reach good radiating effect; Simultaneously, this substrate has good insulating properties, heat resistance, high reliability and physical and mechanical properties.

2. what the utility model adopted is the dimaleoyl imino plate, it is a kind of polymer of high-insulativity, do not need during Drilling operation to carry out the consent processing, thereby avoided problem in traditional double-face aluminium substrate production technology, the problem includes: the filling perforation material very easily produces the problems such as defect, complex process; In addition, high thermal conductivity layer pressing plate provided by the utility model, in the situation that raising wiring board integral heat sink effect has greatly reduced cost, and had frivolous advantage concurrently, can be used for high-power heater members, has broad application prospects.

The accompanying drawing explanation

Fig. 1 is the cutaway view of a kind of laminate of the utility model embodiment.

Wherein: 1, dimaleoyl imino plate; 2, transition film plating layer; 3, DLC film plating layer; 4, metal-plated rete.

The specific embodiment

Below in conjunction with embodiment, the utility model is further described:

Embodiment mono-:

Step 1: BMI performed polymer synthetic

Take 4,4 '-diphenyl methane dimaleimide (BDM) 100g, pi-allyl bisphenol a resin (DABPA) 40g, pi-allyl tribromo phenylate 20g is in beaker, be warming up to the isothermal reaction 120min of 135 ℃, naturally cool to room temperature and obtain the pi-allyl modified bismaleimide resin, be designated as BMI-1.

Step 2: the making of substrate

BMI-1 hard resin will 160g obtained above is dissolved in the butanone of 70g after pulverizing, and adds 0.15g2-methylimidazole stir about half an hour again after resin dissolves fully; Then add the 250g aluminium oxide in another is equipped with the beaker of 140g butanone, this filler is stirred to half an hour, until filler is the homogeneous state in solvent; The resin stirred is poured in this filler again, continued to stir half an hour, then disperseed by high-shear emulsion machine, jitter time is half an hour, obtains uniform glue; Adopt 7628 glass-fiber-fabrics to flood this glue, under 155 ℃, baking obtains the bonding sheet of semi-cured state in about 4 minutes; Prepreg is cut into to certain size, and 6 bonding sheets stack, and two sides is covered with Copper Foil, and in vacuum press 200 ℃, within 150 minutes, lamination obtains copper-clad laminate, obtain the dimaleoyl imino plate that thickness is 1.2mm after removing Copper Foil.

Step 3: the deposition of heat conducting coating

(1) board cleaning: the above-mentioned substrate that makes is cleaned up in supersonic wave cleaning machine, after oven dry moisture, substrate is clamped in vacuum film coating chamber, vacuum film coating chamber is bled; Then pass into hydrogen in the plated film vacuum chamber, use ion beam carry out ionization and bombard substrate the hydrogen of introducing;

(2) transition film plating layer (Si plated film): in the plated film vacuum chamber, pass into argon gas, use the non-balance magnetically controlled sputter negative electrode to carry out the Si plated film to substrate, plated film is used purity at 99.99% above single crystalline Si target, apply the pulse direct current of voltage 650V, frequency 50kHz on described negative electrode, coating film thickness is 0.8 micron;

(3) DLC film plating layer: in the plated film vacuum chamber, pass into acetylene gas, use ion beam to carry out the DLC plated film to substrate, the ion energy of ion beam ionization is more than 1100eV, more than applying 4500V on negative electrode, the DC pulse bias voltage of pulse frequency 70kHz, coating film thickness is 2 microns;

(4) Cu film plating layer: pass into argon gas in the plated film vacuum chamber, use the non-balance magnetically controlled sputter negative electrode substrate to be carried out to the plated film of Cu, plated film is used purity at the Cu target more than 95%, applies the pulse direct current of voltage 450V on described negative electrode, and coating film thickness is 5 microns.

The above-mentioned substrate made and high thermal conductivity layer pressing plate performance are in Table 1.

The cutaway view of described laminate is shown in Figure 1, comprises dimaleoyl imino plate 1, the two-sided heat conducting coating that is provided with of dimaleoyl imino plate; Described heat conducting coating comprises metal-plated rete 4, DLC film plating layer 3 and transition film plating layer 2 successively; Described transition film plating layer 2 is located on dimaleoyl imino plate 1.

Embodiment bis-:

Step 1: BMI performed polymer synthetic

Take 4,4 '-diphenyl methane dimaleimide (BDM) 100g, pi-allyl bisphenol a resin (DABPA) 20g, pi-allyl tribromo phenylate 15g is in beaker, be warming up to the isothermal reaction 100min of 135 ℃, naturally cool to room temperature and obtain the pi-allyl modified bismaleimide resin, be designated as BMI-2.

Step 2: the making of substrate

After being pulverized, the BMI-2 hard resin obtained in 135g step 1 is dissolved in the butanone of 60g, add isocyanate modified epoxy resin 25g (epoxide equivalent 360g/mol), 2-ethyl-4-methylimidazole 0.20g after resin dissolves fully, continue stir about half an hour; Then 300g aluminium oxide and 100g boron nitride are joined in the 170g butanone, stir half an hour, until filler is the homogeneous state in solvent; The resin stirred is poured in this filler again, continued to stir half an hour, then disperseed by high-shear emulsion machine, jitter time is half an hour, obtains uniform glue; Adopt 7628 glass-fiber-fabrics to flood this glue, under 155 ℃, baking obtains the bonding sheet of semi-cured state in about 4 minutes; Prepreg is cut into to certain size, and 6 bonding sheets stack, and two sides is covered with Copper Foil, and in vacuum press 200 ℃, within 150 minutes, lamination obtains copper-clad laminate, obtain the dimaleoyl imino plate that thickness is 1.2mm after removing Copper Foil.

Step 3: the deposition of heat conducting coating

Step 3 with embodiment 1.Substrate and high thermal conductivity layer pressing plate performance are in Table 1.

Comparative Examples one:

Step 1: BMI performed polymer synthetic

Step 1 with embodiment 1.

Step 2: the making of substrate

Be dissolved in the butanone of 60g after the BMI-1 hard resin that obtains in 160g step 1 is pulverized, add 2-ethyl-4-methylimidazole 0.15g after resin dissolves fully, continue stir about half an hour; Then 300g aluminium oxide and 100g boron nitride are joined in the 170g butanone, stir half an hour, until filler is the homogeneous state in solvent; The resin stirred is poured in this filler again, continued to stir half an hour, then disperseed by high-shear emulsion machine, jitter time is half an hour, obtains uniform glue; Adopt 7628 glass-fiber-fabrics to flood this glue, under 155 ℃, baking obtains the bonding sheet of semi-cured state in about 4 minutes; Prepreg is cut into to certain size, and 6 bonding sheets stack, and two sides is covered with Copper Foil, and in vacuum press 200 ℃, it is 1.2mm and, not containing the bismaleimide laminates of heat conducting coating, its performance indications are in Table 1 that 150 minutes laminations obtain thickness.

Comparative Examples two:

Step 1: the making of substrate

135g isocyanate modified epoxy resin (epoxide equivalent 360 g/mol) is dissolved in the butanone of 60g, after dissolving fully, resin adds High Bromine epoxy Resin 25g (bromine content 48%, epoxide equivalent 400g/mol), dicyandiamide 5.05g, glyoxal ethyline 0.20g, continue stir about half an hour; Then 300g aluminium oxide and 100g boron nitride are joined in the 170g butanone, stir half an hour, until filler is the homogeneous state in solvent; The resin stirred is poured in this filler again, continued to stir half an hour, then disperseed by high-shear emulsion machine, jitter time is half an hour, obtains uniform glue; Adopt 7628 glass-fiber-fabrics to flood this glue, under 155 ℃, baking obtains the bonding sheet of semi-cured state in about 4 minutes; Prepreg is cut into to certain size, and 6 bonding sheets stack, and two sides is covered with Copper Foil, and in vacuum press 190 ℃, within 100 minutes, lamination obtains copper-clad laminate, obtain the glass fiber reinforced epoxy resin substrate that thickness is 1.2mm after removing Copper Foil.

Step 2: the deposition of heat conducting coating

Step 3 with embodiment 1.Substrate and heat-conducting layer pressing plate performance are in Table 1.

Comparative Examples three:

Step 1: the making of prepreg

135g isocyanate modified epoxy resin (epoxide equivalent 360 g/mol) is dissolved in the butanone of 60g, after dissolving fully, resin adds High Bromine epoxy Resin 25g (bromine content 48%, epoxide equivalent 400g/mol), dicyandiamide 5.05g, glyoxal ethyline 0.20g, continue stir about half an hour; Then 300g aluminium oxide and 100g boron nitride are joined in the 170g butanone, stir half an hour, until filler is the homogeneous state in solvent; The resin stirred is poured in this filler again, continued to stir half an hour, then disperseed by high-shear emulsion machine, jitter time is half an hour, obtains uniform glue; Adopt 1080 glass-fiber-fabrics to flood this glue, under 155 ℃, baking obtains prepreg in about 4 minutes.

Step 2: the pressing of aluminium base

The aluminium sheet that is 1.2mm by thickness (5052) is washed the plate machine by high temperature and is washed, and to remove plate flour dirt, then the aluminium base after cleaning is put into to baking box, keeps 115 ± 5 ℃ of bakings of temperature 30 minutes; Stick 3 of the prepared prepregs of step 1 in the treated one side of aluminium base, the gross thickness of insulating barrier probably is controlled at 75 microns left and right, then cover copper foil layer on prepreg, to post prepreg and be coated with copper foil layer and fully dry aluminium base is sent into laminating machine, in vacuum press 190 ℃, obtain a kind of heat conduction aluminum substrate after 100 minutes laminations, test result is in Table 1.

Table 1

Above embodiment and Comparative Examples are all detected substrate with reference to the IPC4101 standard, and detection method is as follows:

1, glass transition temperature (T _g): dynamic thermomechanical analysis (DMA);

2, heat decomposition temperature (T _d): thermogravimetry, condition is: 10 ℃/minute of heating rates, thermal weight loss 5%;

3, bending strength: by omnipotent sample machine, load is put on the sample of regulation shape and size and measured;

4, the thermally stratified layer time (T288): the fingerboard material, under the design temperature of 288 ℃, because lamination appears in hot effect, before this duration, records by thermomechanical analysis (TMA);

5, breakdown voltage: impose enough strong electric field action in the sheet material both sides, it loses the voltage applied when dielectric properties become conductor and is breakdown voltage;

6, flammability: adopt the UL-94 testing standard;

7, thermal conductivity: adopt ASTM D 5470 standard method tests.

As seen from the above table, by comparing embodiment and Comparative Examples, can find out, the high heat conduction compositions of thermosetting resin that the utility model provides is a kind of high heat conduction, high glass-transition temperature (glass transition temperature is greater than 250 ℃), high heat-resisting, superior isolation and the modified bismaleimide resin system with high physical and mechanical properties, with epoxy resin, compare, the substrate of being made by the compositions of thermosetting resin of this high heat conduction, there is good heat resistance and high heat conductance, as adopt composite filled mode, can further improve its thermal conductivity; After DLC heat radiation coating is set on substrate, the thermal conductivity of sheet material and integral heat sink effect are obviously promoted; Simultaneously, the high thermal conductivity layer pressing plate that the utility model provides is compared with the conventional aluminium substrate, when thermal conductivity is suitable, the heat that can the very first time chip be produced due to the DLC film plating layer spreads and comes equably rapidly in the horizontal direction, and then by the substrate Large-Area-Uniform distribute, thereby obtain better radiating effect.

Claims (7)

1. one kind high heat-conductive glass-fiber fabric base laminated sheet, it is characterized in that: comprise the dimaleoyl imino plate, the single or double of described dimaleoyl imino plate is provided with heat conducting coating; Described heat conducting coating is the DLC film plating layer.

2. high heat-conductive glass-fiber fabric base laminated sheet according to claim 1, it is characterized in that: the thickness of described dimaleoyl imino plate is 0.5 ~ 5 millimeter.

3. high heat-conductive glass-fiber fabric base laminated sheet according to claim 1, is characterized in that: between described dimaleoyl imino plate and heat conducting coating, also be provided with the transition film plating layer.

4. high heat-conductive glass-fiber fabric base laminated sheet according to claim 3 is characterized in that: described transition film plating layer is a kind of in Si film plating layer, Cr film plating layer, Al film plating layer, Ti film plating layer and Ni film plating layer, and its thickness is 0.1 ~ 1 micron.

5. high heat-conductive glass-fiber fabric base laminated sheet according to claim 1, it is characterized in that: the thickness of described DLC film plating layer is 1 ~ 5 micron.

6. high heat-conductive glass-fiber fabric base laminated sheet according to claim 1, is characterized in that: also be provided with the Cu film plating layer on described heat conducting coating.

7. high heat-conductive glass-fiber fabric base laminated sheet according to claim 6, it is characterized in that: the thickness of described Cu film plating layer is 4 ~ 6 microns.

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