CN203313510U

CN203313510U - Antistatic module structure with adhered TP and LCD (liquid crystal display)

Info

Publication number: CN203313510U
Application number: CN2013203102012U
Authority: CN
Inventors: 仇琼; 胡敏; 邱小旭; 周世彦
Original assignee: CONHUI (HUIZHOU) SEMICONDUCTOR Co Ltd
Current assignee: CONHUI (HUIZHOU) SEMICONDUCTOR Co Ltd
Priority date: 2013-05-31
Filing date: 2013-05-31
Publication date: 2013-11-27
Anticipated expiration: 2023-05-31

Abstract

The utility model discloses an antistatic module structure with adhered TP and LCD (liquid crystal display). The antistatic module structure with the adhered TP and LCD comprises an LCD face light sheet, a TP bottom, a conducting foam gasket and a copper foil, and is characterized in that the conducting foam gasket is adhered between the LCD face light sheet and the TP bottom, is in a strip shape and surrounds to form a circuit, and the copper foil is adhered on the outer side of the conducting foam gasket and is used for transferring static charges. The antistatic module structure with the adhered TP and LCD, which is disclosed by the utility model, has the advantages that the manufacturing is convenient, the use effect is good, the application range is wide, and the anti-static performance of a vehicle-mounted LCD product can be remarkably improved.

Description

The antistatic modular structure of a kind of TP and LCD laminating

Technical field

The utility model relates to the module product technical field, the antistatic modular structure of especially a kind of TP and LCD laminating.

Background technology

Static happens occasionally in electronic equipment, in the process of static discharge, can produce potential disintegration voltage, electric current and electromagnetic field.Static is that static discharge current directly causes damage by circuit to the interference one of circuit and equipment, and to be the electromagnetic field that produces close etc. circuit is caused to interference by capacitive coupling, inductive coupling or space misfortune another kind.Static produce to destroy and to mainly contain two kinds electronic device, and the one, the heat that electric current produces causes the device thermal failure, and another is that the high voltage of generation of static electricity causes insulation breakdown, causes and excites larger electric current, causes further thermal failure.May cause temporary transient or cause permanent infringement.When static discharge acted on components and parts, while causing direct fault, instantaneous large-current infringement electronic device, caused the IC failure of chip, and circuit parameter is degenerated not obvious, can stay hidden danger, has cumulative bad and potentiality.Now for static discharge, the measure of taking has to be increased apart from path, shielding, and grounding, be exactly to stop static to enter electronic equipment internal, guiding static to be discharged on the earth or the less point of earth impedance on the whole.

At present the antistatic performance of module product is subject to the antistatic property of module IC basically, and on the market the antistatic specification of non-Vehicle-carrying type steel COG IC usually in ± 8kv.If need under ± 15kv static environment, make the product normal operation, need to overcome the restriction of module material static specification.But, being subject to drive IC antistatic effect deficiency, conventional products is not easy to resist static by 15KV.Prior art is covered with a metal outer frame on module top, a plurality of footing of metal outer frame pass the driver circuit plate and with the ground connection Copper Foil on the driver circuit plate, are connected after reversing, upper surface in described metal outer frame is equipped with the adhesives of one deck with electric conductivity, on described layer of adhesive material with electric conductivity, is bonded with the transparent panel of bottom with electric conductivity.The metal frame of this utilization is manufactured complicated, has also increased the thickness of product simultaneously, is unfavorable for the requirement of present stage product miniaturization, so prior art need to improve.

Summary of the invention

For the deficiencies in the prior art, the utility model provide a kind of easy to make, result of use good and the antistatic modular structure of TP applied widely and LCD laminating, when electrostatic interaction, during in modular structure, can pass through the conductive structure rapid grounding, avoid each member to be subjected to electrostatic interference.

The technical solution of the utility model is: the antistatic modular structure of a kind of TP and LCD laminating, comprise LCD face mating plate, TP bottom surface, conducting foam and Copper Foil, it is characterized in that: be bonded with conducting foam between described LCD face mating plate and TP bottom surface, conducting foam is elongated and surround into loop, the conducting foam outside is bonded with Copper Foil, be used to transmitting electrostatic charge.

Described Copper Foil is connected with client rs PC B earth terminal, and for by electrostatic charge ground connection effectively, and then the static that makes to be applied on modular structure passes to rapidly earth terminal.

The loop that described conducting foam is coiled into is that ，Qie closed-loop path, closed-loop path is shaped as frame or annular.

The beneficial effects of the utility model are: with the traditional metal frame, resist the static scheme and compare; can effectively protect module IC; guarantee that each member avoids electrostatic interference; the resistance electrostatic efficiency is better; the antistatic specification that has realized non-Vehicle-carrying type steel COG IC existing product is promoted to ± 15KV by ± 8KV; and cost is more cheap, and have longer useful life.The utility model has been widened product applications, requires high industrial products more suitable for antistatic.

The accompanying drawing explanation

Fig. 1 is the schematic diagram of the antistatic modular structure of a kind of TP described in the utility model and LCD laminating;

Fig. 2 is the vertical view of the antistatic modular structure of TP described in the utility model and LCD laminating.

In figure, 1-TP bottom surface, 2-Copper Foil, 3-conducting foam, 4-LCD face mating plate.

Embodiment

Below in conjunction with accompanying drawing, embodiment of the present utility model is described further:

As depicted in figs. 1 and 2, the antistatic modular structure of a kind of TP and LCD laminating, comprise LCD face mating plate 4, TP bottom surface 1, conducting foam 3 and Copper Foil 2, wherein between LCD face mating plate 4 and TP bottom surface 1, be bonded with conducting foam 3, conducting foam 3 elongated and on LCD face mating plate 4 along being coiled into loop all around, and conducting foam 3 glue thickness, cross sectional shape and the loop shape be coiled into all can need to change according to making, in the present embodiment, the loop that conducting foam 3 is coiled into is the closed-loop path of shaped as frame, conducting foam 3 outsides are bonded with Copper Foil 2, Copper Foil 2 shapes can require to change according to antistatic effect, such as making strip, for transmitting electrostatic charge, Copper Foil 2 is connected with the earth terminal of client rs PC B, for by electrostatic charge ground connection effectively, and then the static that makes to be applied on modular structure passes to rapidly earth terminal.The utility model is easy to make, and result of use is good and applied widely, can promote significantly the antistatic property of vehicle-mounted LCD product.

That in above-described embodiment and specification, describes just illustrates principle of the present utility model and most preferred embodiment; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.

Claims

1. the antistatic modular structure of a TP and LCD laminating, comprise LCD face mating plate, TP bottom surface, conducting foam and Copper Foil, it is characterized in that: between described LCD face mating plate and TP bottom surface, be bonded with conducting foam, conducting foam is square frame-shaped, boring, the conducting foam outside is bonded with Copper Foil.

2. the antistatic modular structure of TP according to claim 1 and LCD laminating, it is characterized in that: described Copper Foil is connected with client rs PC B earth terminal.

3. the antistatic modular structure of TP according to claim 1 and LCD laminating, it is characterized in that: the loop that described conducting foam is coiled into is that ，Qie closed-loop path, closed-loop path is shaped as frame or annular.