CN203324391U - General bus test system - Google Patents

General bus test system Download PDF

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Publication number
CN203324391U
CN203324391U CN201320060371XU CN201320060371U CN203324391U CN 203324391 U CN203324391 U CN 203324391U CN 201320060371X U CN201320060371X U CN 201320060371XU CN 201320060371 U CN201320060371 U CN 201320060371U CN 203324391 U CN203324391 U CN 203324391U
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CN
China
Prior art keywords
test option
option module
test
module
card test
Prior art date
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Expired - Lifetime
Application number
CN201320060371XU
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Chinese (zh)
Inventor
毛国梁
杨佳峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Hongtai Semiconductor Technology Co ltd
Original Assignee
SHANGHAI MACROTEST SEMICONDUCTOR Inc
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Priority to CN201320060371XU priority Critical patent/CN203324391U/en
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Publication of CN203324391U publication Critical patent/CN203324391U/en
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Abstract

The utility model relates to integrated circuit test equipment and discloses a general bus test system. According to the general bus test system, data and a power source which are at a slot set on a bus back board of a system are shared by a mother card test option module and a child card test option module through onboard slot technology, so two test option modules only use one slot set on the bus back board of the system, at most two test option modules can be mounted on a general interface slot of the bus back board of the system, and thereby the greatest number of the test option modules which can be mounted on the system is improved, and test capability of the test system is improved.

Description

The versabus test macro
Technical field
The utility model relates to integrated circuit testing equipment, particularly the versabus test macro.
Background technology
In existing versabus test macro, all test option modules all must be connected on system bus, by the general-purpose interface slot on the system bus backboard as shown in Figure 1.A test option module can be installed in every group of groove position, and several groups of groove positions are arranged on the system bus backboard, and whole test machine system just can only be equipped with several test option modules.
The working method of single test option module is: all signals and power supply are introduced from the groove position of system bus backboard, enter one group of bus transceiver on test option module, as shown in Figure 2.Whether bus transceiver is opened by groove position gating signal (CS) is controlled, and when bus transceiver is opened, the test option module be inserted on this groove position can communicate by groove position and system bus backboard, otherwise can not communicate by letter when bus transceiver is closed.Realize that thus each test option module communicates by letter with the time data of system bus.
The test option module quantity of the maximum that whole device systems can be supported depends on the number of slots amount on the system bus backboard.In the situation that between universal test option groove position, interval is definite with total number of slots amount, some relatively narrow test option module takies a universal test option groove potential must cause the waste on space.
The utility model content
The purpose of this utility model is to provide a kind of versabus test macro, make maximum two test option modules can be installed on a general-purpose interface slot of system bus backboard, but increased the quantity of system maximum installation testing option module, promoted the power of test of test macro.
For solving the problems of the technologies described above, embodiment of the present utility model provides a kind of versabus test macro, comprises: system bus backboard, master card test option module and sub card test option module;
Described master card test option module and described sub card test option module carry groove position technology by plate, share data and power supply on one group of groove position on described system bus backboard, and two test option modules only take one group of groove position on described system bus backboard;
Wherein, it is that sub card test option module is installed on master card test option module by connector that described plate carries the groove position, with master card test option module, shares the data of same general-purpose interface slot and the connected mode of power bus.
In addition, the front of described master card test option module has three and connects the tank position, and the back side of described sub card test option module has three connectors, and described sub card test option module is installed on described master card test option module by three connectors.
In addition, when described sub card test option module only needs a test option module in the groove position of described system bus backboard, from described master card test option module, remove.
The utility model embodiment in terms of existing technologies, master card test option module and sub card test option module carry groove position technology by plate, data and power supply on one group of groove position on the shared system bus backplane, two test option modules only take one group of groove position on the system bus backboard.Make maximum two test option modules can be installed on a general-purpose interface slot of system bus backboard, but increased the quantity of system maximum installation testing option module, promoted the power of test of test macro.
The accompanying drawing explanation
Fig. 1 is the structure principle chart according to the versabus test macro of prior art;
Fig. 2 is the fundamental diagram according to the single test option module of the versabus test macro of prior art;
Fig. 3 is the master card test option modular structure schematic diagram according to versabus test macro of the present utility model;
Fig. 4 is the sub card test option modular structure schematic diagram according to versabus test macro of the present utility model.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, embodiment of the present utility model is explained in detail.Yet, persons of ordinary skill in the art may appreciate that in the utility model embodiment, in order to make the reader understand the application better, many ins and outs have been proposed.But, even without these ins and outs and the many variations based on following embodiment and modification, also can realize each claim of the application technical scheme required for protection.
The first embodiment of the present utility model relates to a kind of versabus test macro, test option module relatively narrow in test macro is designed to two versions: master card version and subcard version.Master card version and subcard version are by data and power supply on one group of groove position on " plate carries the groove position " (Slot On Board) Techno-sharing system bus backboard, the test option module of two versions only takies one group of groove position on the system bus backboard, thereby the quantity of the installable full test option of whole test macro module is got a promotion, strengthened the combination property of test macro.
Refer to shown in Fig. 3 and Fig. 4, the versabus test macro of present embodiment comprises: system bus backboard, master card test option module and sub card test option module; Master card test option module and sub card test option module carry groove position technology by plate, data and power supply on one group of groove position on the shared system bus backplane, and two test option modules only take one group of groove position on the system bus backboard.Wherein, it is that sub card test option module is installed on master card test option module by connector that plate carries the groove position, with master card test option module, shares the data of same general-purpose interface slot and the connected mode of power bus.
The front of master card test option module has three and connects the tank position, and the back side of sub card test option module has three connectors, and sub card test option module is installed on master card test option module by three connectors.That is to say, on the module of master card version, three of positive increases connect the tank positions, and on the module of subcard version, the back side increases by three connectors, and the subcard module can be installed on the master card module by three connectors.Its working method is: data-signal is introduced from the system bus backboard, through one group of bus transceiver, enters the master card module and is connected the tank position with on a master card, and power supply is from the introducing of system bus backboard, enters the master card module and is connected the tank position with another on master card.Bus transceiver is controlled by the groove position gating signal (CS) of introducing on a system bus backboard, when these bus transceivers are opened, the master card module can further capture certain a data of bus transceiver output as selecting signal (SS), is used for selecting to allow master card module and bus communication still allow subcard module and bus communication.The output signal of subcard module connects on the output interface that the tank position enters into the master card module and exports by the 3rd on the master card module.
In addition, what deserves to be explained is, when sub card test option module only needs a test option module in the groove position of system bus backboard, remove from master card test option module.That is to say, the compatible original technical scheme of present embodiment,, when certain group groove position of system bus backboard only needs a test option module, master card version test option module can be used as common test option module and use, and does not need the subcard version.
Therefore, in universal test system, maximum two test option modules can be installed on a general-purpose interface slot of system bus backboard, but increase the quantity of system maximum installation testing option module, promote the power of test of test macro.
Persons of ordinary skill in the art may appreciate that the respective embodiments described above are to realize specific embodiment of the utility model, and in actual applications, can do various changes to it in the form and details, and do not depart from spirit and scope of the present utility model.

Claims (3)

1. a versabus test macro, is characterized in that, comprises: system bus backboard, master card test option module and sub card test option module;
Described master card test option module and described sub card test option module carry groove position technology by plate, share data and power supply on one group of groove position on described system bus backboard, and two test option modules only take one group of groove position on described system bus backboard;
Wherein, it is that sub card test option module is installed on master card test option module by connector that described plate carries the groove position, with master card test option module, shares the data of same general-purpose interface slot and the connected mode of power bus.
2. versabus test macro according to claim 1, it is characterized in that, the front of described master card test option module has three and connects the tank position, the back side of described sub card test option module has three connectors, and described sub card test option module is installed on described master card test option module by three connectors.
3. versabus test macro according to claim 1 and 2, is characterized in that, when described sub card test option module only needs a test option module in the groove position of described system bus backboard, from described master card test option module, removes.
CN201320060371XU 2013-02-01 2013-02-01 General bus test system Expired - Lifetime CN203324391U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320060371XU CN203324391U (en) 2013-02-01 2013-02-01 General bus test system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320060371XU CN203324391U (en) 2013-02-01 2013-02-01 General bus test system

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110727624A (en) * 2019-09-03 2020-01-24 中国航空工业集团公司西安飞行自动控制研究所 Backboard bus interconnection device
CN113447874A (en) * 2021-09-01 2021-09-28 南京宏泰半导体科技有限公司 Calibration device and method for semiconductor test system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110727624A (en) * 2019-09-03 2020-01-24 中国航空工业集团公司西安飞行自动控制研究所 Backboard bus interconnection device
CN113447874A (en) * 2021-09-01 2021-09-28 南京宏泰半导体科技有限公司 Calibration device and method for semiconductor test system
CN113447874B (en) * 2021-09-01 2021-11-12 南京宏泰半导体科技有限公司 Calibration device and method for semiconductor test system

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C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20200506

Address after: 210000 24 / F, block B, Kechuang headquarters building, Kechuang Plaza, No. 320, pubin Avenue, Jiangpu street, Pukou District, Nanjing City, Jiangsu Province

Patentee after: Nanjing Hongtai Semiconductor Technology Co.,Ltd.

Address before: No. 1 C 201114 Shanghai Minhang District city Pujiang town LIANHANG Road No. 1588 Ming Pu incubator building, building 4 floor

Patentee before: SHANGHAI MACROTEST SEMICONDUCTOR Inc.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20131204

CX01 Expiry of patent term