CN101616536A - The circuit board of tool electrostatic discharge protective and use its Liquid Crystal Module and electronic installation - Google Patents
The circuit board of tool electrostatic discharge protective and use its Liquid Crystal Module and electronic installation Download PDFInfo
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- CN101616536A CN101616536A CN200810125780A CN200810125780A CN101616536A CN 101616536 A CN101616536 A CN 101616536A CN 200810125780 A CN200810125780 A CN 200810125780A CN 200810125780 A CN200810125780 A CN 200810125780A CN 101616536 A CN101616536 A CN 101616536A
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Abstract
A kind of circuit board of tool electrostatic discharge protective and use its Liquid Crystal Module and electronic installation.Circuit board is in order to be installed among the electronic installation.Wherein, electronic installation comprises a metal frame at least, and circuit board is to be arranged in the metal frame to small part.Circuit board comprises a substrate, an internal circuit and at least one conductive structure.Internal circuit is formed in the substrate.Conductive structure is the edge that is formed at substrate, and adjacent to an inner surface of metal frame.Conductive structure has at least one first tip, and first tip comes down to the inner surface that is exposed to substrate surface and comes down to relative metal frame.Wherein conductive structure is to separate with internal circuit and for being electrically insulated, and is transferred to the metal frame of electronic installation in order to the electrostatic charge with internal circuit.
Description
Technical field
The present invention relates to a kind of circuit board, and particularly relevant for a kind of circuit board of tool electrostatic discharge protective and use its Liquid Crystal Module and electronic installation.
Background technology
Nowadays electronic product has been one of indispensable consumer goods of each life link.Even cause electronic product to produce one of problematic source of unusual fault usually, be exactly environment in the electrostatic effect that exists all the time.Nearly all electronic product all can be subjected to static discharge, and (electro-static discharge, interference ESD) is even be subjected to the destruction of static discharge.
(liquid crystal display module, LCM), the problematic source that is easy to generate abnormal quality most is exactly a static for Liquid Crystal Module.Because the source of static can be from each link in the environment, for example in process, the process of transporting and the module of module assembling and the process of product main body assembling, even under dry environment the process of user's operated products, all might have generation of static electricity, and cause Liquid Crystal Module to be subjected to the interference of static discharge.Slight person only can produce unusual that picture shows, as long as start can recover normal again.Severe patient then can produce nonvolatil destruction to Liquid Crystal Module, such as be integrated circuit (integrated circuit, IC) or the abnormal voltage that produced of passive component (passive component) damage or the undesirable condition of abnormal current.Though, the existing electrostatic discharge protective design of traditional Liquid Crystal Module.But, the design of traditional electrostatic discharge protective, regular meeting causes Liquid Crystal Module to produce the bad visual effect of ripples line etc. when showing.Therefore, how before product is high-quality, under the topic, solve the problem that static brings effectively, be still one of problem that industry endeavours.
Summary of the invention
The invention relates to a kind of circuit board of tool electrostatic discharge protective, particularly can be applicable to the circuit board in Liquid Crystal Module or the electronic installation.The present invention is a kind of point discharge structure Design in addition around circuit board, makes the too much electrostatic charge of circuit board can see through the point discharge structure promptly be discharged to minimum energy from shortest path position.For instance, electrostatic charge can see through the point discharge structure and be discharged to an external ground circuit, for example is the earthed circuit of an electronic installation, even to avoid high-energy static to cause the unusual breaking-up of integrated circuit signal, use the effect that reaches electrostatic discharge protective.
The present invention proposes a kind of circuit board of tool electrostatic discharge protective.Circuit board is in order to being installed among the electronic installation, and electronic installation comprises a metal frame at least, and circuit board is to be arranged in the metal frame to small part.Circuit board comprises a substrate, an internal circuit and at least one conductive structure.Internal circuit is formed in the substrate.Conductive structure is the edge that is formed at substrate, and adjacent to an inner surface of metal frame.Conductive structure has at least one first tip, and first tip comes down to the inner surface that is exposed to substrate surface and comes down to relative metal frame.Wherein conductive structure is to separate with internal circuit and for being electrically insulated, and is transferred to the metal frame of electronic installation in order to the electrostatic charge with internal circuit.
The present invention proposes a kind of Liquid Crystal Module of circuit board of tool electrostatic discharge protective, comprises a metal frame, a liquid crystal panel, at least one chip for driving and at least one circuit board.Liquid crystal panel is arranged in the metal frame.Chip for driving is arranged on the liquid crystal panel.Circuit board is arranged on the liquid crystal panel, and electrically connects with chip for driving, and an end of circuit board is in order to couple a driving interface of an electronic installation.Circuit board comprises a substrate, an internal circuit and at least one conductive structure.Internal circuit is formed in the substrate.Conductive structure is the edge that is formed at substrate, and adjacent to an inner surface of metal frame.Conductive structure has at least one first tip, and first tip comes down to the inner surface that is exposed to substrate surface and comes down to relative metal frame.Wherein conductive structure is to separate with internal circuit and for being electrically insulated, and is transferred to metal frame in order to the electrostatic charge with internal circuit.
The present invention proposes a kind of electronic installation of circuit board of tool electrostatic discharge protective, comprises a body and a Liquid Crystal Module.Body comprises a driving interface.Liquid Crystal Module is installed among the body.Liquid Crystal Module comprises a metal frame, a liquid crystal panel, at least one chip for driving and at least one circuit board.Liquid crystal panel is arranged in the metal frame.Chip for driving is arranged on the liquid crystal panel.Circuit board is arranged on the liquid crystal panel, and is be to electrically connect with chip for driving, and an end of circuit board is to be coupled to the drive bulk interface.Circuit board comprises a substrate, an internal circuit and at least one conductive structure.Internal circuit is formed in the substrate.Conductive structure is the edge that is formed at substrate, and adjacent to an inner surface of metal frame.Conductive structure has at least one first tip, and first tip comes down to the inner surface that is exposed to substrate surface and comes down to relative metal frame.Wherein conductive structure is to separate with internal circuit and for being electrically insulated, and is transferred to metal frame in order to the electrostatic charge with internal circuit.
For foregoing of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Fig. 1 illustrate circuit board according to one embodiment of the invention be installed in a Liquid Crystal Module in schematic diagram.
Fig. 2 illustrates the explosive view of the Liquid Crystal Module of Fig. 1.
Fig. 3 illustrates the partial enlarged drawing of the position A of corresponding diagram 2.
Fig. 4 illustrates the partial enlarged drawing of the position B of corresponding diagram 3.
Fig. 5 illustrates conductive structure and has relative most advanced and sophisticated schematic diagram with internal circuit.
Fig. 6 illustrates the schematic diagram that circuit board has the cabling design.
Fig. 7 illustrates the partial enlarged drawing of the position C of corresponding diagram 6.
Fig. 8 illustrates cabling and has relative most advanced and sophisticated schematic diagram with internal circuit.
Fig. 9 illustrates the schematic diagram of the square conductive structure of circuit board tool.
Figure 10 illustrates the schematic diagram that the circuit board side is provided with conductive structure.
Figure 11 illustrates the schematic diagram that circuit board has the conductive structure that extends inward.
Figure 12～15 illustrate the schematic diagram of the sharp convex region section with different configuration modes respectively.
Figure 16～18 illustrate the schematic diagram that metal frame has different bump design respectively.
Symbol description
100,600,900: circuit board
100e a: end of circuit board
110,610,910,1010,1110: substrate
120,620,920,1020,1120: internal circuit
122: the second tips
130,630,930,1030,1130,1630,1730,1830: conductive structure
131,631,931,1031,1131,1631,1731,1831: the first tips
133: the tri-point
200: Liquid Crystal Module
210,1610,1710,1810: metal frame
210a, 1610a, 1710a, 1810a: inner surface
220: liquid crystal panel
230: chip for driving
624: the four tips
640: cabling
645: the five tips
1011,1111: the side of substrate
1013,1113,1213,1313,1413,1513: sharp convex region section
1215,1315,1415,1416,1515,1516: spike
Embodiment
The embodiment of the invention proposes a kind of circuit board and Liquid Crystal Module and the electronic installation of using it of tool electrostatic discharge protective.This circuit board includes at least one conductive structure, and it is formed at the substrate edges of circuit board, and adjacent to a metal frame.And this conductive structure is to have at least one first tip, the inner surface that it comes down to be exposed to the substrate surface of circuit board and comes down to relative metal frame.Wherein, this conductive structure is to be transferred to metal frame in order to the electrostatic charge with the internal circuit of circuit board, to reach the effect of electrostatic discharge protective.
Below will arrange in pairs or groups graphic illustrate according to the present invention spirit and the circuit board of design are with as haveing the knack of the reference that these those skilled in the art implement according to this.Among following examples, circuit board for example is to be installed among the Liquid Crystal Module, as the circuit board of Liquid Crystal Module chip for driving use.Yet tool knows that usually the knowledgeable is when knowing, circuit board is through the adjustment of circuit design with appropriateness, just can be applied to as other purposes use among the various electronic installation, such as mobile communication device, carry-on media player, hand held arcade server etc., so the present invention should only not exceeded with the application of Liquid Crystal Module.
In addition, also describe at the several characteristic of circuit board of the present invention respectively below.And these features are can look applicable cases and collocation use mutually, and the present invention does not do any restriction to this point.In addition, be to omit unnecessary assembly among accompanying drawing, in order to highlighting feature of the present invention.
Please refer to Fig. 1 and Fig. 2, Fig. 1 illustrates circuit board according to one embodiment of the invention and is installed in schematic diagram among the Liquid Crystal Module, and Fig. 2 illustrates the explosive view of the Liquid Crystal Module of Fig. 1.In the present embodiment, the circuit board 100 of tool electrostatic discharge protective proposed by the invention is to be installed among the Liquid Crystal Module 200.Circuit board 100 is preferably and is a kind of flexible printed wiring board.This Liquid Crystal Module 200 includes metal frame 210, liquid crystal panel 220 and chip for driving 230.Circuit board 100 comes down to be arranged in the metal frame 210.
Wherein, liquid crystal panel 220 is to be arranged in the metal frame 210, and chip for driving 230 is to be arranged on the liquid crystal panel 220.This circuit board 100 is to be arranged on the liquid crystal panel 220 and with aforementioned chip for driving 230 to electrically connect, and an end 100e of this circuit board 100 for example is in order to couple a driving interface of an electronic installation (not illustrating).
Please refer to Fig. 3, it illustrates the partial enlarged drawing of the position A of corresponding diagram 2.Circuit board 100 includes substrate 110, is formed at internal circuit 120 and three conductive structures 130 in the substrate 110.Conductive structure 130 is the edges that are formed at substrate 110, and adjacent to an inner surface 210a of metal frame 210.And conductive structure 130 has at least one first tip 131, the inner surface 210a that this first tip 131 comes down to be exposed to substrate 110 surfaces and comes down to relative metal frame 210.Wherein, conductive structure 130 is with internal circuit 120 separations and for being electrically insulated.
Because conductive surface charge density is to be inversely proportional to conductive surface curvature.So curvature is big more, then charge density is high more.Generally speaking, under the effect of highfield, electric charge can be accumulated in the bigger place of surface curvature (as most advanced and sophisticated or tiny top).Yet charge density is directly proportional with electric field again, so curvature is big more, electric field strength is also big more.When the current potential change, when electric field strength increases, electric field makes the electric carving of the air of conductive surface, produces the phenomenon of gas discharge even near most advanced and sophisticated air electricity is carved, and its course of discharge is by the transfer of high potential toward electronegative potential.Briefly, point discharge just accumulates on the tip for electric charge, and Kong Qi Dian From produces by the phenomenon of high potential to the electronegative potential discharge near making.
Below will describe at the tip design of present embodiment circuit board.Please refer to Fig. 4, it illustrates the partial enlarged drawing of the position B of corresponding diagram 3.In Fig. 4, internal circuit 120 has at least one second tip 122 adjacent to the side of conductive structure 130, and second tip 122 comes down to towards conductive structure 130.Therefore, when producing electrostatic charge on internal circuit 120, more electrostatic charge can concentrate on second most advanced and sophisticated 122 places, and sees through the point discharge characteristic at second tip 122, and is transferred to conductive structure 130.First tip 131 by conductive structure 130 utilizes the point discharge characteristic again, and electrostatic charge is transferred to metal frame 210.Because electrostatic charge is to be transferred to metal frame 210, is ground connection so metal frame 210 is preferably.Though, among accompanying drawing, only illustrating one second tip 122, tool is known the knowledgeable usually when knowing, internal circuit 120 also can have more than two second tip 122 towards conductive structure 130.
Perhaps, between conductive structure 130 and internal circuit 120, except internal circuit 120 has at least one towards the tip of conductive structure 130, conductive structure 130 for example also can have at least one tip towards internal circuit 120.Please refer to Fig. 5, it illustrates conductive structure and has relative most advanced and sophisticated schematic diagram with internal circuit, and wherein Fig. 5 is the partial enlarged drawing of the position B of corresponding diagram 3.Fig. 5 is similar in appearance to Fig. 4, and the conductive structure 130 that both difference are Fig. 5 also has at least one tri-point 133, the tri-point 133 adjacent to the side of internal circuit 120 and comes down to towards internal circuit 120 and corresponding with second most advanced and sophisticated 122.
Similarly, in Fig. 5, when the electrostatic charge on internal circuit 120 can see through the point discharge characteristic at second tip 122, and be transferred to the tri-point 133 of conductive structure 130.First tip 131 by conductive structure 130 utilizes the point discharge characteristic again, and electrostatic charge is transferred to metal frame 210.And also explanation as the aforementioned, metal frame 210 is preferably and is ground connection.Wherein, because between internal circuit 120 and conductive structure 130, be to have two tips 122 and 133, see through point discharge electrostatic charge is transferred to the probability of conductive structure 130, electrostatic charge can more successfully be transferred on the conductive structure 130 so can increase internal circuit 120.
Because electrostatic effect is might occur on any position, outside the cause, a cabling also can be set between conductive structure 130 and internal circuit 120, and this cabling comes down to be looped around the outside of internal circuit 120, the electrostatic charge that increases internal circuit 120 further is transferred to the speed of conductive structure 130, so that better static discahrge protection effect to be provided.
Please refer to Fig. 6, it illustrates the schematic diagram that circuit board has the cabling design.Fig. 6 is similar in appearance to Fig. 3, and both difference are that the circuit board 600 of Fig. 6 also includes a cabling 640, is that the mode with adjacent inner circuit 620 is formed among the substrate 610.Wherein, cabling 640 is to separate with internal circuit 620 and for being electrically insulated, and cabling 640 is preferably and 630 electric connections of at least one conductive structure.
And, please be simultaneously with reference to Fig. 7, it illustrates the partial enlarged drawing of the position C of corresponding diagram 6, and wherein Fig. 7 is similar in appearance to Fig. 4.In Fig. 7, internal circuit 620 has 624, the four tips 624, at least one the 4th tip adjacent to the side of cabling 640 and comes down to towards cabling 640.Similarly, when when internal circuit 620 has electrostatic charge, electrostatic charge can see through the point discharge characteristic at the 4th tip 624, is transferred to cabling 640 and the conductive structure 630 that arrives.First tip 631 by conductive structure 630 utilizes the point discharge characteristic again, and electrostatic charge is transferred to metal frame 210.
Similarly, similar to the effect of Fig. 5, between cabling 640 and internal circuit 620, except internal circuit 620 has at least one towards the tip of cabling 640, cabling 640 can also have at least one tip towards internal circuit 620.Please refer to Fig. 8, it illustrates cabling and has relative most advanced and sophisticated schematic diagram with internal circuit, and wherein Fig. 8 is the partial enlarged drawing of the position C of corresponding diagram 6.Fig. 8 is similar in appearance to Fig. 7, and the cabling 640 that both difference are Fig. 8 also has 645, the five tips 645, at least one the 5th tip adjacent to the side of internal circuit 620 and comes down to towards internal circuit 620 and corresponding with the 4th most advanced and sophisticated 624.
When electrostatic charge concentrates on certain of internal circuit 620 when a bit, electrostatic charge can see through point discharge by the shortest path, promptly be transferred to cabling 640 and the conductive structure 630 that arrives.
In addition, for the effect of cabling, except above-mentioned function, cabling also can be considered as the extension of conductive structure.Especially at the internal circuit of circuit board because the needs of using, and cause conductive structure can't be adjacent to internal circuit the time, cabling is the outside that can be looped around internal circuit in the mode corresponding with the shape of internal circuit.In other words, cabling is preferably can comply with the shape of internal circuit and be formed in the substrate.
Conductive structure also can have other external form profile except being the triangle conductive structure 130 of earlier figures 3.Please refer to Fig. 9, it illustrates the schematic diagram of the square conductive structure of circuit board tool.Fig. 9 except the shape of conductive structure with Fig. 3 is different, as all the other can also illustrate as described above, the in addition design at second and third tip, or add the design at cabling, the 4th and the 5th tip.In other words, the present invention is not exceeded with the shape of conductive structure.But, for preferred implementation of the present invention, be to make conductive structure corresponding with the shape of internal circuit adjacent to the side of internal circuit, perhaps utilize the extension of cabling as conductive structure, and corresponding with the shape of internal circuit.
Though among above-mentioned explanation, be the corner that conductive structure is arranged at substrate.But the present invention is not as qualification.Please refer to Figure 10, it illustrates the schematic diagram that the circuit board side is provided with conductive structure.Figure 10 is similar in appearance to Fig. 9, and both difference are that the conductive structure 1030 of Figure 10 is the sides 1011 that are positioned at substrate 1010.As shown in figure 10, the side 1011 of substrate 1010 is adjacent with the inner surface 210a of metal frame 210, and it is inside edge 210a towards metal frame 210 that side 1011 has at least one sharp convex region section 1013, and first most advanced and sophisticated 1031 of this conductive structure 1030 then is to be positioned at sharp convex region section 1013.Wherein, between conductive structure 1030 and internal circuit 1020, also can arrange in pairs or groups and use the design at second and third tip, or the design at aforementioned cabling, the 4th and the 5th tip.
In addition, as above stated specification, because the needs of using, and cause conductive structure 1030 can't be adjacent to internal circuit 1020 time at the internal circuit 1020 of circuit board 1010.Please refer to Figure 11, it illustrates the schematic diagram that circuit board has the conductive structure that extends inward.Figure 11 is similar in appearance to Figure 10, both difference are that the conductive structure 1130 of Figure 11 is that edge by substrate 1110 extends inward to the position adjacent to internal circuit 1120, so that conductive structure 1130 is corresponding with the shape of internal circuit 1120 adjacent to the side of internal circuit 1120.Similarly, between conductive structure 1130 and internal circuit 1120, also can arrange in pairs or groups and use the design at second and third tip, or the design at aforementioned cabling, the 4th and the 5th tip.
And with sharp convex region Duan Eryan, it for example can have several identical spikes, or establishes different spikes.For instance, please refer to Figure 12～15, it illustrates the schematic diagram of the sharp convex region section with different configuration modes respectively.In Figure 12, sharp convex region section 1213 is to have several identical spikes 1215, and the shape of spike 1215 for example is the isosceles triangle with long sides such as two.And in Figure 13, sharp convex region section 1313 also has several identical spikes 1315, and spike 1315 for example extends to illustrated upper left side, and its shape for example is a right angle triangle, and is different with the isosceles triangle of Figure 12.Figure 14 then is similar in appearance to Figure 12, and both difference are that the sharp convex region section 1413 of Figure 14 has the spike 1415 and 1416 of two kinds of different sizes.Figure 15 then similarly is the combination of Figure 12 and Figure 13, and its sharp convex region section 1513 is made up of the spike 1516 of the spike 1515 of an isosceles triangle and two right-angled triangles, makes whole sharp convex region section 1513 have the characteristic that spike is concentrated.Point convex region section is that can to look applicable cases required and do the adjustment of appropriateness, so the present invention is not exceeded with the design shape of sharp convex region section.
Similarly, except corner and side, adjacent to the inner surface of metal frame, it also can be the plate face of substrate, the tip of conductive structure then is to be positioned at any point on this plate face, and the electrostatic charge of using the internal circuit of circuit board is transferred to metal frame, to reach the effect of electrostatic discharge protective.
In the explanation of aforementioned each figure, conductive structure is with metal frame 210 separations and for being electrically insulated.But between conductive structure and metal frame 210, also can add the design of salient point at the inner surface 210a of metal frame 210, come the reinforced conductive structure to see through point discharge electrostatic charge is transferred to the mechanism of metal frame 210, electrostatic charge can more successfully be transferred on the metal frame 210.
For instance, please refer to Figure 16～18, it illustrates the schematic diagram that metal frame has different bump design respectively.In Figure 16 and Figure 17, the inner surface 1610a of metal frame 1610 has at least one salient point 1611, these a little salient points 1611 come down to first most advanced and sophisticated 1631 of corresponding conductive structure 1630 and are provided with, and the difference of Figure 17 and Figure 16 is, the salient point 1711 of Figure 17 and first tip 1731 are to dispose in the mode that staggers.In addition, in Figure 18, the inner surface 1810a of metal frame 1810 also has at least one salient point 1811, and these salient points 1811 come down to against first tip 1831 of living conductive structure 1830, makes that metal frame 1810 and conductive structure 1830 are for electrically connecting.Because conductive structure 1830 is to electrically connect with metal frame 1810.Therefore, after the electrostatic charge of internal circuit is transferred to conductive structure 130, will directly be transferred to metal frame 1810.
When practical application, with a electronic installation, such as being mobile phone, hand held arcade server etc. with Liquid Crystal Module.Traditionally, the driving interface between electronic installation and the Liquid Crystal Module often because ground connection pin (GND pin) number is not enough, and when high-tension electrostatic charge produces, causes high voltage to scurry into once more within the chip for driving, makes Liquid Crystal Module produce anomaly.Therefore, when Liquid Crystal Module is when using the circuit board of the foregoing description, electrostatic charge just can be transferred to earthed circuit via both direction, so that electrostatic charge can promptly be discharged to the position of minimum energy from shortest path, and can not scurry within the chip for driving once more.The one direction is identical with traditional mode, and high-tension electrostatic charge is the earthed circuit that is transferred to electronic installation by the internal circuit of circuit board via driving interface.Other direction then as described above as, after high-tension electrostatic charge can utilize the mode of point discharge to be transferred to conductive structure, shift electrostatic charge to metal frame by conductive structure again, wherein the earthed circuit that is preferably with electronic installation of metal frame electrically connects.By this, can make electrostatic charge can promptly be discharged to the position of minimum energy, reach the effect of better electrostatic discharge protective from shortest path.
The disclosed circuit board of the above embodiment of the present invention and Liquid Crystal Module and the electronic installation of using it are the effects with electrostatic discharge protective.Owing to be provided with many point discharge structures around the circuit board, it can make the too much electrostatic charge of circuit board promptly be discharged to the position (such as being discharged to an earthed circuit) of minimum energy from shortest path, even, use the effect that reaches electrostatic discharge protective to avoid high-energy static to cause the unusual breaking-up of integrated circuit signal in the device.
In sum, though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention should be as the criterion with the application's the content that claim was defined.
Claims (20)
1. the circuit board of a tool electrostatic discharge protective is characterized in that, this circuit board is in order to being installed in the electronic installation that comprises a metal frame at least, and this circuit board to small part is arranged in this metal frame, and described this circuit board comprises:
One substrate;
One internal circuit is formed in this substrate; And
At least one conductive structure, it is the edge that is formed at this substrate, and adjacent to an inner surface of this metal frame, this conductive structure has at least one first tip, this first tip comes down to be exposed to this substrate surface and comes down to this inner surface of this metal frame relatively, wherein this conductive structure is to separate with this internal circuit and for being electrically insulated, and is transferred to this metal frame of this electronic installation in order to the electrostatic charge with this internal circuit.
2. circuit board as claimed in claim 1 is characterized in that, this metal frame of this electronic installation is a ground connection.
3. circuit board as claimed in claim 1 is characterized in that, this conductive structure is with this metal frame separation of this electronic installation and for being electrically insulated.
4. circuit board as claimed in claim 3 is characterized in that, this inner surface of this metal frame has at least one salient point, comes down to this first most advanced and sophisticated setting that should conductive structure.
5. circuit board as claimed in claim 1 is characterized in that, this inner surface of this metal frame of this electronic installation has at least one salient point, comes down to against this first tip of living this conductive structure, makes that this metal frame and this conductive structure are for electrically connecting.
6. circuit board as claimed in claim 1 is characterized in that, at least one corner of this substrate is this inner surface adjacent to this metal frame, and this of this conductive structure first tip is to be positioned at this corner.
7. circuit board as claimed in claim 1, it is characterized in that, at least one side of this substrate is this inner surface adjacent to this metal frame, and to have at least one sharp convex region section be this inside edge towards this metal frame in this side, and this of this conductive structure first tip is to be positioned at this point convex region section.
8. circuit board as claimed in claim 7 is characterized in that, this point convex region section has at least one first spike, and this first spike has one first profile.
9. circuit board as claimed in claim 1 is characterized in that, at least one plate face of this substrate is this inner surface adjacent to this metal frame, and this of this conductive structure first tip is to be positioned at any point on this plate face.
10. circuit board as claimed in claim 1 is characterized in that, this conductive structure is to extend to position adjacent to this internal circuit by the edge of this substrate to this substrate inside.
11. circuit board as claimed in claim 10 is characterized in that, this conductive structure is corresponding with the shape of this internal circuit adjacent to the side of this internal circuit.
12. circuit board as claimed in claim 10 is characterized in that, this internal circuit has at least one second tip adjacent to the side of this conductive structure, and this second tip comes down to towards this conductive structure.
13. circuit board as claimed in claim 12 is characterized in that, this conductive structure has at least one tri-point adjacent to the side of this internal circuit, and this tri-point comes down to towards this internal circuit and corresponding with this second tip.
14. circuit board as claimed in claim 1 is characterized in that, also comprises:
One cabling is that the mode with adjacent this internal circuit is formed among this substrate, and this cabling is to separate with this internal circuit and for being electrically insulated, and this cabling is and at least one this conductive structure electric connection.
15. circuit board as claimed in claim 14 is characterized in that, this cabling comes down to be looped around the outside of this internal circuit.
16. circuit board as claimed in claim 14 is characterized in that, this internal circuit has at least one the 4th tip adjacent to the side of this cabling, and the 4th tip comes down to towards this cabling.
17. circuit board as claimed in claim 16 is characterized in that, this cabling has at least one the 5th tip adjacent to the side of this internal circuit, and the 5th tip comes down to towards this internal circuit and most advanced and sophisticated corresponding with the 4th.
18. circuit board as claimed in claim 1 is characterized in that, this circuit board is a flexible printed wiring board.
19. the Liquid Crystal Module of a tool electrostatic discharge protective is characterized in that, this Liquid Crystal Module comprises:
The metal frame of one ground connection;
One liquid crystal panel is arranged in this metal frame;
At least one chip for driving is arranged on this liquid crystal panel; And
As each described circuit board in the claim 1 to 18, and electrically connect with this chip for driving.
20. the electronic installation of a tool electrostatic discharge protective is characterized in that, this electronic installation comprises:
One body, this body comprises a driving interface; And Liquid Crystal Module as claimed in claim 19, and couple this driving interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101257807A CN101616536B (en) | 2008-06-25 | 2008-06-25 | Circuit board with electrostatic discharge protection as well as liquid crystal module and electronic device applying same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101257807A CN101616536B (en) | 2008-06-25 | 2008-06-25 | Circuit board with electrostatic discharge protection as well as liquid crystal module and electronic device applying same |
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| CN101616536A true CN101616536A (en) | 2009-12-30 |
| CN101616536B CN101616536B (en) | 2011-06-29 |
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| CN2008101257807A Expired - Fee Related CN101616536B (en) | 2008-06-25 | 2008-06-25 | Circuit board with electrostatic discharge protection as well as liquid crystal module and electronic device applying same |
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| US6211565B1 (en) * | 1999-04-29 | 2001-04-03 | Winbond Electronics Corporation | Apparatus for preventing electrostatic discharge in an integrated circuit |
| CN100349038C (en) * | 2003-04-25 | 2007-11-14 | 胜华科技股份有限公司 | Method and devoce for arranging conductive metal wire on display faceplate possessing point discharge |
| CN101135789A (en) * | 2007-09-25 | 2008-03-05 | 上海海晶电子有限公司 | Method for resolving breakdown of LCD device electrostatic |
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2008
- 2008-06-25 CN CN2008101257807A patent/CN101616536B/en not_active Expired - Fee Related
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| CN103813604A (en) * | 2012-11-12 | 2014-05-21 | 纬创资通股份有限公司 | Electronic device and conductive plate thereof |
| CN103813604B (en) * | 2012-11-12 | 2017-03-01 | 纬创资通股份有限公司 | Electronic device and conductive plate thereof |
| TWI566662B (en) * | 2014-10-22 | 2017-01-11 | 鴻海精密工業股份有限公司 | Coupling frame and methods for making the same |
| CN108024490A (en) * | 2016-10-28 | 2018-05-11 | 研华股份有限公司 | The circuit layout structure and miniaturized electronic device of electrostatic discharge protective |
| CN106604533A (en) * | 2017-02-03 | 2017-04-26 | 环旭电子股份有限公司 | Electrostatic protection structure |
| CN109215727A (en) * | 2017-07-05 | 2019-01-15 | 慧荣科技股份有限公司 | Wire bonding and testing method and flash memory device adapting the method |
| CN108023978A (en) * | 2017-11-29 | 2018-05-11 | 维沃移动通信有限公司 | A kind of terminal device |
| CN110035600A (en) * | 2018-01-11 | 2019-07-19 | 和硕联合科技股份有限公司 | Have the circuit board of electrostatic discharge (ESD) protection mechanism and the electronic device with this circuit board |
| CN110035600B (en) * | 2018-01-11 | 2020-05-19 | 和硕联合科技股份有限公司 | Circuit board with electrostatic discharge protection mechanism and electronic device with same |
| CN108877533A (en) * | 2018-07-18 | 2018-11-23 | 厦门美图移动科技有限公司 | Display screen and electronic equipment |
| CN109195295A (en) * | 2018-08-27 | 2019-01-11 | 出门问问信息科技有限公司 | Electronic equipment |
| WO2021120292A1 (en) * | 2019-12-17 | 2021-06-24 | Tcl华星光电技术有限公司 | Source driver and display device |
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| CN101616536B (en) | 2011-06-29 |
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