CN203327394U - Chip mounter charging tray of surface mounting element - Google Patents
Chip mounter charging tray of surface mounting element Download PDFInfo
- Publication number
- CN203327394U CN203327394U CN2013203792130U CN201320379213U CN203327394U CN 203327394 U CN203327394 U CN 203327394U CN 2013203792130 U CN2013203792130 U CN 2013203792130U CN 201320379213 U CN201320379213 U CN 201320379213U CN 203327394 U CN203327394 U CN 203327394U
- Authority
- CN
- China
- Prior art keywords
- chip mounter
- charging tray
- mounting
- mounter charging
- orifice plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model relates to a chip mounter and specifically relates to a chip mounter charging tray of a surface mounting element. The chip mounter charging tray comprise a base board, wherein an A face of the base board is for element mounting, the chip mounter charging tray is further equipped with an element hole board mounted at the A face of the base board, the element hole board is provided with element holes matching with profile dimensions of elements, and the elements can be clamped in the corresponding element holes. The chip mounter charging tray has a simple structure, can realize proper selection of element hole boards according to different types of elements, other parts are universal, flexible and convenient. The chip mounter charging tray of the surface mounting element can effectively reduce frequent material discards during processing and shutdown caused by image identification for small-scale mounting or bulk material mounting and realizes accurate position mounting.
Description
Technical field
The utility model relates to a kind of chip mounter, is specially a kind of chip mounter charging tray of element pasted on surface.
Background technology
Along with the future development of electronic product towards miniaturization, high reliability, SMT(element pasted on surface technology) become the main flow of hyundai electronics Assembly.Traditional manual welding is general is only reprocessing or the welding of plug-in mounting device is used, consuming time and production efficiency is low, and some chip components can't be welded by hand.Surface-assembled Automation of Welding degree is high, and quality conformance is good, so electronic and electrical equipment is used surface mounting technology more.
The high precision die bonder chip component loader that the SMT production line is used at present is generally the belt feed bin, and this mode is only suitable for the production in enormous quantities of single product.Now bulk cargo or a small amount of element feed mode are mainly contained to two kinds: the one, element again pack and is gone up the chip mounter feed bin again with braider, this method need newly be added standby, and if material casting or shutdown appear when in the braid process, control does not with great difficulty mount; The 2nd, the element material strip is bonded on metallic plate with double faced adhesive tape or glue, then be fixed on the chip mounter feeding platform, the relative position of element relies on operating personnel to estimate judgement fully like this, and position error is large, frequently occurs material casting during processing.
Summary of the invention
The purpose of this utility model is, for the deficiencies in the prior art, provides a kind of chip mounter charging tray of element pasted on surface, guarantees that the component mounter position is accurate, and has guaranteed the follow-up process stabilization that mounts.
The technical solution of the utility model is, a kind of chip mounter charging tray of element pasted on surface, comprise base plate, the A face of base plate is for mount components, described chip mounter charging tray also is provided with the element orifice plate that is arranged on base plate A face, the element orifice plate is provided with component hole a plurality of and component profile size coupling, and element can be installed in corresponding component hole.
By install additional with component hole the element orifice plate, element can be installed in component hole.
Described element orifice plate is arranged on base plate by securing member, and securing member can be selected screw, can dismantle at any time the element orifice plate, changes suitable element orifice plate.
Evenly be provided with many row's component holes on described element orifice plate.
Described component hole is provided with identifier, and the identifier on each component hole is not identical, and identifier can adopt the identifier of laser incising, facilitates the location of element.
Chip mounter adopts above-mentioned chip mounter charging tray to be mounted to add man-hour, as follows operation:
1) base plate, element orifice plate are connected by screw, by whole screw lock;
2) mounted chip mounter charging tray is horizontally fixed on the feeding platform of chip mounter, the element orifice plate is with to mount direction parallel;
3), according to the requirement of assembling processing, the required element mounted is put into to the component hole of element orifice plate;
4) after the device Installation and Debugging complete, press the chip mounter program setting, definition charging tray type and position of components, carry out component mounter.
The chip mounter of wherein said assembly element is the MY100LV-10 high precision die bonder, and the utility model also can be used for MY100LV-10 and has the high precision die bonder of similar structures.
After using the chip mounter charging tray of element pasted on surface described in the utility model, the component mounter position is accurate, process stabilization, and has greatly reduced due to material casting or the poor shutdown caused of image recognition, has improved the element utilance.And, after using this device, the operator can stablize, control neatly charging tray, production efficiency is significantly improved.
Apparatus structure of the present utility model is simple, can select suitable element orifice plate according to component type, and other parts are general, flexibly, conveniently.The bulk cargo of chip mounter charging tray by using element pasted on surface after to some small lots or screening mounts, the shutdown phenomenon that frequently occurs material casting while significantly having reduced processing and cause due to image recognition, and also it is accurate to mount position.Simultaneously, significantly reduce operation easier, the operator can complete preferably charging tray through short-term cultivation and install and component mounter.
The accompanying drawing explanation
The structural front view that Fig. 1 is chip mounter charging tray described in the utility model;
The structure side view that Fig. 2 is chip mounter charging tray described in the utility model;
Fig. 3 installs the structural representation of element additional in Fig. 1.
Embodiment
As shown in Figure 1 and Figure 2, a kind of chip mounter charging tray of element pasted on surface, comprise base plate 1, the A face of base plate 1 is for mount components 4, the chip mounter charging tray also is provided with the element orifice plate 2 that is arranged on base plate A face, and element orifice plate 2 is arranged on base plate 1 by securing member 3, and securing member 3 can adopt screw; Element orifice plate 2 is provided with component holes 5 a plurality of and element 4 overall dimension couplings, evenly is provided with many row's component holes 5 on element orifice plate 2; Component hole 5 is provided with identifier, and the identifier on each component hole 5 is not identical, also can arrange on first component hole of component hole 5 and last component hole identifier is set at each, knows the identifier that symbol can adopt laser incising.
As shown in Figure 3, element 4 can be installed in corresponding component hole 5.
Claims (4)
1. the chip mounter charging tray of an element pasted on surface, comprise base plate (1), the A face of base plate (1) is for mount components (4), it is characterized in that, described chip mounter charging tray also is provided with the element orifice plate (2) that is arranged on base plate A face, element orifice plate (2) is provided with component hole (5) a plurality of and element (4) overall dimension coupling, and element (4) can be installed in corresponding component hole (5).
2. the chip mounter charging tray of element pasted on surface according to claim 1, is characterized in that, described element orifice plate (2) is arranged on base plate (1) by securing member (3).
3. the chip mounter charging tray of element pasted on surface according to claim 1, is characterized in that, evenly is provided with many row's component holes (5) on described element orifice plate (2).
4. the chip mounter charging tray of element pasted on surface according to claim 3, is characterized in that, described component hole (5) is provided with identifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203792130U CN203327394U (en) | 2013-06-28 | 2013-06-28 | Chip mounter charging tray of surface mounting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203792130U CN203327394U (en) | 2013-06-28 | 2013-06-28 | Chip mounter charging tray of surface mounting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203327394U true CN203327394U (en) | 2013-12-04 |
Family
ID=49666683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203792130U Expired - Lifetime CN203327394U (en) | 2013-06-28 | 2013-06-28 | Chip mounter charging tray of surface mounting element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203327394U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244606A (en) * | 2014-09-29 | 2014-12-24 | 陕西宝成航空仪表有限责任公司 | Bulk component auto-picking method for use in mounting process of full-automatic chip mounter |
-
2013
- 2013-06-28 CN CN2013203792130U patent/CN203327394U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244606A (en) * | 2014-09-29 | 2014-12-24 | 陕西宝成航空仪表有限责任公司 | Bulk component auto-picking method for use in mounting process of full-automatic chip mounter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107635351B (en) | Flexible circuit board connection alignment method and alignment structure | |
| CN104244573A (en) | Flexible printed circuit board and flexible printed circuit board reflow soldering method | |
| CN104918477B (en) | A kind of electronic component inserts system and its insertion method automatically | |
| CN102709253A (en) | Process for manufacturing integrated circuit board | |
| CN203327394U (en) | Chip mounter charging tray of surface mounting element | |
| CN106304829A (en) | A kind of scattered or short braid components and parts mount pallet automatically | |
| CN201797652U (en) | Structure for splicing multiple different types of PCB boards | |
| CN203697636U (en) | Surface mount fixation jig for FPC (flexible printed circuit) of high-end camera shooting module | |
| CN104125715A (en) | Device for bending flexible circuit board | |
| CN203536377U (en) | Plug-in module with package outline | |
| CN203368905U (en) | Printed circuit board | |
| WO2016197748A1 (en) | Through hole reflow soldering device for b surface socket and a surface, and socket mounting method | |
| CN202517166U (en) | Wave-soldering jig | |
| CN102528357A (en) | Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head | |
| CN109195335A (en) | A kind of L-type auxiliary positioning module and molding gong plate method for forming gong plate | |
| CN204191031U (en) | A kind of chip mounter PCB connecting gear being provided with positioner | |
| CN203851371U (en) | Flexible circuit board clamp | |
| CN203027357U (en) | Mobile phone camera module with strong universality | |
| CN202026529U (en) | Printed circuit board | |
| CN201937979U (en) | Circuit board wave soldering tool | |
| CN203788564U (en) | New type single-side PCB | |
| CN204315179U (en) | A kind of Anisotropically conductive glued membrane attaches device | |
| KR20150123475A (en) | A procucing method for inforcement for pfcb | |
| CN102581810B (en) | Method for quickly assembling scissor feet | |
| CN205264262U (en) | Panel display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131204 |
|
| CX01 | Expiry of patent term |